United States Patent (19)
`Lumbard et al.
`
`USOORE36614E
`Patent Number: Re. 36,614
`11 E
`(45) Reissued Date of Patent: Mar. 14, 2000
`
`54 MODULAR SURFACE MOUNT COMPONENT
`FOR AN ELECTRICAL DEVICE OR LED’S
`75 Inventors: Marvin Lumbard, Los Gatos; Lynn K.
`Wiese, Santa Clara, both of Calif.
`73 Assignee: Infineon Technologies Corporation,
`San Jose, Calif.
`
`21 Appl. No.: 09/120,591
`1-1.
`22 Filed:
`Jul. 17, 1998
`Rei
`f Related U.S. Patent Documents
`CSSUC O.
`64 Patent No.:
`4,843,280
`Issued:
`Jun. 27, 1989
`Appl. No.:
`07/144,370
`FE.
`Jan. 1 5 1988
`a
`lays
`(51) Int. Cl. ............................................... H01L 33/00
`52 U.S. Cl. ..................
`313/500; 313/505; 313/512
`58 Field of Search ..................................... 313/500, 505,
`313513 499
`s
`
`References Cited
`U.S. PATENT DOCUMENTS
`6/1965 Stetson .................................. 28'ssix
`3,189,978
`3,908,184 9/1975 Anazawa et al. ........
`... 174/52.4 X
`4,000,437 12/1976 Lederhandler et al. ............ 313/512 X
`
`56)
`
`4,305,204 12/1981 Toggart et al. ........................... 29/841
`4,445,132 4/1984 Ichikawa et al.
`313/500 X
`4.508,758 4/1985 Wong ........................................ 29/841
`3.6% 8.E. E. et al.
`"...i.
`2Y- - -2
`alZel all. . . . . . . . . . . . . . . . . . . . . . . . . . . .
`4,713,579 12/1987 Miura ...................................... 313/500
`FOREIGN PATENT DOCUMENTS
`
`55-113387 9/1980 Japan ..................................... 313/500
`56-135984 10/1981 Japan.
`56-137466 10/1981 Japan.
`61-134040 6/1986 Japan ....................................... 29/835
`175735 6/1961 Sweden ................................. 313/506
`Primary Examiner Vip Patel
`57
`ABSTRACT
`Processing techniques for Various Surface mount modular
`components provide various Structures for Single device
`components (10) and multiple device components (FIGS. 6
`and 7) Suitable as character displays. The technique beings
`with a slab of Substrate material 12 patterned on both sides.
`Plated through holes (33,43) connecting back side terminals
`(19, 20) to front side connective strips (22, 24) are formed.
`Devices (15, 16) are mounted to land areas (13,34) and wire
`bonded to connecting pads (14). The front side is coated with
`epoxy to encapsulate the devices in a layer having an outer
`surface formed into optional lenses (262, 263). The slab is
`then separated to provide the modular components.
`20 Claims, 2 Drawing Sheets
`
`
`
`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
`
`

`

`U.S. Patent
`
`Mar. 14, 2000
`
`Sheet 1 of 2
`
`Re. 36,614
`
`FIG. 2
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`FIG. 3
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`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
`
`

`

`U.S. Patent
`
`Mar. 14, 2000
`
`Sheet 2 of 2
`
`Re. 36,614
`
`
`
`FIG. 6
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`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
`
`

`

`Re. 36,614
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`1
`MODULAR SURFACE MOUNT COMPONENT
`FOR AN ELECTRICAL DEVICE OR LED’S
`Matter enclosed in heavy brackets
`appears in the
`original patent but forms no part of this reissue specifi
`cation; matter printed in italics indicates the additions
`made by reissue.
`BACKGROUND OF THE INVENTION
`This invention relates to electro-optical displays and other
`modular compact components. In particular, the invention
`relates to a method of manufacturing Such components
`capable of being fully automated for producing low cost
`modular components also highly Suitable for automated
`assembly in installations.
