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`Cree Ex. 1016
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`Page 5
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`
`
`(19) Japan Patent Office (JP)
`
`(12) Japanese Unexamined Patent
`Application Publication (A)
`
`
`(51) Int. Cl.7
`
`Identification codes
`
` FI
`
`
`
`(11) Japanese Unexamined Patent
`Application Publication Number
`2001-308388
`(P2001-308388A)
`(43) Publication date: November 2, 2001
`(11.2.2001)
`Theme codes (reference)
`
`Request for examination: Not yet requested Number of claims: 6 OL (Total of 5 pages)
`
`(21) Application number
`
`
`Japanese Patent Application
`2000-128079 (P2000-
`128079)
`
`(22) Date of application
`
`April 27, 2000 (4.27.2000)
`
`
`
`
`
`
`
`
`
`(71) Applicant
`
`000116024
`ROHM Co., Ltd.
`21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi,
`Kyoto
`Hiromoto ISHINAGA
`℅ ROHM Co., Ltd.
`21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi,
`Kyoto
`100087701
`Patent Attorney Kosaku INAOKA (and 2 others)
`F terms (reference)
`
`(72) Inventor
`
`(74) Agent
`
`
`
`
`
`
`
`(54) [TITLE OF THE INVENTION] CHIP-TYPE LIGHT-EMITTING ELEMENT
`
`(57) [ABSTRACT]
`[PROBLEM] To design the structure of a chip-type light-
`emitting element so that, when the element is mounted on a
`wiring board, the junction parts are within the area
`occupied by the element in a plan view.
`[MEANS FOR SOLVING] A pair of internal electrodes 2 are
`disposed on one surface 1a of an insulating substrate 1, and
`external electrodes 5 are disposed on the other surface 1c.
`These are electrically connected by a conductive material 7
`filled in through-holes 6 opened in the insulating substrate
`1. A light emitter chip 3 is die-bonded to one of the internal
`electrodes 2, and this joined with the other internal
`electrode 2 by a bonding wire 4. The light emitter chip 3,
`the bonding wire 4, and junction parts between these and
`the internal electrodes 2 are protected by a translucent
`member 8.
`
`
`
`
`
`
`
`
`
`
`Cree Ex. 1016
`
`Page 6
`
`

