ENCAPSULATED
`MlCROELECTRONlCS ;
`
`Edward B. Hakim
`
`Materials,
`
`Processes,
`
`Quality,
`
`Reliability, and
`
`.
`
`-
`
`Applications
`
`i-Ltlilt'd by
`
`Michael G. Pecht
`Luu T. Nguyen
`
`PLASTIC-
`
`?
`
`:2 :'
`
`Cree Ex. 1006
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`Cree Ex. 1006
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`Page 1
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`

`

`PLASTIC-ENCAPSULATED
`
`MICROELECTRONICS
`
`Materials, Processes, Quality, Reliability, and Applications
`
`Edited by
`
`Michael G. Pecht
`
`Luu T. Nguyen
`Edward B. Hakim
`
`@ A
`
`Wiley-lnterscience Publication
`
`JOHN WILEY & SONS, INC.
`
`NewYork / Chichester
`
`/ Brisbane / Toronto / Singapore
`
`
`
`Cree Ex. 1006
`
`Page 2
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`Cree Ex. 1006
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`Page 2
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`

`

`This text is printed on acid-free paper.
`
`Copyright © 1995 by John Wiley & Sons. Inc.
`
`All rights reserved. Published simultaneously in Canada.
`
`Reproduction or translation of any part of this work beyond
`that permitted by Section 107 or 108 of the 1976 United
`States Copyright Act without the permission of the copyright
`owner is unlawful. Requests for permission or further
`information should be addressed to the Permissions Department,
`John Wiley & Sons, Inc., 605 Third Avenue. New York, NY
`10158-0012.
`
`10987654321
`
`This publication is designed to provide accurate and
`authoritative information in regard to the subject
`matter covered. It is sold with the understanding that
`the publisher is not engaged in rendering legal, accounting.
`or other professional services. If legal advice or other
`expert assistance is required, fire services of a competent
`professional person should be sought.
`
`Library of Congress Cataloging-in-Publication Data:
`
`Pecht, Michael.
`Plastic encapsulated microelectronics: materials, processes,
`quality, reliability, and applications / Michael G. Pecht, Luu T.
`Nguyen, Edward B. Hakim.
`p.
`cm.
`Includes index.
`ISBN 0-471-30625-8 (cloth ; alk. paper)
`1. Microelectronic packaging-Materials. 2. Microencapsulation.
`3. Plastics in packaging.
`I. Nguyen, Luu T. H, Ilakim, Edward B.
`III, Title.
`TK7874.P428 1995
`621.381'046ud020
`
`94-46528
`
`Printed in the United States of America
`
`Cree Ex. 1006
`
`Page 3
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`Cree Ex. 1006
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`Page 3
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`

`

`GLOSSARY
`
`459
`
`LIFE TEST: Test ofa component or circuit under electrical load and high temperature to assure
`reliability device.
`
`LOOP: The curve or are of the wire between the attachment points at each end of a wirebond.
`
`LOOP HEIGHT: A measure of the deviation of the wire loop from the straight line between
`the attachment points ofa wirebond. Usually, it is the maximum perpendicular distance from this
`line to the top of the wire loop.
`
`MARKING: A method ofidentifying printed boards or components with part number, revision
`letter, manufacturer code, and so on.
`
`METALLIZATION: A deposited or plated thin metallic film used for its protective or electrical
`properties. The process of applying a conductive metal film to the surface of the integrated
`circuit chip. This metallization is used both for interconnection on the chip and to define a place
`for the attachment of bond wires.
`
`MICROCRACKS: A thin crack in a substrate or chip, “or in thick—film trim-kerf walls, that can
`only be seen under magnification and which can contribute to latent failure phenomena.
`
`MICROSECTIONING: The preparation of a specimen for the metallographic examination of
`the material (usually by cutting out a cross section, followed by polishing, etching, staining, and
`mounting).
`
`MIL: An unit of length that is equal to 0.001 in or 0.0254 mm
`
`MISREGISTRATION:
`
`Improper alignment of successively produced features or patterns.
`
`MODULE: A generic term referring to assembled units in electronic equipments/assemblies.
`
`MODULUS OF ELASTICITY: The ratio of stress to strain in a material
`deformed.
`
`that is elastically
`
`MOISTURE BARRIER BAG (MBB): A plastic bag designed to restrict the transmission of
`water vapor and used to pack moisture-sensitive plastic-encapsulated components.
`
`MOISTURE STABILITY: The functional stability of a circuit under hi gh-humidity conditions,
`
`MOLDING COMPOUND: The plastic formulation used to package [Cs through a molding
`process.
`
`a starting material
`A precursor of low molecular weight used as
`MONOMER:
`polymerization to produce molecules of larger molecular weight, called polymers.
`
`for
`
`MULTICHII’ PACKAGE:
`
`An electronic package that carries
`
`a number of chips and
`
`—_—-—-
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`Cree Ex. 1006
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`Page 4
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`Cree Ex. 1006
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`Page 4
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