United States Patent [19]
`
`Abe
`
`‘
`
`[54] DISPLAY DEVICE WITH LEDS HAVING A
`REDUCTION OF THE THERMAL
`EXPANSION COEFFICIENTS AMOUNG
`THE ASSOCIATED COMPONENTS
`
`[75]
`[73]
`
`Inventor: Munezo Abe, Nara, Japan
`Assignee:
`Sharp Kabushiki Kaisha, Osaka,
`Japan
`[21]
`Appl. No.: 576,653
`[22] Filed:
`Sep.4, 1990
`[30]
`Foreign Application Priority Data
`Sep. 4, 1989 [JP]
`Japan ........................... .. 1-103839[U]
`
`[51] Int. Cl.5 ................. .. H01L 29/161; HOlL 33/00;
`HOIL 23/48; H01L 23/29
`[52] U.S. Cl. ...................................... .. 257/98; 257/88;
`257/100
`[58] Field of Search ..................... .. 357/16, 17, 72, 74,
`357/81, 70, 72, 19
`
`[56]
`
`References Cited
`U.S. PATENT DOCUMENTS
`4,942,454 7/1990 Mori et al. .......................... ,. 357/70
`
`FOREIGN PATENT DOCUMENTS
`
`0018190 2/l977 Japan ................................... .. 357/17
`0017573 1/1988 Japan ................................... .. 357/17
`
`lllllllllllllllllIllllllllllllllllllllllllllllllllllilllllllllllllIllllllll
`5,177,593
`Jan. 5, 1993
`
`USOO5177593A
`Patent Number:
`Date of Patent:
`
`[11]
`[45]
`
`OTHER PUBLICATIONS
`“Introduction to MID (Molded Interconnection De
`vice)".
`Primary Examiner—Andrew J. James
`Assistant Examiner-Carl Whitehead, Jr.
`[57]
`ABSTRACT
`A display device with LEDs includes an interconnec
`tion frame in which an electrical lead interconnection is
`formed by conductive metal plating on a surface includ
`in g a main surface of a resin substrate capable of receiv
`ing a plating process. LEDs are bonded at the predeter
`mined positions on the main surface of this interconnec
`tion frame so that they are connected to the electric lead
`interconnection. A re?ection case having openings with
`their inner peripheral surfaces serving as reflection sur
`faces surrounding the LEDs is affixed to the main sur
`face of the interconnection frame at a position corre
`sponding to the LED arrangement. In the openings of
`the reflection case, the LEDs are covered with light
`transmissive resin members. Because the interconnec
`tion frame for the lead is formed of resin as well as the
`re?ection case and provided with metal plating inter
`connection, thermal stresses are not produced due to
`difference of thermal expansion coefficient between the
`interconnection frame and the re?ection case.
`
`10 Claims, 8 Drawing Sheets
`
`Cree Ex. 1017
`
`Page 1
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`

`

`US. Patent
`
`Jan. 5, 1993
`
`Sheet 1 0f 8
`
`5,177,593
`
`F161
`
`PRIOR ART
`
`F162
`
`PRIOR ART
`
`22
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`Cree Ex. 1017
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`Page 2
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`

`

`US. Patent
`
`Jan. 5, 1993
`
`Sheet 2 of 8
`
`5,177,593
`
`FIGAA
`
`Cree Ex. 1017
`
`Page 3
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`

`

`US. Patent
`
`Jan. 5, 1993
`
`Sheet 3 of 8
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`5,177,593
`
`'FIGAD
`
`P32
`
`Cree Ex. 1017
`
`Page 4
`
`

`

`U.S. Patent
`
`Jan, 5, 1993
`
`Sheet 4 of 8
`
`5,177,593
`
`FIG.5A
`
`F1G.5B
`
`F1IG.5D
`
`FIG.5C
`
`FIG.5E “ 3 36
`
`
`
`
` VIIIood Sle
`
`
`
`
`Cree Ex. 1017
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`Page 5
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`Cree Ex. 1017
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`Page 5
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`

`

`U.S. Patent
`
`Jan. 5, 1993
`
`8
`Sheet 5 of
`
`5,177,593
`
`FIG.6A
`
`37 I
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`/ 41
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`
`Cree Ex. 1017
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`Page 6
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`

