PRADEEP LALL
`John and Anne MacFarlane Endowed Professor, Mechanical Engineering
`Director, NSF-CAVE3 Electronics Research Center
`Technical-Council and Governing-Council, NextFlex Manufacturing Institute
`Auburn University, Auburn, AL; Tele: (334) 844-3424, Email: lall@auburn.edu
`
`
`EDUCATION
`Mechanical Engineering Ph.D. 1993
`University of Maryland, College Park
`Kellogg School of Mngt, Northwestern Univ Finance, Strategy
`M.B.A. 2002
`University of Maryland, College Park
`Mechanical Engineering M.S. 1989
`Delhi College of Engineering
`Mechanical Engineering B.E. 1988
`
`CURRENT POSITIONS HELD
`AUBURN UNIVERSITY
`2019 – Present
`John and Anne MacFarlane Endowed Distinguished Professor
`2008 – Present Director, NSF-CAVE3 Electronics Research Center
`2015 – Present
`Technical-Council, NextFlex Manufacturing Institute
`2017 – Present Governing-Council, NextFlex Manufacturing Institute
`
`PREVIOUS POSITIONS HELD
`AUBURN UNIVERSITY
`2015 – 2019
`John and Anne MacFarlane Endowed Professor
`2008 – 2015
`Thomas Walter Professor and Director
`2006 – 2008
`Thomas Walter Professor and Associate Director
`2005 – 2006
`Thomas Walter Associate Professor and Associate Director
`2004 – 2005
`Associate Professor and Associate Director
`2002 – 2004
`Associate Professor
`MOTOROLA, INC.
`2001 – 2002
`Distinguished Member of Technical Staff, Motorola, Inc., Illinois
`1999 – 2001
`Manager, Component & Interconnect Reliability Laboratory,
`Motorola, Inc., Illinois
`
`Senior Staff Engineer, Motorola, Inc., Illinois
`1997 – 1999
`Lead Engineer, Motorola, Inc., Florida
`1994 – 1997
`UNIVERSITY OF MARYLAND
`1992 – 1994
`Assistant Director,
`CALCE Electronic Packaging & Systems Center,
`University of Maryland, College Park, Maryland
`
`
`RESEARCH INTERESTS
`Semiconductor Packaging, Reliability, Diagnostics, Testing, Flexible Hybrid
`Electronics, Additively Printed Electronics, Prognostics Health Management, Harsh
`Environment Electronics, Electronics Failure Mechanisms, Modeling and Simulation
`
`Page 1 of 92
`
`Apple, Inc. v. Qualcomm Incorporated
`IPR2018-01460
`Qualcomm Ex. 2003
`
`

`

`AWARDS
`Awards and Honors:
`39 Awards
`Best-Paper Awards:
`32 Awards
`Engineering Awards:
`5 Awards
`Publication Awards:
`4 Awards
`US Patents:
`3 Patents
`PUBLICATIONS
`Conference Papers:
`507 Papers
`Journal Papers:
`
`69 Papers
`Books:
`2 Books
`
`Book Chapters:
`17 Chapters
`SELECTED NOTABLES:
`1. IEEE Electronic Packaging Society’s
`Outstanding Sustained Technical
`Contribution Award (2018)
`2. NSF-IUCRC Alex Schwarzkopf Prize
`for Technology Innovation (2016)
`3. Samuel-Ginn COE Senior Faculty
`Research Award (2016)
`4. Wright A. Gardner Award, Alabama
`Academy of Sciences (2016)
`5. IEEE Exceptional Technical
`Achievement Award (2014)
`6. Fellow of Alabama Academy of
`Sciences (2014)
`7. ASME-EPPD Applied Mechanics
`Award (2013)
`8. SMTA Member of Technical
`Distinction (2013)
`9. AU Creative Research and
`Scholarship Award (2013)
`10. Fellow, IEEE (2012)
`11. Fellow, ASME (2008)
`12. SEC Faculty Achievement Award
`(2013)
`13. Member, National Academies Panel,
`Electronic Vehicle Controls and
`Unintended Acceleration (2010)
`14. IEEE Reliability Society AdCom
`(2010-Present)
`INVITED LECTURES
`Keynote-Address: 7 (Intl Conferences)
`
`SUMMARY
`JOURNAL REVIEW & REVIEW
`PANELS
`1. Journal Editorships: 9-Appts
`2. Associate Editor, IEEE Transactions
`on Components Packaging and
`Manufacturing Technologies (TCPT)
`3. Associate Editor, IEEE Access
`Journal
`4. Reviewer for Major Journals in
`IEEE and ASME including ADVP,
`TCPT, TEPM, JEP
`7 Panels
`5. Review Panels:
`PROFESSIONAL SOCIETIES
`1. Conference & Session
`Chairmanships :120-Appts
`2. Member, IEEE Reliability Society
`AdCom, 2010 – present.
`3. Member, IEEE Reliability Society
`Fellows Selection Committee, 2013 –
`present.
`4. General Chair, IEEE PHM 2015
`5. Member, IEEE USA Government
`Relations Council, R & D
`Committee, 2013 – present.
`6. Chair, Congress Steering Committee
`Senate (2013)
`7. Congress Steering Committee Chair
`(2012-13)
`8. General Chair, ASME Congress
`(2010)
`9. Technical Program Chair, ASME
`Congress (2009)
`10. Technical Program Vice-Chair,
`ASME Congress (2008)
`11. Chair, SEM, Electronic Packaging
`TD (2008)
`12. SMTA Technical Committee (2010)
`13. Chair, IEEE ECTC Modeling &
`Simulation (2010)
`
`Page 2 of 92
`
`