`Display devices are used extensively particularly in digi
`tal circuitry to provide information for the interface for the
`user. However, with the advances in integrated circuitry
`technology progressively providing increased processing
`power in Smaller space at reduced costs, the cost of interface
`devices, Such as displayS, becomes a larger portion of the
`total cost and thus more Significant. Also when the cost of
`displaying information is low, the additional cost of display
`ing more information when desirable is not a deterent
`leading to greater design freedom. In View of these eco
`nomic or cost Saving benefits, it is extremely desirable to
`have a fully automated manufacturing process for producing
`display devices.
`Another consideration in display devices as electronic
`components is modular construction. From a packaging
`Stand-point, the display device should be Sealed to prevent
`physical damage during automated assembly and contami
`nation after assembly. Versatility is also advantageous to
`limit constraints on product design and packaging.
`Furthermore, it would be desirable for the display package
`35
`to have terminals Suitable for Surface mount Soldering. Of
`course, compactness of size is highly desirable in addition to
`the previously enumerated considerations and Sought after
`advantages.
`SUMMARY OF THE INVENTION
`An object of the present invention is to provide a novel
`and improved method of manufacturing modular compo
`nents in which the manufacturing costs are considerably
`lower than those known from the prior art and in which at
`the same time the packaging features are at least the equal
`of those known from the prior art.
`Another object of the invention is to provide a method of
`manufacturing modular display components that is adapt
`able to mass production techniques.
`A further object of the invention is the provision of a
`novel method of manufacturing modular components, each
`component having a plurality of devices being arranged in
`the form of lines and columns.
`Yet another object of the invention is to provide a method
`of manufacturing an alpha-numeric display device having a
`modular structure and which can be placed Side by Side to
`display characters in both vertical and horizontal formats.
`A still further object of the invention is the provision of a
`method of manufacturing modular components which are
`highly Suitable for automated assembly installations.
`Another aim of the invention is the provision of packed
`modular components formed by the method described
`herein.
`In accordance with one form of the present invention the
`method comprises, and the product of Such method is
`formed by the steps of:
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`(a) providing an electrically insulating, generally planar
`Substrate having two opposing major Surfaces, the first of
`Said two major Surfaces including a plurality of land areas
`for receiving devices to be mounted thereon and a plurality
`of connection pads, the Second of Said two major Surfces
`including a plurality of terminal pads Serving as external
`terminals for mounted devices, and plated through holes for
`providing electrical connections between Some of the exter
`nal terminals to the land areas and between the remaining
`external terminals to the connection pads;
`(b) mounting at least one device having at least two
`terminals on individual land areas So that one terminal is
`electrically and mechanically coupled to one of Said land
`areas and electrically connected to its corresponding exter
`nal terminal;
`(c) electrically connecting any remaining terminals of
`each device to respective ones of Said connection pads;
`(d) depositing a curable layer of insulative material onto
`Said first major Surface for encapsulating Said devices
`including electrical connections made in step (c);
`(e) curing said layer of insulative material at least par
`tially; and
`(f) dividing the planar Substrate including the layer of
`insulative material into individual modular components,
`each individual modular component including at least one
`device mounted therein and encapsulated by the layer of
`insulative material and electrically connected to its external
`terminals.
`When the above method is employed the features of
`mounting a plurality of devices on a planar Substrate and
`dividing the planar Substrate into individual modular com
`ponents renders the method highly suitable for fully auto
`mated and therefore low cost production.
