United States Patent (19)
`Kish et al.
`
`(56)
`
`(54 WAFER BONDING OF LIGHT EMITTING
`DODE LAYERS
`75) Inventors: Fred A. Kish; Frank M. Steranka,
`both of San Jose; Dennis C.
`DeFevere, Palo Alto; Virginia M.
`Robbins, Los Gatos; John Uebbing,
`Palo Alto, all of Calif.
`73) Assignee: Hewlett-Packard Company, Palo
`Alto, Calif.
`(21) Appl. No.: 36,532
`22 Filed:
`Mar. 19, 1993
`51) Int. Cl. ............................................. HO1L 21/20
`52 U.S. C. .................................... 437/127; 437/129;
`437/130,437/117
`58 Field of Search ............... 437/127, 129, 130,905,
`437/974, 117, 229; 148/DIG. 135
`References Cited
`U.S. PATENT DOCUMENTS
`4,771,016 9/1988 Bajor et al. ............... 148/DIG. 135
`4,775,645 10/1988 Kurata et al. ......
`4,846,931 7/1989 Gmitter et al.
`. 156/633
`4,864,369 9/1989 Snyder et al. .
`... 357/17
`4,864,371 9/1989 Steranka ........
`... 357/17
`156/633
`4,883,561 11/1989 Gmitter et al. ...
`4,902,356 2/1990 Noguchi et al. .................... 437/127
`4,921,817 5/1990 Noguchi.............................. 437/127
`4,971,925 11/1990 Alexander et al. ....... 148/DIG. 135
`4,992,837 2/1991 Sakai et al. ............................ 357/17
`5,008,718 4/1991 Fletcher et al.
`... 357/17
`5,087,585 2/1992 Hayashi............................... 437/974
`5,110,748 5/1992 Sarma ........
`... 437/974
`5,135,877 8/1992 Albergo et al. ...
`... 437/229
`5,153,889 10/1992 Sugawara et al. .................... 372/45
`5,244,817 9/1993 Hawkins et al. .......... 148/DIG. 135
`OTHER PUBLICATIONS
`Dudley, J. J., et al., "144° C. operation of 1.3 um In
`GaAsP vertical cavity lasers on GaAs substrates”, Appl.
`Phys. Lett, 61 (26), Dec. 28, 1992, pp. 3095-3097.
`Ishiguro, Hisanori et al., "High efficient GaAlAs light
`
`so a 437/905
`
`USO05376580A
`Patent Number:
`Date of Patent:
`
`11
`45
`
`5,376,580
`Dec. 27, 1994
`
`-emitting diodes of 660 nm with a double heterostruc
`ture on a GaAlAs substrates', Appl. Phys. Lett, 43 (11),
`Dec. 1, 1983, pp. 1034-1036.
`Pollentier, I. et al., "Epitaxial Lift-off GaAs LEDs to Si
`for Fabrication of Opto-Electronic Integrated Cir
`cuits', Electronics Letters, vol. 36, No. 3, Feb. 1, 1990,
`pp. 193-194.
`Schnitzer, I. et al., “Ultrahigh spontaneous emission
`quantum efficiency, 99.7% internally and 72% exter
`nally, from AlGaAs/GaAs/AlGaAs double heteros
`tructures', Appl. Phys. Lett, 63 (3), Jan. 11, 1993, pp.
`131-133.
`Sugawara, H. et al., "High-efficiency IngaAlP/GaAs
`visible light-emitting diodes”, Appl. Phys. Lett, 58 (10),
`Mar. 11, 1991, pp. 1010-1012.
`Primary Examiner-Tom Thomas
`Assistant Examiner-Kevin M. Picardat
`
`ABSTRACT
`57
`A method of forming a light emitting diode (LED)
`includes providing a temporary growth substrate that is
`selected for compatibility with fabricating LED layers
`having desired mechanical characteristics. For exam
`ple, lattice matching is an important consideration.