`

`CITATION INDICES
`CITVVTICflqIDHDICEHS
`
`
`Cited by
`
`CHaflons
`
`h4ndex
`
`MCI-index
`
`8m092013
`
`3695
`
`31
`
`102
`
`
`
`HesearchGate members.
`
`Your score 1.9 higher ”than 92.5% of
`
`2011 2012 2013 2014 2015 2010 2017 2018
`
`
`
`
`
`PERCENTILE
`
`
`
`Page 3 of 92
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`

`

`AWARDS & HONORS
`
`3.
`
`7.
`
`3.
`
`1. Fellow of the NextFlex National Manufacturing Institute on Flexible Electronics
`(2019)
`
`2. Auburn University Research Advisory Board’s Advancement of Research and
`Scholarship Achievement Award (2018).
`
`IEEE Electronic Packaging Society’s Outstanding Sustained Technical
`Contribution Award (2018)
`
`4. NSF-IUCRC Alex Schwarzkopf Prize for Technology Innovation (2016)
`
`5. Samuel-Ginn College of Engineering Senior Faculty Research Award (2016)
`
`6. Wright A. Gardner Award, Alabama Academy of Sciences (2016)
`
`John and Anne MacFarlane Endowed Professor (2015)
`
`IEEE Exceptional Technical Achievement Award, IEEE CPMT Society (2014)
`
`8.
`
`9. Fellow of the Alabama Academy of Sciences (2014)
`
`10. ASME EPPD Applied Mechanics Award, American Society of Mechanical
`Engineers, (2013)
`
`
`11. Recipient of Member of Technical Distinction Award, Surface Mount Technology
`Association, SMTA (2013).
`
`
`12. Creative Research and Scholarship Award, Auburn University (2013)
`
`13. SEC Faculty Achievement Award (2013)
`
`14. Fellow of IEEE (2012)
`
`15. Member, National Academies Committee, Electronic Vehicle Controls and
`Unintended Acceleration (2010)
`
`
`16. Joint Appointment, Department of Finance, Auburn University (2009)
`
`17. Fellow of the ASME, (2008).
`
`18. Samuel Ginn College of Engineering Senior Faculty Research Award, Auburn
`University (2007).
`
`
`
`Page 4 of 92
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`

`

`19. Thomas Walter Professor, Samuel Ginn College of Engineering, Auburn
`University (2006)
`
`
`20. Thomas Walter Associate Professor, Samuel Ginn College of Engineering,
`Auburn University (2005)
`
`
`21. 6-σ (Six-Sigma) Black Belt in Statistics, Motorola, Inc. (2001)
`
`22. Beta Gamma Sigma Honorary Society. (2002)
`
`23. Jane Robertson Memorial Award Scholar, Northwestern University, (2000)
`
`24. iDen EAGLE Stock Award, Award for Spearheading Successful Implementation
`of 0.5mm Pitch Chip-Scale Packaging Technology in the iDen EAGLE Pocket
`Phone, February 1998.
`
`
`25. Silver Quill Award, Reliability Study of the Laminate Based Flip-Chip Chip-
`Scale Package, 2nd 1998 IEMT/IMC Symposium, April 15, 1998.
`
`
`26. Outstanding Innovation Award for 6 Patent Disclosures, 1997
`
`27. Silver Quill Award, Reliability Characterization of the SLICC Package, Pradeep
`Lall, Glenn Gold, Barry Miles, Kingshuk Banerji, Pat Thompson, Corey Koehler,
`Indira Adhihetty, Electronics Components and Technology Conference (ECTC),
`Orlando, Florida, May 28-31, 1996.
`
`
`28. Outstanding Innovation Award for 7 Patent Disclosures, 1996
`
`29. Outstanding Innovation Award for 9 Patent Disclosures, 1995
`
`30. President of International Society for Hybrid Microelectronics, Student Chapter
`at University of Maryland.(07/91-5/93)
`
`
`31. Vice-President of International Society for Hybrid Microelectronics, Student
`Chapter at University of Maryland. (07/90-06/91)
`
`
`32. Ranked 2nd of 120 students in B.S., Mechanical Engineering, 1988.
`
`33. Merit-Certificate for excellence in investigations on "Design and Analysis of
`Cooling Towers", B.S., Mechanical Engineering, 1988.
`
`
`34. Merit-Prize for Standing 1st in "Fluid Systems", B.E., Mechanical Engineering,
`VI Semester, August 1987.
`
`
`
`Page 5 of 92
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`

