(19) 52115212??? (J P)
`
`amfifififififlfiw
`
`(11) fififlflfiflfififi%
`
`$$0fi2001-118868
`
`(P2001 — 118868A)
`(432% El E13153313413 4 E 27 El (2001. 4.27)
`
`
`
`fan—113%)
`
`T J
`
`I)
`A
`
`H
`
`(51) Int.C1.T
`
`mlfiflfi-
`
`H01L mms
`
`F I
`
`H01L mfifi
`
`23/28
`
`9.3/29
`
`23/28
`
`23/50
`
`Efiéfifi
`7%
`fijfilfiwfia 0L (fi 8 E)
`fififilifi<
`
`
`(2mmfigfi-
`
`fiE2000—279804(P2000—279804)
`
`(62) fififilmfirfi
`
`fififlig— 19810903fi§0
`
`(22) H 1% El
`
`EIT-JI5J295F7 H243 (199'(.'/.24)
`
`(54)
`
`[fififiwéflfifi]
`
`fifififififlnflfizrfii‘wfifififi
`
`(W)[%%l
`
`{fifil
`
`fiOEHE$éflfiffiv7—ytfi%v—
`
`Fwflfimfifi2$0éfik0\filtfi%¥%fi®%
`
`vftfifififififiéitéfififiétfim\%%U—
`
`FfifififiéfiLTW%EWfi¢éfimmfimfi$flfi
`
`fifififi$éNV¢—§7fiV7RUW%%E®%$%
`
`Efifibtfifi%%%%&U%®flfififiéfififiéo
`
`{fimi&l U—F7V—A13K%¥%fi®+v7
`
`17%fifitffi%fifivfi—yl1Wkfiifiéafi
`
`12‘ U—F7D—Aflfi’lfifiU—F21, 22, 23, 2
`
`4Efi%fl”v7—V11®Efikm%éfifgfi%%
`
`fi£tt§fi$§%fimbnf0%%U—F2l,2
`
`2,23,24fi%fifi3$fiffififlNv7—Jll
`
`mfifififlbffifi%%Efi%fiéfifififfimt\E
`
`%%Nv¢—§1lt—¢fi%éflfméo
`
`(71)tfllfi)\
`
`597105407
`
`fiffl‘fbfififikifiéfl
`
`fifififlfi‘ifi’fiflififimfi “[177fifl11 1
`
`(”flfiflflfi Bil:
`
`ii
`
`fififilfidllfifiifiifi TE7§7% flit
`
`fii‘i‘E—JI/ Ffififififgfilfiw
`
`(79.)fiflflfi
`
`llIEl
`
`$513
`
`Hfiflfl$fénifi1EEWTEHl177§fifll
`
`1&3]
`
`{EEEHEEC’E‘EW
`
`(74) REA 100089266
`
`#flj: kg:
`
`11%—
`
`
`
`
`
`21b(24b)
`
`22b(23b)
`
`Cree Ex. 1011
`
`Page 1
`
`Cree Ex. 1011
`
`Page 1
`
`

