as) United States
`a2) Patent Application Publication (10) Pub. No.: US 2010/0312468 Al
`(43) Pub. Date:
`Dec. 9, 2010
`Withanawasam
`
`US 201003 12468A1
`
`(54)
`
`INTEGRATED
`MICRO-ELECTRO-MECHANICAL SYSTEMS
`
`(MEMS) SENSOR DEVICE
`
`(75)
`
`Inventor:
`
`Lakshman Withanawasam, Maple
`Grove, MN (US)
`
`Correspondence Address:
`HONEYWELL/FOGG
`Patent Services
`101 Columbia Road, P.O Box 2245
`Morristown, NJ 07962-2245 (US)
`
`(73) Assignee:
`
`HONEYWELL
`INTERNATIONALINC.,,
`Morristown, NJ (US)
`
`(21) Appl. No.:
`
`12/477,667
`
`(22)
`
`Filed:
`
`Jun. 3, 2009
`
`Publication Classification
`
`(51)
`
`Int. CL
`(2006.01)
`GOIC 21/00
`(2006.01)
`HOLL 29/84
`(2006.01)
`HOIL 21/450
`(52) US. Cl. .... 701/207; 257/415; 438/51; 257/E29.324;
`257/E21.499
`
`(57)
`
`ABSTRACT
`
`An integrated sensor device is provided. The integrated sen-
`sor device comprises a first substrate including a surface
`portion and a second substrate coupled to the surface portion
`ofthe first substrate in a stacked configuration, wherein a
`cavity is defined betweenthe first substrate and the second
`substrate. The integrated sensor device also comprises one or
`more micro-electro-mechanical systems (MEMS) sensors
`located at least partially in the first substrate, wherein the
`MEMSsensor communicates withthe cavity. The integrated
`sensor device further comprises one or more additional sen-
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`an
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`SS
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`001
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`GOOGLE1017
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`Patent Application Publication
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`Dec. 9,2010 Sheet 1 of 5
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`US 2010/0312468 Al
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`PERSONALNAVIGATION DEVICE (PND)
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`100
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`PROCESSOR
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`410
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`DISPLAY
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`140
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`120
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`INTEGRAGED MEMS
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`AND MAGNETIC
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`SENSOR
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`130
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`NAVIGATION AND
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`ORIENTATION
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`ROUTINE
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`FIG. 1
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`FIG. 2A
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`Card
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`Patent Application Publication
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`Dec. 9,2010 Sheet 4 of 5
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`US 2010/0312468 Al
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`{ 200
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`No
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`Patent Application Publication
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`Dec. 9,2010 Sheet 5 of 5
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`US 2010/0312468 Al
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`300 my
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`FORM AT LEAST A PORTION
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`OF A MEMS SENSOR
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`INA FIRST SUBSTRATE
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`FORM AT LEAST ONE
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`ADDITIONAL SENSOR
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`PACKAGE THE SENSORS
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`BOND THE FIRST SUBSTRATE
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`TO A SECOND SUBSTRATE
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`INA STACKED CONFIGURATION
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`FIG. 3
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`US 2010/0312468 Al
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`Dec. 9, 2010
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`INTEGRATED
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`MICRO-ELECTRO-MECHANICAL SYSTEMS
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`(MEMS) SENSOR DEVICE
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`
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`BACKGROUND
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`[0001] Mobile devicessuch as personalnavigation devices
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`(PND) and smart phones typically have some form of navi-
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`gation and maporientation application. These mobile devices
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`often utilize a magnetic compassthat have to work even when
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`the device is not held level, which requires a micro-electro-
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`mechanical systems (MEMS)accelerometer or a gyroscope
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`to be integrated with the magnetic sensors. The typical mobile
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`device includes a magnetic compasssensor as well as a sepa-
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`rate MEMSaccelerometer or a gyroscope sensor. However,
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`including these sensors as two separate sensor devices in a
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`mobile device takes a large printed circuit board (PCB) foot-
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`print. Because the mobile navigation devices are very sensi-
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`tive to cost and size, any solution that reduces cost or the
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`printed circuit board (PCB) footprint of the compass hard-
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`ware 1s desired.