`

`35. Merit Certificate for Ranking 2nd in 120 students (2nd year B.E.) 1986.
`
`36. Merit-Prize for Standing 1st in "Engineering Mechanics", B.E., Mechanical
`Engineering, III Semester, March 1986.
`
`
`37. Merit-Certificate for Ranking 2nd in 120 students (1st year B.E.), 1985.
`
`38. Merit-Prize for - Standing 1st in "Electrical Technology", B.E., Mechanical
`Engineering, III Semester, March 1986.
`
`
`39. Merit-Prize for - Standing 1st in "Engineering Materials", B.E., Mechanical
`Engineering, II Semester, June 1985.
`
`
`40. Marker Cup for excellence in "Physics", 1983.Gold Medal and Certificate-of-
`Excellence for meritorious performance in school. (1972-1984).
`
`
`
`Best Paper Awards
`
`1. Outstanding Paper Award, Oral Session, Mechanics and Reliability Track, P.
`Lall, Y. Luo and L. Nguyen, A Novel Numerical Multiphysics Framework for the
`Modeling of Cu-Al Wire Bond Corrosion under HAST Conditions, ITHERM, San
`Diego, CA, US, pp. 1177-1184, May 29-June 1, 2018.
`
`2. Outstanding Paper-Award, Poster-Session, Mechanics and Reliability Track,
`Abrol, A., Lall, P., Flexible Power Source Survivability Assurance Under
`Bending Loads and Operating Temperatures Representative of Stresses of Daily
`Motion, Proceedings of the ITHERM Conference, San Diego, CA, US, pp. 1027-
`1035, May 29-June 1, 2018.
`
`3. Best Paper Award, Poster-Session, Mechanics and Reliability Track, A. Fahim,
`S. Ahmed, J. Suhling and P. Lall, Mechanical Characterization of Intermetallic
`Compounds in SAC Solder Joints at Elevated Temperatures, Proceedings of the
`ITHERM Conference, San Diego, CA, US, pp. 1081- 1091, May 29-June 1, 2018.
`
`4. Best Poster-Award, Zhang, H., Lall, P., Color Shift Analysis and Modeling of
`High Power Warn White pc-LED under High Temperature and High Humidity
`Environment, Mechanics and Reliability Track, Proceedings of the ITHERM
`Conference, Orlando, FL, May 30-June 2, 2017.
`
`5. Outstanding Poster-Award, Yadav, V., Lall, P., High Strain Rate Mechanical
`Behavior of SAC-Q Solder, Mechanics and Reliability Track, Proceedings of the
`ITHERM Conference, Orlando, FL, May 30-June 2, 2017.
`
`
`Page 6 of 92
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`

`

`7.
`
`6.
`
`2015 Best Paper -- IEEE Transactions on Components, Packaging and
`Manufacturing Technology in the Electronics Manufacturing category: Lall, P.,
`Patel, K., Narayan, K., Model for Inverse Determination of Process and Material
`Parameters for Control of Package-on-Package Warpage, IEEE Transactions on
`Components, Packaging and Manufacturing Technology, Volume 5, No. 9., pp.
`1358 – 1375, Sept 2015.
`
`2014-2015 ASME Journal of Electronic Packaging Best-Paper Award (2015); for
`paper: Lall, P., Lowe, R., Comparison of Prognostic Health Management
`Algorithms for Assessment of Electronic Reliability Under Vibration, ASME
`Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp.
`041013-1-to 041013-8, December 2014.
`
`8. Best Poster-Paper Award: Lall, P., Deshpande, S., Nguyen, L., Fuming Acid
`Based Decapsulation Process for Copper-Aluminum Wirebond System Molded
`with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME
`International Technical Conference and Exhibition on Packaging and
`Integration of Electronic and Photonic Microsystems (InterPACK), San
`Francisco, CA, pp. 1-13, July 6-9, 2015
`
`9. Outstanding Poster-Paper Award: Ahmed, S., M. Basit, J. C. Suhling, P. Lall,
`Characterization of Doped SAC Solder Materials and Determination of Anand
`Parameters, Paper IPACKICNMM2015-48624, 14-2-2, ASME International
`Technical Conference and Exhibition on Packaging and Integration of Electronic
`and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-14, July 6-9,
`2015
`
`10. Best-of-Conference Oral Session Paper: Hasnine, M., Suhling, J., Prorok, B.,
`Bozack, M., Lall, P., Exploration of Aging Induced Evolution of Solder Joints
`Using Nanoindentation and Microdiffraction, Electronic Components and
`Technology Conference, 64th ECTC, pp. 379-394, Orlando, FL, May 27-30, 2014,
`Award Presented at the 65th ECTC, 2015.
`
`11. Best Poster-Paper Award: Lall, P., Deshpande, S., Nguyen, L., Murtuza, M.,
`Damage Mechanisms in Copper-Aluminum Wirebond Under High Temperature
`Operation, 14th IEEE ITHERM Conference, pp. 1171-1178, Orlando, FL, May
`27-30, 2014.
`
`12. Best Poster-Paper Award: Lall, P., Harsha, M., Suhling, J., Goebel, K., Damage
`Pre-Cursors Based Prognostication of Accrued Damage and Assessment of
`Operational Readiness of Lead-free Electronics, Proceedings of the ASME 2013
`International Technical Conference & Exposition on Packaging and Integration
`of Electronic and Photonic Microsystems, InterPACK2013-73251, pp. 1-17,
`Burlingame, CA, 2013.
`
`Page 7 of 92
`
`

