(19) AaBCY PD
`
`a2 os BR BF A Rw
`
`(11) SPRLBES
`#FPAZ003 — 17754
`( P2003 —17754A)
`43.400 SeRRlSeF 1 A17F) 003.1.17)
`
`(SL) nti,”
`HOIL 233/00
`
`mela>
`
`Fi
`
`HOI1L 33/00
`
`p-Pa-b (Bs)
`5FO041
`
`N
`
`Bea
`ARR PRHORM2Z OL (# 6 A)
`
`COOL LENZ
`
`QLea (72001 — 2082721 P2001 — 208272)
`
`(71) EA
`
`(22) EAA
`
`*ERRISIE 7 4 4 AY C2001.7. 4)
`
`OdERE
`SCABRATACPMAYP50 BPDT21
`GER EE
`FRATSCABTaRSHT21
`Moataaley
`100090181
`
`Rd,
`
`72) 38S
`
`DAA
`
`Cb 1)
`SP WW BRA
`SFOd] AAd? DAOD2 DAO? DAL DAZD
`FY (BS)
`DABS DAG
`
`
`:
`
`
`
`30 He
`
`32
`
`(54) (FRO-BA] AISTRPERSEa
`
`(57) (89)
`(tint) Hie] Qian eR Sa VBR
`18LOS] MEER RM2 2 OZHENOMPHC,
`8] Ab K-11 AORGMD) 4 ako
`HPPA 1 4 bMS THO. FHKE ea LY
`YRRLSLCELED Fo SSOMRL FeV yant
`eS, Cnickyo, Bil 2k eI RUS oY Pee
`LS Sway Sth OAN—-RL, MAK Fd LIS
`182351 MEAS 2 0 4 A RARER TSh
`MOAN -ALSERACESZOU, ZOHM AICHE
`Le omgmeereacagsces, @L0, #1 WE
`EAB 2 2 SRE 8 MBI ROL 40 atc
`H42 atc kotHete anor, Ble 8 hick
`Haw 1 OSSET ARMADA ORALMCERA
`RODAN- ZEEESete yi,
`(#) BMAn. OnesRSMORAME 4
`HRAYVELLY SO LMWTES,
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`Uta OM)
`[iaKT 1) Bk,
`ECHR ORMCSie ea KL PD OBE
`OT 4 PRY So OBE,
`Ble Sa KK ge ORa BR Pa SY DEE
`MRF Fy oS
`MieFo TMS APR eet
`EBAAUCHERTS I 4 ¥,
`PAROREBSI RLU? RSS
`H.
`REcHRe Bal, WHOtN SHOwaeAiais
`AbD 7 ¢ YR LU GES 1 ESASH
`PVN OMPCAm a iE 1 Asbo —b,
`PERCHES BwL, BHO NeNOMDBswD
`APRU SF ¢ > PRE KUM 2 REAR ADE
`EHOMPA Ades Nie2 AIL— a be,
`BEES 1 AIL OLPUI AR aN, HELP KL 4
`» Vete LHe 1 RRAt ERAT S
`3] BE. PAU CRIS 2 A — RL AICHE
`Sh MEO 4 ORD 74 Pet de2
`BAL+BAOCET SADRH4AS.
`SRN Shameeee
`[3518 2 ) MieTe Tet, LR
`KAT F o TCH IC, BEERSe AWE KL
`a tHtika ive, ERIE] ROMSRea ee,
`[ AASRime ey ]
`[9001]
`[ERLOPMAD) CORB, MRMawe eS
`(CRI, FOT AAR AAO KOS VRS
`MavA ORM CUMS hike F4IKL FS +p TR
`LUGE PRL FS 4 ORHL, RMS hice 1
`BAUS 2 HERA, BLOWSZEDES
`LAA Ibo — VP ORS a rcBic Eo TBA
`BUC RAR Sac. SER tase RT ZS,
`[oo0a2]
`[HER] (ROSEERLeDAs
`Sr kVE altard, COM+ wiam CL
`F Sic [aebstit) B59,
`)
`lik Bi2e8A,
`SU 2 OESBEL2 ab kU? hiclk HOBMAI BLE
`CAAA ATS, BHIBLM AL, Ghee
`FURS abst atSH, GIF awit aw
`ha PMA, DPR 4D BES bdskey
`BIW ABA DAHATAA, ELT, FILER b
`OHIO RDF 4 DH oo ARR SHE TO
`d,
`[OO0S) @0t, 42 74 v PBlea co letg,
`ERSRLATF oT UF, TLEDFe7I LE
`4, OMAR FLUENT. *ORMBE
`fed (BRAC HIRSENTS, SLT, LEDF a7
`SOLS BRIM PK FV OBR he
`
`19
`
`29
`
`4G
`
`30
`
`BASOOS-17754
`é
`
`MPSA LUBATLA, SH5tc,
`D4PKU SF 1 OBI b, SHLAA, Pty
`Pi vyBedc, PAPSRILVLEDF 2 S6S
`OS, Heth SateSe Sue ck eb ah
`TS,
`[O00 4) 2 Mk 45RRI1 BFA ak
`U4 aDENFnHOMMR3S ewLO4e +, BIBER
`BORE -—V Ba BLUR HOSHENEM
`ab Ohi ky BAacHeahS!’, te. the
`POPAABS attr atk, RR2 ORAM
`RMB S do. 4d, BR 2 OMIARS ici
`Se, 4e, PLU? ORACLE MEANK RED 3
`f. 4fPbHo Td,
`[9005]
`[RPMRRL ES CTS) LL, Batre ft
`50, tEOR KEL Ck, SA ORRB2 a, 2
`bo, HEFAST OZMIME YS SIM HL CRA
`THAD, CORMM2Z a, 2hORHBSLI, L
`2 SRE | OMNES< DTS Bl cto Tha
`4S, LU, HTM a. 4aDthenowmMns
`e, 4e¢, BERS OR IY-VBa, BHOt
`NEHEMHHG a, GDHUCL oC BARUCHRAHNS’
`OC CO#AGa, SHOAN-2L3, L4 DMR
