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`Cree Ex. 1011
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`Cree Ex. 1011
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`Page 6
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`Cree Ex. 1011
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`(8) 001-118868 (P2001-118868A)
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`Cree Ex. 1011
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`Page 8
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`Cree Ex. 1011
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`Page 8
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`(19) Japan Patent Office (JP)
`
`(12) Japanese Unexamined Patent
`Application Publication (A)
`
`
`
`
`
`(51) Int. Cl.7
`
`Identification codes
`
`
`
`
`
`
`(11) Japanese Unexamined Patent
`Application Publication
`2001-118868
`(P2001-118868A)
`(43) Publication date: April 27, 2001 (4. 27.2001)
`
`FI
`
`Theme code (reference)
`
`
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`
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`Request for examination: Requested Number of claims: 3 OL (Total of 8 pages) Continued on the last page
`(21) Application number
`Japanese Patent Application
`(71) Applicant
`597105407
`
`2000-279804 (P2000-279804)
`
`Kyowa Kasei Co., Ltd.
`177-1 Megawa Makishima-cho, Uji-shi,
`(62) Indication of
`Japanese Patent Application
`
`Kyoto-fu
` division
`H9-198109 division
`
`Kiyoshi ISHII
`(22) Date of application
`July 24, 1997 (7. 24.1997)
`(72) Inventor
`℅ Mold Technology Laboratory Co., Ltd.
`
`6-7-7 Minamioi, Shinagawa-ku, Tokyo-to
`
`Morio YAMAGUCHI
`(72) Inventor
`℅ Kyowa Kasei Co., Ltd.
`
`177-1 Megawa Makishima-cho, Uji-shi,
`
`Kyoto-fu
`
`Minoru ABE, Patent Attorney
`(74) Agent
`100089266
`Youichi Ojima, patent attorney
`
`
`(54) (TITLE OF THE INVENTION) SURFACE-MOUNTING COMPONENT AND MANUFACTURING METHOD THEREOF
`
`(57) Abstract
`(PURPOSE) To provide a surface-mounting component and the
`manufacturing method thereof, wherein no gap occurs at the
`interface between a package and an external lead under an
`external force due to bending, no external force acts on the
`sealed electronic component chip, while package cracks as well
`as occurrence of internal corrosion, etc., which are caused by
`mechanical stress, heat, and moisture that act on the inside
`through an external lead and a gap are reduced.
`(MEANS FOR SOLVING) In a surface-mounting component, in
`which an electronic component chip 17 is mounted to a lead
`frame 13 and sealed in a resin package 11, and external leads 21,
`22, 23, and 24 of the lead frame are mounted to the bottom
`surface of resin package 11, serving as a substrate-mounting
`surface; the external leads 21, 22, 23, and 24 are bent to a U-
`shape cross-section, with the substrate-mounting surface being
`exposed almost flush with the bottom surface of resin package
`11, and integrally formed with the resin package 11.
`
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`Cree Ex. 1011
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`Page 9
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`
`
`(Scope of Patent Claims)
`(Claim 1) A surface-mounting component, wherein an electronic
`component chip is mounted to a lead frame and sealed in a resin
`package, and external leads of this lead frame are provided on the
`bottom surface of the above-mentioned resin package, serving as
`a substrate-mounting surface, characterized in that
`the inside of the external leads to which bending to a U-shape
`cross-section has been performed in advance is filled with an
`injection-molded sealing resin material to bury the external leads
`in this sealing resin material; and in this state, a lead frame is
`formed integrally with a resin package, and a substrate-mounting
`surface of external leads is exposed almost flush with the bottom
`surface of the resin package.
`(Claim 2) The surface-mounting component as recited in Claim 1,
`wherein the electronic component chip described above is an
`optical semiconductor chip.