`BRIEF DESCRIPTION OF THE DRAWING
`Features of the invention and additional aspects and
`objects of the invention will be more readily appreciated and
`better understood by reference to the following detailed
`description which should be considered in conjunction with
`the drawing in which:
`FIG. 1 is a perspective view of a modular compact
`component including a light emitting diode which is encap
`Sulated in transparent epoxy,
`FIG. 2 is a view similar to FIG. 1 but illustrating a second
`illustrative embodiment with a dome lens top;
`FIG. 3 is a view similar to FIG. 1 but depicting a third
`illustrative embodiment having a prism top;
`FIG. 4 is a view similar to FIG. 1 but showing a fourth
`illustrative embodiment with a fresnal prism top;
`FIG. 5 demonstrates a step in a method of manufacturing
`in accordance with the invention having a plurality of
`modular compact components of the type shown in FIG. 1;
`FIG. 6 is a partial plan view on a planar Substrate with a
`matrix arrangement of light emitting diodes, and
`FIG. 7 is a partial plan view on a planar Substrate bearing
`a plurality of individual digit character displays having
`Sixteen Segment fonts.
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENTS
`FIG. 1 demonstrates the construction of a typical modular
`component 10 that may be manufactured according to the
`present invention. Deposited onto the upper Side 11 of a flat
`Substrate 12 of an electrically insulating material, for
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`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
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`3
`instance Synthetic plastic material or the like, is a conductive
`pattern of highly conductive material Such as copper. The
`conductive pattern deposited onto the upper Side 11 defines
`a land area 13 and a connection pad 14. A light emitting
`diode 15 is mounted on the land area 13 So that its terminal
`on the underneath or back Side is electrically and mechani
`cally coupled to the land area 13. The upper side of the light
`emitting diode 15 is provided with a terminal 16 which is
`electrically conductive and connected with the connection
`pad 14 via a bonding wire 17.
`Deposited onto the rear of back side 18 of the flat
`Substrate 12 is a Second conductive pattern of highly con
`ductive material Such as copper. This Second conductive
`pattern defines a first terminal pad 19 and a Second terminal
`pad 20. Both Each of terminal pads 19 and 20 externally
`are coated with a corresponding layer of Solder 21 in order
`to make the modular component 10 Suitable for surface
`mount Soldering.
`The land area 13 on the upper side 11 of the substrate 12
`is provided with an extension 22 which is electrically
`connected to the terminal pad 19 on the under side 18 via a
`plated through groove 23 having a Semicircular croSS
`Section. Similarly, the connection pad 14 on the upper side
`11 of the substrate 12 is provided with an extension 24 which
`is electrically connected to the terminal pad 20 on the under
`side 18 via a plated through groove 25, which is preferably
`identical to the plated through groove 23. In this manner the
`two terminal pads 19 and 20 serve as external terminals for
`the light emitting diode 15 which mechanically secure
`modular component 10 during Surface mounting of the
`component.
`It is to be understood that the plated through grooves 23
`and 25 are located at opposing edges of the Substrate 12, So
`that they can be produced by dividing plated through holes
`into two Substantially equal parts. AS will be seen hereinafter
`Such dividing of plated through holes can be advantageously
`adapted to mass production techniques with the present
`invention.
`The modular component 10 is provided with a transparent
`covering 26 for protective purposes. Thus the light emitting
`diode 15 and its electrical contacts including the bonding
`wire 17 are Sealed and encapsulated in the covering 26
`which may comprise of Synthetic resin, Silicone rubber or
`other Suitable transparent and insulative material. According
`to a preferred illustrative embodiment of the present inven
`tion the covering 26 is made from clear or diffused epoxy,
`which provides especially good optical characteristics.
`In the illustrative embodiment of FIG. 1, the covering 26
`of the modular component 10 has a cubical shape with a
`planar upper Surface. Other embodiments for different pur
`poses and with different shapes of the coverings are shown
`in FIGS. 2, 3 and 4.
`FIG. 2 illustates an illustrative embodiment of the present
`invention in which the modular component 10 is provided
`with a covering 261 forming a generally hemispherically
`shaped lens above the light emitting diode 15.
`FIG. 3 illustrates an illustrative embodiment in which the
`modular component 10 is provided with a covering 262
`forming a prism over the light emitting diode 15. This prism
`is Suitable for Side emitting.