`Bie bicodBt ans, COLA. HEORKER
`1k, MMASLI, Lekha<hote). Dt
`BRBHiRS He#Aoa, GhMAN-AL3, L4A&
`GCBATAZOC. BRR SIE S HARARE IS
`MS eeehI MOM to TlhS,
`[O006 EhHMAC. CORMOLL ABR, H
`SEMIS IRA Toth bic, Ae
`LICE ADRODAN-REOBL LAL, GRRE
`meme SCE CHS,
`[0007]
`(HBL AMAT Sh DOFR) BLOREL, Bik, &
`ORR YR Ta VRB EO TA
`PRU FP 4 UPB FARV ST a Pei AKL
`FV EMCEET Fy 7, ERIEEF TL
`D4PKU SF OBES BAAR AT TY,
`PRORMCIEME Nick | BLOW 2 SABIE,
`BRE BIEL. MMODOBEN Ff RUS
`4 TRIER LU PERSON eNOMPIC
`ws) Abe RL, Be SIL,Me
`HEN OBL4 PL FD YB LUO
`HFFA SLVEN SNORE SN B2 Alb
`K-, BLA RoW ACHRSh, FHL4
`VVBtee BS SEAR FACET 28 1
`BEBE, POUR 2 RohOLE, oD
`APR F 4 PRR A 2 EAB eB
`HATZ S 2EGBEeAD, BSS eT
`4,
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`3
`
`[O008)
`(ie) CORMCLSZL BLAV—K LOMO
`ENF OB iHaM Ff LF + PBka
`HekAREOENAHNOMACRRANtTHO. a1
`AN KILO SIS LERBI kT 4
`KY Fo YRHE SMEARS AMSA
`ENTS, CHickst. FAKE Ke VRE
`IEICERET STeMOAS-AL, MAK FV es
`tet fl RBA+t FBR RT ZkHOAn~
`HREBRBATAZCALMTHA, LeMOT, R4KLY
`FY PBS ART SIMOAS ALC. aK
`LFV SRLS | SAAB SHR Siew
`ASA (B44 arP AR 2 h oHTPSZAS- AL
`2) SABC RS SOBA <, FORK EROH
`AMOTEE SS FSZCAMTAS,
`[(OD0S) #0, B22s-K-NOMMOZHE
`ADP74 PKL Fe VY PRR LORE
`SA REOCHeN OMA beth T RY, 2 Alb
`— KILDA SA ie2HB E07 of PK
`VF _V PRLS 2 RRA Set MERE Bie
`NTA, CHKK oT. VAPKL Ke > VBR
`HEIRS StemMAn-AL, PAPKY Fie
`Bit 2 MERMSE+ tBAMICRRT SHO?
`N-REBRATSZCLHCHSA, LicwMot. F4P
`KY Se PRAT SRD DAN- ALEC,
`FD
`4°RUF 4 RRR 2 RABEL HERTS
`MODAN A (BA oa TIA? a CHEST SAN O
`AL 1) GANRRRS Sat. | SOc aR
`OAM OTE He << TAC ALMCES,
`[9010] #4, BRORMICHRANKS ] PLD
`32 MSE BOMDRE RICA S ics
`(CRRA SHAT. C OMSals ees
`EBETARDOAN- Al, BAe4h,
`SaDMArn-AL4, L3 SRR LCRAT 508
`MELA,
`f[oo11)
`(RAD) cmeeRgle hilt, 4 ame He ROR
`iw 1 OWE2 a, 2 oI SAX-ALI, L
`SCHR OMAM OTE. FSI LH CESL,
`BBBRbicteat#AGa, DhOAas-ALB, L
`ASPAEPTALEMTES, CMT, BPHRIC
`BE SNZHRRYSesOVSRELHERKLNG
`HSC dsTES,
`[0012) COROLROBN, 7OIORN, FB
`als LORS. EM BIBL C774 LP OSM PEE
`HT RAORAO,
`[9013]
`(SHA) Blk VR 2nd CORWOMEY
`Sun (See UP, Bic (teat) 43S.) 1
`Qik FEBS PHSSOLALPAASTESO
`
`10
`
`20
`
`3)
`
`40
`
`WE2OO3-17754
`4
`
`RAS LcEOTHY MIREORRI2eSh,
`BURL 21k, PORASOAL LWABMEO BR THBAS
`MSRRBTL YL, FFRZLKS LY SHS6HO EO
`the KR (RITE KIRN XA) [d, AEOPBILOBF
`toRUt, AAI. 2ammx2. Ommxo. 8
`mm. #%tkO. BmmxXl. Bmmxd. Sanne
`ESSMEZHNTLS, CORBBRPIOM. 10¢
`MX S cmH OAS AOHRLAMK SRORLAF FT
`»F (REP, TLED Fo 7) £35, ) SeMiTe
`APA AP bh U PACH. CoOBREWS
`MTS CA LVBEHS,
`[O014) Bik] 2ictk, BLtcHmAeRe CLM
`{21 24Rit SZ HAOA ] Ao L LA EOS
`2ZAMoO ROW | OMENS, COB] BLD
`B2 Ak A,
`| COEHEHORE 1] 2ZOR
`HCHOF SRM 4a, 1b alk. Bikl
`2ORACHBMENTWLHS TAK FS «PSH BB
`KODA PKL F 4 VBR. ODEHENOWACR
`M2nHteY,
`tNHenOGsesySsBHW1l38, 204
`sURDATHS, ELT. RAM-—towb1 4, 16
`OEHEAORMMADHERL 4a, 16 alk. Sah
`18, 20H@HnFnoprichm,. Ths, Hie, B
`LiGEVMZ AWK WL A, LEDENEHORR
`12 ORTHOT 42RD lL 4h, 16h
`tk. BRI 2ORMICHRS NSH 1 PSSA
`226k? MEHR M2 4MtHeROMP Cw
`Ment). EHeNOWetSBH2 2, 24004
`2TRhbNTHA, ELT. BAMHI AL 16
`OFHENAOMMAPRE IL 4b.