`

`W2)001*118868(P2001*118868A)
`
`{firfififij‘mifill
`
`%%®Nv¢—yémkfixfiéfi\W%®%%KM%
`
`{fififill U—F7v—Amfi¥%fim%v7%%
`
`$U—F4EL?fitfi0EWfififiTflfifl§Nv7
`
`%L1fi%fifiv¢—§Wfifilfiétfifi\C®U—
`
`—y6@gfifltfifimfimé€\%®fi%%1w—$
`
`F7v—A®%%U—Féfiifififlfivfi—ymfifi
`
`—w7kfiltffuy%£m8®%fimfi¥mfié
`
`mfifififi%fifitttfifi%%%fit3mf\
`
`éfifiéfit\%%®%éu%%U—F4Ej$fimfi
`
`%fi3$fit$Wfi0EHMILE%%U—FWK\fl
`
`0 Hflcffcififigf'fmfi‘fiififléfi v 7— :2 6 mififlfifixaffimz
`
`mfi%ttfiifi%flfiffién\:mfiifififlwm
`
`mofmfiéfi\%®Efifi§%fi$fifiatf70y
`
`%%U—FEE%LE%ET\U—F7v—Afifififl
`
`bgm8imfifitf¥mfiéfiéfifiéfifiéo
`
`Nv7—§t#¢fi%éflét#t\%%U—F®£W
`
`{00031fi%éfikfiét\%%®§fi%%%fil
`
`ififififififlfivfi—ymfifimfitf%fi#&fifi
`
`Bm%étdfi%®fifl%filA;0\%%U—F4fi
`
`Timbfméztéfifitttfifi%%%fio
`
`%mt&wfifififififiéfififiwfi<fmflfiimé
`
`{fififi2} Wfi¥¥%%®%v7fi\%$$W?v
`
`fléitfif%é:t\%%U—F4EXW—$—W&
`
`T?%é%fifi1tfifitk§fi$fi$fio
`
`EALQM®T\ifififigTififimmiéflé:t
`
`{fififisl U—F7V—AE%¥%fi®f97%%
`
`fi?%é:a\Wfl¢fi%%U—F4fi%fié%fiffi
`
`fitffififlfivfi—mGfilfiétfim\:mU—
`
`vfi—Vétwfimfifiéiféztfiwgmmf\%
`
`F7v—A®%%U—Féfiifififlfivfi—ymfifi
`
`%U—F4%fiLfW%K¢fifiéfi$mfiE;éNv
`
`mafiffifiififitLtfifiifi%fi®%fifimmb
`
`f—973V7RUW%EE%EMT%éZE\$®fi
`
`mfx
`
`fléfi$offi$flfioffifi§m§flfwéfi\:0
`
`WED—F7V—AHN9F%%%Uf97$§fififi
`
`fifiifi%filB®%fitéWtfiNéififi\fimé
`
`fiéfififl$U—Fé%fifl$fimfi0EHMIL\:
`
`fl%afiéfifififiéflfmho
`
`@0—F7V—Afi%v7$%fiETflWm%Htfl7
`
`{0004}
`
`7nv7®fififim%fiéfikfififiTflmfififiéa
`
`{fiflfifimtifitfiéfifilwé\fi$®§fi$§
`
`%m\£fi$§fifi%éfi%U—F®Efifimflfimt
`
`%fi13m5fiéfififi%U—F4H\fifififififii
`
`hiflwmfiéfifiéfi\Lfl®¢%t%fitfififix
`
`5E#%WENv7—V6WEE%LEEK®%®E%
`
`flfléfiifififléfilb\%®fiflEfimiofWfi
`
`fjifimfiDEWMILfmtmf\:mfibfifim
`
`U—F7V—A®+VT%%E%ZTTDv7®flfifi
`
`I%K%%U—F4fi%fiE%HTNV7—§6tmfi
`
`mEfiéfi\Hofifififi$%fiéiflmmfitE%é
`
`mfifiéitéfitbxfibfifi%fifi%fifimtof
`
`fi&fi%\fifi%%U—FWK1¢EEHEEEL\:
`
`Nvf—V6WE%E¢5EfiKHEO%E$UE<\
`
`mfiifi%fl¢tfl%U—F%flfiéfi\%%U—F®
`
`fifiififi§fuVb£fi8imm¥mfifitkfifiT
`
`ifi£%fififififlfiv7—ymfifitfitfflfiéfi
`
`imfiéfiéztfiflfimtéflh%%éo
`
`fififfiflfiéfifif\U—F7v—AEfififlfiv7
`
`{0005}%0f\%%U—F4th7—V6t®
`
`—§t—¢fi%éfié:t%%fitLtfifiifi%fi®
`
`fimfifiéitéa\fil%fi1A®%éafifimfl%
`
`@fififio
`
`{$135}? méir’émécéfiflfi }
`
`{0001}
`
`{fifimfifiéfimfifilififiw\U—F7V—Am
`
`U—F4§fiLfW%E¢%¢éfl$fifimiéNv7
`
`—V75v7&0W%%fi§%&fiéflfl%%é:t\
`
`m¥mfifiéfltntfiéfifififiTfiéafim\:m
`
`%¥%fifi%ELED%®%¥§¢$¥®%QEH\fl
`
`fi?$fi®%v7§%§bffififlfiv7—VWKEA
`
`flfiffltfififfifiéhffigmfifififiént<t
`
`fiétfim\:wv—F7v—A®%%U—Féfififi
`
`éflflé$éo
`
`EQNvfi—ywfififimfiéfiffifiififitLtfi
`
`{0006]%:T$%%Tm\WELE;5&%%E
`
`fi$%$fi&fl%®§fifiitfib\mzfi%fiy4fi
`
`mafifiéfimfiétmm\fifimfifi£§$fiflit
`
`—F(UT\LEDtM5)%®%¥%¢%¥,%®M
`
`%fi®%§§%fi&mifithfi—Jtfibffi%u
`
`®$§¢$¥,fifi$flyFyfi%®%¥%fimfifié
`
`—FéfiUU—F7V—Ammfifififivmflfifimé
`
`ago
`
`{0002}
`
`fififiétfit\iflfifitlofTbegfifitfi
`
`LTNvfi—Vém¥fiflffi%m%fifié:tfifi%
`
`{fi%®fim1%¥%fimifififiatfd\Wififl
`
`a&0\W£fi$fii0$flkfiéCkEfifiaLtfi
`
`1(a)Tfi?fil$filAfiwflfll(b)?fi?§
`
`fi££$fikw%®flfififiéfififéo
`
`fi$%$fi18&5fi%0\wfflm%fim%U—F7
`
`{0007}
`
`V—A2E%¥%fi®+973%%fifié&fiE\Z®
`
`{fifiéfimfiétm®$&1$%WM\U—F7v—
`
`+v73tU—F7v—A2®%%U—F4méfiwa
`
`Atfi¥%fiw%vfé%fibffi%flfiv7—VWN
`
`Efiy¥¢yflv415éfitffifibtfififéfifi
`
`fix¢6t#t\:0U—F7v—A®%%U—FEW
`
`Cree Ex. 1011
`
`Page 2
`
`Cree Ex. 1011
`
`Page 2
`
`