`LED layers are then grown on the temporary growth
`substrate. High crystal quality is thereby achieved,
`whereafter the temporary growth substrate can be re
`moved. A second substrate is bonded to the LED layers
`utilizing a wafer bonding technique. The second sub
`strate is selected for optical properties, rather than me
`chanical properties. Preferably, the second substrate is
`optically transparent and electrically conductive and
`the wafer bonding technique is carried out to achieve a
`low resistance interface between the second substrate
`and the LED layers. Wafer bonding can also be carried
`out to provide passivation or light-reflection or to de
`fine current flow.
`
`29 Claims, 13 Drawing Sheets
`
`
`
`44
`
`Cree Exhibit 1008
`Page 1
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 1 of 13
`
`5,376,580
`
`12
`1O
`
`
`
`14.
`
`
`
`22
`2O
`18
`
`16
`
`ALGOAS(n)
`ALGOAs(p)
`
`FIG 1 (PRIOR ART)
`
`ALGOAs(p)
`
`
`
`ALGOAs(p)
`
`ALGOAS(n)
`
`GOAS(n)
`
`FIG 2 (PRIOR ART)
`
`Cree Exhibit 1008
`Page 2
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 2 of 13
`
`5,376,580
`
`ALGOAs(p)
`
`AlGaAs(p)
`
`ALGOAS(n)
`
`FIG 3 (PRIOR ART)
`
`28
`26
`
`
`
`24
`
`38
`
`35
`34 32
`
`3O
`
`FIG 4
`
`Cree Exhibit 1008
`Page 3
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 3 of 13
`
`5,376,580
`
`-40
`
`42
`
`FIG 5
`
`38 - N
`35 34
`
`32
`
`38 -
`35 34.
`
`32
`
`
`
`Cree Exhibit 1008
`Page 4
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 4 of 13
`
`5,376,580
`
`48
`
`30
`
`.
`
`30
`
`38 -
`
`35 341
`
`32
`
`-
`35 341
`
`32
`
`FIG 3
`
`FIG 9
`
`Cree Exhibit 1008
`Page 5
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 5 of 13
`
`5,376,580
`
`
`
`FIG 10
`
`38 E 34.
`
`32
`
`60
`
`62
`
`FIG 11
`
`Cree Exhibit 1008
`Page 6
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 6 of 13
`
`5,376,580
`
`FIG 2
`
`126
`
`
`
`Cree Exhibit 1008
`Page 7
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 7 of 13
`
`5,37 6,580
`
`142
`
`
`
`28
`
`
`
`ZYZZZZY ZN 126
`
`
`
`
`
`130
`132
`134.
`
`136
`
`M 142
`
`14.6
`
`AZZZZZZZZZZZZZZZZZZZZZZZZZZZ
`
`FIG 14
`
`144
`
`154.
`156
`R 152 P2YZZZZ
`
`2N4 N
`/
`I
`
`. .
`
`. .
`
`.
`
`. .
`
`/
`
`. . . A
`
`
`
`. .
`
`.
`
`
`
`150
`
`ZZZZZZZZZZZZZZZZZZZZZZZZZZZ
`
`FIG 15
`
`144
`
`148
`
`Cree Exhibit 1008
`Page 8
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 8 of 13
`
`5,376,580
`
`
`
`F
`
`Cree Exhibit 1008
`Page 9
`
`

`

`US. Patent
`
`Dec. 27, 1994
`Dec. 27, 1994
`
`Sheet 9 of 13
`
`5,376,580
`5,376,580
`
`
`
`
`
`Cree Exhibit 1008
`
`Page 10
`
`Cree Exhibit 1008
`Page 10
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 10 of 13
`
`
`
`009
`TEMPERATURE (C)
`
`
`
`(U|UU) EVN||
`
`5,376,580
`
`091,OZI,090
`
`Cree Exhibit 1008
`Page 11
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 11 of 13
`
`5,376,580
`
`
`
`FIG. 20
`
`Cree Exhibit 1008
`Page 12
`
`

`

`U.S. Patent
`
`m
`
`Dec. 27, 1994
`
`Sheet 12 of 13
`
`5,376,580
`
`
`
`Cree Exhibit 1008
`Page 13
`
`

`

`U.S. Patent
`
`Dec. 27, 1994
`
`Sheet 13 of 13
`
`5,376,580
`
`
`
`Cree Exhibit 1008
`Page 14
`
`

`

`1.