`1bBhbs. Ble
`KB ER ASE2 2. 2ADTHENOPRC
`mL TLS,
`[O015) #%, BLBEVBZAV— ROW] 4,
`LEDtHEHOMIRMCIK, BRR? 6 oko
`2BE2 OMERANTOA, COS 1 ERB
`26, FAK FS + VFB SL BRERA
`22¢4¢BSHBRLTIOS, CLC, BORSRE
`28h, DAP RY Tal 1B? O42 EES
`22 4 be BAHICIBEL TA,
`(00186) 4K 7 4. YB) BOLm, Eb
`HELL OLE DF 173 OMMMBS HT 4K Fo
`VENTS, COLEDF » 730, FORRS
`fet X4KU FYB) 8 AMBRACHER ANT
`WS, ie, LED Fx S23 OORMBERI Oa LTA
`PHF 4 YB OLMIS TAPS 2c
`PHU Fe VPVENTHOSA, ELT. BRL 2D
`do, FEOAES Ce AOR AA)
`BG SEARS AEB SH, COMRAS ale ko tT
`LEDFx73O, D4EI2, FARV TH 4 PB
`my
`LR kO 4 PRY Fi V2 OMS,
`ORB S 420RL TC, SALTHPs, KORE
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`5
`
`4,
`[OO017) #%e, Bl (B} amr kaic, LEDF
`pRBO, FARV FS 4 PB Bek DI 1 EK
`Fi VBE2 ODENEHOWARK, PEABO
`HS, LU RAKV SY YBR) 8 OMMEK
`td LEDF o> SISOBLUD APR ST +L YB?
`ODFMRRAKLOOSDPLAES BRA HTLS, 2L
`C, A2iumpP ist, ARAL2 MABE?
`2. 2407MAAK, BERR CHD, FAK T+
`UPRELOLRMLASS THA, ELT, BRL 20
`MARISCHS, © OH) 2 OMAMLE
`SSRI QOS GER kea? AV K
`“Wl 4, LEDENTHODDOHTRL TA, #
`ke FRAMIPSAT, BH] Asbo IL 1 Ami
`H4pusF 4 PRBS, BSR Bee HE
`OLED Fs TIODEhHFenNOGDAMT SAT
`SHENMMRSNTLS, FHC. B2aL—R-
`LEORMCT PKU SF 1 LPB! ORLUH 2
`ZEABR2 4DENTHOHiIMBTSZLEILEN
`EnMMEENT A ELT, Choe 12. LE
`DFo730. 4A BV Fe > PBM BB, D4 PKL
`FeV PRE O, RAUL S BLOS 2 SRS
`222, 24k. HEHE PRAMS RT EVO
`[IT SOOL4 DMBAR Cie ST he
`d.
`[OO18) 227, Bl (B) wR kat. FAK
`VF qv IRBH) BO—-IORSEM)LELEDF o 73
`OD-WOREM2 KHSKES LTUAZM, COKES
`(CARES LTS, LEDF»ySIOOKL Fay
`SFIRMSPTHTELLEDF x73 Oe PTARL F 4
`) YB BERR IKU FP CREA LILTS]
`4b, GH RST 42RRA1 2 bic
`LUE BREIL SZRMOORBRT HY, BBL
`EHSRBRMCHARS LTS, UT, BRL 2D
`EACEZWH 2a, 12b4, CHSAMH] 2a,
`l2D¢cRGS KAKU F 7D PBR) BREDA LP
`KY FP 4 > SBM] O OZR E OMAN 1, Neots,
`SST ety DL CR 1 2 RET St & OU
`OILS DEeBEST SROORBEATHY, BRL
`SW SMBE LTS,
`[09019) Mlimtett lowed. Paik
`LF _ Uv FBRM) BOLMKLEDF eo 73 ORL SF
`tePVaNCiat, FAP ee) othe
`1HRERSM2 20thHeN ORAS 1 2k
`LL ADENEN ORB MDMA 1 44 BORE
`BALNGABL A pb Ava LTA, AGI, FHARU Ts
`- YR 1 8 21Ae 2 BoM, BI] Abo
`KOOL APLCAC RBH? bck TB
`SRUCRRERTIOS, Cloot X4KU Kyu
`in) 8H) 2 kiteAkmoanx-at,
`
`C4)
`
`10
`
`20
`
`40
`
`RWEQO03-17754
`6
`
`4h>F 4-7Rel St ARRAS2s
`FAUCET SeMDOAN-ALSHATA CAME
`A,
`(D020) kot, FARV FH 4D VBE 8 SHAR
`PSM DAN-ALYHC, FAKYL Fa - OBR SB
`£2 | PEASE? 2A SBRINCRET SICHDA
`NR (BAIRTAB? bicfH#PZAN-AL22}
`SR GICERT 2UBM <<, CORRE 2OH
`Bae GSE) OTHE hactZcamc#4a, =
`Bi, HW 1 2ORMICHMA iH | DA BE2
`2 ABRAMS 8 HCAS BUR Rom 4 0 9 to
`A42aes tL CRABS NSOT, Ree 1
`OLE SteHMAN- ALY, 4 tome AS
`h@OAN-AL4S# BPRS 8 EM BRT Sette
`bs
`[OO2Z1L) 4L0, P4732 OSBRACER
`She I4 PK St VR? OKOSR? EE
`Bh2 AMTHEN OMAR AV—K-IL] OME
`HEROAPI MOBS 1] 6 a $3 LORMBAR 1
`BbAMMLTS, £5, Sf PRY TL PB
`204202 PRARSie2 42, B2AWHK-I1
`SPUCHAR Sic 2B 2 Be b> CBRE
`MSHT 4S, ChHilLkot, PAK Fev PBB