`FIG. 4 shows a further illustrative embodiment in which
`the modular component 10 is provided with a covering 263
`forming a fresnal prism over the light emitting diode 15.
`This fresnal prism is suitable for lateral or top emission of
`light.
`In order to mass produce modular components in the most
`economical manner, all necessary Steps are performed while
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`the Substrates 12 corresponding to a plurality of modular
`components 10 are coherent in the form of a panel. An
`appropriate method of manufacturing the modular compo
`nents 10 corresponding to FIG. 1 will subsequently be
`described.
`The method starts with a generally planar Substrate 12
`metalized with 3 mil copper on both sides. First, holes are
`drilled in the substrate 12 and then plated through to provide
`electrical connections between the upper Side 11 to the under
`side 18. Next conductive patterns are formed on both sides
`of the Substrate 12 by masking and etching. Techniques for
`forming conductive patterns are well-known and form no
`part of the present invention and therefore will not be
`discussed in further detail herein. The conductive patterns of
`the Substrate 12 include on the upper side 11 a plurality of
`land areas 13 with the corresponding extensions 22 and a
`plurality of connection pads with the corresponding exten
`Sions 24.
`On the under side 18 of the Substrate 12, the conductive
`patterns include a plurality of terminal pads 19 and 20 which
`are arranged in pairs around the plated through holes. Then
`a gasket tape is applied to the under Side 18 of the Substrate
`12. Subsequently, light emitting diodes 15 are mounted on
`the land areas 13 So that their terminals on their under sides
`are electrically and mechanically coupled to the correspond
`ing land areas 13. The terminals 16 on the upper sides of the
`light emitting diodes are then electrically connected to their
`corresponding connection pads 14 via bonding wires 17.
`After this wire bonding, a test is performed automatically
`utilizing a probe Station and defective light emitting diodes
`15 are identified. In the next step, neither reworking is
`possible to correct malfunctioning light emitting diodes 15
`by rebounding and/or repairing wire 17 or malfunctioning
`light emitting diodes 15 are replaced.
`Liquid epoxy is deposited onto the upper side 11 of the
`Substrate 12 in a Sufficient quality So as to provide a coating
`of a thickness that will encapsulate all the light emitting
`diodes 15 and the bonding wires 17. The deposition of epoxy
`onto the Substrate 12 is performed as a coating or casting
`operation. Then the liquid epoxy is degassed in a controlled
`ambient vessel utilizing a pressure leSS than atmospheric
`pressure in order to remove bubbles. Thereafter the epoxy is
`cured and after this curing Step the gasket tape is peeled off
`the under side 18 of the substrate 12 since it has no longer
`to prevent the flow of liquid epoxy through the plated
`through holes.
`Then the substrate 12 is inverted and a test is performed
`with a wafer prober using a glass Stage with an optical Sensor
`under the Stage. This Step is performed to test the light
`emitting diodes 15 for output. After this testing Step, the
`external Surfaces of all terminal pads 19 and 20 on the back
`side 18 of the Substrate 12 are coated with a layer of solder
`21. Techniques for depositing Solder on terminal pads are
`well-known and form no part of the present invention, and
`therefore will not be discussed herein. According to FIG. 5,
`an adhesive carrier 27 is Subsequently applied to the under
`neath Surface 18 of the Substrate 12 and the Substrate 12 is
`sawed into strips 28 held together by the adhesive carrier 27.
`Then the strips 28 are cut into individual modular compo
`nents 10 which are illustrated in FIG. 1. This second cut is
`in a direction that is at a right angle to the first cut.
`In FIG. 5, the first cuts are designated with reference
`numerals 29 and the Second cuts are designated with refer
`ence numerals 30. It can be seen that the first cuts 29 divide
`the plated through holes into Substantially equal parts having
`Semicircular cross-sections, e.g. each plated through hole is
`
`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
`
`

`

`S
`divided into a first plated through groove 23 and a Second
`plated through groove 25, which are both present in FIG. 1
`but for two adjacent plated through holes.