`(Claim 3) A method of manufacturing a surface-mounting
`component, wherein an electronic component chip is mounted to
`a lead frame and sealed in a resin package, and external leads of
`this lead frame are provided on the bottom surface of the above-
`mentioned resin package, serving as a substrate-mounting surface,
`characterized in that
`the above-mentioned lead frame has external leads continuous to
`the chip-mounting surface containing a pad that have been bent to
`a U-shape cross-section; this lead frame is mounted to a lower die
`while the chip-mounting surface is brought in contact with the
`mounting surface of a core block provided inside the lower die;
`the inner surface of a clamped upper die is brought into contact
`with the bottom pieces of external leads, which is a substrate-
`mounting surface; a sealing resin material is injected from a resin
`injection hole provided in the center of the upper die; the chip-
`mounting surface of the above-mentioned lead frame is pressed
`by this injection pressure against the mounting surface of the core
`block; and while the above-mentioned substrate-mounting surface
`is pressed against the inner surface of the upper die, the inside of
`the above-mentioned external leads is filled with a sealing resin
`material to bury the external leads in this sealing resin material,
`and the substrate-mounting surface of the external leads is
`exposed almost flush with the bottom surface of resin package;
`and in this state, the lead frame is formed integrally with the resin
`package.
`(Detailed Description of the Invention)
`(0001)
`(Technical Field to Which the Invention Belongs) The present
`invention pertains to a surface-mounting component and a
`manufacturing method thereof, wherein an electronic component
`chip is mounted to a lead frame and sealed in a resin package, and
`external leads of this lead frame are provided on the bottom
`surface of the resin package, serving as a substrate-mounting
`surface; the present invention is applied to, for example, optical
`semiconductor elements, such as a
`light emitting diode
`(hereinafter will be called LED), other semiconductor elements,
`electronic components such as resistors, and capacitors.
`(0002)
`(Prior Art) As a packaging form of an electronic component, there
`are an insertion part 1A shown in FIG. 1(a) and a surface-
`mounting component 1B shown in FIG. 1(b), for example; either
`of which an electronic component chip 3 is mounted to a lead
`frame 2, and this chip 3 and one end of an external lead 4 of the
`lead frame 2 are connected via a bonding wire 5, and in this state,
`it is sealed in a package 6 made of synthetic resin; the former has
`
`[text cut off] (2) 001-118868 (P2001-118868A)
`
`a configuration in which the external lead 4 is bent into the shape
`of an L, and while in this state, other end is made to protrude in a
`position away from the package 6, this end part is inserted into a
`through hole 7 so as to be joined by solder on the back surface
`side of the printed circuit board 8; the latter has a configuration in
`which the external lead 4 is bent into a U shape, and while in this
`state, the other end is attached to the bottom surface from the side
`surface of the package 6, and the bottom piece is brought in
`contact with and joined by solder to the top of the printed circuit
`board 8, serving as a substrate-mounting surface.
`(0003) As the results of comparing both configurations, we found
`that the latter, which is the surface-mounting component 1B, is
`more advantageous than the former, which is the insertion part 1A,
`based on the following reasons: size and weight reduction can be
`achieved from a small area in which the external leads 4 are
`mounted only at the portions not protruding; productivity can be
`improved owing to an easy mounting step since the external lead
`4 is not inserted into a through hole; and package cracks and
`internal corrosion caused by heat and moisture that act on the
`inside via the external lead 4 can be reduced, because the external
`lead 4 is less likely to receive an external force during handling
`and form a gap with the package 6; therefore, the latter has been
`widely used especially in recent years; however, this surface-
`mounting component 1B still has issues, which will be described
`below, that need to be solved.
`(0004)
`(Problem to be Solved by the Invention) That is, the external lead
`4 in the conventional surface-mounting component 1B has one
`end side formed [at first] in a linear shape buried in the package 6
`to be bent to a U shape later, as indicated by the imaginary line,
`wherein the external lead 4 receives an external force during
`bending process, producing a gap with the package 6, or the
`folded part becomes in a bent shape, easily causing variations in
`the thickness protruded from the package 6, so there has also been
`a concern where solder joint is difficult while the substrate-
`mounting surface is in a state of being horizontally placed on top
`of the printed circuit board 8.
`(0005) Therefore, there is also a concern of generating package
`cracks and internal corrosion from heat and moisture that act on
`the inside via the external lead 4 as in the case with the insertion
`part 1A, if a gap is produced between the external lead 4 and the
`package 6; and there are also concerns of deterioration in bonding
`strength, if it fails to be placed horizontally and of no longer
`capable of obtaining desired performances, if it is mounted while
`an optical axis is shifted when the electronic component is an
`optical semiconductor element, such as LED, or the like.