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`US. Patent
`
`Jan. 5, 1993
`
`_ Sheet 6 of 8
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`5,177,593
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`FIG.7A
`
`FIG.7B
`
`FIG.7C
`
`FIG.7D
`
`FIG.7E
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`7
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`32
`
`Cree Ex. 1017
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`Page 7
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`

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`U.S. Patent
`
`Jan. 5,1993
`
`Sheet 7 of 8
`
`5,177,593
`
`F1G.8A
`
`F1G.8B
`
`F1G.8D
`
`
`
` PZZIZIZL
`
`
`
`43
`
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`(RET
`
`
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`Cree Ex. 1017
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`Page 8
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`Cree Ex. 1017
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`Page 8
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`

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`‘US. Patent
`
`Jan. 5, 1993
`
`Sheet 8 of 8
`
`5,177,593
`
`FIGJO
`
`32b /
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`
`Cree Ex. 1017
`
`Page 9
`
`

`

`1
`
`DISPLAY DEVICE WITH LEDS HAVING A
`REDUCTION OF THE THERMAL EXPANSION
`COEFFICIENTS AMOUNG THE ASSOCIATED
`COMPONENTS
`
`5,177,593
`2
`In the molded type shown in FIG. 3, there is no such
`problems as described above because the device does
`not use any dispersion sheet, and besides, the number of
`parts is decreased to enhance workability of assembling.
`However, since coef?cients of thermal expansion of the
`lead frame 12 and the epoxy resin 14 are considerably
`different from each other, thermal stresses are likely to
`be produced in the resin. Therefore, defects in quality
`are developed that the LED is not lit because of cracks
`of the LED chip due to stresses, or because of discon
`necting of a gold wire with a diameter of 25;.tm-30pm
`connecting a bonding pad (not shown) provided on the
`upper surface of the LED chip and the pad (not shown)
`on a lead frame. Furthermore, because of resin exfolia
`tion between the outer peripheral surface of the LED
`chip and the resin layer surrounding it, there is an air
`layer between the LED chip and the resin layer. As a
`result, the light intensity of the LED decreases because
`of refraction at the bou'ndary. Accordingly, troubles in
`quality are not avoided. Besides, having a large number
`of work steps in manufacturing, the device has a prob
`lem of high cost due to a decrease in workability.
`
`BACKGROUND OF THE INVENTION
`1. Field of the Invention
`The present invention relates to a display device with
`LEDs (Light Emitting Diodes), and more particularly
`to a display device of a type in which LEDs are sur-'
`rounded by a re?ection case of a predetermined pattern
`to obtain a light emitting shape of that pattern by means
`of lightening of the LEDs. This display device with
`LEDs is, e.g. as a numeric and symbolic display device
`of a segment type, applied to a counter of a measuring
`instrument or a mechanical apparatus, or to display
`various physical quantities such as time.
`2. Description of the Background Art
`In conventional display devices with LEDs, there is a
`numeric and symbolic display device of a segment type
`as shown in FIG. 1. Such a display device, in which
`LEDs are attached in the respective grooves of a re?ec
`tion case 1 having a plurality of re?ection structures of
`25
`a groove shape corresponding to the respective seg
`ments, displays desired ?gures by lightening predeter
`mined LEDs according to a driving signal externally
`supplied through a lead 2.
`Such conventional display devices with LEDs are
`generally divided into the following two types accord
`ing to difference the of their structures.
`One type of display device, referred to as a substrate
`type, has a sectional structure shown in FIG. 2. Refer
`ring to FIG. 2, in this display device, an LED 13 is
`mounted on an electrically interconnected substrate 14,
`and a re?ecting case 11 having an upper surface on
`which a dispersion sheet 15 is attached is provided on
`the substrate 14. The LED 13 is ?xed on the substrate 14
`with a silver paste, electrically connected to the electric
`interconnection on the substrate 14 by means of bond
`ing by a gold wire 16, and also electrically connected to
`outside portions by a pin 12 soldered to the substrate 14.
`Another type of display device is referred to as a
`molded type, of which the sectional structure is shown
`in FIG. 3. In this display device, referring to FIG. 3, an