`

`
`13. Best-of-Conference Award: Lall, P., Patel, K., Lowe, R., Strickland, M., Blanche,
`J., Geist, D., Montgomery, R., Modeling and Reliability Characterization of
`Area-Array Electronics Subjected to High-G Mechanical Shock Up to 50,000G,
`Proceedings of the 62nd ECTC, pp. 1194 – 1204, May 29-June 1, 2012.
`
`
`14. Best-of-Conference Award: Cai, Z., Zhang, Y., Suhling, J., Lall, P., Johnson, R.
`W., Bozack, M., Reduction of Lead Free Solder Aging Effects using Doped SAC
`Alloys, 60th ECTC, Las Vegas, Nevada, pp. 1493-1511, June 1-4, 2010.
`
`
`15. Best-of-Conference Award: Lall, P., Vaidya, R., More, V., Goebel, K.,
`Interrogation Of Damage-State In Lead-Free Electronics Under Sequential
`Exposure To Thermal Aging And Thermal Cycling, SMTAI Technical Conference,
`Orlando, FL, pp. 405-418, Oct 24-28, 2010.
`
`
`16. Best Poster Award, EPPD Poster Contest, Lowe, R., Lall, P., Prognostication
`based on Resistance Spectroscopy for High Reliability Electronics in Shock
`Impact, ASME International Mechanical Engineering Congress and Exposition,
`Lake Buena Vista, Florida, Nov 13-19, 2009
`
`
`17. Second-Place Poster Award, EPPD Poster Contest, EPPD Poster Contest,
`Vaidya, R., More, V., Lall, P., Prognostication of Leadfree Electronics Subjected
`to Multiple Thermal Environments, ASME International Mechanical
`Engineering Congress and Exposition, Lake Buena Vista, Florida, Nov 13-19,
`2009
`
`
`18. Best Session Paper Award, Lall, P., Lowe, R., Suhling, J., Goebel, K.,
`Prognostication for Impending Failure in Leadfree Electronics Subjected to
`Shock and Vibration Using Resistance Spectroscopy, IMAPS International
`Symposium on Microelectronics, San Diego, CA, pp. 195-202, Nov. 1-5, 2009
`
`
`19. Best-Poster Award, Lall, P, Gupta, P., Angral, A., Suhling, J., Anomaly-
`Detection and Prognostication of Electronics Subjected To Shock And Vibration,
`ASME InterPACK, pp. 1-15, San Francisco, CA, USA, July 19-23, 2009.
`
`
`20. Best Proceedings Paper Award, Lall, P., Iyengar, D., Shantaram, S.,
`Panchagade, D., Suhling, J., Survivability Assessment of SAC Leadfree
`Packaging Under Shock and Vibration using Optical High-Speed Imaging,
`Proceedings of the SMTAI, Orlando, Florida, pp. 519-531, Aug 17-21, 2008.
`
`
`21. Best Paper in Test and Measurement Track, Intermittency Detection and
`Mitigation in Ball Grid Array (BGA) Packages, Hofmeister, J.P., Lall, P.,
`Goodman, D., Ortiz, E.G., Adams, M.G.P., Tracy, T.A. , AUTOTESTCON,
`Baltimore, Inner Harbor, MD, pp. 40-49, Sept 17-20, 2007.
`
`Page 8 of 92
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`