`
`WAFER BONDING OF LIGHT EMITTING DODE
`LAYERS
`
`15
`
`TECHNICAL FIELD
`The present invention relates generally to light emit
`ting diodes and more particularly to methods of fabri
`cating light emitting diodes.
`BACKGROUND ART
`Light emitting diodes (LEDs) are employed in a wide
`variety of applications. For example, in optical data
`transmission, LEDs are used to launch data signals
`along a fiberoptic cable.
`Unlike lasers, LEDs do not generate well-focused
`beams of light. Rather, an LED radiates light in all
`directions. That is, the light emission is isotropic. The
`layers of many conventional LEDs are grown on an
`optically absorbing substrate having an energy gap less
`than the emission energy of the active region of the
`LED. The substrate absorbs some of the light generated
`within the active region, thereby reducing the effi
`ciency of the device. An example of a prior art alumi
`nun gallium arsenide (AlGaAs) LED of the single
`heterojunction type is shown in FIG. 1. An epitaxial
`25
`layer 10 of p-doped AlGaAs and an epitaxial layer 12 of
`n-doped AlGaAs are grown on a surface of a p-doped
`gallium arsenide (GaAs) substrate 14. The conduction
`of current through the junction of the epitaxial layers 10
`and 12 will generate light. However, since the energy
`gap of the absorbing substrate 14 is less than the emis
`sion energy, light that is emitted or internally reflected
`downwardly toward the substrate 14 will be absorbed.
`FIG. 2 is a double heterojunction AlGaAs LED on
`an absorbing substrate 16. An epitaxial layer 18 of n
`35
`doped AlGaAs and two layers 20 and 22 of p-doped
`AlGaAs are grown on the absorbing substrate 16. The
`bandgaps of the epitaxial layers 18-22 are chosen to
`cause light to be generated in the active layer 20 and to
`travel through the epitaxial layers 18 and 22 without
`40
`being absorbed. However, absorption of light does
`occur at the substrate 16.
`Improved performance can be achieved by employ
`ing a transparent substrate that has an energy gap
`greater than the emission energy of the LED active
`45
`region. The effect of the transparent substrate is to
`prevent the downwardly emitted or directed light from
`being absorbed. Rather, the light passes through the
`transparent substrate and is reflected from a bottom
`metal adhesive and reflecting cup. The reflected light is
`50
`then emitted from the top or the edges of the chip to
`substantially improve the efficiency of the LED.
`There are several techniques for fabricating LEDs
`having transparent substrates. A first technique is to
`epitaxially grow the p-n junction on a transparent sub
`55
`strate. However, a problem with this technique is that
`acceptable lattice matching may be difficult to achieve,
`depending upon the lattice constant of the LED epitax
`ial layers. A second technique is to grow the LED
`epitaxial layers on an absorbing substrate that is later
`removed. For example, in FIG.3 the n-doped transpar
`ent substrate 24 and the p-doped epitaxial layers 26 and
`28 may be epitaxially grown on an absorbing substrate,
`not shown. The transparent "substrate'24 is fabricated
`by growing a thick, greater than 75um, optically trans
`65
`parent and electrically conductive epitaxial layer on the
`lattice-matched absorbing substrate. The other layers 26
`and 28 are then grown on the epitaxial "substrate” 24
`
`5,376,580
`2
`and the absorbing substrate is removed. Alternatively,
`the thinner layers 26 and 28 may be grown before the
`thicker transparent "substrate' 24.
`The above-described techniques of fabricating LEDs
`having transparent substrates suffer from inherent dis
`advantages. Firstly, epitaxially growing a "thick” opti
`cally transparent, electrically conductive "substrate'
`may not be practical, or even possible, when employing
`some growth techniques for certain semiconductor
`O
`materials. Secondly, even when possible, a "thick' epi
`taxial layer requires a long growth time, limiting the
`manufacturing throughput of such LEDs. Thirdly, fol
`lowing removal of the absorbing substrate, the resulting
`LED layer is relatively thin, e.g. approximately 3-6
`mils. The thin wafers are difficult to handle without
`breaking, rendering fabrication more difficult. More
`over, thin wafers create difficulties during mounting the
`wafers in an LED package. Silver-loaded epoxy is typi
`cally utilized for mounting and contacting the bottom of
`the device. The epoxy tends to flow over the edges of
`thin wafers, causing the short circuiting of the diode
`(LED). Also, thin wafers are not as mechanically robust
`as the devices of FIGS. 1 and 2, which are grown on
`'thick' substrates of at least 10 mills. Such “thin' LEDs
`may exhibit increased device-failure problems when
`mounted in epoxy lamps. Thus, there are contradictory
`thickness problems when this second technique is em
`ployed, since the transparent layer may be “too thick”
`for practical crystal growth processes and "too thin'
`for device applications.