`20 2SHR1 2 ICBARTSRMOAN-AL, DAF
`KL S42 > TRHS OCA 2 MRABe AL eR
`PECTS Sic OAN-RELARATA EMCTE
`4,
`[D022] kot, PARR ST 4 > PR OA
`RBS SRMODAN- ALI, D4 eK S47 vee
`20232 MESA Sie2 4 +eBSCR Sk
`DANA (BA CeshaSR2 9 AAT SAS—AL
`1) SHBCHIRY ZB ite 4, EORRMER1 2
`Dima) (RAG) OTEAHac TEC LAcTe
`&, LC, (02 PERS 2 4B HRS 8
`HRSAa > LOND WERADRhHEALTt
`BAGS RSD 4 tomMPtHS aDar—-
`ALSeARICTSC LACHSA,
`(0023) ¥%, LEDF »7F3SOMKV FT (VS
`teh KU Fv YH) BORE, LEDF oT
`SODEHORRKAVSKES L, PORE OMIRMIA
`WRF SCOMEY, KAKU SH > Btw B Etc
`LEDFx73OeKLF (VU Ft SLEOMBTNEG
`BHAT ARMORMERE 4K SF 4 OBIE) BEDS
`BRB SUENMTSZCAMUVRS, Kat, FAK
`74 Pe) ORES LENSER RE <
`PTZCEMTESZDT, KAKY TY 7B] Bet
`AVA FSC LMHS,
`[OO24) COLAC, BAtlas peoORthe 1
`Owm2 a, 2boitbryeZax-a2Li, Ler!
`1 20H MAM) OTe toc 4a
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`7
`
`C3)
`
`BA2OOS-1LI754
`8
`
`XZ L, Lit BRRHIRS 8 kiddie TA 4 tomeEw
`9a. SHMAR-ALS. LASSE TSEACALHT
`#4, LeMot, DRESS 8iceHeAN ARE
`10 SORERRSGELOSELWSCEMUCES,
`[O02Z5)] anick). GRRS 6 Lic SRORK
`ew) ORR LIGA. DBs SoOLmoOmES
`KROOZLEDF » 73 OMBRET SIAR S = EEL
`HEREC FSCEMVES!L, BH] 2OLHOMR
`4eoODRMSECRLOLASS PAC LHe
`4,
`(OOZ6]) ELT, MIRRTEIE, LEDFo7
`SORKLU SARS +> PRE 1 BOBO BL UC
`—RSthR Chik, LEDFoeSIODFAKLT
`tv PSB BT ARDS a VYOWRTHOHRS
`RAE AS SC TSZCLMCES, ELT, FALL T+
`VRS, 21ABRs Zieh] Abo
`KOVILA DERENOBLEMSA TAI AY,
`BR) ALOK AC PATS ev Bel
`BLOG ASRASHA2 CeAe CORY
`UZ KSZENPHOHSMREAE << TAC LMT
`4, Bike, D4 PKU Fe (DoBH20, BH
`WBMh? 4 BEKO? Z—K-IL] BOENEHOM
`eRe ter cick, BZAV—KoW] GtoH
`LUDA PKL FS 4 > YRA2 ORLUS2 TESS
`M24 RMT SCR OUMRTHNIC ESATHEnHOHS
`MRSAS SC TSZCLACES,
`[OO027 ) yeteL, bie. LEDF 273
`QO, 4K Fi VP) 8, MEA Ba 2
`BKB AVRIL] ADENFHOHDE-RS
`iow, ENFnoOPoeMate Th kla, ke
`L. 2DHSeth, BIA KOW | AORMBEO
`iSS0 1 4a BLOM4 ppOCHeHhe ¥
`hv F + vB PLUS MEAS 2 20
`ENFHORAN METS, CUT. GHPRV Fey
`YRH20, #2 MRA BH2 4c kOR2 AK
`WL 6B OEHenoOPbe—-Re ties, CheEND
`Boeke tbh, COMSCORE, B
`2 20-—A OL | B SPIRE | 6 a BOR
`HUFALDIBAE 1G DOEHEHAIA PRU Fo PRE
`20 LOR 2 MER 4PthHeNOHACKR
`mt 4,
`[OOZB8)] 40, Liaw riak LEDF»73
`OD RMORRENRIRAK A LDC FHKE Kae Lv
`TBH 1 8 ORRANIEAR EC Lit LEDFo 73
`ODEMOMEMK + AWE CHS LAE, RAKE
`FV PBB) SEEN LO ODLASLEOMUOT
`WHATA Lia,
`(0029) ¥%c, ERMINE PH KU PF Ue
`BH] BORRELEDF »o 73 OO RROMROBY
`We Cis, HB E LAS Tekan, Blt, LED F
`
`10
`
`2G
`
`30
`
`PROS A RLS al VRB ROK PR Ue
`TEBAS ELAR CHHL,
`[0030] 25tc, LiteHAti LEDF»73
`OL PATARI ORAL CON
`Shore & ALAR LP FAAS SEC DD
`RAST SZCAMTEAL, LAL VAPSOMD
`Hestaepeeiclbo DRS RATA CLAS
`3d,
`[OOS 1) # Lt, Hier Alirrk 4
`io, Ka BYP PB 8, PA PRES Ve
`20, KAU REAUS2 ERM Bhs 2, 2
`4A Bl RBLUSZ AVRO A, 1LED*EHE
`NAVTOES SRAMA a, Lb awRLURH
`HIRSOHABI 4b, LBD ERAL SIREN TLS
`MS CHCHAT, THIRD Pay YBBR S. C4
`KY Fey SRM 0, CSUR] bk UR. ME
`FRPBH22, 2Z4DENFHODR SILA,
`ENHENOBMUAMENENL ADT SSL BLUA2
