throbber
Tungsten
`Properties, Chemistry, Technology of the
`Element, Alloys, and Chemical Compounds
`
`Erik Lassner and
`Wolf-Dieter Schubert
`
`Vienna University of Technology
`Vienna, Austria
`
`Kluwer Academic / Plenum Publishers
`New York, Boston, Dordrecht, London, Moscow
`
`Nichia Exhibit 1015
`Page 1
`
`

`

`Library of Congress C a t a l o g i n g - i n - P u b l i c a t i on Data
`
`Lassner, Erik.
`Tungsten
`.- properties, chemistry, technology of the element,
`a l l o y s, and c h e m i c al compounds / Erik Lassner and Wolf-Dieter
`Schubert.
`cm.
`p.
`Includes b i b l i o g r a p h i c al references and index.
`ISBN 0-306-15Q53-4
`1. Tungsten.
`I. Schubert, Wolf-Dieter. II. Title.
`QD181.W1L37 1998
`620 . 1 ' 8934—dc21
`
`98-45787
`CIP
`
`ISBN 0-306-45053-4
`
`© 1999 Kluwer Academic / Plenum Publishers, New York
`233 Spring Street, New York, N.Y. 10013
`
`1 0 9 8 7 6 5 4 3 21
`
`A C.I.P. record for this book is available from the Library of Congress.
`All rights reserved
`
`No part of this book may be reproduced, stored in a retrieval system, or transmitted in any form or by any
`means, electronic, mechanical, photocopying, microfilming, recording, or otherwise, without written
`permission from the Publisher
`
`Printed in the United States of America
`
`Nichia Exhibit 1015
`Page 2
`
`

`

`affect the recrystallization grain morphology and the retained dislocation substructure. In
`particular, non-sag tungsten is significantly more creep-resistant than pure tungsten,
`mainly as a result of the interlocking grain structure, which forms on recrystallization
`and which prevents both grain boundary sliding and difrusional creep. In addition, the fine
`dispersion of potassium bubbles contributes to the outstanding creep resistance through
`pinning of dislocations [1.62,1.66].
`Non-sag tungsten wires are the most creep-resistant wires, with the exception of
`monocrystalline tungsten. They are therefore used for sag-free lamp filaments at service
`temperatures of up to 300O0C (0.88 rm), and shear stresses in the range of 0.5 to 10 MPa
`[1.66].
`
`1.2.4. Thermal Properties
`
`Melting point: 3422 ± 15 0C (3695 K) [1.67],
`3390 ±40 0C (3663 K) [1.68],
`3423 ±30 0C (3696) [1.69].
`
`The high melting point (highest of all metals) is the most prominent and important
`property in regard to all applications as refractory metal. It is a consequence of the electron
`density of states. Small amounts of impurities, such as carbon, lower the melting point.
`The molar volume increases by 8% on melting. This is the largest expansion
`observed for bcc metals [1.7O].
`The melting curve of W has been determined to 5GPa [1.71].
`Enthalpy of fusion: 46±4kJ-mol"1 [1.68].
`Entropy of fusion: 14 J - mol"! - K~ ! [1.7O].
`Enthalpy of sublimination: 858.9±4.6U-HiOl"1 [1.35].
`Vapor Pressure. Tungsten has the lowest vapor pressure of all metals. Within the
`temperature range from 2600 to 3100 K, it obeys the following equation [1.76]:
`
`log /?[Pa] = -453957"1 + 12.8767
`
`At 200O0C, the vapor pressure is 8.15 x 10"8Pa; at 300O0C it is 10" * Pa. Experimental
`data for p over liquid W are not available.
`The rate of evaporation in vacuum is about 6.2 x 10" ug - c m "2^ s "1 at 200O0C,
`about7xlO"8g.cm"2-s"1 at 250O0C, and about 2.5 x 10""5S-Cm"2^"1 at 30000C
`[1.72]. It is markedly reduced by an inert gas atmosphere (Ar, Kr). Therefore, modern
`incandescent lamps contain inert gas fillings to avoid enhanced wall-blackening (the rate of
`evaporation in vacuum is about 500 times larger as compared to an Ar atmosphere of 1.2
`bar) [1.73].
`
`Boiling Point: calculated from rates of evaporation of solid tungsten,
`
`5663 0C (5936 K) [1.74],
`5700 ±200 0C [1.64].
`
`Nichia Exhibit 1015
`Page 3
`
`

