`IPR2018‐01460
`
`U.S. Patent No. 9,024,418
`December 12, 2019
`
`1
`
`
`
`’418 Patent | Technology Overview
`
`2
`
`
`
`’418 Patent | Technology Overview
`
`’418 Patent Figures 4A and 4B
`
`’418 Patent at 6:52‐64
`
`PO Resp. at 4‐5
`3
`
`
`
`’418 Patent | Technology Overview
`
`’418 Patent Figures 4A and 4B
`
`’418 Patent at 6:64‐7:3
`
`PO Resp. at 4‐5
`4
`
`
`
`’418 Patent | Technology Overview
`
`’418 Patent Figures 4A and 4B
`
`’418 Patent Claim 1; see also Claims 12 and 17
`
`PO Resp. at 4‐5
`5
`
`
`
`’418 Patent | Technology Overview
`
`’418 Patent Figures 4A and 4B
`
`’418 Patent Claims 2‐5
`
`PO Resp. at 4‐5
`6
`
`
`
`Rashed | Comparison to ‘418 Patent
`
`• Rashed’s power rails do not meet independent Claims 1, 12, 17
`– Based on undisputed “configured to” / “forming … to” and “means for” coupling construction
`• No coherent mapping of additional recitations of dependent Claim 5
`• Rashed’s power rails not within continuous diffusion region (Claims 4, 15, 20)
`– Only basis to modify Rashed as proposed is improper hindsight
`
`Pet.’s Annotation of Rashed Figure 5A (Pet. at 18)
`
`’418 Patent Figures 4A and 4B
`
`PO Resp. at 49‐76
`7
`
`
`
`Rashed | Petitioner’s Mapping
`
`• Petitioner’s mapping:
`– “first gate layer” to “isolating electrode”
`150PG or 150NG
`– “gate‐directed local interconnect” to
`“conductive contact” 190P or 190N
`– “diffusion‐directed local interconnect
`configure to couple …” to “power rail”
`140P or 140N
`• “conductive contact” 192P or
`192N not mapped
`
`Petitioner’s Annotation of Figure 5A (Pet. at 18)
`
`Pet. at 20‐30; PO Resp. at 51
`8
`
`
`
`Rashed | Overview
`
`Petitioner Does Not Assert that FIG 4A is a separate embodiment from FIG 5A
`
`Petition at 17
`74. Given this relationship between Figures 4A and 5A, a
`person of ordinary skill in the art would not interpret Figures
`4A as disclosing any alternative or different structural
`arrangement from Figure 5A. … [A] person of ordinary skill
`in the art would not interpret Figure 4A as suggesting Rashed
`discloses power rail 140H and isolating electrode 150PG are
`connected with no intervening structure. Such a conclusion
`would be directly contrary to Figures 5A and 5A-B and the
`accompanying text ….. Rather, a person of ordinary skill in
`the art would simply conclude that Figure 4A (and Figure 4B,
`which has the same level of detail) do not contain sufficient
`detail as to that aspect.
`
`Lall Dec. (EX2002) at ¶ 74
`PO Resp. at 54‐56
`9
`
`Pet.’s Annotation of Rashed Figure 5A (Pet. at 18)
`
`
`
`Claim Construction | “Configured To” / “Forming … To” (Claims 1 and 10)
`
`Undisputed: Claims 1 and 12 require that a purported “diffusion‐
`directed local interconnect” be designed to couple as recited
`Claim 1: a diffusion-directed local interconnect layer
`Claim 12: forming a diffusion-directed local interconnect
`configured to couple the first gate layer to one of the first
`to couple one of the first and second gate-connected local
`and second gate-directed local interconnects
`interconnects to the first gate layer
`
`Based on the foregoing, Patent Owner presents persuasive arguments and
`credible evidence to support a finding that “configured to” and “adapted to”
`should be construed narrowly. As such, we construe the terms “configured to”
`and “adapted to” as “requiring structure designed to or configured to
`accomplish the specified objective, not simply that they can be made to
`serve that purpose.” PO Resp. 5–6 (quoting Aspex Eyewear, 672 F.3d at 1349).
