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`US 20040206964Al
`
`(19) United States
`(12) Patent Application Publication
`Matsumura et al.
`
`(10) Pub. No.: US 2004/0206964 Al
`Oct. 21, 2004
`(43) Pub. Date:
`
`(54) LED DEVICE AND MANUFACTURING
`METHOD THEREOF
`
`(75)
`
`Inventors: Kanae Matsumura, Nishikasugai-gun
`(JP); Yuji Takahashi, Nishikasugai-gun
`(JP); Hideaki Kato, Nishikasugai-gun
`(JP); Shunsuke Ohtsuka, Tokyo (JP)
`
`Correspondence Address:
`MCGINN & GIBB, PLLC
`8321 OLD COURTHOUSE ROAD
`SUITE 200
`VIENNA, VA 22182-3817 (US)
`
`(73) Assignees: Toyoda Gosei Co., Ltd., Aichi (JP);
`Koha Co., Ltd., Tokyo (JP)
`
`(21) Appl. No.:
`
`10/842,494
`
`(22) Filed:
`
`May 11, 2004
`
`Related U.S. Application Data
`
`(62) Division of application No. 10/231,067, filed on Aug.
`30, 2002.
`
`(30)
`
`Foreign Application Priority Data
`
`Sep. 3, 2001
`Sep. 3, 2001
`Sep. 3, 2001
`
`(JP) .................................... P2001-265422
`(JP) .................................... P2001-265423
`(JP) .................................... P2001-265424
`
`Publication Classification
`
`(51)
`
`Int. Cl.7 .......................... HOlL 27/15; HOlL 31/12;
`HOlL 33/00; F21S 8/00
`(52) U.S. Cl. ................................................. 257/79; 257/88
`
`ABSTRACT
`(57)
`In an LED device, an opening portion of a package in which
`a plurality of five light-emitting elements are mounted is
`filled with a transparent epoxy resin and sealed with the
`resin. The transparent epoxy resin is shrunk when cured.
`Hence, the surface of the transparent epoxy resin is dented
`in the center portion so that the outer edge portion becomes
`higher than the center portion. The light-emitting elements
`located at opposite ends are the highest in element height
`among the five light-emitting elements. Hence, when the
`light-emitting elements are mounted at opposite ends of a
`single row, distances from light-emitting surfaces of the five
`light-emitting elements to the surface of the transparent
`epoxy resin are made uniform and luminous intensity dis(cid:173)
`tribution characteristics thereof are made uniform. Tips of
`leads are further bent up along side surfaces of the package.
`Hence, when the LED device is soldered onto a mount
`board, solder is deposited even on the up-bent tips of the
`leads, so that surface tension of solder is balanced on the
`front and rear of the package. As a result, the LED device
`can be mounted in a predetermined position while prevented
`from sliding. In an LED lead frame, hanger leads are
`provided so as to be extended in three directions of a
`package. Hence, the electrically conductive leads can be
`bent stably and accurately without tottering of the package
`in the process of bending the electrically conductive leads.
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`Patent Application Publication Oct. 21, 2004 Sheet 1 of 6
`
`US 2004/0206964 Al
`
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`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`Patent Application Publication Oct. 21, 2004 Sheet 2 of 6
`
`US 2004/0206964 Al
`
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`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`Patent Application Publication Oct. 21, 2004 Sheet 3 of 6
`
`US 2004/0206964 Al
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`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
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`

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`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

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`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`Patent Application Publication Oct. 21, 2004 Sheet 6 of 6
`
`US 2004/0206964 Al
`
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`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`US 2004/0206964 Al
`
`Oct. 21, 2004
`
`1
`
`LED DEVICE AND MANUFACTURING METHOD
`THEREOF
`
`[0001] The present application is based on Japanese Patent
`Applications No. 2001-265422, 2001-265423 and 2001-
`265424, which are incorporated herein by reference.