`

`Critical temperature: 13400 ± 140OK [1.75].
`Critical pressure: (3.37 ±0.85) x 1O8Pa [1.75].
`Critical density: 4.31 g • cm~3 [1.35].
`Thermal expansion. At room
`temperature, values between 4.32 and 4.68
`x 10"6K"1 were obtained for the linear coefficient of expansion ex, depending on the
`material (P/M sheet, arc-cast sheet, etc.) and the type of measurement. Values for low and
`high temperatures are listed in Table 1.12. The linear coefficient of expansion can also be
`calculated according to the following equations [1.76]:
`
`temperature range: 293-1395 K
`
`a = 4.266 x 10~6(7 - 293) + 8.479 x 10-10(r - 293)2 - 1.974 x 10~13(r - 293)3
`
`temperature range 1395-2495 K
`
`oc = 0.00548 + 5.416 x 10~6(r - 1395) H-1.952
`x 10~10(r - 1395)2 + 4.422 x 10~13(r - 1395)3
`
`temperature range 2495-3600 K
`
`a = 0.01226 + 7.451 x 10~6(7 - 2495) + 1.654 x 10~9(r - 2495)2 + 7.568
`x 10~14(r-2495)3
`
`The very low thermal expansion of tungsten makes it compatible with glass and
`ceramics in high temperature applications.
`
`Thermodynamic functions [1.35]. Thermodynamic functions for solid tungsten are
`listed in Table 1.13. For more details and data for liquid tungsten, see elsewhere [1.1O].
`
`TABLE 1.12. Thermal Expansion Coefficient for
`Low and High Temperatures [1.35]
`
`T(K)
`
`106-Qt(K-1)
`
`T(K)
`
`106-Ot(K-1)
`
`10
`15
`20
`25
`30
`40
`50
`60
`70
`80
`100
`130
`
`0.006
`0.019
`0.048
`0.102
`0.20
`0.53
`0.90
`1.43
`1.88
`2.30
`2.82
`3.42
`
`160
`190
`220
`260
`300
`600
`1000
`1400
`1800
`2200
`2600
`3000
`3400
`
`3.82
`4.06
`4.20
`4.32
`4.49
`4.75
`5.02
`5.46
`6.11
`6.89
`7.76
`9.05
`11.60
`
`Nichia Exhibit 1015
`Page 4
`
`