`Acclarent, Inc. v. Ford Albritton, IV, IPR2017‐00498, slip op. at 16 (PTAB July 9, 2018) (Paper 40)
`(quoting Aspex Eyewear, Inc. v. Marchon Eyewear, Inc., 672 F.3d 1335, 1349 (Fed. Cir. 2012))
`PO Resp. at 7‐10
`10
`
`
`
`Rashed | Power Rail Design
`
`Pet.’s Annotation of Rashed Figure 5A (Pet. at 18)
`
`Lall Dec. (EX2002) at ¶ 77
`
`PO Resp. at 49‐50, 56‐59
`11
`
`
`
`Rashed | Power Rail Design
`
`• Rashed explicitly describes coupling design of other components
`With continuing reference to FIGS.5A-5C, in one
`illustrative embodiment, [a] the device level contacts 175
`that contact the source regions 120S of the transistors
`120P2 and 120P3 are conductively coupled to [b] the
`power rail 140H [c] by a plurality of conductive contacts
`190P and
`[a]
`150PG is
`the
`isolating
`electrode
`conductively coupled to [b] the power rail 140H [c] by a
`conductive contact 192P.
`
`Rashed (EX1005) at 7:26‐32
`– But Rashed never states that [a] isolating electrodes 150 are conductively
`coupled to [b] conductive contacts 190 [c] by power rail 140
`
`PO Resp. at 49‐50
`12
`
`
`
`Rashed | Failure of Mapping Claims 1 and 12
`
`Claim 12: forming a diffusion-directed local
`Claim 1: a diffusion-directed local interconnect
`interconnect to couple one of the first and second
`layer configured to couple the first gate layer to
`gate-connected local interconnects to the first gate
`one of the first and second gate-directed local
`interconnects
`
`ylayer
`[W]e construe the terms “configured to” and “adapted to” as “requiring
`structure designed to or configured to accomplish the specified objective,
`not simply that they can be made to serve that purpose.”
`Acclarent, Inc. v. Ford Albritton, IV, IPR2017‐00498, slip op. at 16 (PTAB July 9, 2018) (Paper 40)
`(quoting Aspex Eyewear, Inc. v. Marchon Eyewear, Inc., 672 F.3d 1335, 1349 (Fed. Cir. 2012)).
`
`EX2002 at Para. 77
`
`PO Resp. at 49‐50, 56‐59
`13
`
`
`
`Claim Construction | “Means for Coupling …” (Claim 17)
`Agreed Corresponding Structure
`“a diffusion-directed local
`interconnect as
`described at 7:8-12, Fig. 4A, 3:9-14, Fig. 4B,
`3:15-19, 7:12-16, 5:62-64, 6:36-39, 8:9-11,
`2:48-52, Figs. 5A, 5B, 6A, 7A, or 7B, and
`equivalents thereof.”
`
`Claim 17: means for coupling the gate-directed
`local interconnect to the third gate layer
`
`EX2001 at 26‐28
`
`PO Resp. at 6‐7
`14
`
`
`
`Rashed | Failure of Mapping Claim 17
`• The Power Rails of Rashed are not the same as interconnect 450
`or any other corresponding structure of the ‘418 Patent
`– Petitioner does not even argue equivalents
`
`Pet.’s Annotation of Rashed Figure 5A (Pet. at 18)
`
`PO Resp. at 60‐61
`15
`
`
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`Rashed | Failure of Mapping Claim 5
`
`Petitioner fails to provide a coherent mapping of all elements of
`Claim 5
`
`Pet.’s Annotation of Rashed Figure 5A (Pet. at 18)
`
`’418 Patent Claim 5
`
`PO Resp. at 62‐64; PO Sur‐Reply at 17‐18
`16
`
`
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`Rashed | Failure of Mapping Claim 5
`
`The Petition fails to identify any structure in Rashed as the recited
`“power supply node”
`The Petition’s annotated FIG. 5A‐A
`does not show a “power supply node.”