`LED 23 is mounted to one end of a formed lead frame
`22, and the lead frame 22 and the LED 23 are connected
`with each other by means of bonding by a gold wire 26.
`The device has a structure in which the lead frame 22
`provided with the LED 23 is inserted in a re?ection
`case 21 having a groove-shaped re?ection structure
`simultaneous with sealing by epoxy resin 24, and then
`the epoxy resin 24 is hardened. The LED 23 is electri
`cally connected to outside portions through the respec
`tive lead terminals of the lead frame 22.
`Among these conventional display devices, in the
`substrate type shown in FIG. 2, troubles arise such as
`positioning errors in providing the dispersion sheet 15, a’
`defect that adhesive exudes outside the dispersion sheet
`15, change in colors of the dispersion sheet 15 due to
`exposure to heat or solvents in the manufacturing pro
`cess, and a defect due to dust stuck on the dispersion
`sheet 15. Accordingly, problems such as a decrease in
`quality and workability or an increase in cost arise.
`Furthermore, there is also a problem of moisture resis
`tance because the device cannot be subjected to resin
`molding.
`
`60
`
`SUMMARY OF THE INVENTION
`It'is an object of the present invention to try to de
`crease defects in quality such as cracks of LED chips
`and disconnecting of bonding wires by reducing the
`difference in thermal expansion coefficients among
`components to prevent thermal stresses from occurring.
`A display device with LEDs of the present invention
`includes an interconnection frame which is formed by
`providing electric interconnection for use as leads by
`conductive metal plating on agsurface including at least
`a main surface of a resin substrate composed of resin
`which can be subjected to a plating process. LEDs are
`bonded at predetermined positions on the main surface
`of this interconnection frame so that they are connected
`to the lead interconnection. A re?ection case with
`openings having their inner peripheral surfaces serving
`as re?ection surfaces surrounding the LEDs is affixed at
`the position corresponding to arrangement of LEDs on
`the main surface of the interconnection frame. In the
`openings of the re?ection case, the LEDs are covered
`with light transmissive resin members.
`According to the display device with LEDs of the
`present invention, because that lead, interconnection is
`composed of resin as well as the re?ection case and
`provided with metal plated interconnection, thermal
`stresses are decreased due to the difference of thermal
`expansion coefficients between the interconnection
`frame and the re?ection case.
`The display device with LEDs of the present inven
`tion is manufactured according to the following meth
`ods.
`In the first method of manufacturing a display device
`with LEDs of the present invention, a resin substrate is
`?rst formed having a major surface on which LEDs are
`arranged and composed of resin which is capable of
`receiving a plating treatment. Next, to form an intercon
`nection frame, a lead interconnection having a predeter
`mined pattern is plated on a surface including at least
`the major surface of this interconnection frame. On the
`main surface of this interconnection frame, a re?ection
`case having openings to expose this main surface and to
`make their peripheral surfaces serve asvre?ection sur
`faces is formed integrally with the interconnection
`frame. Subsequently, LEDs are bonded and connected
`to the lead interconnection at predetermined positions
`
`35
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`20
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`35
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`5,177,593
`3
`on the main surface of the interconnection frame within
`the openings of the re?ection case. Then, light transmis
`sive resin is injected into the openings of the re?ection
`case and the LED chips are molded.
`In the second method of manufacturing a display
`device with LEDs of the present invention, after form
`ing an interconnection frame by means of the similar
`method to the above described ?rst manufacturing
`method, LED chips are bonded and connected to the
`lead interconnection at predetermined positions on the
`main surface of the interconnection frame. Next, a re
`?ection case having openings passing through it at the
`predetermined positions corresponding to the positions
`where the LED chips are bonded and re?ection sur
`faces at inner peripheral surfaces of the openings, and
`light transmissive resin members for sealing the open
`ings are integrally formed. Subsequently, the re?ection
`case is connected and ?xed to the interconnection frame