`
`BACKGROUND OF THE INVENTION
`
`[0002] 1. Field of the Invention
`
`[0003] The present invention relates to a light-emitting
`diode lamp (hereinafter referred to as "LED lamp") in which
`a single light-emitting element or a plurality of light-emit(cid:173)
`ting elements, and leads and wires electrically connected to
`the single or plurality of light-emitting element(s) are
`packed in a package such as a synthetic resin package and
`sealed with a light-transmissive material such as a transpar(cid:173)
`ent epoxy resin. Incidentally, in this specification, an LED
`chip itself is called "light-emitting element" whereas a
`light-emitting device having a plurality of LED chips
`mounted therein is collectively called "light-emitting diode
`lamp" or "LED lamp", further, more comprehensively called
`"LED device". A lead frame as a raw material thereof is
`called "LED lead frame".
`
`[0004] 2. Description of the Related Art
`
`[0005] A surface mounting chip LED (SMD) type LED
`lamp has been heretofore used in a light source for a
`backlight unit, or the like. In the SMD type LED lamp, a
`plurality of metal leads disposed in an injection-molded
`synthetic resin package, and a plurality of light emitting
`elements mounted on one of the leads and electrically
`connected to the other leads by wire-bonding are entirely
`sealed with a transparent epoxy resin or the like.
`
`In the LED lamp having such a plurality of light(cid:173)
`[0006]
`emitting elements, however, luminous intensity distribution
`characteristic varies in accordance with the respective light(cid:173)
`emitting elements. Moreover, heat-radiating characteristic is
`worsened compared with that of a package of a single
`light-emitting element. Hence, the respective light-emitting
`elements become uneven both in heat-radiating characteris(cid:173)
`tic and in light-emitting efficiency. In addition, there arises
`a problem that color-mixing characteristic is worsened when
`a plurality of light-emitting elements different in wavelength
`are mounted in the LED lamp.
`
`[0007] Further, in this LED lamp, however, lead portions
`(LED loads) by which the lamp is bonded on the mount
`board via solder is made fiat. The viscosity of solder is
`reduced instantaneously when the LED lamp is made to pass
`through a refiow furnace at a high temperature in order to
`solder the LED lamp onto the mount board. For this reason,
`surface tension of solder is applied on the lead portions but
`the LED lamp is hardly positioned because the lead portions
`are so fiat that the LED lamp slides. For this reason, in the
`LED lamp having such leads bent once, there is a problem
`that accurate mounting can be hardly made.
`
`[0008] Still further, an example of a related-art LED lead
`frame for the LED lamp will be described with reference to
`FIG. 7. FIG. 7 is a plan view showing the configuration of
`the related art LED lead frame.
`
`[0009] As shown in FIG. 7, in the LED lead frame 21, four
`electrically conductive leads 25a, 25b, 25c and 25d are
`protruded inward from an outer frame 23 so that an injec-
`
`tion-molded synthetic resin package 22 is fixed to tips of the
`leads. A plurality of light-emitting elements are mounted in
`the package 22, electrically connected to the LED lead frame
`21 by wire-bonding and then sealed with a scaling resin.
`Thus, a body portion of an LED lamp is produced. Then, the
`electrically conductive leads 25a, 25b, 25c and 25d are cut
`into a predetermined length and then bent along the outer
`circumference of the package 22. Thus, a surface-mountable
`LED lamp is obtained.
`
`In the LED lead frame 21, however, nothing sup(cid:173)
`[0010]
`ports the package 22 after the electrically conductive leads
`25a, ... , and 25d are cut. Therefore, the package 22 must
`be fixed by a jig or something when the electrically con(cid:173)
`ductive leads 25a, ... , and 25d are to be bent back or forth
`along the outer circumference of the package 22. For this
`reason, there is fear that the package 22 may be broken.
`Moreover, the electrically conductive leads 25a, ... , and
`25d cannot be bent accurately because the package 22
`cannot be fixed firmly. Hence, there is a problem that,
`inconsistency in positioning accuracy with respect to a
`partner member may occur in a post-process.
`
`SUMMARY OF THE INVENTION
`
`[0011] Therefore, an object of the present invention is to
`provide an SMD type LED device in which uniformity of
`luminous intensity distribution characteristic in respective
`light-emitting elements and improvement both in heat radi(cid:173)
`ating characteristic and in color-mixing characteristic can be
`achieved.