`AN—HK-IL1 4, 16 ORMMAMABI 4a, 16
`ait kORMPALsl 4h, 16b cer eka
`tLthbkh, Hh, PhenOBwILORE, W1
`BEUS2 ALK 4A, LEDEHN SNM
`Mane SH BLO 2HRBH26, 2 8 ONE
`tfl-t 74,
`{ aii ODPASatz BG )
`(1) (A) CORA OSHOPSRI
`MRBRLicRHSN TVS hRerTHe,
`(B) cB) 1 (A) RHPORAER ems PHC H
`4,
`(82) 1 (A) SORARe ant SHAT
`bs
`(44) HAORAEAARLCRA TS
`emsaes,
`(44) HERORRARESH TS
`eters ih HE] Ta A,
`(iS5488)
`10 ew
`12 -- SHR
`14 --R 1 AMO ROW
`
`40
`
`l4a, 16a --IRD
`l4b, 16b --ePIRDeES
`16 --32 Abo
`
`18 +44 hers Ve
`20 C4 FRU FS 4 LD VBE
`22 --S 1 meee
`24 --S32 meee
`26 --Blew
`28 + S2eSet
`30 --LEDFoy
`32 <4
`
`vO
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`9
`
`34 - WES
`38 - bgeR
`
`(6)
`
`RAE 2OOS3-17754
`10
`*408, 40D —-BORS Rm
`
`*
`
`(41)
`
`(2)
`
`
`
`(4 ]
`
`
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`
`
`(19) Japan Patent Office (JP)
`
`(12) Japanese Unexamined Patent
`Application Publication (A)
`
`
`(11) Japanese Unexamined Patent
`Application Publication Number
`2003-17754
`(P2003-17754A)
`(43) Publication date: January 17, 2003 (1.17.2003)
`Theme codes (reference)
`
`(51) Int. Cl.7
`
`Identification codes
`
` FI
`
`
`
`Request for examination: Not yet requested Number of claims: 2 OL (Total of 6 pages)
`
`(21) Application number
`
`
`Japanese Patent Application
`2001-203272 (P2001-
`203272)
`
`(22) Date of application
`
`July 4, 2001 (7.4.2001)
`
`
`
`
`
`
`
`
`
`
`
`
`
`(71) Applicant
`
`000116024
`ROHM Co., Ltd.
`21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi,
`Kyoto-fu
`Hiromoto ISHINAGA
`℅ ROHM Co., Ltd., 21 Saiin Mizosaki-cho,
`Ukyo-ku, Kyoto-shi, Kyoto-fu
`100090181
`Patent Attorney Yoshihito YAMADA (and 1 other)
`F terms (reference)
`
`(72) Inventor
`
`(74) Agent
`
`
`
`
`
`
`
`
`(54) (TITLE OF THE INVENTION) SURFACE MOUNT TYPE SEMICONDUCTOR DEVICE
`
`(57) (ABSTRACT)
`(CONSTITUTION) A front surface side opening end 14a and a
`rear surface side opening end 14b of a first through-hole 14
`are disposed within the respective planes of a die bonding
`electrode 18 and a first surface mount electrode 22 formed
`on a substrate 12, and an LED chip 30 is bonded on the die
`bonding electrode 18. As a result, a space for forming the
`die bonding electrode 18 on the substrate 12 and a space for
`electrically connecting the die bonding electrode 18 and the
`first surface mount electrode 22 can be shared, so the
`horizontal width of the substrate 12 can be reduced by the
`shared amount. The first surface mount electrode 22 can be
`connected to a wiring pattern 40a of a circuit board 38 with
`solder 42a, so it is unnecessary to secure a space for
`soldering in addition to the space for mounting a light-
`emitting device 10 to the circuit board 38.
`(EFFECT) The mounting density of a surface mount type
`light-emitting device on a circuit board can be enhanced
`beyond conventional levels.