`

`
`22. Best Student-Poster Award for Rahim, M. K., J. Roberts, J. C. Suhling, R. C.
`Jaeger, P. Lall, Die Stress Variation During Thermal Cycling Reliability Tests,
`ASME InterPACK Conference, Vancouver, British Columbia, Canada,
`IPACK2007-33548, pp. 1-12, July 8-12, 2007.
`
`
`23. Fundamentals of Delamination Initiation and Growth in Flip Chip Assemblies,
`M. K. Rahim, J. C. Suhling, R. C. Jaeger, and P. Lall, Proceedings of the 55th
`IEEE Electronic Components and Technology Conference, Orlando, FL, pp.
`1172-1186, June 1-3, 2005.
`
`
`24. Reliability of Harsh Environment Electronics Assembled on Metal-Backed
`Printed Circuit Boards, Islam, N., Lall, P., Shete, T., Gale, S., Suhling, J.,
`Proceedings of the SECTAM XXII, August 15 – 17, 2004.
`
`
`25. High I/O BGA Format Packages in Portable Communication Devices, P. Lall, C.
`Zhai, L. Leicht, Proceedings of the HERMES Symposium, Ft. Lauderdale, FL,
`October 9-13, 2000
`
`
`26. A Mesh-Free Approach for Numerical Simulation of Portable Electronic
`Products, P. Lall, W. Hao, Proceedings of the Simulation & Modeling Symposium,
`Phoenix, AZ, June 20-22, 2000
`
`
`27. Field-Failure Validation of Board Assembly Thermal Fatigue Reliability
`Predictions, P. Lall, H. Liebman, Proceedings of the HERMES Symposium,
`Austin, TX, Sept. 20-24, 1999.
`
`
`28. Reliability Forecasting System – Tool-Set for Reducing Product Development
`Cycle Time, P. Lall, K. Banerji, Proceedings of the Motorola Summer AMT
`Symposium, Schaumburg, IL, July 23-24, 1997;
`
`
`29. Reliability Characterization of the µBGA Package, P. Lall, E. Bradley, K. Banerji,
`Proceedings of the Motorola Summer AMT Symposium, Schaumburg, IL, July
`23-24, 1997
`
`
`30. Development of a System Model for Solder Joint Reliability, P. Lall, K. Banerji,
`Proceedings of the Motorola Winter AMT Symposium, Phoenix, AZ, January 15-
`19, 1996, pp.753-765
`
`
`31. Soldering Process Characterization to Evaluate Air Versus Nitrogen Reflow, E.
`Bradley, J. Galloway, P. Lall, K. Banerji, F. Alves, V. Goudarzi, L. Roscioli,
`Proceedings of the Motorola Winter AMT Symposium, Phoenix, Arizona,
`January 15-19, 1996, pp.565-574
`
`
`
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`

`

`32. Approval of an Immersion Nickel Gold Finish for the Eurotraveller Portable
`Radio, B. Lee, R. Callanan, E. Bradley, J. Gillette, P. Lall, K. Banerji,
`Proceedings of the Motorola Summer AMT Symposium, Schaumburg, IL July 24
`& 25, 1996, pp.425-432
`
`
`
`Highly Commended Paper Award
`
`1. Thermal Cycling Reliability of Lead Free Chip Resistor Solder Joints, Suhling,
`J., Gale, H. S., Johnson, W., Islam, M. N., Shete, T., Lall, P., Bozack, M., Evans,
`J., Seto, P., Gupta, T., Thompson, R., Soldering and Surface Mount Technology
`Journal, Vol. 16, No. 2, pp. 77 – 87, 2004.
`
`
`
`Engineering Awards
`
`1. Algorithm To Prevent CPU Overflow Condition, Pradeep Lall, Scott Potter,
`Engineering Award, 1997.
`
`
`2. Automated IC Package Pad Array Generation, Pradeep Lall, Scott Potter,
`Engineering Award, 1999.
`
`
`3. Method for Solder Joint Geometry Generation, Pradeep Lall, Kingshuk Banerji,
`Engineering Award, 1999.
`
`
`4. Method for Generating Map-meshable Areas and Volumes, Pradeep Lall,
`Kingshuk Banerji, Engineering Award, 1999.
`
`
`5. Method For Optimizing Electronic Component Solder Joint Geometry, Pradeep
`Lall, Kingshuk Banerji, Engineering Award, 1999.
`
`
`
`U.S. Patents
`
`1. Method and Apparatus for Extending Fatigue Life of Solder Joints in
`Semiconductor Device, Lall, P., US Patent No. 6,444,563, 2002 (with Potter, S.,
`Gillette, J., Galloway, J., Johnson, Z.)
`
`
`2. Surface Mountable Flexible Interconnect, Lall, P., US Patent No. 5,928,001,
`1999 (with Gillette, J., Potter; S.)
`
`
`3. Flexible Connector For Circuit Boards, Lall, P., US Patent No. 5,742,484, 1998.
`(with Gillette, J., Potter; S., Lall, P.)
`
`
`
`
`Page 10 of 92
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`

`

`Publication Awards
`
`1. Method To Compensate For Shield And PCB Warpage, V. Goudarzi, P. Lall, P.F.
`Ang, Publication Award, 1997.
`
`
`2. Method to Increase µBGA Reliability and Solder Yields, S. Potter, P. Lall, J.
`Gillette, J. Galloway, Publication Award, 1997.
`
`
`3. An Design Feature for Ensuring Resist Coverage, P. Lall, G. Thompson, S. Potter,
`K. Banerji, Publication Award, 1997.
`
`
`4. Tool and Process for BGA Solder Joint Failure Analysis, J. Gillette, K. Banerji,
`E. Bradley, J. Galloway, P. Lall, Publication Award, Vol.33, pp.52, Dec.1997.
`
`
`Page 11 of 92
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`