`Consequently, there may be a tradeoff associated
`with selection of an absorbing substrate or a transparent
`substrate. Depending upon the growth and fabrication
`techniques, an LED having an absorbing substrate may
`possess mechanical characteristics that are superior to a
`transparent substrate LED, but the absorbing substrate
`LED is generally less efficient. Increased efficiency is
`possible using a transparent substrate; however, lattice
`mismatch may create difficulties when the epitaxial
`layers are grown on a transparent substrate having a
`different lattice constant. In addition, the contradictory
`thickness problems may be encountered when a "thick”
`transparent “substrate” is epitaxially grown.
`The effect of an absorbing layer or substrate can be
`minimized by growing a Bragg reflector between the
`standard LED epitaxial layers and the absorbing sub
`strate. An increase in efficiency is achieved, since the
`Bragg reflector will reflect light that is emitted or inter
`nally reflected in the direction of the absorbing sub
`strate. However, the improvement is limited compared
`to transparent substrate techniques, because the Bragg
`reflector only reflects light that is of near normal inci
`dence. Light that differs from a normal incidence by a
`significant amount is not reflected and passes to the
`substrate, where it is absorbed. Moreover, LEDs hav
`ing Bragg reflectors are more difficult to manufacture,
`since they require the repeated growth of many thin
`epitaxial layers, typically on the order of 100 angstroms
`in thickness.
`It is an object of the present invention to provide a
`method of forming an LED having the desirable me
`chanical characteristics of a “thick' substrate of at least
`8 mils and the desirable optical characteristics of a trans
`parent-substrate LED.
`
`Cree Exhibit 1008
`Page 15
`
`

`

`10
`
`15
`
`3
`SUMMARY OF THE INVENTION
`The above object has been met by a method that
`utilizes a temporary growth substrate optimized for the
`growth of LED layers, but then provides a perfor
`mance-enhancing substrate without requiring the epi
`taxial growth of this substrate. In a preferred embodi
`ment, the performance-enhancing substrate is a trans
`parent member that is joined to the LED layers using
`wafer bonding techniques. Because the transparent
`layer is not bonded to the LED layers until completion
`of epitaxial growth of the LED layers, lattice matching
`of the transparent substrate and epitaxial layers is not a
`COCea.
`The temporary growth substrate is made of a material
`compatible with fabricating LED layers having desired
`mechanical characteristics. For example, in order to
`achieve high crystal quality growth and to optimize
`lattice matching, standard absorbing substrate materials
`may be utilized. LED layers are then grown using one
`20
`or more of a variety of methods, including liquid phase
`epitaxy, vapor phase epitaxy, metalorganic chemical
`vapor deposition and/or molecular beam epitaxy. The
`LED layers that form an LED structure may consist of
`a light-emitting active layer, upper and lower confining
`25
`layers, current spreading and light extraction layers and
`one or more buffer layers, but this is not critical.
`Following the growth of the LED structure, the
`temporary absorbing growth substrate has completed
`its purpose of allowing the formation of high-quality
`30
`epitaxial layers. The growth substrate is preferably re
`moved, since the absorbing growth substrate has an
`energy gap that is less than or equal to the emission
`energy of the LED structure. Such a relationship be
`tween the energy gap and the emission energy of the
`35
`device would significantly limit the efficiency of the
`device. While the method of removing the temporary
`growth substrate is not critical, alternatives include
`chemical etching, lapping/polishing, reactive ion etch
`ing, and ion milling. Removing the growth substrate
`may further include removal of a portion or all of the
`layer that contacts the absorbing substrate.