`
`Petition at 40
`
`Petition at 41
`
`PO Resp. at 62‐64
`17
`
`
`
`Rashed | Failure of Mapping Claim 5
`
`The Petition fails to identify any structure in Rashed as the recited
`“power supply node”
`Cited sections of Rashed never
`reference a “power supply node.”
`
`Petition at 40
`
`EX1005 at 5:17‐23
`
`EX1005 at 8:18‐32
`PO Resp. at 62‐64
`18
`
`
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`Rashed | Failure of Mapping Claim 5
`
`The Reply’s assertion that Rashed’s power rails are also the“power
`supply node” is untimely and nonsensical
`
`Petition describes “power
`supply node” and “power rail”
`separately
`
`Petition at 40
`
`Reply still fails to identify “power supply
`node” in Rashed, instead arguing that
`the “power supply node” and “power
`rail” need not “be distinct structures”
`
`PO Resp. at 62‐64; PO Sur‐Reply at 17‐18
`
`Pet. Reply at 23‐24
`
`19
`
`
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`Rashed + Lu Combination | No Motivation to Modify Rashed (Claims 4, 15, 20)
`• Petitioner concedes that Rashed’s power rails are not “positioned
`within a footprint for the continuous diffusion region”
`– Prior art does not suggest removing (or moving) power rails
`Rashed
`Lu
`Rashed
`
`Pet. at 63
`
`Ex. 1006
`
`Pet. at 63
`PO Resp. at 65‐76
`20
`
`
`
`Rashed + Lu Combination | No Motivation to Modify Rashed (Claims 4, 15, 20)
`• Once the required power rails are shown in “Modified” Rashed,
`there is no “area reduction” to motivate modifying Rashed
`– And with power rails, no reason to add “modified” structures
`
`Moreover, it would have been obvious to
`APOSITA to modify the teachings of
`Rashed in view of Lu to reduce the area
`(chip real estate) being utilized by the
`various
`semiconductor
`devices
`and
`elements in device 100. Dec., ¶[xx].
`Petition at 64
`
`PO Response at 65‐76
`
`21
`
`
`
`’418 Patent | Swear Behind
`
`Inventor Nallapati Dec. (EX2060) at ¶ 2;
`see also Inventor Zhu Dec. (EX2061) at ¶ 2
`
`EX2006 at 1
`
`PO Resp. at 11‐49
`22
`
`
`
`’418 Patent | Swear Behind
`
`• Primary swear‐behind proof not disputed
`– No dispute that Qualcomm proved DUT16 structure defined in GDS file
`embodies all elements of all Swear‐Behind claims except one disputed
`element of a single dependent claim
`– No dispute that Qualcomm proved January 17, 2012 date of GDS file
`– No dispute that Qualcomm proved that fabricated test chips include DUT16
`structure as defined in GDS file
`– No dispute that Qualcomm proved diligence from before Rashed filing date
`through latest identified reduction to practice
`
`PO Resp. at 11‐49; Pet. Reply at 4‐19; PO Sur‐Reply at 3‐4
`23
`
`
`
`’418 Patent | Swear Behind
`
`Swear-Behind requires either: [a] reduction to practice prior to the effective date of the
`reference, or [b] conception of the invention prior to the effective date of the reference
`coupled with due diligence from prior to said date to a subsequent reduction to practice
`37 CFR § 1.131(b)
`June 28 – September 21
`Numerous Reductions to Practice:
`Multiple fabrication and testing
`milestones of multiple test chip batches
`
`January 17
`Corroboration of Conception:
`Finalized GDS file including test
`structures (DUT16) embodying
`Swear‐Behind Claims,
`corroborating conception
`between August 2011 and
`January 2012
`
`Jan
`
`Feb
`
`Mar
`
`Apr
`
`May
`
`Jun
`
`PO Resp. at 11‐49
`
`July 2
`Rashed filing date
`
`Demonstrated Diligence
`Activities
`Aug
`
`Jul
`
`2012
`
`Sep
`
`Oct
`
`Nov
`
`Dec
`
`December 31
`Lu Provisional filing date
`24
`
`
`
`’418 Patent | Swear Behind
`
`Reduction to Practice requires: (1) an embodiment of the invention was
`constructed that meets all the limitations of the claims at issue; and (2) the
`inventor appreciated that the invention would work for its intended purpose.