`

`
`
`[SCOPE OF THE PATENT CLAIMS]
`[CLAIM 1] A chip-type light-emitting element comprising:
`an insulating substrate having internal electrodes provided
`on one surface thereof;
`a light emitter chip provided on the one surface of the
`insulating substrate and connected
`to
`the
`internal
`electrodes; and
`external electrodes provided on another surface of the
`insulating substrate and electrically connected to the
`internal electrodes via a wiring member formed inside the
`insulating substrate.
`[CLAIM 2] The chip-type light-emitting element according
`to claim 1, wherein the wiring member comprises a
`conductive material disposed inside through-holes formed
`in the insulating substrate.
`[CLAIM 3] The chip-type light-emitting element according
`to claim 2, wherein the through-holes are filled with the
`conductive material.
`[CLAIM 4] The chip-type light-emitting element according
`to any one of claims 1 to 3, wherein none of the external
`electrodes is formed on a side surface of the insulating
`substrate.
`[CLAIM 5] The chip-type light-emitting element according
`to any one of claims 1 to 4, wherein the external electrodes
`are formed at intervals on the other surface inward from the
`side surface of the insulating substrate.
`[CLAIM 6] The chip-type light-emitting element according
`to any one of claims 1 to 5, further comprising a translucent
`member having a side surface roughly flush with the side
`surface of the insulating substrate so as to cover a periphery
`of the light emitter chip.
`[DETAILED DESCRIPTION OF THE INVENTION]
`[0001]
`[TECHNICAL FIELD OF THE INVENTION] The present invention
`relates to the structure of a chip-type light-emitting element
`used in a pilot lamp or the like.
`[0002]
`[CONVENTIONAL TECHNOLOGY] FIG. 5 is an illustrative
`cross-sectional view
`illustrating a state
`in which a
`conventional chip-type light-emitting element is soldered to
`a wiring board. A pair of internal electrodes 52 are
`provided on one surface 51a of an insulating substrate 51,
`and a light emitter chip 53 such as an LED is die-bonded to
`one of the internal electrodes. This light emitter chip 53 and
`the other internal electrode 52 are connected by a bonding
`wire 54. The internal electrodes 52 are connected to
`external electrodes 55 in the vicinity of the ends of the
`insulating substrate 51.
`[0003] The regions including the light emitter chip 53, the
`bonding wire 54, and the junctions between these and the
`internal electrodes 52 are protected by a translucent
`member 56. The external electrodes 55 are formed at the
`ends of the insulating substrate 51 so as to cover the end
`faces 51b.
`[0004]
`[PROBLEM TO BE SOLVED BY THE INVENTION] When a chip-
`type light-emitting element having such a structure is
`joined to electrode pads 58 on a wiring board 59 by solder
`57, the junctions ‒ that is, the portions where the solder 57
`is present ‒ protrude beyond the area occupied by the chip-
`type light-emitting element itself, and regions C required
`only for these junctions arise on the sides of the chip end
`faces. Therefore, the wiring and various electronic parts on
`
`
`
`
`(2)001-308388 (P2001-308388A)
`the wiring board must be disposed while avoiding these
`regions for soldering, which leads to a problem in that the
`mounting density of various parts becomes low.
`[0005] Therefore, an object of the present invention is to
`provide a chip-type light-emitting element capable of
`reducing the area occupied at the time of mounting, thereby
`enabling the high-density mounting of parts on a wiring
`board.
`[0006]
`[MEANS FOR SOLVING THE PROBLEM, AND EFFECT OF THE
`INVENTION] The invention of claim 1 for achieving the
`object described above is a chip-type light-emitting element
`comprising: an
`insulating substrate having
`internal
`electrodes provided on one surface thereof; a light emitter
`chip provided on the one surface of the insulating substrate
`and connected to the internal electrodes; and external
`electrodes provided on another surface of the insulating
`substrate and electrically connected
`to
`the
`internal
`electrodes via a wiring member formed
`inside
`the
`insulating substrate.
`[0007] According to this invention, the external electrodes
`of the chip-type light-emitting element are formed on the
`bottom surface of the insulating substrate (the surface on
`the opposite side as the surface where the light emitter chip
`is mounted). Therefore, when this chip-type light-emitting
`element is mounted on electrode pads on the wiring board
`by soldering, most of the junction parts are within the area
`occupied by the chip-type light-emitting element itself. As
`a result, the effective area occupied by the chip-type light-
`emitting element on the wiring board can be reduced,
`which enables the high-density mounting of electronic parts
`or the like.
`[0008] The invention of claim 2 is the chip-type light-
`emitting element according to claim 1, wherein the wiring
`member comprises a conductive material disposed inside
`through-holes formed in the insulating substrate. This
`invention assumes a simple structure in which electrical
`connections between the internal and external electrodes
`are achieved by a conductive material disposed inside
`through-holes provided in the insulating substrate, which
`makes it possible to reduce the cost of the element.
`[0009] The invention of claim 3 is the chip-type light-
`emitting element according to claim 2, wherein the
`through-holes are filled with the conductive material. The
`surface of the conductive material with which the through-
`holes are filled is preferably flush with the surface of the
`insulating substrate. Since the insides of the through-holes
`are filled with the conductive material, when an internal
`electrode is provided directly above a through-hole, the
`bonding wire from the light emitter chip can be effectively
`joined to the internal electrode. That is, junctions can be
`achieved easily because the supersonic waves applied at the
`time of wire bonding are transmitted to the junction parts
`efficiently.
`[0010] The invention of claim 4 is the chip-type light-
`emitting element according to any one of claims 1 to 3,
`wherein none of the external electrodes is formed on a side
`surface of the insulating substrate. According to this
`invention, when mounted on a wiring board, most of the
`solder junction parts are within the area occupied by the
`chip-type light-emitting element. The invention of claim 5
`is the chip-type light-emitting element according to any one
`of claims 1 to 4, wherein the external electrodes are formed
`
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`
`Page 7
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`