`A second substrate is then wafer bonded to the LED
`structure. In a preferred embodiment the second wafer
`is electrically conductive and is optically transparent.
`45
`As compared to the absorbing substrate, the transparent
`substrate is a performance-enhancing layer. Wafer
`bonding can occur at the uppermost or lowermost layer
`of the LED structure. Conventionally, the LED device
`includes electrodes at opposed ends for properly biasing
`50
`the p-n junction of the device, so that minimizing the
`resistivity at the interface of the transparent substrate
`and the grown layers is important. Utilizing compounds
`that include indium has been shown to aid in achieving
`desired ohmic characteristics. In addition to In-bearing
`55
`compounds, other compounds with a high surface mo
`bility, high diffusivity, and/or superior mass transport
`properties (e.g., Hg-bearing, Cd-bearing and Zn-bear
`ing compounds) may provide advantages when used in
`solid-state wafer bonding applications.
`60
`One concern with employing the above-described
`method is that following removal of the temporary
`growth substrate, the remaining LED structure may be
`extremely thin, e.g., less than 10 um, and therefore
`fragile and difficult to handle. In a second embodiment,
`the temporary growth substrate is removed only after
`attachment of the second substrate to the uppermost
`layer of the LED structure. Utilizing wafer bonding of
`
`5,376,580
`4.
`the second substrate, rather than epitaxially growing
`the second substrate, permits attachment of a thick
`substrate, e.g.8 mils or more. This second substrate may
`be transparent and act as a performance-enhancing
`layer for optical extraction and current spreading and
`/or act only as a means for obtaining improved mechan
`ical stability during the steps of removing the growth
`substrate and performing a second wafer bonding of a
`transparent substrate at the side of the LED structure
`from which the growth substrate was removed. If only
`mechanical stability is desired, this second substrate
`may be subsequently removed after the second wafer
`bonding step is performed.
`While the clearest use of the wafer bonding technique
`is one in which an optically absorbing substrate is re
`moved and replaced with an optically transparent sub
`strate, this is not critical. The temporary growth sub
`strate may be a transparent substrate having a low elec
`trical conductivity that limits its current spreading abil
`ity. Such a substrate would ultimately limit the effi
`ciency of the LED. Thus, removal of the temporary
`transparent growth substrate for replacement by a
`transparent substrate having a higher electrical conduc
`tivity would improve the performance of the device.
`Similarly, one absorbing layer having a low electrical
`conductivity may be replaced with an absorbing layer
`having a higher electrical conductivity.
`The above-described method forms a light emitting
`semiconductor device having a wafer-bond layer. A
`"wafer bond layer' is defined herein as a layer or sub
`strate that exhibits the properties that are characteristic
`of a layer that has undergone wafer bonding. It is be
`lieved that one such characteristic is a different nature
`of misfit dislocations formed at the wafer bonded inter
`face, compared to an epitaxially grown mismatched
`heterointerface. An interface that has undergone wafer
`bonding has been observed to exhibit misfit dislocations
`which primarily consist of "edge dislocations," i.e. dis
`locations whose Burgers vector lies in the plane of the
`wafer bonded interface. These properties are in contrast
`to an epitaxially grown mismatched interface, which
`typically exhibits a much higher density of "threading
`dislocations,’ i.e. dislocations which are not confined to
`the plane of the mismatched interface and tend to prop
`agate perpendicular to the interface.
`In another embodiment of the present invention, lay
`ers are epitaxially grown on a first growth substrate that
`is not necessarily removed at a later time. Many Al
`bearing III-V semiconductors are unstable in moist
`ambients and will undergo degradation by hydrolysis.
`Such degradation may cause reliability problems for
`LEDs containing Al-bearing III-V epitaxial layers of
`significant thickness. For example, an AlGaAs LED
`such as the one shown in FIG. 3 will undergo signifi
`cant degradation as a result of oxidation of the high
`Al-composition layer 28 during wet high-temperature
`reliability testing. This degradation may potentially be
`reduced by employing wafer bonding. For example, the
`majority of the thickness of the high Al-composition
`layer 28 may be replaced by a thick optically transpar
`ent, electrically conductive wafer-bond layer which
`does not contain a high composition of Al. In like man
`ner, a wafer-bond layer of Gap may be substituted for a
`major portion of the transparent substrate 24. That is, it
`is possible to employ the wafer bonding technique to
`achieve passivation.