`(0006) In order to solve the problems in the prior art described
`above, the present invention is to provide a surface-mounting
`component and the manufacturing method thereof with improved
`mounting structure, and the manufacturing method thereof, of a
`lead frame containing external leads to a package so as not to be
`influenced by an external force, more improved than those in the
`conventional
`surface-mounting
`component, wherein
`this
`improvement allows a package to be reliably mounted in a
`horizontal state to a printed circuit board surface, enabling further
`miniaturization than that of the conventional products.
`(0007)
`(Means for Solving the Problems) The present invention is a
`surface-mounting component, wherein an electronic component
`chip is mounted to a lead frame and sealed in a resin package, and
`external leads of this lead frame are provided on the bottom
`surface of the resin package,
`
`
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`Cree Ex. 1011
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`Page 10
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`
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`serving as a substrate-mounting surface, wherein the inside of the
`external leads to which bending to a U-shape cross-section has
`been performed in advance is filled with an injection-molded
`sealing resin material to bury the external leads in this sealing
`resin material; and in this state, a lead frame is formed integrally
`with a resin package, and a substrate-mounting surface of external
`leads is exposed almost flush with the bottom surface of resin
`package (Claim 1).
`(0008) In this surface-mounting component, external leads to
`which a bending process has been performed in advance are
`mounted to a package, so that it is unnecessary to perform a
`bending process later as in the case in the conventional surface-
`mounting components; therefore, this solved the problems that
`occur in the conventional surface-mounting components in that an
`external force generated during bending or other handling causes
`a gap to occur in the interface between a package and an external
`lead, or an external force acts on the sealed electronic component
`chip, and it is possible to significantly reduce the generation of
`package cracks and internal corrosion due to mechanical stress,
`heat, and moisture that act on the inside via the external leads and
`the gap.
`(0009) The bottom piece of the external lead, which is a substrate-
`mounting surface, while maintaining its levelness, is joined by
`solder in a horizontal state to a wiring line on a printed circuit
`board, enabling it to be mounted with a stable bonding strength,
`and when the electronic component is especially an optical
`semiconductor element such as a LED, or the like, and the
`electronic component chip is an optical semiconductor chip
`(Claim 2), an optical axis can be arranged right-angled with
`respect to a chip-mounting surface, in a state of the substrate-
`mounting surface being flat, thereby desired performances can be
`obtained.
`(0010) Next, in the manufacturing method of the surface-
`mounting component according to the present invention, an
`electronic component chip is mounted to a lead frame and sealed
`in a resin package, and external leads of this lead frame are
`provided on the bottom surface of the resin package, serving as a
`substrate-mounting surface, wherein the lead frame has external
`leads continuous to the chip-mounting surface containing a pad
`that have been bent to a U-shape cross-section; this lead frame is
`mounted to a lower die while the chip-mounting surface is
`brought in contact with the mounting surface of a core block
`provided inside the lower die; the inner surface of a clamped
`upper die is brought into contact with the bottom pieces of
`external leads, which is a substrate-mounting surface; a sealing
`resin material is injected from a resin injection hole provided in
`the center of the upper die; the chip-mounting surface of the lead
`frame is pressed by this injection pressure against the mounting
`surface of the core block; and while the substrate-mounting
`surface is pressed against the inner surface of the upper die, the
`inside of the external leads is filled with a sealing resin material to
`bury the external leads in this sealing resin material, and the
`substrate-mounting surface of the external leads is exposed almost
`flush with the bottom surface of resin package; and in this state,
`the lead frame is formed integrally with a resin package (Claim 3).
`(0011) According to this manufacturing method, the chip-
`mounting surface of a lead frame and the substrate-mounting
`surface that were pressed against the mounting surface of a core
`block and the inner surface of the upper die, respectively, can be
`made a flat exposed metal surface without generating any burr or
`
`[text cut off] (3) 001-118868 (P2001-118868A)
`
`coating resulting from the inflow of a sealing resin material;
`therefore, chip mounting and mounting to a printed circuit board
`can be performed easily, reliably, and firmly, and especially when
`the mounting component is an optical semiconductor element
`such as an LED as in this embodiment, if both component
`surfaces become flat, an optical axis can be correctly set in a
`certain direction.