`

`5(3) 001*118868 (P2001*118868A)
`
`Efifififivfi—ymfifimfififfifiififitLtfi
`
`:tfi?%é®T\fwfflfifififitTUVE£fik
`
`fi$%$fit3uf\%fifl$fit$&fi0$fifllt
`
`®%%E§%flofi%fifltfifi:tfiféétfim\
`
`k%%U—FWE1%$W%Ltfiifififlfififié
`
`%E%§%fifi$¥fi%fi®LED®$fififi¥§¢$
`
`n1:mfiifififl$mfi%U—F%E%Ltfififi\
`
`¥®%%KH\flfimifififi¥fimfiéafiflé—E
`
`U—F7u—Afifi%flfiv7—Vtéwfi%énét
`
`fimKEL<%fif%éo
`
`fimxfi%U—F®£fi%§fififififlfiv7—§®E
`
`{0 0 1 2] 51%; :fiflifimflfiswffifiéfifilfiw—
`
`fitfitffifi—fififi?§fltfnéfifi$§%fi
`
`Fmfififi%$mim%fiflfimfi0EWMItffi
`
`(fififi1)f%éo
`
`§\iflfififiéflfimttiflmfiEfm¥fitfi0
`
`[0008}:®$fi%%%fifu1%m%%U—Ffi
`
`EHE%§E\LEQWfiEfifiéfififififimEfifi
`
`WOEWMIéflEfifiTNv2—yfififiéfl\fi$
`
`§fifiéfiét\fiifi%fl®fil%$0fiimm¢¢
`
`Mmfifi$%%fi®ifit§ffi0fifiWi¢é2¥fi
`
`é:tfif§&®f\#%tfiu$fifi®%imtw¥
`
`fiwmf\fi$fl®fifi£§$fimfifif%otfibfi
`
`ifltfififigtflmzfié C t fifé 1
`
`thfiifi’afiffimr’éflfli-
`
`W%®fl®flfl¢t5fié%fiffiv7—§t%%v—
`
`ifi%fl®fififi£fififiéi£fi?$éo
`
`Fwfifimfifi§itéfit01filth%¥%fi®%
`
`{0013}
`
`vftflfifiwmfiéztfififiéflét#t\%$U
`
`{%%®%m®%%1HT\$%%®$fi%%%fi&0
`
`—FRUfifi2fiLTW$KWfi¢éfiWmtmfi$fi
`
`%®%fifiitfiwf\fifiififié%¥%fiath
`
`fiwmfimiéfivfi—v73v7fifiW%fifiwfii
`
`EDEEfiLtfifi?¥fl%fifi£fi%\fifitfifl2
`
`$E§L<flfif§éo
`
`xémflfiéfifittfigfit<fififiéfi\fl2fi$
`
`{0009}itx£fiififif%é%%U—F®Efi
`
`fififififiéflfiLED®¥fifl§fiL\H3HE2®
`
`fifl\X¥Efifi%énTTUVbEfitwmfifi4y
`
`III—IIIfiKMot%fifl%fiL\fl4HU—F
`
`mfit1fi¥fifif¥mfiéénémf\fiibtfié
`
`7D—AE%&¢&$¢£W®¥$T(a>fl$fiflé
`
`fiETfifiifiéflé&%K\%¥%fifi%ELED%
`
`(b)fl(a)®IV—1Vfimmot%fifléfit\
`
`mfi¥§¢$¥ffifi%¥%fi®1vréfi¥§¢+v
`
`H5Hfi%fi%®lfifi%fl?(a)Hfl%%fifimb
`
`7®%é fififi2)tu\fim%%fié$fitttfi
`
`H6fifl$fl®fi%fiflé\(b)fiflfibfi%fi3fi
`
`%T\1v7%%fitfitf%fléfifitmfiféém
`
`éfifl$fl®fi%fiflé\(c)fi$fiflgfitfififl
`
`T1fiflfifhéfifigfifiénffigmfifiéfié:
`
`@fiflfififlflfl%fiL\H6Hfifléflkfi%fifiv
`
`t 75"C‘% Zn 0
`
`7—§T(a)fié%éfi%tt$fiflé\(b)fi
`
`{0 0 1 0} m; 21:%W:J:éi’éfi%%%m®§éififi
`
`(a)®VI*VIfiEMot%fiflEfifio
`
`ETH\U—F7V—AE$¥%fi®fvT%%%LT
`
`{0 O 1 41II2JSiU'3’C‘fifiJ: 513‘ fifiifi-‘Efinfln
`
`fififlfivfi—VWNfixfiétfim\:mU—F7v
`
`T%éLED10fi%Efi(R),fi(G),%(B)
`
`—A®%%U—Féfififififlfiv7—V®EEK%H
`
`w§%%%§10®fi%fl”v7—V11WRW§§E
`
`ffifiififiaLtfifiifi%fimflfifimmbuf\
`
`EE®T%0\”v7—91lflfififiT¢%®L%fl
`
`WED—F7V—AMNVF%Efifl%v7%%fiK
`
`mflfifim;éfifl%l2éfififfififlfimfifié
`
`fifiéfitfi$U—Fé%fifl$fimfiDEHWIL\
`
`2% fifiD§E 1 2®Emzcifi~77—V1 1 téfixfifiiflé
`
`:wu—F7v—Aw+v7%%fi%TflWEfifikfl
`
`fltU—F7V—A13®#%#+v7%%fiatf§
`
`77Dv7®fififim%%éfitfi%TTflmfififié
`
`fléfl150\%fiv%%l4,15,16EH24fi
`
`t#t\£W%%fif%é%%U—F®Efifitflfim
`
`V7‘V V7‘§flfi:3fi®%fi'fi€‘v7°1 7 a,
`
`1 7b,
`
`1
`
`Lt:fl®flfi%%%éfix1fl®¢%mfifitfi%fi
`
`7cfi%fl%fl?fiVbéflé&%E\§fifi+v¢1
`
`Aflfléfiifififléfiit\%®%$Efimioffi
`
`7 a,
`
`1 7 b,
`
`1 7 c®5€fi3®#fi6i7fi75"4 V771
`
`EU—F7v—A®%v7%%fiéfl77nv7mflfi
`
`#18EfiLT7—XfifitfiéfifiiU7%1QKE
`
`fitEfi§fi\Hofifi£mi%fiéifl®WfimEfi
`
`fiéfl\:flaéfigfiééfifiifi#vfi%fi%mm
`
`éfitfi6\fififl%0—FWK1¢E%H%KEL\
`
`EH2 Obi'FfiEJlilfifil 213235211 Fafililfifil 2®WJ§JE
`
`:mfiifi%fi¢mfl%U—Féfl%éfi\%%U—F
`
`fi%—NE%HffififlflEflLffififil2aéfifi
`
`mgfi%%fififififlfiv7—yafifitfltf%fié
`
`waxéo
`
`fififiTfififiéfifiT\U—F7V—Aéfififlfiv
`
`{0 O 1 5] U—F7lx—A1 313K %/\°‘V 1““??31 4,
`
`7—Vt#¢fi%§fifwé(%fifi3)o
`
`15,1ébafifi¢é%$U—F21,22,23
`
`{OOllliwflfifiEKiét\377Dv7®fi
`
`t\#fiIU7%19Efififié%$U—F21,2
`
`fifififi:fl®fififi%fl%flEfiLtU—F7v—A
`
`2,23,24%fi21%%%U—Ffl%fifl$fififi
`
`m+v7%%fitfifi$%fifi1fitfi%fi®filmfl
`
`OEfififi§fltflfifi21a,22a,23a,24
`
`flfiéfiufififim%&®&w$fififififimfimfié
`
`atfififi21b, 22b, 23b, 24b7&%fl%'i’t
`
`Cree Ex. 1011
`
`Page 3
`
`Cree Ex. 1011
`
`Page 3
`
`