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`SUMMARY
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`[0002] One embodimentof the present invention provides
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`an integrated sensor device. The integrated sensor device
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`comprises a first substrate including a surface portion and a
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`second substrate coupled to the surface portion of the first
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`substrate in a stacked configuration, wherein a cavity is
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`defined between thefirst substrate and the second substrate.
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`The integrated sensor device also comprises one or more
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`micro-electro-mechanical systems (MEMS)sensors located
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`at least partially in the first substrate, wherein the MEMS
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`sensor communicates with the cavity. The integrated sensor
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`device further comprises one or more additional sensors.
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`DRAWINGS
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`Features ofthe present invention will become appar-
`[0003]
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`ent to those skilled in the art from the following description
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`with reference to the drawings. Understanding that the draw-
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`ings depict onlytypical embodimentsofthe invention and are
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`not therefore to be consideredlimiting in scope, the invention
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`will be described with additional specificity and detail
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`through the use of the accompanying drawings, in which:
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`FIG. 1 is one embodimentof a personal navigation
`[0004]
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`device (PND) comprising an integrated MEMSand magnetic
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`sensor;
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`[0005] FIGS.2A-2C are cross-sectionalside viewsof alter-
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`native embodiments of a stacked MEMSsensordevice;
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`[0006]
`FIG. 2D is top view of the stacked MEMSsensor
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`device of FIG. 2A; and
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`[0007] FIG.3isa flowchart of one embodimentof'a method
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`of forming an integrated MEMSsensordevice.
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`DETAILED DESCRIPTION
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`In the following detailed description, embodiments
`[0008]
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`are described in sufficient detail to enable those skilled in the
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`art to practice the invention.It is to be understood that other
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`embodiments may be utilized without departing from the
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`scope of the present
`invention. The following detailed
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`description is, therefore, not to be taken as limiting.
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`[0009] The embodiments described hereafter relate to inte-
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`grated micro-electro-mechanical systems (MEMS) sensor
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`devices that include a MEMSsensorand at least one addi-
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`tional sensor, such as a magnetic sensor. Typically, MEMS
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`sensors are capped with a substrate to create a cavity needed
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`for the accelerometer to function and are encompassed in
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`plastic molded packages. Portions of the MEMSsubstrate
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`and the cap substrate are often left unused. In one embodi-
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`mentofthe present invention, a MEMSsensor anda magnetic
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`sensor are integrated into a single stacked configuration. In
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`one implementation,the electrically unused (blank) semicon-
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`ductor area of a cap of a MEMSsensoris utilized to host one
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`or more additional sensors in a stacked configuration to form
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`an integrated sensordevice.
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`[0010] The present integrated MEMSsensor devices are
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`miniature sensor devices that reduce the amount of semicon-
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`ductor substrate material used in the device and concurrently
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`reduce the PCB footprint of the packaged device. Integrating
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`an accelerometer(also referred to hereinasa tilt sensor) or a
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`gyroscope and magnetic sensors into a common semiconduc-
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`tor device reduces the size taken up by the sensors compared
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`to when the sensorsare formed in individual semiconductor
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`chips. For example, a magnetic sensor die anda tilt sensor die
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`can be stacked together to reduce the package size and
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`thereby the package footprint. Since the already available
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`substrate area is used more fully in the present embodiments,
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`fabrication costs will also be lower.
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`FIG. 11s one embodimentof a personal navigation
`[0011]
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`device (PND) 100 comprising an integrated MEMSand mag-
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`netic sensor 130. The PND 100 can be a mobile (hand-held)
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`navigation device, a smart phone, or any similar mobile
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`device configuredto aid a user in navigation and applications
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`requiring orientation information. For example, a user can be
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`a professionalfirst responder or a memberof the public. The
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`PND 100 includes a processor 110 configured to run a navi-
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`gation and orientation routine module 120. A display 140
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`presents navigation information to the user, and can comprise
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`a liquid crystal display (LCD), a digital display, or the like.
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`Navigation information that can be displayed includes posi-
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`tional information, orientation information, maps, compass
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`directions, a predetermined path, or any other information
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`useful in navigation.