`so that the LEDs are covered with the light transmis
`sive resin members in the openings.
`According to the above described two manufacturing
`methods, the display devices with LEDs of the present
`invention are manufactured with excellent production
`ef?ciency.
`The foregoing and other objects, features, aspects
`25
`and advantages of the present invention will become
`more apparent from the following detailed description
`of the present invention when taken in conjunction with
`the accompanying drawings.
`BRIEF DESCRIPTION OF THE DRAWINGS
`FIG. 1 is a perspective view showing external ap
`pearance of a conventional display device with LEDs.
`FIG. 2 is a sectional view showing structure referred
`to as substrate type among conventional display devices
`with LEDs.
`FIG. 3 is a sectional view showing structure referred
`to as molded type among conventional display devices
`with LEDs.
`FIG. 4A is a plan view ofa display device with LEDs
`in the ?rst embodiment of the present invention, FIG.
`4B is an A-A sectional view thereof, FIG. 4C is a right
`side view of FIG. 4A, and FIG. 4D is a plan view show
`ing one example of an interconnection pattern of an
`interconnection frame.
`FIGS. 5A, 5B, 5C, 5D and 5E are sectional views
`sequentially showing a display device with LEDs in
`one embodiment, of the present invention at the respec
`tive manufacturing steps.
`FIGS. 6A, 6B, and 6C are sectional views sequen
`tially showing the steps for forming a re?ection case 31
`integrally with an interconnection frame 37 by an insert
`molding method.
`FIGS. 7A, 7B, 7C, 7D and 7E are sectional views
`sequentially showing a display device with LEDs in
`one embodiment of the present invention at other manu
`facturing steps.
`FIGS. 8A, 8B, 8C, and 8D are sectional views se
`quentially showing the steps for forming transparent
`resin member 35 in re?ection segment 31a of re?ection
`case 31 by a two-color molding method.
`FIG. 9 is a sectional view showing structure of a
`display device with LEDs in another embodiment of
`the present invention.
`FIG. 10 is a perspective view for describing a cutting
`pattern in case where a plurality of resin substrates 34
`for interconnection frames are formed by cutting off a
`single resin board 340.
`
`4
`DESCRIPTION OF THE PREFERRED
`EMBODIMENTS
`One embodiment of the present invention will be
`described below on the basis of FIGS. 4A-C. FIGS.
`4A-C are a plan view, a front sectional view and a right
`side view of a display device with LEDs of one embodi
`ment of the present invention, respectively. Referring
`to these ?gures, a plurality of re?ection segments 31a
`forming a display pattern such as a figure together are
`provided in a re?ection case 31 formed of resin. Each
`re?ection segment 31a is composed of an opening hav
`ing taper-like inner peripheral surfaces, and the inner
`peripheral surfaces serve as re?ection surfaces re?ect
`ing the light of an LED. The main surface of an inter
`connection frame 37 formed by providing a lead inter
`connection 32 having a predetermined pattern on a resin
`substrate 34 is connected to the lower end surface of the
`re?ection case 31. The lead interconnection 32 is
`formed by conductive metal plating from the upper
`main surface to the lower surface by way of the side
`surface of the resin substrate 34. An LED 33 is provided
`on the main surface of the interconnection frame 37
`located at a bottom surface of the opening forming each
`re?ection segment 31a, and bonded by a gold wire 36 to
`be electrically connected to the lead interconnection 32.
`Terminals of each LED 33 are led to the lower surface
`of interconnection frame 37 by the lead interconnection
`32.
`The LED 33 in each re?ection segment 31a is molded
`with a light transmissive resin member 35, respectively.
`This light transmissive resin member 35 should be com~
`posed of resin having excellent adhesive property to a
`chip and also having excellent moisture and thermal
`resistance, which is generally formed by molding with
`transparent epoxy resin.
`An example of an interconnection pattern on a sur
`face of the interconnection frame 37 in this embodiment
`is shown in FIG. 4D.
`An example of a process for manufacturing a display
`device with LEDs of the present embodiment will be
`described below on the basis of FIGS. 5A-E.
`First, referring to FIG. 5A, a plain-board-like resin
`substrate 34 is formed. For this resin substrate 34, for
`example, a liquid crystal polymer is employed which is
`capable of receiving conductive metal plating on the
`surface thereof. Next, referring to FIG. SE, a lead inter
`connection 32 extending from the top main surface of
`the resin substrate 34 through the side surface to the