`

`W4)001*118868(P2001*118868A)
`
`7E!“ :wififlfimi/W 7—9“ 1 1 mmumrmmm
`
`éifimfiE%U—F7v—A13t§ééfitMfi%
`
`v7—V1lflfifit%fl%fl%fié(fié$fiflfifi
`
`29a,30b?%fiét%E1Tfl30®Mfi$30
`
`szcm‘g‘é) mfifié’c—fififik‘ém :mrfififiz 1
`
`bWKHfiEfiE?—N%31a%%fitk:77nv
`
`b,22b,23b,24bfifuyb§fi25:®m
`
`731%%H\C®377Dv731®fififi31bfi
`
`fifi4y(flfifif)m¥mfiééflé£mi%fitt
`
`fifi%U—F®Efifi21b,22b,23b,24b
`
`éo
`
`ELE29WEWH\%va%14,15,16km
`
`[OOlé]UL®fifi¥%%fi(LED10)Tfl\
`
`fifi;07%1gwfifiéfifiéfitfififu—F7V
`
`$bfifiL$fitfi0EHMléfltU—F7v—A1
`
`—A13Eflfib\%®ififlfi$flfiflfiP.Lté
`
`3®%$U—F21,22,23,24fi1Nv7—V
`
`fifiéifitU—F7v—A13®WEfifiHfi<fl7
`
`1 1 mififlfififlffizfit%fl%‘nflfifi—§c4fifiéf‘ MEL
`
`7Dv731®fififi3lb®§éfi$fi§flfméo
`
`WEfififlfL$$fiéTfi<k$flw)Nv7—J1
`
`{0021}%0f\fifib?ét%v7£%fiflEU
`
`1tg¢fifléflfm50T1fifl§tfi$U—Féfi
`
`—F7D—A13M%va%14,15,lékUfi
`
`Ofifimlfiéfll(b)®§fi%§%fi1BEkNé
`
`filv7%19®§fifi377nv731®fififi31
`
`k1fibfifi%®mmflfl¢tfifiéfififfiv¢—y
`
`bm%%L\fifiififiwéfl%U—F®%Efifi21
`
`t%$U—F®fifitfifié$téfit01fixttfi
`
`b,22b,23b,24b®§fifiifl29®fi$fl
`
`$%fi®+v7t%fifi¢fifié:afitumT\%%
`
`fimfifiLtfifif\:77nv731éfiflTfl30
`
`U—Ffiflfifi%fith%m¢%fiéfimmfimfi%
`
`aifl29®fimfifién\U—F7V—A13m—fi
`
`fiflvfifitiéfivf—J7fiv7kvm$fifi®%
`
`fitfififi®#15%432fimfiwtflfifi®%wfi
`
`i¥§§t<fifif§éo
`
`$433fi%fl%fl%fiéflx#&E?432,33%
`
`{0017}it£fi$§fifi%éfi%U—F®Efifi
`
`M%va%14,15,16fifififilv7%19®
`
`fixm¥fifififiéflffuyb§miflmfifi4ym
`
`fit?fifié§fi%35éfibffi§fififiéhfiw
`
`flLTm¥fififi$Efiééné®T\fifittfiéfi
`
`$0
`
`ETfifiifiéflétfiE\%¥%fifi%KLED%®
`
`{0022]:mflfimfifimfiflfiflmfit1fiifi
`
`fiigwfi¥®%étfi\fiflfiffltfiflfi%fiéfl
`
`fiflMthWifim&fiU7—(LCP)%fiUI—
`
`(figfififififiaflfi<fiéfifi%fifif%éo
`
`?w:bUw(PEN)fiEfimflfiflfiflfifi%E\
`
`{0018lfifififiifi%fi(LED10)@QE?
`
`fifififlflB4§fitT¥fE$4WfimgfifiTfifl
`
`éfitu\ifvyémtammé$%®mfifiméfi
`
`fiét\$fl®¢%fléfififitfifittfimfififlm
`
`fifififiémwfflfiékvfibEfimlt\Hofi%
`
`fi%&E?%WR%%EfE§fl1fléffifiifififi
`
`wwwéfifixV#%flLffl4fififiéw£fi26%
`
`%U—F%%UU—F7V—A1BéflfiLt—Wwfi
`
`flfifiéfi\:wéwfifi26fi113vifififié
`
`v7—V11fififléfléfi\%®%mfimfififlmw
`
`U—F7u—A1smwy—Vfifififiw7v—AW2
`
`fimEfifi%%U—FE%UU—F7b—A1smmfi
`
`TWEmfiénéafim\7v—Afi27%fitf§fi
`
`wm¢%¢5mvx:m%mEfi;orgmvr%1
`
`@1:vEfififififififiéhtfifiTU—F7v—A
`
`4,
`
`1 5,
`
`1 GRU'iESEIUWEBl gwfifiififl (f-n“
`
`13%flfiéfl\1v7%%fiéfifi¢éU—F7u—
`
`$%fi)fifl77flv731®flfifi31bk\fi$U
`
`A13®%Nv%%14,15,16tfifil07%1
`
`—F®Efifi21b,22b,23b,24b®%fifl
`
`9Mfififi28§fitf7v—Am27Efifi§fiéfl
`
`(Hiiflzéfi) 12111111 2 9 mfi'fimmysnifiufifié
`
`fbxéo
`
`n\fi£%fit§lbffi%Lifitfiéfimfififlm
`
`{0 0 1 9} fifiéafifiifi-‘Eflfimwvfi—yl 1 ”$91.3
`
`wfifléflifiéo
`
`fiflfiéfiflfiflH1fl5(a)®;5ELTfimfim
`
`{0023]:®;5ELTNv¢—§11WKU—F
`
`mfiéhtifl29tTfl30Efii\TEBOWKM
`
`7v—A135flfiéfiét\%¥%&®%v7%%%
`
`U—F7D—A13Efifi¢537fflv731fi%fi
`
`%%v717a,17b,17cfi?fiyb§flé?v
`
`§n1E5(b)®;5mfl%mm;ofifl29aT
`
`7%%fi&U\70y1§m25mvarénégm
`
`£30&U377nv731mfitfifiéhh¥w€$
`
`$%fifl%%&fififi\fiifififimmxmiéfivfi
`
`132,33WA\LE29®¢%K%HEE%EAH
`
`fifim%$®&m¥fi&$fi§flfitfiéztfiféé
`
`34flafiifi%HM%ffit\:wfiififiHMWE
`
`®T11vfmifififimruybgfikwifiéfig
`
`%%U—FE%UU—F7b—A13Efl%éfi\H5
`
`Hofi£fiflmfifiztfif%étfim\%t%%%fi
`
`(c)@ifimU—F7v—A13fifiv7—V11t
`
`fi$%fl%%®LED®ifi&%¥$¢$¥®%ém
`
`#Wfifléfl飮fi%éo
`
`M1flfiwifififi¥fimfiéafiflé#fifimkfit
`
`{002OJLE2QRUTEBOKM\fiOEWMI
`
`<§ET§5°
`
`éht%%U—FE%UU—F7v—A1séfiétfi
`
`{0024]iti4®§¢§fi26éfi¢fié%m\
`
`Cree Ex. 1011
`
`Page 4
`
`Cree Ex. 1011
`
`Page 4
`
`