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`[0012] Orientation information is informationrelating to
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`the present orientation of the PND 100, and can be deter-
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`mined using the integrated MEMSand magnetic sensor 130
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`(also referred to herein as the integrated MEMSsensor). The
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`integrated MEMSand magnetic sensor 130 provides infor-
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`mationto the processor 110 relating to acceleration,roll, and
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`directional data (that is, relating to a compass direction). The
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`PND100 can use three axes of sensing for acceleration and
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`gyroscopedata in one single integrated MEMSsensor 130. In
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`alternative embodiments, the PND 100 comprises a plurality
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`of integrated MEMSsensors 130, each for a different axis of
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`acceleration or gyroscope data. The components of the PND
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`100 are communicatively coupled to one another as needed
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`using suitable interfaces and interconnects.
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`[0013]
`FIGS. 2A-2C illustrate alternative embodiments of
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`a stacked sensor device 200, 200', and 200". The integrated
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`MEMSsensor devices 200, 200', and 200" comprise a first
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`substrate 210 including a surface portion 212. Thefirst sub-
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`strate 210 contains at least one MEMSsensor 220. A second
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`substrate 240 is coupled to surface portion 212 of the first
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`substrate 210. In some embodiments, portions of the MEMS
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`sensor 220 are located in the second substrate 240. The sensor
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`devices 200, 200', and 200" comprise at least one additional
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`sensor 250 such as a magnetic sensor.
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`[0014]
`Thefirst and second substrates 210, 240 can be
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`composedof various materials suchassilicon, glass, quartz,
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`007
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`US 2010/0312468 Al
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`Dec. 9, 2010
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`(such as in the PND 100). Packaging makes the sensor
`or the like. In one embodiment, the second substrate 240 is a
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`devices 200, 200', and 200"easier to handle and morerobust.
`cap used to cover the MEMSsensor 220. The cap can be
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`sealingly attached to surface portion 212 of substrate 210
`FIG. 3isa flowchart of one embodiment of'a method
`[0020]
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`300 of integrating a sensor with a MEMSdevice. Atleast a
`using a known bonding process suchas glass fritz bonding,
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`portion ofa MEMSsensoris formed inafirst substrate (310).
`gluing, or welding.
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`If the MEMSsensoris not formed entirely in the first sub-
`[0015] The MEMSsensor 220 can include one or more
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`strate, the rest is formed in a secondsubstrate. One exemplary
`accelerometers, gyroscopes, or combinations thereof, as well
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`methodoffabricating a MEMSactive waferis the Micragem
`as flow sensors. gas detectors, or any other sensor suitable for
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`standard. The Micragem standard comprises first etching
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`MEMStechnologythathasan electrically unused portion in
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`cavities ina glass wafer. Thenelectrodes, lines, and bond pads
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`at least one of the substrate 210 or the cap 240. For example,
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`are patterned. A silicon on insulator (SOI) handle wafer is
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`three accelerometer axes can be employedina single sensor
`anodically bonded to the glass wafer. The silicon handle
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`device 200. Similarly, two gyroscope axes can be employed in
`wafer and a buried oxide layer are etched. Next, a low stress
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`a single sensor device 200. In one embodiment, the MEMS
`metalis deposited. Lithographically pattern and deepreactive
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`sensor 220 includesa tilt sensor die.
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`ion etch (DRIE) is performed torelease silicon microstruc-
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`[0016] The integrated sensor devices 200, 200', and 200"
`tures. The MEMSsensor elements are formed. However, the
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`further comprise a cavity 230, which is formed between the
`Micragem standardis just one exemplary method, and other
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`first substrate 210 and the second substrate 240. The second
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`suitable methods of forming a MEMSsensor knownto those
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`substrate 240 acts as a cap that protects the MEMSsensor 220
`of skill in the art are contemplated.
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`from the external environmentandseals the cavity 230. The
`[0021] Once the MEMSsensor is formed (310), one or
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`MEMSsensor 220is in communication with the cavity 230.