`
`
`
`
`
`
`
`
`
`
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`(SCOPE OF THE PATENT CLAIMS)
`(CLAIM 1) A surface mount type semiconductor device
`comprising:
`a substrate;
`a die bonding electrode and a wire bonding electrode
`formed on a front surface of the substrate;
`a semiconductor element chip die-bonded to the die
`bonding electrode;
`a wire for electrically connecting the semiconductor
`element chip and the wire bonding electrode;
`first and second surface mount electrodes formed on a rear
`surface of the substrate;
`a first through-hole passing through the substrate so that
`opening ends on both sides are disposed within the
`respective planes of the die bonding electrode and the first
`surface mount electrode;
`a second through-hole passing through the substrate so that
`opening ends on both sides are disposed within the
`respective planes of the wire bonding electrode and the
`second surface mount electrode;
`a first connection electrode formed inside the first through-
`hole so as to electrically connect the die bonding electrode
`and the first surface mount electrode; and
`a second connection electrode formed inside the second
`through-hole so as to electrically connect the wire bonding
`electrode and the second surface mount electrode.
`(CLAIM 2) The surface mount type semiconductor device
`according to Claim 1, wherein the semiconductor element
`chip is a top surface light-emitting type light-emitting
`element chip sealed by a covering part made of a
`translucent resin.
`(DETAILED DESCRIPTION OF THE INVENTION)
`(0001)
`(FIELD OF INDUSTRIAL APPLICATION) The present invention
`relates to a surface mount type semiconductor device, and
`more particularly to a surface mount type semiconductor
`device in which a die bonding electrode and a wire bonding
`electrode formed on the front surface of a substrate
`included in a light-emitting diode, a transistor, or the like,
`for example, and first and second surface mount electrodes
`formed on
`the rear surface
`thereof are electrically
`connected by connection electrodes formed in through-
`holes so as to correspond to one another.
`(0002)
`a
`example of
`(CONVENTIONAL TECHNOLOGY) An
`conventional surface mount type semiconductor light-
`emitting device is illustrated in FIGS. 3 and 4. This surface
`mount type semiconductor light-emitting device (simply
`called “light-emitting device” hereinafter) 1 includes a
`substrate 2, and a pair of electrodes 3 and 4 are formed at
`each of the ends 2a and 2b of the substrate 2. The
`electrodes 3 and 4 respectively include terminal parts 3a
`and 4a, and a wire bonding electrode 3b and a drawer part 4
`are formed in the center of the width directions of each of
`the terminal parts 3a and 4a. A die bonding electrode 4c is
`formed at the tip of the drawer part 4b.
`(0003) A semiconductor light-emitting element chip (called
`an “LED chip” hereinafter) 6 is die-bonded to the die
`bonding electrode 4c, and a bottom surface electrode
`thereof is electrically connected to the electrode 4. A top
`surface electrode of the LED chip 6 and the wire bonding
`
`
`Japanese Unexamined Patent Application Publication 2003-17754
`(2)
`
`electrode 3b of the electrode 3 are then electrically
`connected via a wire 5. Further, the wire bonding electrode
`3b, the drawer part 4b, the die bonding electrode 4c, the
`wire 5, the LED chip 6, and the like are sealed by a
`covering part 7 made of a translucent synthetic resin.
`(0004) In such a light-emitting device 1, the side surface
`parts 3e and 4e of each of the terminal parts 3a and 4b as
`well as wiring patterns 8a and 8b of a circuit board 8 are
`electrically connected by solder 9a and 9b, respectively.
`Note that the respective terminal parts 3a and 4a consist of
`front surface parts 3d and 4d formed on the front surface of
`the substrate 2, side surface parts 3e and 4e formed on the
`side surfaces of the substrate 2, and rear surface parts 3f
`and 4f formed on the rear surface of the substrate 2.
`(0005)
`(PROBLEM TO BE SOLVED BY THE INVENTION) However, as
`illustrated in FIG. 4, in the case of the conventional light-
`emitting device 1, the respective ends 2a and 2b of the
`substrate 2 are formed so as to project further outward than
`each of the side surfaces of the cover part 7, so the
`projection amounts L1 and L2 of the respective ends 2a and
`2b are a cause of an increase in the horizontal width of the
`light-emitting device 1. The respective side surface parts 3e
`and 4e of each of the terminal parts 3a and 4a as well as the
`wiring patterns 8a and 8b of the circuit board 8 are
`electrically connected by solder 9a and 9b, so spaces L3
`and L4 for the solder 9a and 9b are required on the circuit
`board 8. In this way, in the case of the conventional light-
`emitting device 1, the horizontal width increases by L1 and
`L2, and the spaces L3 and L4 for the solder 9a and 9b are
`required on the circuit board 8, which obstructs increases in
`the mounting density of the light-emitting device 1 or the
`like mounted on the circuit board 8.
`(0006) Therefore, a main purpose of the present invention
`is to provide a surface mount type semiconductor device
`which makes it possible to reduce the horizontal width of
`the surface mount type semiconductor device and which
`does not require a space for solder on the circuit board.
`(0007)
`(MEANS FOR SOLVING THE PROBLEM) The first invention is a
`surface mount type semiconductor device comprising: a
`substrate; a die bonding electrode and a wire bonding
`electrode formed on a front surface of the substrate; a
`semiconductor element chip die-bonded to the die bonding
`electrode; a wire
`for electrically connecting
`the
`semiconductor element chip and
`the wire bonding
`electrode; first and second surface mount electrodes formed
`on a rear surface of the substrate; a first through-hole
`passing through the substrate so that opening ends on both
`sides are disposed within the respective planes of the die
`bonding electrode and the first surface mount electrode; a
`second through-hole passing through the substrate so that
`opening ends on both sides are disposed within the
`respective planes of the wire bonding electrode and the
`second surface mount electrode; a first connection
`electrode formed inside the first through-hole so as to
`electrically connect the die bonding electrode and the first
`surface mount electrode; and a second connection electrode
`formed inside the second through-hole so as to electrically
`connect the wire bonding electrode and the second surface
`mount electrode.