`

`5(5)001*118868(P2001*118868A)
`
`I5 (a) ’C‘ifi‘J: 5135114313 'J—FO‘D%EEH‘2 1 b,
`
`{I6} fififléflfCTEHEfl/V‘xfi—SJ’C‘ (a) 1i#%137i’
`
`2 2 b, 2 3 b, 24 b’ix WJiéi‘5w1 OEEEODE
`
`EEJTLEEFEIEK (b) 1: (a) 00V I *VIfim’n‘
`
`ET‘?&LE%¢E$441€LZTE 0 E1?Dull/“Cid < t \ :0)
`
`otli’fiEI’i'ffd‘o
`
`EEfifii'flfiéd) Lfcfififllifl 2 91:4: 0 ’CflfiWibfifi '9
`
`{’F‘ffiifléfififlfi }
`
`Efflfiifiéiéflé’oo)?“ EéfiEfififigéf§ti§§§§flf§
`
`1 1 NV 7—?"
`
`W$§§E13§lt J: 5 £129 E1 tHEHEHmODfiIEJEflJU:
`
`1 2 ED%
`
`flfié’fififi‘é o
`
`1 3 U— F71x—A
`
`{0 O 2 51%] I60); 51ZEE3$11€121110EW11H
`
`1 4,
`
`1 5,
`
`1 6 NV 1&1?
`
`Ififlt%$U—FE%UU—F7V—AlBEEWE
`
`17a,17b,17c %%?v7
`
`Edi/EN» 7—52 1 11:13; +‘V7°%”:€E1:§1tf'§'€¥
`
`1 8 711??? V774”?
`
`3313;611:113 BEE??? v 7°®£¥éjfiUKiQE1EEEfi
`
`1x iiififi2 8 EJCJJEJTL'CSE’Eiifiéi’L'CMfc7D—A
`
`1 9
`
`2 O
`
`$575533) 7%13
`
`113%“
`
`1122 Tfilgfij‘fifié’é Zkifififififiéflfijé‘flldil2fiffil
`
`2 1, 2 2, 2 3, 2 4 fib-éfiW—F
`
`3Tfi¢15§LED11mfiifiéo
`
`{flfimfiififiwl
`
`21a,22a,23a,24a Efifi
`
`21b,22b,23b,24b Efifi
`
`{H1}fi%fimmié%¥%fimifi%fiv\(a)
`
`25 70y1£fi
`
`wa—$—wt;éfii%fi%\(b)M%E%%%
`
`26 EWEW
`
`EE\%fl%flfifio
`
`27 7D—AW
`
`{H2}$fifi®§fi$§EfififiméhtLED®¥
`
`28 EEK
`
`Efléfific
`
`29 LE
`
`[fl3lfl2wlllilllfitmfitEEfléfi
`
`29a EEE
`
`“9‘0
`
`30 T54
`
`{H4}$fifl®fifi$§EfimfififiéU—F7v—
`
`30a EEE
`
`Aéfififiééwgmm%%fi(a)u$fiflé(b)
`
`31 :77nv7
`
`fi(a)®IV*IVfiEm0tEEflE%¢o
`
`31a %—NE
`
`{I5 } EHE‘fi/WZO‘DIEEFEHHI’C‘ ( a ) 1iflfifi§1fifi§12
`
`3 1 b
`
`fiEE
`
`511%) fififlfiflwfiféEEE \
`
`( b ) flakiflfififiwlfififlfis
`
`3 2 , 3 3 ##t‘“? 4
`
`1on filiiflffiiflwfifflifiE’ix
`
`( c ) Cat-TFEWEXMCEHE
`
`3 4 EHE‘EEJGL
`
`Hwififlfifiééfiflfilé’fi‘d‘o
`
`3 5
`
`SEE-‘33
`
`{I2}
`
`[I31
`
`
`22b(23b)
`
`21b(24b)
`
`Cree Ex. 1011
`
`Page 5
`
`Cree Ex. 1011
`
`Page 5
`
`

`

`5(6) 001*118868 (P2001*118868A)
`
`{H1}
`
`[H4]
`
`2/
`
`19 r/
`
`27
`
` 13
`
`21410.46)
`
`21b(24b)
`
`:
`
`220(230)
`
`22b(23b)
`
`(b)
`
`Cree Ex. 1011
`
`Page 6
`
`Cree Ex. 1011
`
`Page 6
`
`

`

`W7)001*118868(P2001*118868A)
`
`{HE}
`
`[E6]
`
`21b(24h)
`34
`
`22b(23b)
`
`
`
`
`(C)
`
`
`
`12a 15
`
`12
`
`’7
`
`
`
`(b)
`
`210(245')
`
`22 25
`
`. a(
`
`a)
`
`
`
`[ifififié]
`
`{EEH}¥K12$12H11H(2000.12.
`
`fie
`
`1 1)
`
`{ifififil}
`
`{fifififiéflfir} Hfir’fiflé
`
`{filEi’TIéEIE E12} fiéfififliwifiI
`
`{fififiilfifi
`
`{fifimfil
`
`{iffifféfiflidfiafil}
`
`{$331152} Wéfig饧5nnnfifv7°di fifiéEU—F7
`
`y—Aflfiv¥%E%%+97fi7fiy%éfléfi$§
`W?v7?%of\C®+v7%%fi%WEEEfiT%
`
`fittgfi%%fit¥fimbtififiltfifittifi
`$§%fio
`
`{fiifisl U—F7V—AK%¥%fi®fvT%%
`
`fibffififlfivfi—VWNfilfiétfim\:00—
`
`{$331}? 1}
`
`U — F 7 Lx—N:€'€¥%En”n€)%
`
`v 7°E¥é
`
`F7u—A®%$U—Féfififififlfivf—ywfifi
`
`Etffi%fifivfi—§Wfifilfiétfit\:wU—
`
`mfifizEfiififitLtfifiifi$fi®flfififimb
`
`F7D—A®%%U—Féfififi%flNv7—V®Efi
`
`LVC \
`
`fifififfifi$fifitttifi£$$fififiwf\
`
`WiU—F7v—Aqub%§%fl+v7%%fimfi
`
`%fifl$fifi$bfi0EWMILE%%U—FWK\%
`
`fié€t%%U—F%%fifl$fififi0Efim1t\C
`
`fifi%btfiifififlfififiéfl\Zwfiifi%fl¢t
`
`mu—F7b—Afi%v7%%fiETflWm%Htfl7
`
`%%U—FEE%LE%ET\U—F7V—Afifififi
`
`7Dv7®flfifimfifiéfitfiflfTflm%%fiét
`
`j‘j‘V’7—‘yt#fi§fififigéflé ki'éfla filfiw— FODIEE,
`
`fitflfifififiEflNv7—V0Efikmfififitf%
`fiéfififlffifltfwéitéfifitLtfifi$§$
`
`flux£fi$§fif$éfl$U—F®Efifitwfififi
`flfimbtiflmmfiéfifiéfi\Lfl®¢%mfifit
`
`ififlfiiijfim Bihfléiflfifi’éifl L \ 7am tHEjJ 1: at
`
`Cree Ex. 1011
`
`Page 7
`
`Cree Ex. 1011
`
`Page 7
`
`