`In another embodiment, an electrically conductive
`mirror can be wafer bonded to the LED layers that
`
`65
`
`Cree Exhibit 1008
`Page 16
`
`

`

`O
`
`5,376,580
`5
`6
`form the LED structure. Light emitted in the direction
`FIG. 10 is a side view of another embodiment of
`of the mirror is then reflected back to the LED struc
`attaching a wafer-bond substrate to the LED structure
`ture so as to improve the efficiency of the device. In this
`of FIG. 5.
`embodiment, the mirror is typically supported by a
`FIG. 11 is a side view of the LED structure of FIG.
`substrate, which may be an absorbing substrate or a 5
`5 attached to a mirror by the use of wafer bonding
`techniques.
`transparent substrate, since light does not reach the
`substrate itself.
`FIG. 12 is a side view of a stacked LED device.
`Wafer bonding can also be used to provide increased
`FIGS. 13-17 are side views of LED devices utilizing
`mechanical and/or thermal stability, regardless of any
`patterned layers that are wafer bonded.
`optical benefits. For example, a robust III-V semicon
`FIG. 18 is an exploded view of a wafer bonding appa
`ratus for carrying out the steps of the present invention.
`ductor wafer or a SiC wafer can be bonded to a II-VI
`LED structure to add stability.
`FIG. 19 is a graph of temperature profiles for operat
`In yet another embodiment, at least one of the wafer
`ing the apparatus of FIG. 18.
`surfaces to be wafer bonded is patterned in a manner to
`FIG. 20 is a schematic view of an alternate apparatus
`selectively vary the electrical and/or optical properties
`for carrying out the steps of the present invention.
`15
`of the wafer. For example, depressions may be formed
`FIGS. 21 and 22 are different embodiments of graph
`at selected areas prior to wafer bonding to define de
`ite members for use with the apparatus of FIG. 20.
`sired current paths to the active region of the LED.
`BEST MODE FOR CARRYING OUT THE
`Possible applications include, but are not limited to,
`INVENTION
`reducing light directed at metallized electrodes for ap
`20
`plying voltages to LEDs and simplifying the fabrication
`With reference to FIG. 4, a first step in carrying out
`of spot emitters. Patterning may also be used to vary
`the invention is to select a substrate 30 onto which a
`optical properties along the wafer surface, so as to redi
`plurality of LED layers will be sequentially grown. In a
`rect light in a desired manner.
`preferred embodiment, the substrate 30 is a temporary
`As noted above, the wafer-bond interface is prefera
`growth substrate which is removed subsequent to fabri
`25
`bly one having a low electrical resistivity and good
`cation of the LED layers. In this embodiment the elec
`mechanical strength. It has been discovered that van
`trical and optical properties of the substrate are irrele
`der Waals forces are typically ineffective in obtaining
`vant to the operation of the LED to be fabricated, so
`the desired ohmic characteristics and structural integ
`that the substrate can be selected solely for properties
`rity. It has also been discovered that a combination of 30
`which affect the growth of the LED layers. For exam
`pressure and high temperature processing more reliably
`ple, lattice matching is typically an important consider
`achieves the desired ohmic and mechanical characteris
`ation in the selection of the substrate. However, in some
`tics. In addition, the application of pressure at high
`embodiments the substrate may remain, so that proper
`temperatures allows the wafers to conform to each
`ties other than growth-compatibility are important to
`other, minimizing any problems which may result from 35
`these embodiments.
`unevenness of the wafer surfaces, especially for bonding
`An exemplary temporary growth substrate 30 is a
`relatively thick layers.
`GaAs substrate within the range of 250 to 500 um thick.
`An advantage of the present invention is that the
`Four LED layers 32, 34, 36 and 38 are then grown on
`performance of the resulting LED is enhanced. Both
`the growth substrate 30. The layers 32-38 may be.