`After the cutting of the strips 28 the individual modular
`components 10 are packed in a bubble tape for automatic
`pick and place equipment.
`FIG. 6 is a partial plan view on a planar substrate 12
`having a plurality of light emitting diodes 15 arranged on its
`upper side 11 to form lines 31 and columns 32. The portion
`of the land areas corresponding to the light emitting diodes
`15 forming each line 31 are interconnected together and to
`a plurality of plated through holes 33 in the form of
`conductive strips 34. The plated through holes 33 are
`arranged in equal distances on the conductor Strips 34 So as
`to allow the mounting of five light emitting diodes 15 on the
`corresponding land area portions between each two plated
`through holes 33.
`The terminals on the upper Sides of the light emitting
`diodes 15 corresponding to each column 32 are connected to
`each other and to a plurality of connection pads 35 by
`bonding wires 36. The connection pads 35 are perforated by
`plated through holes 37 So as to provide electrical connec
`tion to terminal pads on the under Side of the Substrate 12.
`The connection pads 35 and plated through holes 37 corre
`sponding to the light emitting diodes 15 forming each
`column 32 are arranged in equal distances So as to allow the
`mounting of Seven light emitting diodes 15 between each
`two plated through holes 37.
`After the mounting, wiring and encapsulating of the light
`emitting diodes 15, the planar substrate 12 is divided into
`individual modular components. Each individual modular
`component has a matrix arrangement of 5x7 light emitting
`diodes 15. In FIG. 6, the cut lines which are parallel to the
`lines 31 are designated with reference numerals 38 and the
`cut lines which are parallel to the columns 32 are designated
`with reference numerals 39. It can be seen that the cut lines
`38 will divide each of the plated through holes 37 into two
`Substantially equal parts, each part forming a plated through
`groove Similar to the plated through grooves 23 and 25
`shown in FIG. 1. Likewise the cut lines 39 will divide each
`of the plated through holes 33 into two substantially equal
`parts, each part providing a plated through groove similar to
`the plated through grooves 23 and 25 shown in FIG. 1.
`FIG. 7 is a partial plan view on a planar substrate 12
`having a plurality of light emitting diodes 40 arranged on its
`upper Side 11 to form a plurality of multiple Segment joints
`or Single character displayS. Each Segment of the multiple
`Segment joint corresponds to a light emitting diode 40 which
`is mounted on a corresponding land area. Each terminal on
`the upper Side of a light emitting diode 40 is connected to a
`Separate connection pad 41 by a bonding wire 42. Each
`connection pad 41 is perforated by a plated through hole 43
`So as to provide electrical connection to corresponding
`terminal pads on the under Side of the Substrate 12.
`After the mounting, wiring and encapsulating of the light
`emitting diodes 40, the planar substrate 12 is divided into
`individual modular components. Each individual modular
`component functions as a Single character display. In FIG. 7,
`the horizontal cut lines are designated with reference numer
`als 44 while the vertical cut lines are designated with
`reference numerals 45. It can be seen that the cut lines 44
`and 45 will divide each of the plated through holes 43 into
`two Substantially equal parts, each part forming a plated
`through groove like the plated through grooves 23 and 25
`shown in FIG. 1.
`The present invention provides an inexpensive technique
`for making Surface mounted Semiconductor packages.
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`Diodes, photo Sensitive devices, resistorS or integrated cir
`cuits could be manufactured in panel form casing with a
`protective coating which maybe opaque. The panel can be
`tested prior to coating and after coating and Sawed apart
`using the method described above.