`

`TABLE 1.13. Thermodynamic Functions [1.35]
`
`T
`(K)
`
`HT — //298 5
`(kJ . mor1)
`
`Hj — HQ
`
`S
`
`Cv
`(kJ • mor1) (kJ • mol'1 • K"1) (kJ - mor1 • K'1) (kJ - mor1 • K'1) (kJ • mor1 • K"1)
`
`S~SQ
`
`Cp
`
`298.15 O
`500
`5.022-5.024
`1000
`18.23-18.25
`1500
`32.33-32.62
`2000
`47.59-48.11
`2500
`64.52-64.78
`3000
`83.10-83.88
`3500
`105.19
`3600
`110.5-111.8
`
`4.970
`10.007
`23.142
`37.249
`52.599
`69.476
`88.310
`109.845
`114.574
`
`32.640
`45.516
`63.658
`75.068
`83.881
`91.399
`98.254
`104.880
`106.212
`
`32.618
`45.457
`63.686
`75.099
`83.585
`91.397
`98.442
`—
`106.89
`
`24.10-24.42
`24.33-25.44
`27.19-27.60
`29.23-29.86
`31.37-32.13
`34.67-36.00
`39.25-41.80
`46.49-50.85
`48.11-54.68
`
`23.96
`25.16
`26.70
`28.12
`29.80
`—
`35.91
`—
`—
`
`Analyses of thermodynamic properties of tungsten at high temperatures are available
`[1.77,1.78].
`The heat capacity at low temperatures is*
`
`80
`70
`60
`50
`40
`35
`30
`25
`Tin K
`100
`Cp (J-mor1-K-1) 0.73
`10.74 12.81 16.04
`8.39
`5.82
`3.30
`1.35 2.22
`T in K
`260
`300
`220
`200
`180
`140
`160
`120
`Cp (J-mor1-K-1) 18.28 19.87 21.01 21.86 22.54 23.04 23.81 24.35
`
`The heat capacity of liquid tungsten is 35.564JmOl"1 -K"1 [1.10]
`
`[1.35]. At a certain temperature, the diffusion process is characterized
`Self-diffusion
`by the diffusion coefficient D. Its temperature dependency is given by the Arrhenius
`equation D = DQQxp(-Q/R-T) with D0 a constant in crn^g"1, T the absolute
`temperature, R the molar gas constant in J - K"1 • mol"1, and Q the activation enthalpy
`in kJ-mol"1.
`Activation enthalpies for the lattice (volume) diffusion were derived between 586 and
`628 kJ « mol"1 for single crystals and between 502 and 586 kJ - mol"1 for polycrystalline
`tungsten. Accordingly, the following equations were set up [1.79]:
`
`Self-diffusion in tungsten single crystals: D = 42.8 exp(- 64Q/RT).
`Self diffusion in polycrystalline tungsten: D — 54 exp(— 504/RT).
`Over the range of 1900 to 280O0C, a linear relationship between log D and 1/7 was
`obtained for polycrystalline tungsten.
`The self-diffusion parameters D0 and Q are influenced by the impurity content of the
`diffusion zone. Higher values for both were obtained for impure tungsten. This effect is
`more pronounced at low temperatures and vanishes above 2043 K. (It is assumed that
`impurities attract vacancies and the higher vacancy concentration disturbs the diffusion
`process).
`The fact that lower Q values were obtained for polycrystalline tungsten than for single
`crystals, especially for T < 0.7rm, is due to a more or less significant contribution of grain
`boundary diffusion to the total bulk diffusion. Observed rates of volume diffusion,
`
`Nichia Exhibit 1015
`Page 5
`
`

`

`obtained on polycrystalline tungsten, will therefore always depend on the microstructure of
`the material under investigation.
`Grain boundary diffusion
`is the dominant mechanism in polycrystalline tungsten
`below 210O0C. For grain boundary diffusion, activation enthalpies between 377 and
`46OkJ- mol"1 were measured.
`
`[1.35,1.80,1.81]. At room temperature, the
`Thermal conductivity and diffusivity:
`thermal conductivity coefficient X is about 1.75 W • cm"1 • K"1. Its temperature depen-
`dence is shown in Fig. 1.19. Some typical data are given in Table 1.14. In the low-
`temperature range, it is strongly dependent on the RRR (residual resistivity ratio PO/PT)>
`which is also an indication of the purity. Table 1.15 shows the differences between samples
`of varying purity.
`Between 1200 and 280OK, A, obeys the following equation [1.8O]:
`
`2^4 199
`X(W - cm'1 - K-1) = 1.0834 - 1.052 x 10'4F + —-—
`
`At the melting point, A, drops from 0.895 (solid) to 0.705 (liquid) [1.35].
`Sintered and arc-cast tungsten specimens differ in A, values at elevated temperatures.
`The thermal conductivity of single crystals and polycrystalline tungsten, both having the
`same degree of purity, coincide at high temperature.
`There exist certified NBS standards of arc-cast as well as sintered tungsten as
`reference material for the temperature range of 4 to 300OK [1.83].
`The high thermal conductivity of tungsten (very suitable for use as heat sinks) in
`combination with the low specific heat results in high cooling rates during hot-working of
`the metal, which makes the handling during working more difficult.
`The thermal diffusivity of tungsten at 30OK is 0.662 cm2 • s"1, and decreases to
`0.246 cm2 -s"1 at the melting point. At low temperatures (<200 K) the values are strongly
`
`FIGURE 1.19. Temperature dependence of the thermal conductivity A, of well-annealed high-purity tungsten
`[1.35]; source [1.81].
`
`Nichia Exhibit 1015
`Page 6
`
`