`light extraction and current spreading can be improved. 40
`grown using any of a variety of known methods, includ
`ing liquid phase epitaxy, vapor phase epitaxy, metalor
`Another advantage is that a thick substrate of 8 mils or
`ganic chemical vapor deposition and molecular beam
`more can be formed in a cost efficient manner, since
`wafer bonding is not subjected to the limitations of
`epitaxy. The layers 32-38 form a double heterojunction
`epitaxially growing a substrate. The thick substrate
`LED, but the invention may be utilized with any type of
`provides improved handling and device mounting char- 45
`LED device.
`acteristics.
`The layer 32 directly above the growth substrate 30 is
`an n-doped buffer layer. Grown above the buffer layer
`BRIEF DESCRIPTION OF THE DRAWINGS
`is a lower confining layer of n-doped AlGanP. The
`FIG. 1 is a side view of a prior art, single heterojunc
`lower confining layer 34 has an exemplary thickness of
`tion LED device having an absorbing substrate.
`800 nanometers.
`50
`FIG. 2 is a side view of a prior art, double heterojunc
`An active layer 36 of AlGanp is grown to an exem
`tion LED device having an absorbing substrate.
`plary thickness of 500 nanometers. An upper confining
`FIG. 3 is a side view of a prior art, double heterojunc
`layer 38 of p-doped AlGalnP then completes the struc
`tion LED device having a transparent substrate.
`ture of FIG. 4. The upper confining layer has an exem
`FIG. 4 is a side view of a double heterojunction LED
`plary thickness of 800 nanometers. Optionally, a win
`55
`device having a temporary growth substrate in accor
`dow layer that is transparent and that has a higher elec
`dance with the present invention.
`trical conductivity than the layers 34, 36 and 38 may be
`FIG. 5 is a side view of an LED structure having the
`grown atop the upper confining layer 38 in order to
`growth substrate of FIG. 4 removed.
`promote current spreading, thereby enhancing the per
`FIG. 6 is a side view of the LED structure of FIG. 5
`formance of the resulting structure. Such a window
`having a permanent substrate attached using wafer
`layer is described in U.S. Pat. No. 5,008,718 to Fletcher
`bonding techniques.
`et al.
`FIG. 7 is a side view of the structure of FIG. 6 having
`Some degree of optical absorption and electrical re
`electrodes on opposed sides.
`sistivity can be tolerated in the grown layers 32-38,
`since these layers are sufficiently thin that less than
`FIG. 8 is a side view of an alternative LED structure
`fabricated by wafer bonding.
`optimal characteristics will not seriously compromise
`device performance. However, an optically absorptive
`FIG. 9 is a side view of a third embodiment of attach
`ing a wafer-bond substrate to the device of FIG. 4.
`temporary growth substrate 30 will clearly affect per
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`Page 17
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`15
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`10
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`5,376,580
`7
`8
`prior to wafer bonding. Such an epitaxial buffer layer
`formance. Referring now to FIG. 5, the growth sub
`strate has been removed, leaving the LED structure
`may also be utilized with a substrate that replaces the
`formed by the grown layers 32–38. Removal of the
`growth substrate 30 at the bottom of the buffer layer32.
`growth substrate can be accomplished in various ways,
`In another embodiment, the device of FIG. 4 may be
`including chemical etching, lapping/polishing, reactive
`a conventional structure having the layers 32-38grown
`ion etching, ion milling, or any combination thereof. As
`on a transparent or absorbing substrate 30. The wafer
`will be described more fully below, the method of re
`bond layer 48 of FIG.8 would then be a thick, electri
`moving the substrate is not critical so long as a clean,
`cally conductive, optically transparent layer, such as
`planar surface is presented following the removal. In
`the current-spreading window layer described above
`addition to the growth substrate, the buffer layer 32
`with reference to U.S. Pat No. 5,008,718 to Fletcher et
`may be wholly or partially removed and the lower
`al. Furthermore, after bonding the top layer 48, it is also
`confining layer may be partially removed.
`possible to remove the original growth substrate 30 and
`Following removal of the temporary growth sub
`wafer bond another performance-enhancing substrate
`strate, a performance-enhancing substrate is bonded to
`to the bottom of the remaining structure for reasons of
`either the lowermost layer 32 or the uppermost layer 38
`improving optical extraction and/or current spreading.