`

`5(8)001*118868(P2001*118868A)
`
`OTWEU—F7V—A®+VT%%E%E77Dv7
`
`fififfifiifiéflétfimxfitfifi%¥%fim+w
`
`@fiEfiKEfiéfi\HOWEEW$%EELEQWE
`
`7fi\WfiU—F7D—A0NVF$K%%%VTfi?_
`
`KEfiéfififi$\WEfi%U—FWE1¢@%H%K
`
`W7E§fléfi¥§¢fv7Tfiof\C®fv7¥§,
`
`EL\C®fiifi%fl¢fi%%U—F§fl§éfixfi%
`
`U—Fflfififitflfifififififlfivfi—J®EE£H_
`
`fiéfifiEfiHTfimLt£mififia¥fimLfi%é
`(fiifi2)tfi\£m%%fié$fimttfiflf\%
`
`Emfibf%fiéfififlffimfiéflfif\U—F7v
`—A%fi%fifiv¢—§t—¢fi%éfié:té%fit
`
`v7%%fitfibffifléfifimmfifi%éwfi\fifl
`
`fiffléfifi£fifiéflffi$®fifi§fié:afiT%
`
`Ltfifi%%%fimfififiio
`
`{ififiE2}
`
`{fifififiéflfid Hfifiéflé
`
`{WEWQEE%IOOOT
`
`{fiEfiEJEE
`
`{fiEWEI
`
`{0007}
`
`50
`
`{ififiE4}
`
`{fifififigflrra} Hfir’fflé
`
`{fiEfififiE%10010
`
`{fiEfiEIEE
`
`{fiEWEJ
`
`{00101mE\$fififi;é§fi¥§%fi®fififi
`
`{fifiéfimfiétm®$%1$%fifi\U—F7u—
`
`Effi\U—F7V—AK%¥%%®+v7E%fitf
`
`AK%¥%fi®fvféfifiLffi%%Nv7—§WK
`
`@fiflNvfi—VWKfilfié&%E\:wU—F7V
`
`fili§kfim\:mU—F7V—A®%%U—F%W
`
`—A®%%U—F§WEfififiNv7—§®Efimafi
`
`fifi%§”v7—J®EEK%HTEW%%EELtfi
`
`figmififitLtfifi$%$fi®flfifiitfimf\
`
`fiifi$fim5mf\%fifl$fifi$&fi0$fifllt
`
`fifiU—F7V—AMNV%%%%U+v7%%fimfi
`
`k%%U—FWE\%$W%LtfiififiHfififié
`
`fiéfifi%%U—F%%EZ$KEWUEWMIt\C
`
`h\:afiifififi¢tfi%U—FEE%LEEET\
`
`mu—F7b—Afi%v7%%fiETflWm%Htfl7
`
`U—F7v—Afifififlfivfi—va#mfi%énéa
`
`7Dv7®flfifimfifiéfihfifiTTflmfififiét
`
`%E\%%U—F®EfifiaWEfifififi%Nvfi—y
`
`WEE: ffiflfibfim‘ L'C H§figmfi§§fi§m L'C b \ Zn i’éfi
`%%%fi(%fifi1)f%éo
`
`{ifififi3}
`
`{fifififigiéfiéél Hfififlg
`
`{WEWQEE%10009
`
`{fififiilfifi
`
`{WEW§}
`
`flux£fi$§fifi$éfl%U—F®Efifitwfififi
`flfiWLtifl®WfiE%%§fi\Lfl®¢%m%fit
`
`fiflfiiflflb) afiflfiflfifi’éifl L \ Frag-Jr tHEjJ 1: at
`
`0?WEU—F7V—A®fv7$§fi%fl7jflv7
`
`mfififimEfiéfi\Hofififim%%fiéiflflmfi
`
`mEfiéfififié\Wi%$U—FWK1¢EEHEE
`
`fitx:®fi¢fi%fl$mfi%U—F%flaéfi\fl%
`
`U—Fmfififitflfifififi%flfiv7—§®Efitfl
`
`{0009}it\§m%%fif%éfi%U—F®Efi
`
`fifi\X¥Efifi%énffvy%gmiwmfifi4y
`
`Egfibffifiéfifififfiwfiéflfif\U—F7v
`—A%fi%@fiv¢—va#¢fi%§€fné(fififi
`
`Kfit1m¥fifif¥mfiééné®T\fifittfié
`
`3)o
`
`
`
`7nbe—ymfié
`
`(51)Int.C1.7
`
`§§3U§E§%
`
`Ii 0 1 L1
`
`23/31
`
`23/50
`
`F1
`
`H01L B50
`
`23/30
`
`(fifi)
`
`R
`
`E
`
`Cree Ex. 1011
`
`Page 8
`
`Cree Ex. 1011
`
`Page 8
`
`

`

`(19) Japan Patent Office (JP)
`
`(12) Japanese Unexamined Patent
`Application Publication (A)
`
`
`
`
`
`(51) Int. Cl.7
`
`Identification codes
`
`
`
`
`
`
`(11) Japanese Unexamined Patent
`Application Publication
`2001-118868
`(P2001-118868A)
`(43) Publication date: April 27, 2001 (4. 27.2001)
`
`FI
`
`Theme code (reference)
`
`
`
`
`
`Request for examination: Requested Number of claims: 3 OL (Total of 8 pages) Continued on the last page
`(21) Application number
`Japanese Patent Application
`(71) Applicant
`597105407
`
`2000-279804 (P2000-279804)
`
`Kyowa Kasei Co., Ltd.
`177-1 Megawa Makishima-cho, Uji-shi,
`(62) Indication of
`Japanese Patent Application
`
`Kyoto-fu
` division
`H9-198109 division
`
`Kiyoshi ISHII
`(22) Date of application
`July 24, 1997 (7. 24.1997)
`(72) Inventor
`℅ Mold Technology Laboratory Co., Ltd.
`
`6-7-7 Minamioi, Shinagawa-ku, Tokyo-to
`
`Morio YAMAGUCHI
`(72) Inventor
`℅ Kyowa Kasei Co., Ltd.
`
`177-1 Megawa Makishima-cho, Uji-shi,
`
`Kyoto-fu
`
`Minoru ABE, Patent Attorney
`(74) Agent
`100089266
`Youichi Ojima, patent attorney
`
`
`(54) (TITLE OF THE INVENTION) SURFACE-MOUNTING COMPONENT AND MANUFACTURING METHOD THEREOF
`
`(57) Abstract
`(PURPOSE) To provide a surface-mounting component and the
`manufacturing method thereof, wherein no gap occurs at the
`interface between a package and an external lead under an
`external force due to bending, no external force acts on the
`sealed electronic component chip, while package cracks as well
`as occurrence of internal corrosion, etc., which are caused by
`mechanical stress, heat, and moisture that act on the inside
`through an external lead and a gap are reduced.
`(MEANS FOR SOLVING) In a surface-mounting component, in
`which an electronic component chip 17 is mounted to a lead
`frame 13 and sealed in a resin package 11, and external leads 21,
`22, 23, and 24 of the lead frame are mounted to the bottom
`surface of resin package 11, serving as a substrate-mounting
`surface; the external leads 21, 22, 23, and 24 are bent to a U-
`shape cross-section, with the substrate-mounting surface being
`exposed almost flush with the bottom surface of resin package
`11, and integrally formed with the resin package 11.
`
`
`
`
`
`Cree Ex. 1011
`
`Page 9
`
`