`(0012) In particular, in this manufacturing method, if the bottom
`piece of the external lead is bent upward in advance in an inclined
`form, this bottom piece is bent in a horizontal form by the
`pressure of a clamped upper die, increasing the contact pressure
`of the bottom piece with respect to the inner surface of the upper
`die; therefore, the inflow of a sealing resin material can be
`prevented more reliably, making it possible to achieve a flat
`exposed metal surface with no generation of burr or coating, and
`the use of a sealing resin material having relatively fine particle
`size can also be adopted.
`(0013)
`(Mode for Carrying Out the Invention) Hereinafter, the surface-
`mounting component and the manufacturing method thereof
`according to the present invention will be described in details
`with reference to the accompanying drawings, FIGS. 2–6, based
`on the preferable embodiments applied to LED as the electronic
`component to be mounted, where FIG. 2 shows a plan view of
`LED to which the present invention has been applied; FIG. 3
`shows a cross sectional view across line III-III of FIG. 2; FIG. 4
`shows the essential part of a conductor substrate on which a lead
`frame is formed, wherein (a) shows a plan view and (b) shows a
`cross sectional view across line IV-IV of (a); FIG. 5 is a process
`diagram of resin molding, wherein (a) shows a longitudinal
`section view of a mold in an opened state, (b) shows a
`longitudinal section view of a mold in a clamped state, and (c)
`shows an explanation drawing of the resin material being in a
`flowing state as seen from the plane; and FIG. 6 is a molded resin
`package, wherein (a) shows a plan view with a portion thereof
`being cut-off and (b) shows a cross sectional view across line VI-
`VI of (a).
`(0014) As shown in FIG. 2 and FIG. 3, an LED 10, which is a
`surface-mounting component, has each light-emitting part of red
`(R), green (G), and blue (B) stored in one resin package 11,
`wherein the package 11 is rectangular in shape and provided with
`an opening 12 by a round groove on the upper center side and
`formed in a bottomed frame shape; a portion of the lead frame 13
`integrally molded with the package 11 is exposed to the bottom
`surface of the opening 12 as a chip-mounting surface; light-
`emitting chips 17a, 17b, and 17c of three colors to which die
`bonding has been performed are mounted to pads 14, 15, and 16,
`respectively; one side of the electrode of each of the light-
`emitting chips 17a, 17b, and 17c is connected to a common area
`part 19 that serves as a ground electrode via a bonding wire 18;
`the opening 12 is filled with a coating material 20, such as a
`transparent epoxy resin material, to cover these parts, and the
`inner peripheral surface of the opening 12 is provided with a taper,
`to which a mirror surface treatment is performed, forming a
`reflective surface 12a.
`(0015) The lead frame 13 is provided with external leads 21, 22,
`and 23 continued from pads 14, 15, and 16, respectively, and
`external leads 21, 22, 23, and 24 continued from the common area
`part 19; wherein each external lead has side pieces 21a, 22a, 23a,
`and 24a bent into a U-shaped cross-section and bottom pieces 21b,
`22b, 23b, and 24b, respectively;
`
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`Cree Ex. 1011
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`Page 11
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`these side and bottom pieces are integrally formed to and almost
`flush with (either on the same plane or protruding slightly) the
`side and bottom surfaces of the package 11, respectively, and
`these bottom pieces 21b, 22b, 23b, and 24b are joined by solder to
`a wiring line (not shown) on the printed circuit board 25, serving
`as a substrate-mounting surface.
`(0016) In the surface-mounting component (LED 10) described
`above, the external leads 21, 22, 23, and 24 of the lead frame 13
`bent in advance to an L-shaped cross-section are formed
`integrally with the package 11 in a state of being almost flush
`with the side and bottom surfaces of the package 11 (however, the
`side piece may not necessarily be in an almost flush state);
`therefore, compared to the surface-mounting component 1B
`shown in FIG. 1(b) in which the external lead is bent after
`molding, no gap occurs in the interface of a package and an
`external lead by the external force during bending or handling,
`and no external force acts on the sealed electronic component
`chip, so that it is possible to significantly reduce the generation of
`package cracks and internal corrosion due to mechanical stress,
`heat, and moisture that act on the inside via an external lead and a
`gap.
`(0017) The bottom piece of the external lead, which is a substrate-
`mounting surface, while retaining its levelness, is joined by solder
`in a horizontal state to a wiring line on a printed circuit board,
`allowing surface mounting with a stable bonding strength, and if