`

`SCHOLARLY CONTRIBUTIONS
`
`4.
`
`4.A Research and Creative Work
`
`Books and Book Chapters
`
`1. Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage
`and Remaining Useful Life in Field Deployed Electronics, P. Lall, M. Harsha, K.
`Goebel and J. Jones, in Book Titled - Cooling of Microelectronic and
`Nanoelectronic Equipment: Advances and Emerging Research edited by
`Madhusudan Iyengar, Karl J. L. Geisler and Bahgat Sammakia, 2014.
`
`2. Nano-underfills and Potting Compounds for Fine-Pitch Electronics, Lall, P.,
`Islam, S., Dornala, K., Suhling, J., Shinde, D.,
`in Nano-Packaging:
`Nanotechnologies in Electronics Packaging, edited by James Morris, pp. 513-574,
`Second Edition, Springer, 2018.
`
`3. Nano-Underfills for Fine-Pitch Electronics, Lall, P., Islam, S., Tian, G., Suhling,
`J., Shinde, D., in Nano-Packaging: Nanotechnologies in Electronics Packaging,
`edited by James Morris, pp. 287-323, Springer, 2008.
`
`
`4. Electronic Packaging Applications, Suhling, J., Lall, P., in Handbook of
`Experimental Solid Mechanics, edited by William Sharpe, pp. 1015-1044,
`Springer, 2008
`
`
`5. Mechanical Design of Electronic Systems, J. Dally, P. Lall, J. Suhling, 664 Pages,
`College House Enterprises, 2008.
`
`
`6. Cooling in Electronic Applications, P. Lall in - Handbook of Thermal
`Engineering edited by Frank Kreith, CRC Press, Boca Raton, Florida, pp.4-505,
`December 1999.
`
`
`7. Semiconductor Devices: Chip-Scale Packaging, P. Lall, in - Encyclopedia of
`Electrical and Electronics Engineering, edited by J. Webster, John Wiley & Sons,
`New York, NY, 1999.
`
`
`8. Estimating the Influence of Temperature on Microelectronic Reliability, by P.
`Lall, Pecht, M., Hakim, E., CRC Press, Inc., Boca Raton, Florida, 1997.
`
`
`9. Resistors, Pecht, M., Lall, P., in The Electrical Engineering Handbook, edited by
`Richard C. Dorf, CRC Press Inc., 2000 Corporate Blvd., N.W., Boca Raton,
`Florida, pp.5-15, 1997.
`
`
`
`Page 12 of 92
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`

`

`10. Quality Conformance and Qualification of Microelectronic Packages and
`Interconnects: A Focus On Reliability, edited by Michael Pecht, Abhijit
`Dasgupta, John Evans, Jillian Evans, contributing author, John Wiley and Sons,
`New York, New York, 1995.
`
`
`11. Plastic Encapsulated Microelectronics, edited by Michael Pecht, Lu Nguyen,
`Edward Hakim, contributing author, John Wiley and Sons, New York, New York,
`1995.
`
`
`12. Integrated Circuit, Hybrid and Multichip Module Package Design Guidelines: A
`Focus On Reliability, edited by Michael Pecht, contributing author, John Wiley
`and Sons, New York, New York, March 1994.
`
`
`13. Temperature Dependencies on Electromigration, Chapter 3, M. Pecht, P. Lall,
`in Electromigration and Electronic Device Degradation, edited by Aris Christou,
`John Wiley and Sons, Interscience Division, New York, NY, pp.79-104, 1993.
`
`
`14. Mechanics of Wire Bond Interconnects, M. Pecht, P. Lall, Chapter 22, in Thermal
`Stress and Strain in Microelectronics Packaging, edited by John Lau, Van
`Nostrand Reinhold, New York, NY, pp.729-802, 1993.
`
`
`15. Temperature Dependence on Integrated Circuit Failure Mechanisms, M. Pecht,
`P. Lall, E. Hakim, Chapter 2, in Advances in Thermal Modeling III, edited by A.
`Bar-Cohen and A. D. Kraus, IEEE and ASME Press, New York, NY, pp.61-152,
`1992.
`
`
`16. General Reliability Considerations as Applied to MMICs, Pecht, M., Lall, P., in
`Reliability of Gallium Arsenide MMICs, edited by Aris Christou, John Wiley and
`Sons, Baffins Lane, Chicester, Sussex, England, pp.41-60, 1992
`
`
`17. Electronic Components, Chapter 2, Harris, D.B., Pecht, M., Lall, P.; Printed
`Wiring Board Design and Fabrication, Chapter 3, Harris, D.B., Lall, P.;
`Interconnections and Connectors, Chapter 5, Lall, P., Pecht, M., in Handbook of
`Electronic Package Design, edited by Michael Pecht, Marcel Dekker, New York,
`N.Y. pp.39-100; 101-152; 239-292, 1991.
`
`
`
`Archival Journal Publications (Accepted or Published)
`
`1. Lall, P., Deshpande, S., Nguyen, L., Development of Model for Identification of
`Process Parameters for Wet Decapsulation of Copper-Aluminum Wirebond in
`PEMs, IEEE Transactions on Components, Packaging and Manufacturing
`Technology, Volume 7, Issue 8, pp. 1280-1292, August 2017
`
`
`Page 13 of 92
`
`