`

`(Scope of Patent Claims)
`(Claim 1) A surface-mounting component, wherein an electronic
`component chip is mounted to a lead frame and sealed in a resin
`package, and external leads of this lead frame are provided on the
`bottom surface of the above-mentioned resin package, serving as
`a substrate-mounting surface, characterized in that
`the inside of the external leads to which bending to a U-shape
`cross-section has been performed in advance is filled with an
`injection-molded sealing resin material to bury the external leads
`in this sealing resin material; and in this state, a lead frame is
`formed integrally with a resin package, and a substrate-mounting
`surface of external leads is exposed almost flush with the bottom
`surface of the resin package.
`(Claim 2) The surface-mounting component as recited in Claim 1,
`wherein the electronic component chip described above is an
`optical semiconductor chip.
`(Claim 3) A method of manufacturing a surface-mounting
`component, wherein an electronic component chip is mounted to
`a lead frame and sealed in a resin package, and external leads of
`this lead frame are provided on the bottom surface of the above-
`mentioned resin package, serving as a substrate-mounting surface,
`characterized in that
`the above-mentioned lead frame has external leads continuous to
`the chip-mounting surface containing a pad that have been bent to
`a U-shape cross-section; this lead frame is mounted to a lower die
`while the chip-mounting surface is brought in contact with the
`mounting surface of a core block provided inside the lower die;
`the inner surface of a clamped upper die is brought into contact
`with the bottom pieces of external leads, which is a substrate-
`mounting surface; a sealing resin material is injected from a resin
`injection hole provided in the center of the upper die; the chip-
`mounting surface of the above-mentioned lead frame is pressed
`by this injection pressure against the mounting surface of the core
`block; and while the above-mentioned substrate-mounting surface
`is pressed against the inner surface of the upper die, the inside of
`the above-mentioned external leads is filled with a sealing resin
`material to bury the external leads in this sealing resin material,
`and the substrate-mounting surface of the external leads is
`exposed almost flush with the bottom surface of resin package;
`and in this state, the lead frame is formed integrally with the resin
`package.
`(Detailed Description of the Invention)
`(0001)
`(Technical Field to Which the Invention Belongs) The present
`invention pertains to a surface-mounting component and a
`manufacturing method thereof, wherein an electronic component
`chip is mounted to a lead frame and sealed in a resin package, and
`external leads of this lead frame are provided on the bottom
`surface of the resin package, serving as a substrate-mounting
`surface; the present invention is applied to, for example, optical
`semiconductor elements, such as a
`light emitting diode
`(hereinafter will be called LED), other semiconductor elements,
`electronic components such as resistors, and capacitors.
`(0002)
`(Prior Art) As a packaging form of an electronic component, there
`are an insertion part 1A shown in FIG. 1(a) and a surface-
`mounting component 1B shown in FIG. 1(b), for example; either
`of which an electronic component chip 3 is mounted to a lead
`frame 2, and this chip 3 and one end of an external lead 4 of the
`lead frame 2 are connected via a bonding wire 5, and in this state,
`it is sealed in a package 6 made of synthetic resin; the former has
`
`[text cut off] (2) 001-118868 (P2001-118868A)
`
`a configuration in which the external lead 4 is bent into the shape
`of an L, and while in this state, other end is made to protrude in a
`position away from the package 6, this end part is inserted into a
`through hole 7 so as to be joined by solder on the back surface
`side of the printed circuit board 8; the latter has a configuration in
`which the external lead 4 is bent into a U shape, and while in this
`state, the other end is attached to the bottom surface from the side
`surface of the package 6, and the bottom piece is brought in
`contact with and joined by solder to the top of the printed circuit
`board 8, serving as a substrate-mounting surface.
`(0003) As the results of comparing both configurations, we found
`that the latter, which is the surface-mounting component 1B, is
`more advantageous than the former, which is the insertion part 1A,
`based on the following reasons: size and weight reduction can be
`achieved from a small area in which the external leads 4 are
`mounted only at the portions not protruding; productivity can be
`improved owing to an easy mounting step since the external lead
`4 is not inserted into a through hole; and package cracks and
`internal corrosion caused by heat and moisture that act on the
`inside via the external lead 4 can be reduced, because the external
`lead 4 is less likely to receive an external force during handling
`and form a gap with the package 6; therefore, the latter has been
`widely used especially in recent years; however, this surface-
`mounting component 1B still has issues, which will be described
`below, that need to be solved.
`(0004)
`(Problem to be Solved by the Invention) That is, the external lead
`4 in the conventional surface-mounting component 1B has one
`end side formed [at first] in a linear shape buried in the package 6
`to be bent to a U shape later, as indicated by the imaginary line,
`wherein the external lead 4 receives an external force during
`bending process, producing a gap with the package 6, or the
`folded part becomes in a bent shape, easily causing variations in
`the thickness protruded from the package 6, so there has also been
`a concern where solder joint is difficult while the substrate-
`mounting surface is in a state of being horizontally placed on top
`of the printed circuit board 8.
`(0005) Therefore, there is also a concern of generating package
`cracks and internal corrosion from heat and moisture that act on
`the inside via the external lead 4 as in the case with the insertion
`part 1A, if a gap is produced between the external lead 4 and the
`package 6; and there are also concerns of deterioration in bonding
`strength, if it fails to be placed horizontally and of no longer
`capable of obtaining desired performances, if it is mounted while
`an optical axis is shifted when the electronic component is an
`optical semiconductor element, such as LED, or the like.
`(0006) In order to solve the problems in the prior art described
`above, the present invention is to provide a surface-mounting
`component and the manufacturing method thereof with improved
`mounting structure, and the manufacturing method thereof, of a
`lead frame containing external leads to a package so as not to be
`influenced by an external force, more improved than those in the
`conventional
`surface-mounting
`component, wherein
`this
`improvement allows a package to be reliably mounted in a
`horizontal state to a printed circuit board surface, enabling further
`miniaturization than that of the conventional products.
`(0007)
`(Means for Solving the Problems) The present invention is a
`surface-mounting component, wherein an electronic component
`chip is mounted to a lead frame and sealed in a resin package, and
`external leads of this lead frame are provided on the bottom
`surface of the resin package,
`
`
`
`Cree Ex. 1011
`
`Page 10
`
`