`

`TABLE 1.14. Thermal Conductivity
`Coefficient at Different Temperatures
`[1.35,1.81]
`
`Temperature
`(K)
`
`A,
`(W-cm-1-K-1)
`
`O
`10
`50
`100
`300
`500
`1000
`2000
`3400
`
`O
`97.1
`4.28
`2.08
`1.74
`1.46
`1.18
`1.00
`0.90
`
`dependent on the impurity level and the density of lattice defects. For more information see
`elsewhere [1.82].
`
`TABLE 1.15. Thermal Conductivity Coefficient in the
`Low-Temperature Range and Dependence on the
`Residual Resistivity Ratio [1.35,1.80]
`
`X(W-Cm-1 -K-1)
`
`Temperature (K)
`
`RRR 100
`
`RRR 300
`
`1
`5
`10
`20
`50
`100
`150
`200
`300
`
`0.50
`2.49
`4.88
`7.99
`3.57
`2.17
`1.97
`1.89
`1.74
`
`1.51
`7.49
`14.04
`17.34
`3.98
`2.24
`2.01
`1.91
`1.76
`
`7.2.5. Electromagnetic Properties [1.35]
`
`Electrical Resistivity (|ifi • cm). In the low-temperature range <0.07 K the electrical
`resistivity p0 is independent of the temperature and will be only determined by the
`impurity level.
`In order to calculate p within different temperature ranges, equations have been set
`
`up:
`
`up to 4OK
`
`p = 1.5 x 1(T5 + 7 x 10'7T2 + 5.2 x 1(T10T15
`
`Nichia Exhibit 1015
`Page 7
`
`

`

`40-90 K
`
`p = 0.14407 - 1.16651 x 10~2r + 2.41437 x 10~4r2 - 3.66335 x 10'9T4
`
`90-750 K
`
`p = 1.06871+2.06884 x 10~2T + 1.27971 x 10~6r2 + 8.53101 x 10"9J3
`-5.14195 x 10'12T4
`
`300-1240K
`
`p = 4.33471 x 10~1272+ 2.19691 x HT8T7-1.64011 x 10~6
`
`1240-2570K
`
`p = 4.06012 x 10~12r2 +4.67093 x 10~8r - 1.94101 x 10~5
`
`Moreover, the resistivity is influenced by all kinds of lattice defects (vacancies,
`dislocations, grain boundaries, etc.) and impurities.
`Some selected values near and above room temperature are listed in Table 1.16. The
`resistivity of liquid tungsten close to the melting point and at 500OK was given as
`131 |iQ • cm and 160 JiQ • cm, respectively [1.84].
`The resistivity of thin films depends on microstructure, impurity content, and surface
`roughness. These properties are the consequence of deposition conditions, substrate
`temperature, and annealing. Therefore, a wide scatter of values was observed, for example,
`between 6 and 20 JiQ • cm at 3OK [1.35]. Under certain deposition conditions, metastable
`/J-W forms, which has a significantly higher bulk resistivity (approximately 10 times that
`of the thermodynamically stable a-W phase).
`
`Superconductivity [1.35]. Tungsten is a Type I superconductor with a transition
`temperature of 0.0154 ±0.0005 K. The critical magnetic field strength HC(T -» O) is
`1.15 ±0.03 Oe. (91.5A-Hi"1). Impurities only show a minor influence on the transition
`
`TABLE 1.16. Electrical Resistivity of Tungsten at
`Near-Room and at Elevated Temperature [1.35]
`
`T(K)
`
`p(nQ-cm)
`
`T(K)
`
`p(^iO • cm)
`
`273
`293
`298
`300
`
`4.82
`5.28
`5.40
`5.54
`
`400
`500
`600
`800
`1000
`1200
`1400
`
`8.05
`10.70
`13.35
`18.85
`24.75
`30.90
`37.20
`
`Nichia Exhibit 1015
`Page 8
`
`