`

`2. Hasnine, M., Suhling, J.C., Prorok, B.C., Bozack, M.J., Lall, P., Anisotropic
`Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and
`Prediction of Uniaxial Creep Using Nanoindentation Creep, Experimental
`Mechanics, Vol. 57, pp. 603–614, 2017
`3. Lall, P., Zhang, D., Yadav, V., Locker, D., High strain rate constitutive behavior
`of SAC105 and SAC305 leadfree solder during operation at high temperature,
`Microelectronics Reliability, Volume 62, pp. 4-17, 2016.
`
`4. Lall, P., K. Mirza, M. Harsha, K. Goebel, Microstructural Indicators for
`Assessment of Effect of Prolonged and Intermittent Storage on Reliability of
`Lead-free Electronics, IEEE Transactions on Device and Materials Reliability,
`Vol. 16, No. 3, pp. 304 – 317, 2016
`
`5. Lall, P., Deshpande, S., L. Nguyen, M. Murtuza, Microstructural Indicators for
`Prognostication of Copper–Aluminum Wire Bond Reliability Under High-
`Temperature Storage and Temperature Humidity, IEEE Transactions on
`Components, Packaging and Manufacturing Technology, Vol 6, No. 4, pp. 569 –
`585, 2016.
`
`6. Lall, P., Mirza, K., Assessment of the Effect of Mean Temperature on Thermal
`Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure,
`SMTA Journal, Vol 28, No. 4, pp. 28-42, Dec 2015.
`
`7. Lall, P., Patel, K., Narayan, K., Model for Inverse Determination of Process and
`Material Parameters for Control of Package-on-Package Warpage, IEEE
`Transactions on Components, Packaging and Manufacturing Technology,
`Volume 5, No. 9., pp. 1358 – 1375, Sept 2015.
`
`8. Lall, P., Zhang, H., Assessment of Lumen Degradation and Remaining Life of
`Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter,
`ASME Journal of Electronic Packaging, Volume 137, No. 2, doi:
`10.1115/1.4028957, pp. 1-10, June 2015
`
`9. Lall, P., Sakalaukus, P., Davis, L., Reliability and Failure Modes of Solid-State
`Lighting Electrical Drivers Subjected to Accelerated Aging, IEEE Access
`Journal, Vol. 3, pp. 531-542, May 2015
`
`10. Lall, P., Wei, J., Prediction of L70 Life and Assessment of Color Shift for Solid
`State Lighting Using Kalman Filter and Extended Kalman Filter Based Models,
`IEEE Transactions on Device and Materials Reliability, Volume. 15, No.1, pp.
`54 - 68, pp. 1-15, March 2015.
`
`
`Page 14 of 92
`
`

`

`11. Lall, P., Shantaram, S., Suhling, J., Locker, D., Stress-Strain Behavior of
`SAC305 at High Strain Rates, ASME Journal of Electronic Packaging, Volume
`137, No. 1, doi:10.1115/1.4028641, pp. 1-16, March 2015.
`
`12. Lall, P., Wei, J., Sakalaukus, P., Life Prediction and Classification of Fault
`Modes in Solid State Lamps using Bayesian Probabilistic Models, IEEE
`Reliability Digest, Volume. 1, No. 2, pp. 7-18, February 2015.
`
`
`13. Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for
`Assessment of Electronic Reliability Under Vibration, ASME Journal of
`Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 1-8,
`December 2014.
`
`14. Lall, P., Shantaram, S., Locker, D., High Strain Rate Properties of SAC105 and
`SAC305 Leadfree Alloys after Extended High Temperature Storage, Journal of
`the SMTA, Volume 27, No. 1, pp. 13-27, 2014
`
`15. Lall, P., Limaye, G., SnAgCu Lead-Free Electronics Reliability Under Combined
`Temperature and Vibration Environments, Journal of the SMTA, Volume 26,
`No. 1, pp. 11-19, 2013.
`
`16. Lall, P., Gupta, P., Goebel, K., Decorrelated Feature Space and Neural Nets
`Based Framework for Failure Modes Clustering in Electronics Subjected to
`Mechanical Shock, IEEE Transactions on Reliability, Vol. 61, No. 4, pp. 884-900,
`December 2012.
`
`17. Lall, P., Shirgaokar, A., Arunachalam, D., Norris–Landzberg Acceleration
`Factors and Goldmann Constants for SAC305 Lead-Free Electronics, ASME J.
`Electron. Packag. Vol. 134, pp. 031008-1 to 031008-12, 2012.
`
`18. Roberts, J. C., Motalab, M., Hussain, S., Suhling, J. C., Jaeger, R. C., Lall, P.,
`Characterization of Compressive Die Stresses in CBGA Microprocessor
`Packaging Due to Component Assembly and Heat Sink Clamping, ASME J.
`Electron. Packag., Vol. 134, pp. 031005-1 to 031005-17, 2012.
`
`19. Lall, P., Lowe, R., Goebel, K., Prognostication Based on Resistance-Spectroscopy
`and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact, ASME
`J. Electron. Packag. 134, 021001-1 to 021001-10, 2012.
`
`20. Lall, P., Lowe, R., Goebel, K., Extended Kalman Filter Models and Resistance
`Spectroscopy for Prognostication and Health Monitoring of Leadfree Electronics
`Under
`Vibration,
`IEEE
`Transactions
`on
`Reliability,
`DOI:
`10.1109/TR.2012.2220698, Vol. 61, No. 4, pp. 858-871, 2012.
`
`
`
`Page 15 of 92
`
`