`bottom surface is formed by the conductive metal plat
`ing and the subsequent patterning by etching- is applied
`thereto to complete the interconnection frame 37. The
`liquid crystal polymer employed as the material for the
`resin substrate 34 of the interconnection frame 37 in
`cludes “VECTRA” by Polyplastics Kabushiki-Kaisha
`and “XYDAR” by DARTOCO CORPORATION
`(ITALY). Both “VECTRA” and “XYDAR” are com
`posed of thermotropic fully aromatic liquid crystal
`polyester. A method of conductive metal plating used is
`the method described in detail in p.7 of “Guide to MID
`(Molded Interconnection Device) .
`.
`. ”, for example,
`which is a description of “VECTRA” by POLY
`PLASTICS CORPORATION. As the material for
`metal plating, a single layer of a copper plating layer, a
`silver plating layer or a gold plating layer, or a combina
`tion including two or more of the layers is used, the
`thickness of the plating layer is less than several um.
`
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`As for a speci?c .combination of metal plating materi
`als, it is preferable to employ copper as a substrate metal
`and coat the copper with a nickel plating layer and a
`gold plating layer as anti-oxidative metals, for example.
`In patterning the lead interconnection on the resin sub
`strate 34, after completion of metal plating, a resist mask
`with a predetermined pattern is formed by photolithog
`raphy, and the resist mask is peeled off after etching.
`Next, a re?ection case 31 is formed on the intercon
`nection frame 37 by a so called insert molding method.
`Thus, the re?ection case 31 and the interconnection
`frame 37 are integrally formed. In the insert molding in
`this case, as will be described in detail below, the inter
`connection frame 37 is inserted into a forming metal
`mold in advance, and subsequently resin is poured and
`formed in the forming metal mold for the material of the
`re?ection case 31.
`Then, referring to FIG. 5D, the LED 33 is bonded on
`the lead interconnection 32 at the main surface of the
`interconnection frame 37 located at the bottom portion
`of the re?ection segment 31a, and is further bonded by
`the gold wire 36, so that the lead interconnection 32 and
`the LED are electrically connected.
`Next, referring to FIG. 5E, light transmissive epoxy
`resin is injected into the opening of the reflection seg
`ment 31a, the LED is molded thereby, and then a dis
`play device with LEDs of this embodiment is com
`pleted.
`Among the manufacturing steps described above, a
`step of the insert molding for forming the structure
`shown in FIG. 5C will be described referring to FIGS.
`6A-C. First, referring to FIG. 6A, the interconnection
`frame 37 is inserted into a downside mold 41. Next,
`referring to FIG. 6B, an upside mold 42 is made to abut
`against the downside mold 41 so that the interconnec
`tion frame 37 is pressed from upside. In this condition,
`liquid resin is supplied through a resin supply hole 420
`to integrally form the re?ection case 31 on the intercon
`nection frame 37. Furthermore, referring to FIG. 6C,
`by separating the downside mold 41 and the upside
`mold 42 after the liquid resin for forming the re?ection
`case 31 is hardened, an integral molded product of the
`interconnection frame 37 and the re?ection case 31 is
`obtained. By using this insert molding method, position
`ing and joining of the re?ection case 31 onto the inter
`connection frame 37 can be performed simultaneously
`and highly precisely.
`A detailed embodiment of the present invention will
`be described. In FIG. 1, in a conventional LED display
`device, a width L1 is 10.16 mm, a height H] is 15.00
`mm, a thickness D1 is 6.5 mm, and a length of the lead
`D2 is 3.5 mm. Meanwhile, in FIG. 4A of the present
`invention, a width L10 is 7.0 mm, a height H10 is 11.0
`mm, a height of a character W10 is 8.0 mm, a width of
`the character W30 is 4.0 mm, and a width of 1 segment
`of the character is 1.0 mm. In FIG. 4B of the present
`invention, the thickness of a the re?ection case 31 D11
`is 1.0 mm and thickness D12 of a resin substrate 34 for
`frame is 1.0 mm, so that the entire thickness of the LED
`. display device is 2.0 mm, which is extremely thin and
`small. In a conventional manufacturing method, it has
`been dif?cult to manufacture such a ?ne and precise
`LED display device. Also, because the surface of the
`lead interconnection 32 is covered with an anti-oxida
`tive metal having a high the re?ection rate and the
`thickness of the re?ection case 31 is thin (1.0 mm, for
`example), utilization ef?ciency of light emitted by the
`LED chip can be increased, and in one example, it can
`
`6