`

`serving as a substrate-mounting surface, wherein the inside of the
`external leads to which bending to a U-shape cross-section has
`been performed in advance is filled with an injection-molded
`sealing resin material to bury the external leads in this sealing
`resin material; and in this state, a lead frame is formed integrally
`with a resin package, and a substrate-mounting surface of external
`leads is exposed almost flush with the bottom surface of resin
`package (Claim 1).
`(0008) In this surface-mounting component, external leads to
`which a bending process has been performed in advance are
`mounted to a package, so that it is unnecessary to perform a
`bending process later as in the case in the conventional surface-
`mounting components; therefore, this solved the problems that
`occur in the conventional surface-mounting components in that an
`external force generated during bending or other handling causes
`a gap to occur in the interface between a package and an external
`lead, or an external force acts on the sealed electronic component
`chip, and it is possible to significantly reduce the generation of
`package cracks and internal corrosion due to mechanical stress,
`heat, and moisture that act on the inside via the external leads and
`the gap.
`(0009) The bottom piece of the external lead, which is a substrate-
`mounting surface, while maintaining its levelness, is joined by
`solder in a horizontal state to a wiring line on a printed circuit
`board, enabling it to be mounted with a stable bonding strength,
`and when the electronic component is especially an optical
`semiconductor element such as a LED, or the like, and the
`electronic component chip is an optical semiconductor chip
`(Claim 2), an optical axis can be arranged right-angled with
`respect to a chip-mounting surface, in a state of the substrate-
`mounting surface being flat, thereby desired performances can be
`obtained.
`(0010) Next, in the manufacturing method of the surface-
`mounting component according to the present invention, an
`electronic component chip is mounted to a lead frame and sealed
`in a resin package, and external leads of this lead frame are
`provided on the bottom surface of the resin package, serving as a
`substrate-mounting surface, wherein the lead frame has external
`leads continuous to the chip-mounting surface containing a pad
`that have been bent to a U-shape cross-section; this lead frame is
`mounted to a lower die while the chip-mounting surface is
`brought in contact with the mounting surface of a core block
`provided inside the lower die; the inner surface of a clamped
`upper die is brought into contact with the bottom pieces of
`external leads, which is a substrate-mounting surface; a sealing
`resin material is injected from a resin injection hole provided in
`the center of the upper die; the chip-mounting surface of the lead
`frame is pressed by this injection pressure against the mounting
`surface of the core block; and while the substrate-mounting
`surface is pressed against the inner surface of the upper die, the
`inside of the external leads is filled with a sealing resin material to
`bury the external leads in this sealing resin material, and the
`substrate-mounting surface of the external leads is exposed almost
`flush with the bottom surface of resin package; and in this state,
`the lead frame is formed integrally with a resin package (Claim 3).
`(0011) According to this manufacturing method, the chip-
`mounting surface of a lead frame and the substrate-mounting
`surface that were pressed against the mounting surface of a core
`block and the inner surface of the upper die, respectively, can be
`made a flat exposed metal surface without generating any burr or
`
`[text cut off] (3) 001-118868 (P2001-118868A)
`
`coating resulting from the inflow of a sealing resin material;
`therefore, chip mounting and mounting to a printed circuit board
`can be performed easily, reliably, and firmly, and especially when
`the mounting component is an optical semiconductor element
`such as an LED as in this embodiment, if both component
`surfaces become flat, an optical axis can be correctly set in a
`certain direction.
`(0012) In particular, in this manufacturing method, if the bottom
`piece of the external lead is bent upward in advance in an inclined
`form, this bottom piece is bent in a horizontal form by the
`pressure of a clamped upper die, increasing the contact pressure
`of the bottom piece with respect to the inner surface of the upper
`die; therefore, the inflow of a sealing resin material can be
`prevented more reliably, making it possible to achieve a flat
`exposed metal surface with no generation of burr or coating, and
`the use of a sealing resin material having relatively fine particle
`size can also be adopted.
`(0013)
`(Mode for Carrying Out the Invention) Hereinafter, the surface-
`mounting component and the manufacturing method thereof
`according to the present invention will be described in details
`with reference to the accompanying drawings, FIGS. 2–6, based
`on the preferable embodiments applied to LED as the electronic
`component to be mounted, where FIG. 2 shows a plan view of
`LED to which the present invention has been applied; FIG. 3
`shows a cross sectional view across line III-III of FIG. 2; FIG. 4
`shows the essential part of a conductor substrate on which a lead
`frame is formed, wherein (a) shows a plan view and (b) shows a
`cross sectional view across line IV-IV of (a); FIG. 5 is a process
`diagram of resin molding, wherein (a) shows a longitudinal
`section view of a mold in an opened state, (b) shows a
`longitudinal section view of a mold in a clamped state, and (c)
`shows an explanation drawing of the resin material being in a
`flowing state as seen from the plane; and FIG. 6 is a molded resin
`package, wherein (a) shows a plan view with a portion thereof
`being cut-off and (b) shows a cross sectional view across line VI-
`VI of (a).
`(0014) As shown in FIG. 2 and FIG. 3, an LED 10, which is a
`surface-mounting component, has each light-emitting part of red
`(R), green (G), and blue (B) stored in one resin package 11,
`wherein the package 11 is rectangular in shape and provided with
`an opening 12 by a round groove on the upper center side and
`formed in a bottomed frame shape; a portion of the lead frame 13
`integrally molded with the package 11 is exposed to the bottom
`surface of the opening