`
`[0012] Another object of the present invention is to pro(cid:173)
`vide an LED device which can be positioned stably without
`sliding of the LED device when soldered onto a mount board
`and which can be mounted on the mount board accurately.
`
`[0013] Still another object of the present invention is to
`provide a method for manufacturing an LED device lead
`frame in which electrically conductive leads can be bent
`with stable accuracy while a package is fixed firmly without
`being damaged in a process of bending the electrically
`conductive leads, and an LED device lead frame used for
`manufacturing the LED device.
`
`(1) According to the invention, there is pro(cid:173)
`[0014]
`vided an LED device having: a plurality of light(cid:173)
`emitting elements sealed with a light-transmissive
`material in a package, wherein: the plurality of
`light-emitting elements are arranged in a single row
`in the inside of an opening portion of the package
`and in order of element height so that a light-emitting
`element higher in element height is disposed on a
`outer side of the single row; and the inside of the
`opening portion of the package is sealed with the
`light-transmissive material.
`
`[0015] The light-transmissive material for sealing the
`inside of the opening portion of the package is shrunk when
`cured from a liquid state. For this reason, the surface of the
`light-transmissive material in the center portion of the
`package is dented so that the outer side of the package
`becomes higher than the center portion. Accordingly, when
`the plurality of light-emitting elements are arranged in such
`order of element height that a light-emitting element higher
`in element height is disposed on an outer side of the single
`row, distances from light emitting surfaces of the respective
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`US 2004/0206964 Al
`
`Oct. 21, 2004
`
`2
`
`light-emitting elements to the surface of the light-transmis(cid:173)
`sive material are made uniform, so that luminous intensity
`distribution characteristic is made uniform.
`
`[0016]
`In this manner, in the LED device having a plu(cid:173)
`rality of light-emitting elements sealed with a light-trans(cid:173)
`missive material in a package, luminous intensity distribu(cid:173)
`tion characteristic can be improved.
`
`[0017]
`(2) According to the invention, in the LED
`device having the configuration defined in (1), one
`shoot of electrically conductive lead for mounting
`the plurality of light-emitting elements protrudes out
`of the package to thereby form a protrusion provided
`in a center portion of the package.
`
`[0018] With such a configuration, distances from the
`respective light-emitting elements to a heat-radiating portion
`are made uniform, so that heat radiation is made uniform.
`Accordingly, light-emitting efficiency is made uniform, so
`that the LED device can be provided as an excellent LED
`device.
`
`[0019]
`(3) According to the invention, in the LED
`device having the configuration defined in (1) or (2),
`the opening portion has its periphery constituted by
`slopes provided in a lengthwise direction of the
`package and slopes provided in a widthwise direc(cid:173)
`tion of the package, and the slopes provided in the
`lengthwise direction are different in inclination from
`the slopes provided in the widthwise direction so that
`the inclination of the slopes provided in the width(cid:173)
`wise direction is gentler.
`
`[0020] With such a configuration, the opening portion is
`formed so that light is not diffused in the lengthwise direc(cid:173)
`tion but light is diffused in the widthwise direction. Hence,
`it is easy to guide light into a thin light guide plate. This
`contributes to increase in luminance of a backlight unit. In
`addition, when a plurality of such LED devices are used,
`color mixing characteristic of adjacent LED devices is
`improved.
`
`[0021]
`( 4) According to the invention, in the LED
`device having the configuration defined in any one of
`(1) through (3), the plurality of light-emitting ele(cid:173)
`ments are different in wavelength of emitted light
`and are arranged in a single row at intervals of a
`narrow pitch.
`
`[0022] With such a configuration, color-mixing character(cid:173)
`istic of the light-emitting elements is improved in all wave(cid:173)
`lengths of emitted light, so that good color-mixing charac(cid:173)
`teristic is obtained when light in full color is emitted from
`the LED device.
`
`[0023]
`(5) According to the invention, in the LED
`device having the configuration defined in any one of
`(1) through ( 4), the plurality of light-emitting ele(cid:173)
`ments include at least one red light emitting element,
`at least one green light-emitting element, and at least
`one blue light-emitting element.