`be increased to 2-7 times as compared to the luminance
`of a conventional LED.
`As a method of manufacturing a display device with
`LEDs of the present embodiment, the steps shown in
`FIGS. 7A-7E can also be used. In these manufacturing
`steps, the steps for forming the interconnection frame 37
`shown in FIGS. 7A and 7B are similar to the above
`described manufacturing steps shown in FIGS. 5A and
`5B. In this manufacturing process referring to FIG. 7C,
`after forming the interconnection frame 37, an LED
`chip 33 is bonded on the lead interconnection 32 at its
`main surface, and by further bonding by the gold wire
`367, the LED 33 and the lead interconnection 32 are
`electrically connected.
`‘
`Next, referring to FIG. 7D, the re?ection case 31 and
`the light transmissive resin member 35 are integrally
`formed by a so-called two-color molding method de
`scribed later in detail, which is af?xed to the main sur
`face of the interconnection frame 37, for completing the
`structure as shown in FIG. 7E.
`Here, in the case of using this manufacturing method,
`the LED 33 is not ?led with the transparent resin mem
`ber 35, but the LED 33 and the gold wire 36 are cov
`ered with a concave portion formed at the bottom sur
`face of the transparent resin member 35.
`Among the above described manufacturing steps, a
`description will be given about the two-color molding
`method for forming an integral production of the re?ec
`tion case 31 and the transparent resin member 35 shown
`in FIG. 7D referring to FIGS. 8A-D. First, referring to
`FIG. 8A, the angle of rotation of a base plate 43 is
`adjusted so that the downside mold 44 carried on the
`rotating base plate 43 is located right under a ?rst ?xed
`upside mold 45. Next, referring to FIG. 8B, the rotating
`base plate 43 is raised to make the downside mold 44
`abut against the ?rst ?xed upside mold 45, the liquid
`resin is supplied though a resin supply hole 450 to form
`the re?ection case 31. Subsequently, referring to FIG.
`8C, after the liquid resin is cooled and hardened, the
`rotating base plate 43 is descended to separate the
`downside mold 44 and the re?ection case 31 from the
`?rst ?xed upside mold 45, and turned a predetermined
`angle (for example, 180° ), where the angle of rotation
`of the ?xed base plate 43 is adjusted to locate the down
`side mold 44 right under a second ?xed upside mold 46.
`Moreover, referring to FIG. 8D, the rotating base plate
`43 is raised to make the downside mold 44 abut against
`the second ?xed upside mold 46, and liquid light trans
`missive resin is supplied through a resin supply hole 460
`to form the light transmissive resin member 35 in the
`re?ection segment 31a of the re?ection case 31. After
`cooling and hardening the light transmissive resin mem
`ber 35, the rotating base plate 43 is descended to sepa
`rate the downside mold 44 and the second ?xed upside
`mold 46, so that an integral formed production of the
`re?ection case 31 and the light transmissive resin mem
`ber 35 can be taken out. By employing this two-color
`molding method, integral forming of the reflection case
`31 and the light transmissive resin member 35 can be
`ef?ciently performed. Also, since high temperature
`liquid resin is not directly injected onto the LED 33, the
`gold wire 36 or the interconnection frame 37, damage
`due to heat can be prevented.
`~
`In the present invention, a structure having a section
`as shown in FIG. 9 can be introduced other than the
`structure shown in FIG. 412. That is to say, in the em
`bodiment of FIG. 4B, the lead interconnection 32 was
`led to the bottom surface of the resin substrate 34
`
`30
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`5,177,593
`7
`through its side surface, but in the example of FIG-9,
`the lead interconnection 320 by metal plating formed on
`the upper surface of the resin substrate 34 is connected
`to electrodes 320 on the bottom surface through the
`through holes 32b. ,
`,
`Also, in the present invention, it is not essential to
`lead the lead the interconnection 32 to the bottom sur
`face of the resin substrate 34, but the lead interconnec
`tion 32 can be led only to the side surface. Thus, just
`leading the lead the interconnection 32 to the side sur
`face of the resin substrate 34 enables the structure to be
`implemented in which the interconnection frame 37 is
`put into a female socket.
`The resin substrate 34 of the interconnection frame 37
`can be formed one by one, but generally a plurality of
`substrates can be formed at a time by cutting an elon
`gated resin board 34a having through holes 3212 formed
`by applying injection molding to polycarbonate. When
`forming the interconnection frame 37 shown in FIG.