`

`21. Lall, P., Gupta, P., Angral, A., Anomaly Detection and Classification for PHM of
`Electronics Subjected to Shock and Vibration, IEEE Transactions On
`Components,
`Packaging
`And Manufacturing
`Technology,
`DOI:
`10.1109/TCPMT.2012.2207460 , Vol. 2, No. 11, pp. 1902-1918, 2012.
`
`
`22. Lall, P., Lowe, R., Goebel, K., Prognostics Health Management of Electronic
`Systems Under Mechanical Shock and Vibration Using Kalman Filter Models
`and Metrics, IEEE Transactions On Industrial Electronics, Vol. 59, No. 11,
`November 2012.
`
`23. Lall, P., Vaidya, R., More, V., Goebel, K., Assessment of Accrued Damage and
`Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal
`Environments of Thermal Aging and Thermal Cycling, IEEE Transactions on
`Components, Packaging and Manufacturing Technology, Vol. 2, No. 4, April
`2012
`
`24. Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R., Goebel, K., Prognostication
`of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under
`Thermo-mechanical Loads, IEEE Transactions on Industrial Electronics, Vol. 58,
`No. 7, pp. 2605-2616, July 2011.
`
`
`25. Lall, P.; Hande, M.; Bhat, C.; Lee, J., Prognostics Health Monitoring (PHM) for
`Prior Damage Assessment in Electronics Equipment Under Thermo-Mechanical
`Loads, , IEEE Transactions on Components, Packaging and Manufacturing
`Technology, Volume: 1 , Issue: 11, Page(s): 1774 – 1789, 2011
`
`
`26. Lall, P., Lowe, R., Goebel, K., Health Monitoring of Leadfree Electronics Under
`Mechanical Shock and Vibration with Particle Filter Based Resistance
`Spectroscopy, SMTA Journal, Volume 24, Issue 4, pp. 19-32, 2011
`
`
`27. Bozack, M. J., Suhling, J.C., Zhang, Y., Cai, Z., Lall, P., Influence of Surface
`Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder
`Alloys, Journal of Electronic Materials, Vol. 40, No. 10, 2011.
`
`
`28. Bozack, M. J., Suhling, J. C., Zhang, Y., Cai, Z., Lall, P., Surfaces of mixed
`formulation solder alloys at melting, J. Vac. Sci. Technol. A 29(4), Jul/Aug 2011.
`
`29. Lall, P., Gupta, P.; Kulkarni, M.; Hofmeister, J.; Time–Frequency and
`Autoregressive Techniques for Prognostication of Shock-Impact Reliability of
`Implantable Biological Electronic
`Systems, Electronics Packaging
`Manufacturing, IEEE Transactions on, Volume: 33 , Issue: 4, Page(s): 289 - 302,
`2010.
`
`
`
`Page 16 of 92
`
`

`

`30. Lall, P., Vaidya, R., More, V., Goebel, K., Assessment of Accrued Thermo-
`Mechanical Damage in Leadfree Parts During Field-Exposure to Multiple Envts,
`SMTA Journal, Vol. 23(2), pp. 11-24, 2010.
`
`31. Lall, P., Choudhary, P., Gupte, S., Hofmeister, J., "Statistical Pattern
`Recognition and Built-in Reliability Test for Feature Extraction and Health
`Monitoring of Electronics Under Shock Loads," IEEE TCPT, Vol. 32(3), pp. 600-
`616, 2009.
`
`
`32. Lall, P., Gupte, S., Choudhary, P., Darveaux, R., "Cohesive-Zone Explicit
`Submodeling for Shock Life-Prediction in Electronics," IEEE TCPT, Vol. 32(2),
`pp. 365-377, 2009.
`
`
`33. Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Prognostication of system-
`state in lead-free electronics equipment under cyclic and steady-state thermo-
`mechanical loads," Microelectronics Reliability, Vol. 49(8), pp. 825-838, 2009.
`
`
`34. Lall, P., Islam, N., Choudhary, P., Suhling, J., "Leading Indicators of Failure for
`Prognostication of Leaded and Lead-Free Electronics in Harsh Environments,"
`IEEE TCPT, Vol. 32(1), pp. 135-144, 2009.
`
`
`35. Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D., Design
`Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg
`Lead-free Packaging Architectures Under Shock and Vibration, IEEE
`Transactions On Electronics Packaging Manufacturing, Vol. 32, No. 4, pp. 311-
`324, October 2009
`
`
`36. Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., "Damage Progression
`Using Speckle-Correlation and High-Speed Imaging for Survivability of
`Leadfree Packaging Under Shock," Strain Journal, Vol. 45(3), pp. 267-282, 2009.
`
`
`37. Lall, P., Panchagade, D., Iyengar, D., Shantaram, S., Schrier, H., "High Speed
`Digital Image Correlation for Transient-Shock Reliability of Electronics," IEEE
`TCPT, Vol. 32(2), pp. 378-395, 2009.
`
`
`38. Health Monitoring for Damage Initiation & Progression during Mechanical
`Shock in