`
`[0024]
`In this manner, when the LED device is constituted
`by three color types of light emitting elements for emitting
`light in red, green and blue which are light's three primary
`colors, the LED device can be used as a light source for a
`backlight unit because white light is emitted from the LED
`device. In addition, because the opening portion is formed so
`
`that light is diffused in the widthwise direction, it its easy to
`guide light into a thin light guide plate. Hence, the LED
`device contributes to increase in luminance of a backlight
`unit.
`
`[0025]
`(6) According to the invention, in the LED
`device having the configuration defined in any one of
`(1) through (5), the plurality or light-emitting ele(cid:173)
`ments include two red light-emitting elements dis(cid:173)
`posed on outer sides respectively, two blue light(cid:173)
`emitting elements disposed on inner sides of the two
`red light-emitting elements respectively, and one
`green light-emitting element disposed in a center of
`the single row.
`[0026] Each of a red light-emitting element and a blue
`light-emitting element is lower in luminance than a green
`light-emitting element. Hence, when two red light-emitting
`elements and two blue-light-emitting elements are used, the
`three colors are balanced to obtain white light emission in a
`state of uniform heat load balance. Moreover, because a blue
`light-emitting element is superior in light-emitting efficiency
`to a green light-emitting element, the LED device is suitable
`for the purpose of requiring bluish white light or for the
`purpose of requiring electric power saving. In addition, a red
`light-emitting element is higher in element height than each
`of a green light-emitting element and a blue-light-emitting
`element. Hence, when the red light-emitting elements are
`disposed on outermost sides respectively, distances from
`light-emitting surfaces of the respective light-emitting ele(cid:173)
`ments to the surface of the sealing material dented in the
`center portion are made uniform, and luminous intensity
`distribution characteristic is improved.
`[0027]
`(7) According to the invention, there is pro(cid:173)
`vided an LED device having: a package; a plurality
`of leads; a plurality of light-emitting elements elec(cid:173)
`trically connected to the plurality of leads; and a
`light-transmissive material with which the plurality
`of leads and the plurality of light-emitting elements
`are sealed in the package; wherein: protrusions of the
`plurality of leads pulled down out of the package are
`bent back and forth and/or left and right along a
`lower surface of the package; and tips of the plurality
`of bent leads are further bent up along side surfacer
`of the package.
`[0028] Hence, when the LED device is soldered onto a
`mount board, solder is deposited even on the tips of the leads
`bent up along the side surfaces of the package. Surface
`tension of solder is balanced on the front and rear or left and
`right of the package while the skirts of solder are widened.
`Hence, the LED device can be mounted in a predetermined
`position while prevented from sliding.
`
`[0029]
`In this manner, because the leads are bent up, that
`is, bent twice, surface tension of solder is balanced on the
`front and rear or left and right of the package while the skirts
`of solder are widened. Hence, the positioning accuracy of
`the LED device is improved, so that the LED device can be
`mounted accurately.
`[0030]
`(8) According to the invention, in the LED
`device having the configuration defined in (7), pro(cid:173)
`trusions of the plurality of leads are bent back and
`forth along a lower surface of the package, and tips
`of the plurality of bent leads are further bent up along
`side surfaces of the package.
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`US 2004/0206964 Al
`
`Oct. 21, 2004
`
`3
`
`[0031]
`In this manner, because the direction of bending of
`the leads is limited to a back-and forth direction, solder can
`be deposited on the package along the lengthwise direction
`of the package when the LED device is mounted. Hence, the
`length on which surface tension of the solder is applied is
`elongated so that more strongly balanced force is applied on
`the LED device. As a result, the LED device can be
`positioned more accurately when mounted.
`[0032]
`(9) According to the invention, there is provided an
`LED lead frame for producing an LED device having a
`single light-emitting element or a plurality of light-emitting
`elements sealed with a light-transmissive material in a
`package, having: a plurality of electrically conductive leads
`for mounting the single light-emitting element or the plu(cid:173)
`rality of light-emitting elements packed in the package, the
`plurality of electrically conductive leads being protruded out
`from one side of the package and connected to an outer
`frame of the LED lead frame; and a plurality of hanger leads
`protruded out from three sides of the package other than the
`one side of the package and connected to the outer frame.