`Cooper v. Goldfarb, 154 F.3d 1321, 1327 (Fed. Cir. 1998)
`
`January 17
`Corroboration of Conception:
`Finalized GDS file including test
`structures (DUT16) embodying
`Swear‐Behind Claims.
`
`May 24
`Test results: Inventors receive
`M1 WAT testing of ML4 and ML5
`test structures.
`June 28
`Fabrication milestone: 1st Test
`Lot fabrication completed
`through M6 layer.
`
`September 21
`Test results: Nallapati presentation
`of successful DUT16 performance
`
`Jan
`
`Feb
`
`Mar
`
`Apr
`
`May
`
`Jun
`
`2012
`
`Jul
`
`Aug
`
`Sep
`
`Oct
`
`Nov
`
`Dec
`
`PO Resp. at 11‐49
`
`July 2
`Rashed filing date
`
`December 31
`Lu Provisional filing date
`25
`
`
`
`’418 Patent | Swear Behind – Corroborating Evidence
`
`• No case law requires corroborating evidence of inventorship
`– Petitioner’s cited cases say nothing about corroboration of inventorship
`But as the Board noted, “there are no indicia in either the body or header of
`the email indicating a file is attached, let alone a file entitled ‘mechanics6’.”
`… Apator attempts to corroborate Mr. Drachmann’s testimony with the emails
`and the drawings, but the emails and drawings can only provide that
`corroboration with help from Mr. Drachmann’s testimony.
`Apator Miitors v. Kamstrup, 887 F.3d 1293, 1296 (Fed. Cir. 2018)
`
`The inventors declare that the drawings and prototypes depicted in Exhibits
`A–H were created on “a date prior to January 7, 2004.” J.A. 1182. But these
`dates are supported only by inventor testimony. Therefore, Exhibits A–H fail
`to independently corroborate any inventor testimony showing prior conception.
`Kolcraft Enterprises v. Graco, 927 F. 3d 1320, 1324‐25 (Fed. Cir. 2019)
`PO Sur‐Reply at 4‐6
`
`26
`
`
`
`’418 Patent | Swear Behind
`Undisputed: Qualcomm corroborated January 17, 2012 date of GDS file
`
`EX2006 ; see also Non‐Inventor Yang Dec. (EX2062) at ¶ 61
`
`EX2010; see also Non‐Inventor Yang Dec. (EX2062) at ¶ 62
`
`Non‐Inventor Yang Dec. (EX2062) at ¶ 59;
`see also Inventor Nallapati Dec. (EX2060) at ¶ 112,
`Inventor Zhu Dec. (EX2061) at ¶ 76
`
`PO Resp. at 12‐13
`
`27
`
`
`
`’418 Patent | Swear Behind – Corroborating Evidence
`
`• No case law requires corroborating evidence of inventorship
`
`But our case law does not require that evidence have a source independent
`of the inventors on every aspect of conception and reduction to practice;
`“such a standard is the antithesis of the rule of reason.”
`E.I. du Pont De Nemours & Co. v. Unifrax, 921 F.3d 1060, 1077 (Fed. Cir. 2019) (citing Cooper v. Goldfarb, 154 F.3d
`1321, 1331 (Fed. Cir. 1998))
`
`Moreover, corroboration may be provided by sufficient independent
`circumstantial evidence, and corroboration of every factual issue contested
`by the parties is not a requirement of the law.