`There has thus been shown and described a novel method
`of manufacturing modular components which fulfills all the
`objects and advantages Sought therefor. Many changes,
`modifications, variations and other uses and applications of
`the Subject invention will, however, become apparent to
`those skilled in the art after considering this Specification
`and the accompanying drawings which disclose preferred
`embodiments thereof. For example, different arrangements
`of devices are readily possible while utilizing the principles
`of the disclosed technique. Such arrangements may also
`have locations for plated through holes other than at the
`Sides of the modular components, and the present techniques
`may also be extended to include multiple conductive layers
`and laminated Substrate layers. All Such changes,
`modifications, variations and other uses and applications
`which do not depart from the Spirit and Scope of the
`invention are deemed to be covered by the invention which
`is limited only by the claims which follow.
`What is claimed is:
`1. A modular Surface mount component comprising:
`an electrically insulating generally planar Substrate hav
`ing two opposing major Surfaces and at least two lateral
`edges forming two opposite ends of the Substrate, the
`first of Said two major Surfaces including at least one
`land area and at least one connection pad, the Second of
`Said two major Surfaces including at least two terminal
`pads each next to one of the two lateral edges, and at
`least two plated through grooves having Semicircular
`croSSSections and electrically connecting Said land area
`and Said connection pad to respective ones of the two
`terminal pads each plated through groove located in
`one of the two lateral edges,
`at least one device having at least two terminals, one of
`Said terminals being electrically and mechanically
`coupled to Said land area and the Second of Said
`terminals being electrically connected to Said connec
`tion pad;
`at least one layer of insulative material on Said first major
`Surface, Said insulative material encapsulating Said
`device and Said electrical connection between the Sec
`ond of Said terminals and Said connection pad; and
`the two terminal pads physically displaced on the Second
`of Said two major Surfaces for mechanically Surface
`mounting the modular component when the modular
`component is electrically connected.
`2. The modular component according to claim 1 wherein
`the Second of Said terminals and Said connection pad are
`connected by a bonding wire.
`3. The modular component according to claim 1 wherein
`Solder is deposited on Said terminal pads on Said Second
`major Surface.
`4. A modular Surface mount component comprising:
`an electrically insulating generally planar Substrate hav
`ing two opposing major Surfaces, the first of Said two
`major Surfaces including at least one land area and at
`least one connection pad, the Second of Said two major
`Surfaces including at least two terminal pads, and the
`Substrate having at least two opposite side edges each
`having a groove having a Substantially Semicircular
`croSS-Section and a conductive coating electrically con
`necting one land area and one connection pad to
`respective ones of the two terminal pads;
`
`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
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`

`

`7
`at least one light emitting diode having at least two
`terminals, one of Said terminals being electrically and
`mechanically coupled to Said land area and the Second
`of Said terminals being electrically connected to Said
`connection pad;
`at least one layer of insulative material on Said first major
`Surface, Said insulative material being at least partially
`transparent to the light emitted by the light emitting
`diode and encapsulating Said light emitting diode and
`Said electrical connection between the Second of Said
`terminals and Said connection pad; and
`the two terminal pads being Surface mount terminals for
`electrically connecting and mechanically mounting the
`modular component.
`5. The modular component according to claim 4 wherein
`a plurality of light emitting diodes is arranged to form lines
`and columns on Said first major Surface.
`6. The modular component according to claim 5 wherein
`the portion of the land areas corresponding to the light
`emitting diodes forming each line are interconnected
`together and to at least one of Said plated through grooves.
`7. The modular component according to claim 5 wherein
`Said Second terminals of the light emitting diodes corre
`sponding to each column are connected to each other and to
`at least one of Said plated through grooves by a bonding
`wire.
`8. The modular component according to claim 4 wherein
`a plurality of light emitting diodes is arranged to form a
`multiple Segment font on Said first major Surface, whereby
`each Segment of Said multiple Segment font corresponds to
`a light emitting diode.
`9. The modular component according to claim 8 wherein
`each of Said Second terminals of the light emitting diodes is
`connected to a corresponding connection pad by a bonding
`wire.