`

`
`
`at intervals on the other surface inward from the side
`surface of the insulating substrate.
`[0011] In this invention, the external electrodes are
`provided at a distance from the side surfaces of the
`insulating substrate. Therefore, when joined with the wiring
`board, roughly all of the junction parts are within the area
`occupied by the chip-type light-emitting element in a plan
`view. The invention of claim 6 is the chip-type light-
`emitting element according to any one of claims 1 to 5,
`further comprising a translucent member having a side
`surface roughly flush with the side surface of the insulating
`substrate so as to cover a periphery of the light emitter chip.
`[0012] When the chip-type light-emitting element is
`configured to a small size such as 1.0 mm × 0.5 mm, the
`ratio of area occupied by the portion covered by the
`translucent member on the insulating substrate becomes
`larger. However, in this invention, the external electrodes
`are provided on the bottom surface of the insulating
`substrate, resulting in a configuration in which junctions
`with the wiring board are made on the bottom surface side.
`Accordingly, it is unnecessary to expose the surface of the
`insulating substrate near the ends of the chip-type light-
`emitting element. Therefore, by disposing the translucent
`member so as to cover the periphery of the light emitter
`chip while roughly flush with the side surface of the
`insulating substrate, the miniaturization of the element
`becomes easy, and the structure becomes simple, which
`makes it possible to enhance productivity.
`[0013]
`[EMBODIMENTS OF THE INVENTION] Embodiments of the
`present invention will be described in detail hereinafter
`with reference to the attached drawings. FIG. 1 is an
`illustrative cross-sectional view illustrating the structure of
`a chip-type light-emitting element of an embodiment of the
`present invention. This chip-type light-emitting element has
`a structure in which a light emitter chip 3 is mounted on an
`insulating substrate 1, and the light emitter chip 3 is sealed
`by a translucent member 8. That is, a pair of internal
`electrodes 2 are formed on one surface 1a of the insulating
`substrate 1, and the light emitter chip 3 is die-bonded to one
`of the internal electrodes, while the light emitter chip and
`the other internal electrode 2 are electrically connected by a
`bonding wire 4. Glass epoxy, BT resin, ceramic, or the like
`may be used as the material of the insulating substrate 1.
`[0014] In this embodiment, the internal electrodes 2 consist
`of three layers including Cu (2a), Ni (2b), and Au (2c) from
`the insulating substrate 1 side. Using Cu, which is highly
`conductive, as a base material yields low resistance. By
`covering this with Ni, which has appropriate hardness, the
`operability at the time of wire bonding is enhanced. By
`covering this further with Au, which has high weather
`resistance, the characteristics of the electrode members are
`kept constant over time. The internal electrodes 2a are
`electrically connected to external electrodes 5 formed on
`the other surface 1c of the insulating substrate 1 by a
`conductive material 7 filled into through-holes 6 opened in
`the insulating substrate 1. Like the internal electrodes 2, the
`external electrodes 5 consist of three layers including Cu
`(5a), Ni (5b), and Au (5c). A material having low resistance
`such as Cu is preferably used as the material of the
`conductive material 7.
`[0015] The regions including the light emitter chip 3, the
`bonding wire 4, and the junction part between these and the
`internal electrode 2c on the surface 1a of the insulating
`
`
`
`(3)001-308388 (P2001-308388A)
`substrate 1 are protected by a translucent member 8. FIG. 2
`is an illustrative bottom view of the chip-type light-emitting
`element illustrated in FIG. 1 when viewed from the
`direction of arrow A. The external electrodes 5 are disposed
`at constant distances B1 and B2 from the side surface 1b of
`the insulating substrate 1. None of the electrodes is formed
`on the side surface 1b of the insulating substrate 1, and this
`side surface 1b constitutes a surface with no solder
`wettability over the entire perimeter.
`[0016] By employing such a structure, when the chip-type
`light-emitting element is connected to electrode pads 13 on
`a wiring board 14 by solder 12 via the external electrodes 5,
`the junctions ‒ that is, the portions where the solder 12 is
`present ‒ are all within the area occupied by the chip-type
`light-emitting element in a plan view. Accordingly, it is
`unnecessary to secure regions required only for solder
`junctions on the wiring board 14. Therefore, as illustrated
`in FIG. 1, the electrode pads 13 or wiring 15 can be
`disposed in very close proximity on the wiring board 14,
`and when parts are mounted using the solder 12, there is no
`occurrence of solder-induced shorting called bridging
`between adjacent electrode pads or wiring.
`this
`[0017]
`In particular,
`in
`the configuration of
`embodiment, as illustrated in FIG. 2, the external electrodes
`5 are disposed at constant distances B1 or B2 from the side
`surface 1b of the insulating substrate 1. Therefore, when
`joined to the wiring board 14, even if the solder protrudes
`somewhat outside the area of the external electrodes 5,
`there is no occurrence of bridging. From the perspective of
`the operability of wire bonding, the through-holes 6 are
`preferably completely filled by the conductive material 7,
`as illustrated in FIG. 1, but it is also possible to fill only a
`portion of the through-holes with a conductive material 7A,
`as illustrated in FIG. 3. That is, at the time of wire bonding,
`when the lower parts of the internal electrodes 2 to which
`the bonding wire 4 is to be connected are solid, the applied
`supersonic waves are transmitted to the junction parts more
`efficiently than when they are hollow as in FIG. 3, so
`joining becomes easy.
`[0018] However, a structure such as that illustrated in FIG.
`3 may be employed when the operability of wire bonding is
`not problematic ‒ for example, when bonding at a portion
`not directly above the through-holes 6 within the regions of
`the internal electrodes 2. The structure illustrated in FIG. 3
`is achieved by forming the internal electrodes 2 on one
`surface 1a of the insulating substrate 1, opening through-
`holes 6 with a laser or the like from the other surface 1c,
`and performing plating on prescribed portions including the
`inside surfaces of the through-holes 6. With this structure,
`the conductive material 7A for electrically connecting the
`external electrodes 9 and the internal electrodes 2 from the
`bottom surface 1c of the insulating substrate 1 is made of a
`conductive film formed
`integrally with
`the external
`electrodes 9.
`[0019] FIG. 4 is an illustrative cross-sectional view of a
`chip-type light-emitting element of another embodiment of
`the present invention. In this embodiment, an end face 8b
`of a translucent member 8 is formed in a flush manner over
`the entire perimeter of the side surface 1b of the insulating
`substrate 1 so as to cover the periphery of the light emitter
`chip 3. Since the external electrodes 5 are at the bottom of
`the part, it is unnecessary to provide the translucent
`member 8 in a state with exposed parts secured on the
`
`Cree Ex. 1016
`
`Page 8
`
`