`4B, interconnection frame 37 is cut off along the section
`indicated by the dashed line P—P and the section indi
`cated by the dashed line Q—Q as illustrated in FIG. 10
`forming the interconnection frame 37 shown in FIG. 9,
`the interconnection frame 37 is cut off along the section
`indicated by the dashed line P-P and the section indi
`cated by the dashed line R—R.
`According to the display device with LEDs shown in
`each of the above embodiments, as the lead frame is
`formed by conductive metal plating, lead terminals and
`pins can be omitted. As a result, protruding portions,
`which may damage parts around it in transportation,
`can be eliminated, and also it can be employed as SMT
`(Surface Mounting Technology). Besides, so called
`taping packaging in which parts are put in a concave
`shaped packaging container and packed with a lid hav
`ing an adhesive material is enabled, which makes it easy
`for users to assemble it.
`It also has effect that the a width and a height of a
`LED display device, the magnitude of a character, the
`a width of one segment of the character. the thickness
`of the the re?ection case and the thickness of the LED
`display device can be made extremely thin and small.
`The utilization efficiency of the light emitted by the
`LED chip can be increased, and in one example, it has
`an effect to increase the same to 2-7 times as compared
`to the luminance of a conventional LED.
`Although the present invention has been described
`and illustrated in detail, it is clearly understood that the
`same is by way of illustration and example only and is
`not the present invention. All modi?cations as would be
`obvious to one skilled in the art are intended to be in
`cluded within the scope of the appended claims.
`What is claimed is:
`l. A display device comprising:
`an interconnection frame including,
`a resin substrate having a top surface, opposite side
`surfaces and a bottom surface opposite said top
`
`8
`surface and formed of resin capable of receiving
`a conductive plating process, and
`an electric lead interconnection formed by conduc
`tive mate] plating on at least said top surface of
`said resin substrate and de?ning a main surface of
`the interconnection frame, said electric lead in
`terconnection being led to either one of a bottom
`surface of said resin substrate, a side surface of
`said resin substrate, and both said bottom surface
`and said side surface of said resin substrate;
`an LED located at a predetermined position on
`said main surface of said interconnection frame
`and bonded to be connected to said electric led
`interconnection;
`a re?ection use formed of resin having an opening
`and an inner peripheral surface serving as a re
`flection surface surrounding said LED at a posi
`tion corresponding to the arrangement of said
`LED, and affixed to said main surface of said
`interconnection frame; and
`a light transmissive resin member covering said
`LED in said opening of said reflection case.
`2. The display device according to claim 1, wherein
`said LED is molded with said light transmissive resin
`member.
`3. The display device according to claim 1, wherein
`said light transmissive resin member comprises a con
`cave portion at a bottom surface and said LD is covered
`in said concave portion.
`4. The display device according to claim 1, wherein
`said light transmissive resin member comprises said
`transparent epoxy resin.
`5. The display device according to claim 1, wherein
`said resin substrate comprises a liquid crystal polymer.
`6. The display device according to claim 1, wherein
`said lead the interconnection comprises one metal plat
`ing layer selected out of a copper plating layer, a silver
`plating layer and a gold plating layer.
`7, The display device according to claim 1, wherein
`aid lead interconnection comprises a copper plating
`layer as a substrate metal and an nickel layer and a gold
`layer as anti-oxidateive metals above said copper plat
`ing layer.
`8. The display device according to claim 1, wherein
`aid lead interconnection comprises at least two metal
`plating layers selected out of a copper plating layer, a
`silver plating layer and a gold plating layer.
`9. The display device according to claim 1, wherein
`aid lead interconnection comprises a copper plating
`layer as a substitute metal layer and either one of a
`nickel layer and a gold layer as an anti-oxidateive metal
`above said upper plating layer.
`10. The display device according to claim 1, wherein
`said lead interconnection extends and is located on said
`side surface and covers a portion of said bottom surface.
`*
`it
`it
`it
`III
`
`15
`
`25
`
`35
`
`45
`
`55
`
`65
`
`Cree Ex. 1017
`
`Page 13
`
`