`In re Jolley, 308 F.3d 1317, 1328 (Fed. Cir. 2002) (citing Cooper, 154 F.3d at 1330)
`
`PO Sur‐Reply at 4‐6
`
`28
`
`
`
`’418 Patent | Swear Behind – Corroborating Evidence
`
`Evidence shows including inventors part of Qulacomm 20 nm team
`
`Inventor Nallapati Dec. (EX2060) at ¶ 2;
`see also Inventor Zhu Dec. (EX2061) at ¶ 2
`
`Inventor Nallapati Dec. (EX2060) at ¶ 146
`
`PO Resp. at 12, 42‐45; PO Sur‐Reply at 6
`
`Ex. 2017 at 8
`
`29
`
`
`
`’418 Patent | Swear Behind – Corroborating Evidence
`
`Inventorship proven through submission of oath during prosecution.
`MPEP § 602.01(a); 35 U.S.C. § 115(a); 37 C.F.R. § 1.63(a)
`
`EX1002 at
`132‐134
`
`PO Sur‐
`Reply at 5
`
`30
`
`
`
`’418 Patent | Swear Behind – Corroborating Evidence
`The GDS screenshots are verified by Non‐Inventor Yang
`and Apple inspected the Native file
`Screenshots of GDS file made by
`Apple during Apple’s inspection
`
`PO Resp. at 13, PO Sur‐Reply at 6
`
`Non‐Inventor Yang Dec. (EX2062) at ¶ 7
`
`Ex. 1015
`
`31
`
`
`
`’418 Patent | Swear Behind – Physical Reduction to Practice
`
`No basis to discount TSMC fabrication at Qualcomm direction
`
`Qualcomm thus has not shown that the June 28, 2012 test chip, which was
`allegedly fabricated based on this GDS file, was created by or on behalf of the
`inventors.
`
`Petitioner’s Reply at 12
`
`Inventor Nallapati Dec. (EX2060) at ¶ 146
`
`PO Sur‐Reply at 6‐7
`32
`
`
`
`’418 Patent | Swear Behind – Recognition Invention Works for Intended Purpose
`
`ML4 and ML5 test structures targeted leakage current concerns with
`invention design
`
`Inventor Nallapati Dec. (EX2060) at ¶ 119‐120
`
`PO Resp. at 36
`33
`
`
`
`’418 Patent | Swear Behind – Recognition Invention Works for Intended Purpose
`
`• ML4 and ML5 test structures targeted leakage current concerns
`with invention design
`– These test results enabled inventors to appreciate the claimed design
`would work for its intended purpose
`
`Inventor Nallapati Dec. (EX2060) at ¶ 120, 143; see also Inventor Zhu Dec. (EX2061) at ¶ 105‐06
`
`PO Resp. at 36
`34
`
`
`
`’418 Patent | Swear Behind – Recognition Invention Works for Intended Purpose
`
`Inventor Nallapati’s recognition shown in September 2012
`presentation of test data of 78 samples is undisputed
`
`EX2056A.7
`
`Inventor Nallapati Dec. (EX2060) at ¶ 154
`
`PO Resp. at 39‐40
`35
`
`
`
`’418 Patent | Swear Behind – “Power Supply Node”
`
`Multiple declarants identified the DUT 16 metal 2 structure as a “power rail”
`
`Non‐inventor Ranganthan Dec. (EX2063) at ¶ 29
`
`Lall Dec. (EX2002) at ¶ 58
`
`Inventor Zhu Dec. (EX2061) at ¶ 64;
`see also Inventor Nallapati Dec. (EX2060) at ¶ 100
`
`PO Resp. at 24‐25, 35; PO Sur‐Reply at 10‐14
`36
`
`
`
`’418 Patent | Swear Behind – “Power Supply Node”
`
`Petitioner’s incomplete “tracing” fails to address Qualcomm’s
`evidence showing a “power rail” above the DUT 16 structure
`
`Pet. Reply at 19
`
`Pet. Reply at 18
`PO Sur‐Reply at 10‐14
`37
`
`
`
`’418 Patent | Swear Behind – “Power Supply Node”
`
`•
`
`•
`
`Petitioner’s incomplete “tracing” fails to address Qualcomm’s
`evidence showing a “power rail” above the DUT 16 structure
`Petitioner does not dispute:
`– A power rail is a “power supply node”
`– Qualcomm identified a metal layer 2
`structure arranged as required in claims
`Petitioner does not address:
`– Multiple declarants describing the metal
`layer 2 structure as a power rail
`– Any explanation of metal layer 2 structure is
`if not a power rail
`
`Pet. Reply at 18
`PO Sur‐Reply at 10‐14
`38
`
`
`
`’418 Patent | Swear Behind – “Power Supply Node”
`
`Dr. Nallapati did not “confirm[] that this view shows that metal layer 2, in fact, does not
`connect to the Vdd/Ground regions and therefore cannot be a power rail” as Petitioner alleges.