`more sensors or electrical circuits are formed. These addi-
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`As shownin FIGS. 2A-2C the cavity 230 is formed through
`tional sensors can be fabricated onor in the blank portions of
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`the surface portion 212 of the substrate 210. However, in
`thefirst substrate, a second substrate (for example, the MEMS
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`alternative embodiments, the cavity 230 is formed ina bottom
`cap wafer), or combinations thereof (320). The method of
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`portion 242 of the second substrate 240. The cavity 230 is
`fabricating the sensors onto the cap wafer will depend on the
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`sealed to hold either a vacuum or an inert gas. The cavity 230
`particular sensor being made. For an exemplary process of
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`is used to provide freedom ofmovementto the MEMSsensor
`fabricating magnetic sensors for providing compassdata,see
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`220, enabling movements such as vibration androtation.
`US. Pat. No. 5,820,924, filed on Jun. 6, 1997, entitled
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`[0017] Thesecondsubstrate 240 (thatis, the cap) comprises
`“MethodofFabricating a Magnetoresistive Sensor,” which 1s
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`he bottom portion 242 and a top portion 244. In MEMS
`incorporated by reference herein.
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`devices, the cap (andparts ofthe first substrate 210) typically
`[0022] Once all the sensorsare fabricated, the second sub-
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`includeselectrically unused (that is, blank) portions on the
`strate (cap wafer) is bondedto the first substrate using exist-
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`op portion 244. A blank portion ofa substrate any portion that
`ing mechanical processes (330). This creates the integrated
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`is not usedelectrically by the MEMSsensor 220. FIG. 2A
`MEMSandsensorstack, which is then packagedto yield the
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`illustrates an embodiment where the one or more sensors 250
`miniature sensor device (340).
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`are located in the second substrate 240. This embodiment of
`In one embodiment, a single device package com-
`[0023]
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`he sensor device 200 provides that part orall of the electri-
`prises integrated magnetic andtilt sensors. Theelectrically
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`cally unusedportion of the top portion 244 host one or more
`unused silicon surface ofa tilt sensor die is used as a magnetic
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`sensors 250. The sensors 250 can include a magnetic sensor,
`sensordie. The magnetic sensordie and thetilt sensordie are
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`a pressure sensor, a temperature sensor, or any type of suitable
`stacked together to reduce the package size and therebythe
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`electronic circuitry. In alternative embodiments, the cap fur-
`footprint of the device. Since the silicon area is reused, the
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`her comprises active MEMSsensorelements or formspart of
`cost and the footprint both will be reduced. This combinedtilt
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`the overall integrated MEMSsensordevice 200. FIG. 2D is a
`sensor and magnetic sensor can be used to provide position
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`op view ofthe stacked MEMSsensordevice 200 of FIG. 2A,
`and orientation data in a PND.
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`showing the one or more additional sensors 250 in the top
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`[0024] The present invention may be embodied in other
`portion 244 of the second substrate 240.
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`specific forms without departing from its essential character-
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`[0018] As shown in the embodiment of FIG. 2B, one or
`istics. Aspects andlimitations described in a specific embodi-
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`more additional sensors 250 are locatedin electrically unused
`ment are combinable with other embodiments. Thedescribed
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`portionsofthe first substrate 210 of the MEMSsensordevice
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`embodiments are to be considered in all respects only as
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`200'. As depicted in the embodimentof FIG. 2C, one or more
`illustrative and not restrictive. The scope ofthe invention is
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`additional sensors 250 are locatedin electrically unused por-
`therefore indicated by the appended claimsrather than bythe
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`ions ofthefirst substrate 210 and the second substrate 240 of
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`foregoing description. All changes that come within the
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`he MEMSsensordevice 200".
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`meaning and range of equivalency of the claims are to be
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`[0019]
`In the embodiment of FIGS. 2A-2D, the MEMS
`embraced within their scope.