`

`
`
`surface 1a side of the insulating substrate 1, as in the case
`of the conventional configuration (FIG. 5), and the
`translucent member 8 may be formed roughly flush with
`the side surface 1b of the insulating substrate 1.
`[0020] By employing a configuration such as that described
`above, it is possible to use a production method entailing
`providing light emitter chips 3 and bonding wires 4 in
`numbers corresponding to the number of elements on a
`large insulating substrate 1 on which conductive materials
`6, internal electrodes 2, and external electrodes 5 for a
`plurality of elements are formed, forming a translucent
`member 8 covering roughly the entire surface of this large
`insulating substrate 1, and then cutting out the material into
`individual elements. With this method, the translucent
`members 8 for a plurality of elements can be formed at
`once, which enhances productivity.
`[0021] In contrast, in a chip-type light-emitting element
`with a conventional structure such as that illustrated in FIG.
`5, the external electrodes 55 must be formed after the
`insulating substrate 51 is cut out to a prescribed size, and
`the translucent member 56 must be formed thereafter. The
`junctions between the chip-type light-emitting element and
`the wiring board can be produced using a conductive
`adhesive in addition to soldering.
`[BRIEF DESCRIPTION OF THE DRAWINGS]
`FIG. 1 is an illustrative cross-sectional view of a chip-type
`
`
`(4)001-308388 (P2001-308388A)
`light-emitting element of an embodiment of the present
`invention.
`FIG. 2 is an illustrative bottom view of the chip-type light-
`emitting element illustrated in FIG. 1.
`FIG. 3 is an illustrative cross-sectional view illustrating a
`variation of the structure of the insulating substrate.
`FIG. 4 is an illustrative cross-sectional view of a chip-type
`light-emitting element of another embodiment of the
`present invention.
`FIG. 5 is an illustrative cross-sectional view of a typical
`conventional chip-type light-emitting element.
`[EXPLANATION OF SYMBOLS]
`1
`insulating substrate
`1a
`insulating substrate front surface
`1b
`insulating substrate side surface
`1c
`insulating substrate bottom surface
`2
`internal electrode
`3
`light emitter chip
`4
`bonding wire
`5
`external electrode
`6
`through-hole
`7
`conductive material
`8
`translucent member
`9
`external electrode
`12 solder
`14 wiring board
`
`
`[FIG. 1]
`
`
`
`
`
`Cree Ex. 1016
`
`Page 9
`
`

`

`
`
`[FIG. 2]
`
`(5)001-308388 (P2001-308388A)
`
`[FIG. 4]
`
`[FIG. 3]
`
`[FIG. 5]
`
`
`
`
`
`Cree Ex. 1016
`
`Page 10
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`

`

`Certification of Translation
`
`Translator's Declaration: 12l8l17
`
`I, Brian Toth, hereby declare:
`
`That i possess advanced knowledge of the Japanese and English languages. My qualifications
`are as follows:
`
`. Over 18 years as a Japanese-English translator, focusing primarily on technical
`documents and patents
`o Bachelor's degree in Mathematics with a minor in Physics from the University of
`Louisville
`
`I hereby certify that l translated Japanese Unexamined Patent Application Publication Number
`JP2001308388A, from Japanese to English and that. to the best of my ability. my English
`translation, attached hereto, is a true and correct translation.
`
`I further certify that I am competent in both English and Japanese to render and certify such
`translation. I understand that willful false statements and the like are punishable by a fine or
`imprisonment, or both (18 U .S.C. 1001). I declare under penalty of perjury under the laws of
`the United States of America that all statements made herein of my own knowledge are true,
`and all statements made on information and belief are believed to be true.
`
`if called upon to testify at a deposition in connection to this translation, I will make myself
`available.
`
`Brian Toth
`
`M
`
`Cree Ex. 1016
`
`Page 11
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`Cree Ex. 1016
`
`Page 11
`
`