`10. The modular component according to claim 4 wherein
`Said terminal pads on Said Second major Surface are each
`coated with a corresponding layer of Solder.
`11. A modular Surface mount component comprising:
`an electrically insulating generally planar Substrate hav
`ing two opposing major Surfaces and at least two
`lateral edges forming two opposite ends of the
`Substrate, the first of said two major surfaces including
`at least One land area and at least One connection pad,
`the Second of Said two major Surfaces including at least
`two terminal pads each next to One of the two lateral
`edges, and at least two plated through grooves having
`Semicircular croSS-Sections and electrically connecting
`Said land area and Said connection pad to respective
`Ones of the two terminal pads each plated through
`grOOve located in One of the two lateral edges,
`at leaSt One device having at least two terminals, One of
`Said terminals being electrically and mechanically
`coupled to Said land area and the Second of Said
`terminals being electrically connected to said connec
`tion pad,
`at least One layer of insulative material On Said first major
`Surface, Said insulative material encapsulating Said
`device and Said electrical connection between the Sec
`Ond of Said terminals and Said connection pad, Said
`layer of insulative material being Substantially flush
`with the two lateral edges of the planar Substrate, and
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`the two terminal pads physically displaced On the Second
`of Said two major Surfaces for mechanically surface
`mounting the modular component when the modular
`component is electrically connected.
`12. The modular component according to claim 11
`wherein the Second of Said terminals and Said connection
`pad are connected by a bonding wire.
`13. The modular component according to claim 11
`wherein Solder is deposited on Said terminal pads on Said
`Second major Surface.
`14. A modular Surface mount component comprising:
`an electrically insulating generally planar Substrate hav
`ing two opposing major Surfaces, the first of Said two
`major Surfaces including at least One land area and at
`leaSt One connection pad, the Second of Said two major
`Surfaces including at least two terminal pads, and the
`SubStrate having at least two opposite Side edges each
`having a groove having a Substantially Semicircular
`croSS-Section and a conductive coating electrically
`connecting One land area and One connection pad to
`respective Ones of the two terminal pads,
`at least One light emitting diode having at least two
`terminals, One of Said terminals being electrically and
`mechanically coupled to Said land area and the Second
`of Said terminals being electrically connected to Said
`connection pad,
`at least One layer of insulative material On Said first major
`Surface, Said insulative material being at least partially
`transparent to the light emitted by the light emitting
`diode and encapsulating Said light emitting diode and
`Said electrical connection between the Second of Said
`terminals and Said connection pad, Said layer of insu
`lative material being Substantially flush with the Side
`edges of the planar SubStrate, and
`the two terminal pads being surface mount terminals for
`electrically connecting and mechanically mounting the
`modular component.
`15. The modular component according to claim 14
`wherein a plurality of light emitting diode is arranged to
`form lines and columns. On Said first major Surface.
`16. The modular component according to claim 15
`wherein the portion of the land areas corresponding to the
`light emitting diodes forming each line are interconnected
`together and to at leaSt One of Said groove.
`17. The modular component according to claim 15
`wherein Said Second terminals of the light emitting diodes
`corresponding to each column are connected to each Other
`and to at least One of Said grOOveS by a bonding wire.
`18. The modular component according to claim 14
`wherein a plurality of light emitting diodes is arranged to
`form a multiple Segment font On Said first major Surface,
`whereby each segment of Said multiple segment font corre
`sponds to a light emitting diode.
`19. The modular component according to claim 18
`wherein each of Said Second terminals of the light emitting
`diodes is connected to a corresponding connection pad by a
`bonding wire.
`20. The modular component according to claim 14
`wherein each of Said terminal pads. On Said Second major
`Surface is coated with a corresponding layer of Solder.
`
`EVERLIGHT ELECTRONICS CO., LTD.
`Exhibit 1006
`
`