`
`
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`(0008)
`(OPERATION) With the present invention, the respective
`opening ends on both sides of the first through-hole are
`disposed within the respective planes of the die bonding
`electrode and the first surface mount electrode, and the die
`bonding electrode and the first surface mount electrode are
`electrically connected by the first connection electrode
`formed inside the first through-hole. As a result, the space
`for forming the die bonding electrode on the substrate and
`the space for electrically connecting the die bonding
`electrode and the first surface mount electrode can be
`shared. Therefore, it is unnecessary to separately secure a
`space for connecting the die bonding electrode and the first
`surface mount electrode (space L2 corresponding to the end
`2b illustrated in FIG. 4) in addition to the space for forming
`the die bonding electrode, and the dimensions of the
`substrate in the plane direction can be reduced by this
`amount.
`(0009) Further, the respective opening ends on both sides
`of the second through-hole are disposed within the
`respective planes of the wire bonding electrode and the
`second surface mount electrode, and the wire bonding
`electrode and the second surface mount electrode are
`electrically connected by the second connection electrode
`formed inside the second through-hole. As a result, the
`space for forming the wire bonding electrode on the
`substrate and the space for electrically connecting the wire
`bonding electrode and the second surface mount electrode
`can be shared. Therefore, it is unnecessary to separately
`secure a space for connecting the wire bonding electrode
`and
`the second surface mount electrode (space L1
`corresponding to the end 2a illustrated in FIG. 4) in
`addition to the space for forming the wire bonding
`electrode, and the dimensions of the substrate in the plane
`direction can be reduced by this amount.
`(0010) In addition, since the first and second surface mount
`electrodes formed on the rear surface of the substrate are
`electrically connected to wiring patterns formed on the
`circuit board, it is unnecessary to secure spaces L4 and L3
`for the solder 9b and 9a illustrated in FIG. 4 on the circuit
`board in addition to the space for mounting the surface
`mount type semiconductor device.
`(0011)
`(EFFECT OF THE INVENTION) With the present invention, the
`dimensions of the substrate in the plane direction can be
`reduced by spaces L1 and L2 corresponding to the ends 2a
`and 2b of
`the conventional
`light-emitting device 1
`illustrated in FIG. 4, and it is possible to eliminate the need
`for spaces L3 and L4 for solder 9a and 9b on the circuit
`board. Therefore, the mounting density of the surface
`mount type semiconductor device mounted on the circuit
`board can also be increased.
`(0012) The aforementioned object, other objects, features,
`and advantages of the present invention described above
`will become clearer from the following detailed description
`of an example given with reference to the drawings.
`(0013)
`(EXAMPLE) A surface mount type semiconductor light-
`emitting device (simply called “light-emitting device”
`hereinafter) 10 of this example illustrated in FIGS. 1 and 2
`
`
`Japanese Unexamined Patent Application Publication 2003-17754
`(3)
`
`is suitable for the lighting or the like of a mobile electronic
`device such as a mobile telephone or PHS, and the device
`includes an insulating substrate 12. The substrate 12 is
`made of a BT resin prepared by impregnating a glass cloth
`or the like with a heat-resistant BT resin, a glass epoxy, or
`the like, and the size of the substrate (depth × width ×
`thickness) is set as small as approximately 1.25 mm × 2.00
`mm × 0.8 mm or approximately 0.8 mm × 1.6 mm × 0.8
`mm, for example, to meet the demands for miniaturization
`in recent years. This light-emitting device 10 is obtained by
`providing multiple light-emitting element chips (called
`“LED chips” hereinafter) or the like in the form of a matrix
`in the depth direction and the width direction on a substrate
`base material of a size of approximately 10 cm × 5 cm, and
`then cutting the substrate base material.
`(0014) A pair of a first through-hole 14 and a second
`through-hole 16 passing through the substrate 12 with
`space therebetween are provided in the substrate 12. Front
`surface side opening ends 14a and 16a of the first and
`second through-holes 14 and 16, which respectively open
`on the front surface of the substrate 12, are disposed within
`the respective planes of a die bonding electrode 18 and a
`wire bonding electrode 20 formed on the front surface of
`the substrate 12 and are respectively covered by the
`corresponding electrodes 18 and 20. The front surface side
`opening ends 14a and 16a of the respective through-holes
`14 and 16 are positioned in the center of each of the
`electrodes 18 and 20. In addition, rear surface side opening
`ends 14b and 16b of the first and second through-holes 14
`and 16, which respectively open on the rear surface of the
`substrate 12, are disposed within the respective planes of a
`first surface mount electrode 22 and a second surface
`mount electrode 24 formed on the rear surface of the
`substrate 12 and are
`respectively covered by
`the
`corresponding electrodes 22 and 24. The rear surface side
`opening ends 14b and 16b of the respective through-holes
`14 and 16 are also positioned in the center of each of the
`first and second surface mount electrodes 22 and 24.
`(0015) In addition, a first connection electrode 26 and a
`second connection electrode 28 are formed on
`the
`respective inner peripheral surfaces of the first and second
`through-holes 14 and 16. The first connection electrode 26
`is electrically connected to the die bonding electrode 18
`and the first surface mount electrode 22. The second
`connection electrode 28 is electrically connected to the wire
`bonding electrode 20 and the second surface mount
`electrode 24.
