PASO
`ENCAPSULATED
`MICROELECTRONICS|
`a
`Materials,
`
`Cree Ex. 1006
`
`—
`=
`
`Processes,
`Quality,
`Reliability, and
`Applications
`
`|
`
`|
`
`Michael G. Pecht
`Luu T. Nguyen
`Edward B, Hakim
`
`Cree Ex. 1006
`
`Page 1
`
`

`

`PLASTIC-ENCAPSULATED
`MICROELECTRONICS
`
`Materials, Processes, Quality, Reliability, and Applications
`
`Edited by
`
`Michael G. Pecht
`Luu T. Nguyen
`Edward B. Hakim
`
`hy)
`
`A Wiley-Interscience Publication
`
`JOHN WILEY & SONS, INC.
`New York / Chichester
`/ Brisbane / Toronto / Singapore
`
`
`
`Cree Ex. 1006
`
`Page 2
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`Cree Ex. 1006
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`Page 2
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`

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`This text is printed on acid-free paper,
`
`Copyright © 1995 by John Wiley & Sons, Inc.
`
`All rights reserved. Published simultaneously in Canada.
`
`Reproduction or translation ofany part of this work beyond
`that permitted by Section 107 or 108 ofthe 1976 United
`States Copyright Act without the permission of the copyright
`owner is unlawful. Requests for permission or further
`information should be addressed to the Permissions Department,
`John Wiley & Sons, Inc., 605 Third Avenuc, New York, NY
`10158-0012.
`
`10987654321
`
`This publication is designed to provide accurate and
`authoritative informationin regard to the subject
`matter covered. It is sold with the understanding that
`the publisher is not engaged in rendering legal, accounting.
`or other professional services. If legal advice or other
`expert assistanceis required, the services of a competent
`professional person should be sought.
`
`Library af Congress Cataloging-in-Publication Data:
`
`Pecht, Michael.
`Plastic encapsulated microelectronics: materials, processes,
`quality,reliability, and applications / Michael G. Pecht, Luu T.
`Nguyen, Edward B. Hakim.
`p.
`cm.
`Includes index.
`ISBN 0-471-30625-8 (cloth ; alk. paper)
`1. Microelectronic packaging--Materials. 2. Microencapsulation.
`3. Plastics in packaging.
`I. Nguyen, Luu T.
`II. Hakim, Edward B.
`III. Title.
`TK7874.P428 1995
`621.381'046--dc20
`
`94-46528
`
`Printed in the United States of America
`
`Cree Ex. 1006
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`Page 3
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`Cree Ex. 1006
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`Page 3
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`

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`GLOSSARY
`
`459
`
`LIFE TEST: Test of a component or circuit under electrical load and high temperature to assure
`reliability device,
`
`LOOP: The curve or arc of the wire between the attachment points at each end of a wirebond.
`
`LOOP HEIGHT: A measure ofthe deviation of the wire loop from the straight line betwcen
`the attachmentpoints of a wirebond. Usually, it is the maximum perpendicular distance from this
`line to the top of the wire loop,
`
`MARKING: A method ofidentifying printed boards or components with part number, revision
`letter, manufacturer code, and so on.
`
`METALLIZATION:Adeposited or plated thin metallic film usedforits protective orelectrical
`properties. The process of applying a conductive metal film to the surface of the integrated
`circuit chip. This metallization is used both for interconnection on the chip andto define a place
`for the attachment of bond wires.
`
`MICROCRACKS: A thin crack in a substrate or chip, or in thick-film trim-kerf walls, that can
`only be seen under magnification and which can contribute to latent failure phenomena.
`
`MICROSECTIONING: The preparation of a specimen for the metallographic examination of
`the material (usually by cutting out a cross section, followed by polishing, etching, staining, and
`mounting).
`
`MIL: An unit of length that is equal to 0.001 in or 0.0254 mm.
`
`MISREGISTRATION:
`
`Improper alignment of successively produced features or patterns.
`
`MODULE: A generic term referring to assembled units in electronic equipments/assemblies.
`
`MODULUS OF ELASTICITY: The ratio ofstress to strain in a material
`deformed,
`
`that is elastically
`
`MOISTURE BARRIER BAG (MBB):Aplastic bag designed to restrict the transmission of
`water vapor and used to pack moisture-sensitive plastic-encapsulated components.
`
`MOISTURE STABILITY: The functionalstability of a circuit under high-humidity conditions,
`
`MOLDING COMPOUND:
`process.
`
`Theplastic formulation used to package ICs through a molding
`
`a starting material
`A precursor of low molecular weight used as
`MONOMER:
`polymerization to produce molecules of larger molecular weight, called polymers.
`
`for
`
`MULTICHIP PACKAGE;
`
`An electronic package that carries
`
`a number of chips and
`
`ee
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`Cree Ex. 1006
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`Page 4
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`Cree Ex. 1006
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`Page 4
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