`of the LED structure 40 shown in FIG. 5. The location
`Moreover, the device of FIG. 4 may have a conven
`of the wafer to be bonded depends upon the LED struc
`tional transparent layer 30 that possesses a low electri
`ture 40 and the electrical and optical properties of the
`cal conductivity, limiting the current spreading ability
`grown layers 32-38 and/or the substrate to be bonded.
`of the device. In this circumstance, it would be desirable
`A wafer bonding technique is employed. Wafer bond
`20
`to wafer bond a transparent substrate having a higher
`ing offers a number of advantages over other methods
`electrical conductivity. The increase in electrical con
`of providing a performance-enhancing substrate to an
`ductivity would improve the performance of the de
`LED.
`vice. The substitute transparent substrate should be
`FIG. 6 illustrates an embodiment in which an electri
`wafer bonded to the exposed LED layers with low
`cally conductive, optically transparent substrate 42 has
`25
`electrical conductivity. The substitute transparent sub
`been wafer bonded to the buffer layer 32. The wafer
`strate having the higher electrical conductivity could be
`bonding offers the advantage that a transparent sub
`wafer bonded to the LED structure either before or
`strate may be provided without requiring the growth of
`after removal of the transparent layer with low electri
`such a substrate. Preferably, the wafer bonded transpar
`cal conductivity.
`ent substrate 42 has a thickness exceeding 8 mils. Grow
`30
`Similarly, temporary growth absorbing substrates
`ing a substrate having a comparable thickness would be
`may be replaced with absorbing substrates having a
`difficult or impossible utilizing conventional techniques,
`higher electrical conductivity. While the use of wafer
`and would require an extremely long time. Because
`bonding to attach an absorbing layer is not the preferred
`only the relatively thin layers 32-38 of the LED struc
`embodiment, such wafer bonding would indeed im
`ture 40 need to be grown, epitaxial growth times can be
`35
`prove the performance of the LED device.
`drastically reduced, thereby maximizing throughput.
`Referring now to FIG. 9, wafer bonding may also be
`Moreover, the wafer bonding process provides a thick
`employed in providing passivation to the structures of
`device having enhanced mechanical properties, as com
`either FIG. 4 or FIG. 6. Many Al-bearing III-V semi
`pared to transparent substrates which are epitaxially
`conductors are unstable in moist ambients, since such
`grown. Because the resulting LED devices are easier to
`semiconductors are susceptible to degradation by hy
`handle and less susceptible to breakage, fabrication is
`drolysis. The degradation may cause reliability prob
`made easier and device yields are increased. Wafer
`lems in LEDs containing Al-bearing III-V epitaxial
`bonding may also be utilized to displace the p-n junction
`layers 30-38 of significant thickness. For example, deg
`from the bottom of the device, so as to reduce the possi
`radation may result from oxidation of the high Al-bear
`bility of short-circuiting the device when it is mounted
`45
`ing confining layer 38 during wet, high-temperature
`in conductive silver-loaded epoxy, as is conventional in
`use. The degradation can be retarded if the majority of
`the art.
`the Al-bearing layer is replaced by a thick optically
`Referring now to FIG. 7, the remainder of the fabri
`transparent, electrically conductive wafer bond layer
`cation process involves standard LED techniques. An
`that does not contain a high Al composition. For exam
`electrode 44 is formed on the upper confining layer 38,
`50
`ple, the wafer-bond layer 50 may be Gap.
`as for example by evaporation. A typical material for
`Returning to FIG. 6, the desired electrical connec
`forming the electrode is a gold-zinc alloy. A second
`tion between the transparent substrate 42 and the LED
`electrode 46 is formed on the transparent substrate 42.
`Again, evaporation may be used, but this is not critical.
`structure 40 can be ensured by utilizing a metallization
`A typical material is gold-germanium alloy.
`scheme. For example, thin contact areas can be formed
`55
`on the upper surface of the substrate 42 to be wafer
`In some circumstances, it may be desirable, or even
`necessary, to modify the above-described process to
`bonded. Corresponding contact areas can be formed on
`accommodate wafer bonding.