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`sensor 220 and the sensors 250 are electrically isolated. In
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`alternative embodiments, the MEMSsensor 220 and the sen-
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`sors 250 are not electrically isolated. Leads from each sensor
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`may extend outoftheir respective substrates. Embodiments
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`of the sensor devices 200, 200', and 200" also comprise a
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`metal or substrate frame (not shown) that enables outputs
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`from the sensors 220 and 250 to be connectedto other devices
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`(for example, via wires or leads). The sensor devices 200,
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`200', and 200" also comprise packaging (such as plastic
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`molded packages) for assembly to a next level of a device
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`008
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`Whatis claimed is:
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`1. An integrated sensor device, comprising:
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`a first substrate including a surface portion,
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`a secondsubstrate coupled to the surface portion ofthefirst
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`substrate in a stacked configuration, wherein a cavity is
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`defined between thefirst substrate and the second sub-
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`strate;
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`008
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`

`

`US 2010/0312468 Al
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`Dec. 9, 2010
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`one or more micro-electro-mechanical systems (MEMS)
`12. The method of claim 9, wherein the MEMSsensor
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`comprises an accelerometer, a gyroscope, or combinations
`sensors located at least partially in the first substrate,
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`thereof.
`wherein the MEMSsensor communicates with the cav-
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`13. The method of claim 9, wherein the at least one addi-
`ity; and
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`one or more additional sensors.
`tional sensor comprises a magnetic sensor.
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`14. The method of claim 9, wherein the cavity contains a
`2. The sensor device of claim 1, whereinthefirst substrate
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`vacuum or an inert gas.
`and the second substrate comprise silicon, glass, or quartz.
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`15. A navigation device, comprising:
`3. The sensordevice ofclaim 1, wherein the cavity contains
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`an integrated sensor device, comprising:
`a vacuum or an inert gas.
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`a first substrate including a surface portion;
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`4. The sensor device of claim 1, wherein the one or more
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`a second substrate coupledto the surface portion of the
`MEMSsensors comprise an accelerometer, a gyroscope, a
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`first substrate in a stacked configuration, wherein a
`flow sensor, a gas detector, or combinationsthereof.
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`cavity is defined between thefirst substrate and the
`5. The sensor device of claim 1, wherein the one or more
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`second substrate;
`additional sensors comprise a magnetic sensor, a pressure
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`systems
`or more micro-electro-mechanical
`one
`sensor, or combinationsthereof.
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`(MEMS)sensorslocatedat least partially in the first
`6. The sensor device of claim 1, wherein:
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`substrate, wherein the one or more MEMSsensors
`the one or more MEMSsensors is configured to provide
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`communicates with the cavity; and
`acceleration data; and
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`one or more additional sensors;
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`the one or more additional sensorsis at least one magnetic
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`a processor operatively coupled to the integrated sensor
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`sensor configured to provide directional data.
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`device; and
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`7, The sensor device of claim 1, wherein the one or more
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`a navigation module run by the processor, wherein the
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`MEMSsensors and the one or more additional sensors are
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`navigation module is configured to determine orienta-
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`electrically isolated from each other.
`tion information based on data from the integrated sen-
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`8. The sensor device of claim 1, wherein the one or more
`sor device.
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`additional sensors are located in thefirst substrate, the second
`16. The navigation device of claim 15, further comprising
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`substrate, or combinations thereof.
`a display configuredto present the positional informationto a
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`user.
`9. A method of forming an integrated sensor device, the
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`method comprising:
`17. The navigation device of claim 15, wherein the navi-
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`forming, at least a portion of a micro-electro-mechanical
`gation device comprises a personal navigation device (PND)
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`systems (MEMS)sensorinafirst substrate;
`or a smart phone.
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`forming at least one additional sensor: and
`18. The navigation device of claim 15, wherein the one or
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`bonding the first substrate to the second substrate in a
`more MEMSsensors comprise an accelerometer, a gyro-
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`stacked configuration, wherein a cavity is defined
`scope, a flow sensor, a gas detector, or combinationsthereof.
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`betweenthefirst substrate and the second substrate, and
`19. The navigation device of claim 15, wherein the one or
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`the MEMSsensor communicates with the cavity.
`more additional sensors comprise a magnetic sensor, a pres-
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`10. The method of claim 9, further comprising packaging
`sure sensor, or combinationsthereof.
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`the first substrate and the second substrate.
`20. The navigation device of claim 15, wherein the one or
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`11. The method of claim 9, wherein forming at least one
`more additional sensors are formed in the first substrate, the
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`additional sensor further comprises forming the at least one
`second substrate, or combinationsthereof.
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`additional sensorin thefirst substrate, the second substrate, or
`aaa
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`combinationsthereof.
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`009
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`009
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