`

`temperature:
`
`RRR 57000
`RRR 7500
`
`0.0160 K
`0.0154 K
`
`In thin films, due to structural influences or the presence of P- or y-tungsten, much
`higher critical temperatures (up to 6 K) were found.
`
`Thermoelectric effects. A temperature gradient generates in tungsten a small poten-
`tial difference (the Thomson effect). This difference, called the thermoelectric power
`S (uV/K), drops with increasing temperature. Its temperature dependence is tabulated in
`Table 1.17.
`Thermocouples. For temperature measurements up to 230O0C, thermocouples
`consisting of tungsten and tungsten-rhenium alloys are employed widely. The most
`common combinations are W versus W26Re, W5Re versus W26Re, and W3Re versus
`W25Re. Electromotive forces built up by each combination for different temperatures are
`shown in Table 1.18.
`W-Re thermocouples can only be used in neutral or reducing atmospheres. Other
`combinations, such as W/Pt, W/Ta, or W/Mo, have gained no commercial importance.
`
`[1.35]. The Hall coefficient
`Magnetoelectric effects
`between 10 and 12 x 10~n m3 • A"1 - s"1.
`The Magnetic susceptibility is given either as Xmoi (10~6 cm3 -mol"1) or as %g
`(10~6 cm3 • g"1). It increases with temperature. Values for different temperatures are given
`in Table 1.19.
`
`at room temperature varies
`
`1.2.6. Optical Properties
`
`The optical properties of tungsten have been studied in more detail than those of any
`other metal or material, because tungsten is not only used as an incandescent lamp
`filament, but also as a comparison temperature standard in specially constructed strip
`lamps.
`
`TABLE 1.17. Temperature Dependence of
`Thermoelectric Power of Tungsten [1.35]
`
`T
`(K)
`
`10
`20
`50
`80
`100
`150
`200
`250
`273
`300
`
`S
`(JiV-K)
`
`+0.05
`-0.28
`-2.78
`-3.70
`-4.04
`-2.45
`- 1.41
`-0.10
`+ 0.56
`+ 1.44
`
`TS
`(K)
`
`400
`600
`800
`1000
`1200
`1400
`1500
`1600
`1800
`
`(JiV-K)
`
`4.62
`10.75
`15.51
`18.46
`20.06
`20.63
`20.70
`20.61
`19.15
`
`Nichia Exhibit 1015
`Page 9
`
`

This document is available on Docket Alarm but you must sign up to view it.


Or .

Accessing this document will incur an additional charge of $.

After purchase, you can access this document again without charge.

Accept $ Charge
throbber

Still Working On It

This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.

Give it another minute or two to complete, and then try the refresh button.

throbber

A few More Minutes ... Still Working

It can take up to 5 minutes for us to download a document if the court servers are running slowly.

Thank you for your continued patience.

This document could not be displayed.

We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.

Your account does not support viewing this document.

You need a Paid Account to view this document. Click here to change your account type.

Your account does not support viewing this document.

Set your membership status to view this document.

With a Docket Alarm membership, you'll get a whole lot more, including:

  • Up-to-date information for this case.
  • Email alerts whenever there is an update.
  • Full text search for other cases.
  • Get email alerts whenever a new case matches your search.

Become a Member

One Moment Please

The filing “” is large (MB) and is being downloaded.

Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.

Your document is on its way!

If you do not receive the document in five minutes, contact support at support@docketalarm.com.

Sealed Document

We are unable to display this document, it may be under a court ordered seal.

If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.


Access Government Site

We are redirecting you
to a mobile optimized page.





Document Unreadable or Corrupt

Refresh this Document
Go to the Docket

We are unable to display this document.

Refresh this Document
Go to the Docket