`(0016) A top surface light-emitting type LED chip 30 is
`placed on and die-bonded to the top surface of the die
`bonding electrode 18. A bottom surface electrode of this
`LED chip 30 and the die bonding electrode 18 are
`electrically connected. In addition, a front surface electrode
`30a of the LED chip 30 and the wire bonding electrode 20
`are wire-bonded with a wire 32 such as a gold wire. A
`covering part 34 made of a translucent synthetic resin (for
`example, an epoxy resin) is mounted on the entire upper
`surface of the substrate 12. The LED chip 30, the wire 32,
`the die bonding electrode 18, and the wire bonding
`electrode 20 are sealed by this covering part 34, and light is
`emitted through this covering part 34 primarily from the
`
`
`
`
`EVERLIGHT ELECTRONICS CO., LTD. ET AL.
`Exhibit 1008
`
`

`

`top surface.
`(0017) In addition, as illustrated in FIG. 1(B), the planar
`shapes of each of the LED chip 30, the die bonding
`electrode 18, and the wire bonding electrode 20 are roughly
`square. The planar shape of the die bonding electrode 18 is
`formed to be slightly larger than the planar shapes of the
`LED chip 30 and the wire bonding electrode 20. As
`illustrated in FIG. 2, the planar shapes of the first and
`second surface mount electrodes 22 and 24 are roughly
`square and are the same size as the die bonding electrode
`18. The planar shape of the substrate 12 is rectangular. The
`centers of the respective first and second through-holes 14
`and 16 are positioned on a center line 36 of the substrate 12
`parallel to the horizontal width direction of the substrate 12.
`In addition, from the perspective of the planar direction, the
`die bonding electrode 18, the first surface mount electrode
`22, and the LED chip 30 are respectively disposed so that
`the respective centers thereof are positioned in the center of
`the first through-hole 14. Further, the wire bonding
`electrode 20 and the second surface mount electrode 24 are
`respectively disposed so that the respective centers thereof
`are positioned in the center of the second through-hole 16.
`The substrate 12, the LED chip 30, the die bonding
`electrode 18, the wire bonding electrode 20, and the first
`and second surface mount electrodes 22 and 24 are
`disposed so that components of corresponding edges are
`parallel to one another when viewed from the planar
`direction.
`(0018) Here, as illustrated in FIG. 1(B), the length M1 of
`one edge of the die bonding electrode 18 is greater than the
`length M2 of one edge of the LED chip 30. This increased
`amount is a margin for making it possible to reliably bond
`the LED chip 30 to the die bonding electrode 18, even if
`the bonding position of the LED chip 30 is displaced
`slightly, and for ensuring that the conductive adhesive
`bonding the two components together does not flow onto
`the substrate 12. The increase is made with the lowest
`margin necessary. Spaces N1 and N2 between
`the
`respective side surfaces 12a and 12b on the left and right
`sides of the substrate 12 and each of the side edges of the
`die bonding electrode 18 and the wire bonding electrode 20
`adjacent to these side surfaces 12a and 12b are margins for
`accommodating fluctuation in the cutting position when
`forming the substrate 12 by cutting the substrate base
`material, and the smallest spaces necessary are formed.
`(0019) With the light-emitting device 10 illustrated in FIG.
`1, the LED chip 30 is bonded to the top surface of the die
`bonding electrode 18, and the respective front surface side
`opening end 14a and rear surface side opening end 14b of
`the first
`through-hole 14 are positioned within
`the
`respective planes of the die bonding electrode 18 and the
`first surface mount electrode 22. Further, the die bonding
`electrode 18 and the first surface mount electrode 22 are
`electrically connected by the first connection electrode 26
`formed inside the first through-hole 14. Therefore, the
`space for forming the die bonding electrode 18 on the
`substrate 12 and the space for electrically connecting the
`
`Japanese Unexamined Patent Application Publication 2003-17754
`(4)
`
`die bonding electrode 18 and the first surface mount
`electrode 22 can be shared.
`(0020) Accordingly, it is unnecessary to separately secure a
`space for electrically connecting the die bonding electrode
`18 and the first surface mount electrode 22 (space L2
`corresponding to the end 2b illustrated in FIG. 4) in
`addition to the space for forming the die bonding electrode
`18, and the dimensions of the substrate 12 in the plane
`direction (horizontal width direction) can be reduced by
`this amount. Further, since the first surface mount electrode
`22 formed on the rear surface of the substrate 12 is
`electrically connected to a wiring pattern 40a formed on a
`circuit board 38 via solder 42a, it is unnecessary to secure a
`space L4 for the solder 9b illustrated in FIG. 4 on the
`circuit board 38 in addition to the space for mounting the
`light-emitting device 10.
`(0021) The respective front surface side opening end 16a
`and rear surface side opening end 16b of the second
`through-hole 16 are positioned within the respective planes
`of the wire bonding electrode 20 and the second surface
`mount electrode 24 to which one end of the wire 32 is
`electrically connected. Further, the wire bonding electrode
`20 and the second surface mount electrode 24 are
`electrically connected by the second connection electrode
`28 formed inside the second through-hole 16. Therefore,
`the space for forming the wire bonding electrode 20 on the
`substrate 12 and the space for electrically connecting the
`wire bonding electrode 20 and the second surface mount
`electrode 24 can be shared.
`(0022) Accordingly, it is unnecess