`[0033]
`In the LED load frame configured as described
`above, even after the electrically conductive leads are cut
`into a predetermined length, the package is fixed to the outer
`frame by the hanger leads extended in other three directions.
`Accordingly, also in a process of banding back or forth the
`electrically conductive leads along the package, the electri(cid:173)
`cally conductive leads can be bent accurately without tot(cid:173)
`tering because the package is fixed firmly. Moreover,
`because the package is fixed to the outer frame by the hanger
`leads extended in three directions, it is unnecessary to press
`the package so long as the outer frame is fixed firmly. Hence,
`there is no fear that the package may be broken. Incidentally,
`after the process of bending the electrically conductive leads
`is completed, the hanger leads which have become unnec(cid:173)
`essary may be preferably removed.
`[0034]
`In this manner, the LED lead frame is provided as
`an LED lead frame in which the electrically conductive
`leads can be bent with stable accuracy while the package is
`fixed firmly without being damaged in the process of bend(cid:173)
`ing the electrically conductive leads.
`
`[0035]
`(10) According to the invention, in the LED
`lead frame having the configuration defined in (9),
`ones of the plurality of hanger leads are provided in
`a direction of a side which is among the three sides
`of the package and opposite to the one side of the
`package.
`
`[0036]
`In this manner, because a plurality of hanger leads
`are provided in a direction of a side opposite to the one side
`of the package, that is, in a direction opposite to the
`pulling-out direction of the electrically conductive leads, the
`package can be surely prevented from warping when the
`electrically conductive leads are bent back or forth along the
`package in the process of bonding the electrically conduc(cid:173)
`tive leads. Hence, the electrically conductive leads can be
`bent more surely with stable accuracy.
`
`[0037]
`(11) According to the invention, in the LED
`lead frame having the configuration defined in (9) or
`(10), the ones of the plurality of hanger leads pro(cid:173)
`vided in the direction of the side which is among the
`three sides of the package and opposite to the one
`side of the package are wide.
`
`[0038]
`In this manner, because each of the hanger leads
`provided in a direction of a side opposite to the one side of
`the package, that is, in a direction opposite to the pulling-out
`direction of the electrically conductive leads is made wide,
`stiffness becomes large. Hence, the package can be surely
`prevented from warping when the electrically conductive
`leads are bent back or forth along the package in the process
`of bending the electrically conductive leads. Hence, the
`electrically conductive leads can be bent more surely with
`stable accuracy.
`[0039]
`(12) According to the invention, in the LED lead
`frame having the configuration defined in any one of (9)
`through (11), ones of the plurality of hanger leads provided
`in directions of two sides among the three sides of the
`package and substantially perpendicular to the plurality of
`electrically conductive leads are wide.
`[0040]
`In this manner, because each of the hanger leads
`provided in two directions substantially perpendicular to the
`plurality of electrically conductive leads is made wide,
`stiffness against warping force in the widthwise direction
`becomes large. Hence, the package can be surely prevented
`from warping when the electrically conductive leads are
`bent back or forth along the package in the process of
`bending the electrically conductive leads. Hence, the elec(cid:173)
`trically conductive leads can be bent more surely with stable
`accuracy.
`[0041] Further, using the LED lead frame according to any
`one of (9) to (12), an LED device described in any one of (1)
`to (8) or any other type of devices may ha manufactured. The
`LED lead frame has at least one electrically conductive lead
`connected to one side of an outer frame of said LED lead
`frame, and a plurality of hanger leads protruded out toward
`and connected to three sides of said outer frame different
`from said one side to which said electrically conductive lead
`is connected. Next, at least one light-emitting element is
`mounted on said electrically conductive lead. Further, the
`light-emitting element is sealed with a light-transmissive
`material to form a package containing the light-emitting
`element such that a part of said electrically conductive lead
`is protruded out from said one side of said package and
`connected to said outer frame. The electrically conductive
`lead is separated from said outer frame. Thereafter, the
`electrically conductive lead is folded. In the case where a
`plurality of electrically conductive leads are formed in the
`LED lead frame, adjacent leads are folded different in
`thickness direction of the LED lead frame.