`
`Q.
`
`You agree, right, that the highlighted polygon on
`page 4 of Exhibit 1015 is not one of the Metal 2
`lines that you annotated with a red arrow in your
`declaration on page 49; correct?
`
`A.
`
`Correct.
`
`Nallapati Dep. (EX1016) at 191:7‐11
`
`Inventor Nallapati Dec. (EX2060) at p. 49
`
`Pet. Reply at 19; PO Sur‐Reply at 10‐14
`39
`
`
`
`
`
`
`Additional Slides
`
`Additional Slides
`
`40
`
`
`
`Claim Construction | Diffusion‐Directed Local Interconnect
`
`Agreed Construction of “Diffusion‐
`Directed Local Interconnect
`
`a local interconnect that has a polygonal footprint with
`a longitudinal axis that is parallel to the longitudinal
`axes of
`the polygonal
`footprints of
`the diffusion
`regions.
`
`EX2001 at 21
`
`’418 Pat at 4:39‐43
`
`PO Resp. at 10
`41
`
`
`
`Claim Interpretation | Claim 5
`
`Both experts: (1) recognize obvious error in “first gate layer for the second
`transistor” and (2) interpret as “first gate layer for the blocking transistor”
`Dr. Liu recognizes obvious error in Claim 5 language
`
`Liu Dec. (EX1003) at ¶ 82
`Dr. Liu maps Claim 5 to gate for blocking transistor
`
`Liu Dec. (EX1003) at ¶ 82
`
`’418 Patent Claims 2, 5
`PO Resp. at 10‐11; Lall Dec. (EX2002) at ¶ 43
`42
`
`
`
`Rashed | Overview
`
`Rashed Figure 5A/4A Embodiment
`
`Pet.’s Annotation of Rashed Figure 5A (Pet. at 18)
`
`PO Resp. at 49‐56
`43
`
`
`
`’418 Patent | Swear Behind
`Undisputed: The DUT16 structure of the test chip embodies all
`elements of all Swear Behind Claims other than one contested
`element of Dependent Claim 5
`
`PO Resp. at 13‐33; Pet. Reply at 16‐19; PO Sur‐Reply at 3
`44
`
`
`
`’418 Patent | Swear Behind
`Undisputed: The DUT16 structure defined in the GDS file was
`physically fabricated in the test chip
`
`Non‐Inventor Yang Dec. (EX2062) at ¶ 90; see also Inventor Nallapati Dec. (EX2060) at ¶ 146
`
`EX2016A
`
`EX2063 at ¶28 (Annotated Ex. 2016B.1 and Ex. 2016C.1)
`
`PO Resp. at 35
`45
`
`
`
`’418 Patent | Swear Behind
`Undisputed: Work continued with reasonably continuous diligence
`from July 2012 through September 2012 (and beyond)
`
`Inventor Nallapati Dec. (EX2060) at ¶ 161
`
`PO Resp. at 40‐49
`46
`
`