`[0042] Features and advantages or the invention will be
`evident from the following detailed description of the pre(cid:173)
`ferred embodiments described in conjunction with the
`attached drawings.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0043]
`In the accompanying drawings:
`[0044] FIG. lA is a front view showing the configuration
`of an LED lamp according to an embodiment or the inven(cid:173)
`tion, and FIG. lB is a sectional view taken along the line I-I
`in FIG. lA, and FIG. lC is a sectional view taken along the
`line 11-11 in FIG. lA;
`[0045] FIG. 2 is a circuit diagram showing the circuit
`configuration of the LED lamp according to the embodiment
`of the invention;
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`US 2004/0206964 Al
`
`Oct. 21, 2004
`
`4
`
`[0046] FIG. 3 is a graph showing luminous intensity
`distribution characteristic of the LED lamp according to the
`embodiment of the invention;
`[0047] FIG. 4 is a plan view showing the overall configu(cid:173)
`ration of an LED lead frame according to an embodiment or
`the invention;
`
`[0048] FIGS. SA, SB, SC and SD are explanatory views
`showing a first half of a process of bending electrically
`conductive leads by using the LED lead frame according to
`the embodiment of the invention;
`
`[0049] FIGS. 6A, 6B, 6C and 6D are explanatory views
`showing a second half of the process of bending electrically
`conductive leads by using the LED lead frame according to
`the embodiment of the invention; and
`
`[OOSO] FIG. 7 is a plan view showing the configuration of
`a related-art LED lead frame.
`
`DETAILED DESCRIPTION OF IBE
`PREFERRED EMBODIMENTS
`
`[OOSl] An embodiment of the invention will be described
`below with reference to FIGS. lA, lB, lC and FIGS. 2 and
`3. FIG. lA is a front view showing the configuration of an
`SMD type LED lamp according to an embodiment of the
`LED device of the invention. FIG. lB is a sectional view
`taken along the I-I in FIG. lA. FIG. lC is a sectional view
`taken along the line 11-11 in FIG. lA. FIG. 2 is a circuit
`diagram showing the circuit configuration of the SMD type
`LED lamp according to the embodiment of the invention.
`FIG. 3 is a graph showing luminous intensity distribution
`characteristic of the SMD type LED lamp according to the
`embodiment of the invention.
`[OOS2] As shown in FIG. lA, in the SMD type LED lamp
`1, one sheet of metal lead 3 is inserted in a synthetic resin
`or liquid-crystal polymer package 2 so that the lead 3 ranges
`from a left end or an opening portion 2a of the package 2 to
`a right end thereof in an upper half of the opening 2a. Two
`red light-emitting elements Rl and R2, two blue light(cid:173)
`emitting elements Bl and B2 and one green light-emitting
`element G, i.e. five light-emitting elements in total, are
`mounted on the lead 3 so as to be arranged at short intervals
`in a single horizontal row. On the other hand, in a lower half
`of the opening portion 2a, a protrusion of the lead 3 is
`disposed in the nearly center portion, and five sheets of loads
`4a, 4b, 4c, 4d and 4e are inserted in the package 2 so as to
`be at a distance from the lead 3. These leads 3, 4a, ... , and
`4e and the package 2 are integrally formed by insert(cid:173)
`molding the package 2 in the condition that the leads 3, 4a,
`... , and 4e are set in an injection-molding mold for the
`package 2.
`
`[OOS3] The five light-emitting elements are electrically
`connected as follows. Because anode-side electrodes of the
`red light-emitting elements Rl and R2 are on their rear
`surfaces respectively, the red light-emitting elements Rl and
`R2 are bonded and mounted onto the lead 3 by silver paste
`so that the anode-side electrodes are connected to the lead 3.
`Because cathode-side electrodes of the red light-emitting
`elements Rl and R2 are on their front surfaces, the cathode(cid:173)
`side electrodes are bonded to the leads 4a and 4e by wires
`S respectively. On the other hand, because anode-side and
`cathode-side electrodes of the GaN type blue and groan
`light-emitting elements Dl, D2 and G are on their front
`
`surfaces, all the anode-side electrodes are bonded to the
`downward protrusion of the lead 3 by wires S respectively,
`and the cathode-side electrodes are bonded to the leads 4b,
`4c and 4d by wires S respectively.
`
`[OOS4] Electrical connections of the five light-emitting
`elements connected as described above are shown in FIG. 2
`as a circuit diagram. As shown in FIG. 2, the electric circuit
`of the LED lamp 1 is provided as an anode common circuit
`using the lead 3 as an anode-side terminal (3a). Hence, the
`number of terminals can be reduced, so that the size of the
`LED lamp 1 can be reduced.
`[OOSS] As shown in FIG. lB, the opening portion 2a of the
`package 2 is filled with a transparent epoxy resin 6 and
`sealed with the resin 6. The transparent epoxy resin 6 is
`shrunk when cured. Hence, as shown in FIG. lB, the surface
`of the transparent epoxy resin 6 is dented in the center
`portion so that the outer edge portion becomes higher than
`the center portion. Because the red light-emitting elements
`Rl and R2 are the highest in element height among the five
`light-emitting elements Rl, Bl, G, B2 and R2, the red
`light-emitting elements R2 and R2 are mounted at opposite
`ends of the single row so that distances from the light(cid:173)
`emitting surfaces of the five light-emitting elements Rl, Bl,
`G, B2 and R2 to the surface of the transparent epoxy resin
`6 are made substantially uniform or uniform. As a result,
`luminous intensity distribution characteristics of the respec(cid:173)
`tive light-emitting elements Rl, Bl, G, B2 and R2 are made
`uniform, so that the LED lamp 1 can be provided as an LED
`lamp having excellent luminous intensity distribution char(cid:173)
`acteristic. Moreover, color-mixing characteristic of adjacent
`light-emitting elements is improved, so that the LED lamp
`1 can be provided as an LED lamp also excellent in
`color-mixing characteristic.
`
`In the LED lamp 1, the lead 3 on which the
`[OOS6]
`light-emitting elements Rl, Bl, G, B2 and R2 are mounted
`protrudes out of the package 2 to form a protrusion located
`in the center portion of the package 2. Hence, distances from
`the respective light light-emitting elements Rl, Bl, G, B2
`and R2 to a heat-radiating portion are made uniform, so that
`heat radiation is made uniform. Hence, light-emitting effi(cid:173)
`ciency is made uniform, so that the LED lamp 1 can be
`provided as an excellent LED lamp.
`
`In the LED lamp 1 according to this embodiment,
`[OOS7]
`the periphery of the opening portion 2a of the package 2 is
`constituted by slopes 7a provided in the widthwise direction
`and slopes 7b provided in the lengthwise direction. The
`inclination of the slopes 7a provided in the widthwise
`direction is gentle whereas the inclination of the slopes 7b
`provided in the lengthwise direction is steep. Hence, light
`emitted through the opening portion 2a is not diffused in the
`lengthwise direction but diffused in the widthwise direction.
`As a result, when the LED lamp 1 is used as a backlight unit,
`efficiency of incidence of light onto a thin light guide plate
`such as a transparent acrylic plate is improved to thereby
`contribute to increase in luminance of the backlight unit.
`
`In the LED lamp 1, five light-emitting elements Rl,
`[OOS8]
`Bl, G, B2 and R2 different in wavelength of emitted light
`are arranged in a signal horizontal row at intervals of a
`narrow pitch. Hence, color-mixing characteristic
`is
`improved more greatly, so that good color-mixing charac(cid:173)
`teristic can be obtained when full-color light is emitted from
`the LED lamp 1.
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1010
`
`

`

`US 2004/0206964 Al
`
`Oct. 21, 2004
`
`5
`
`[OOS9] Further, as shown in FIG. lC, the leads 4a, ... ,
`and 4e pulled dow