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`LIQUID CRYSTAL
`FLAT PANEL
`DISPLAYS /
`
`MANUFACTURING
`SCIENCE &
`TECHNOLOGY
`
`WILLIAM C. O’ MARA
`
`[aR VAN NOSTRAND REINHOLD
`
`lew York
`
`—soBANSHEetHy
`|
`" DOCUMENT Sureu¥ CENTRE
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`~7 FED isda
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`QA |oro As
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`Copyright © 1993 by Van Nostrand Reinhold
`
`Library of Congress Catalog Card Number 92-43119
`ISBN 0-442-01428-7
`
`All rights reserved. No part ofthis work covered by the copyright
`hereon may be reproduced or used in any form or by any means—
`graphic,electronic, or mechanical, including photocopying, record-
`ing, taping, or information storage and retrieval systems—without
`the written permission ofthe publisher.
`1@)P Van Nostrand Reinholdis a division ofInternational
`Thomson Publishing. ITP logo is a trademark underlicense.
`
`Printed in the United States of America
`
`Van Nostrand Reinhold
`115 Fifth Avenue
`New York, NY 10003
`
`International Thomson Publishing
`Berkshire House
`168-173 High Holborn
`London WC1V 7AA,England
`
`Thomas Nelson Australia
`102 DoddsStreet
`South Melbourne 3205
`Victoria, Australia
`
`Nelson Canada
`1120 Birchmount Road
`Scarborough, Ontario
`MI1K 5G4, Canada
`
`16 15
`
`14 1312 1110987654321
`
`Library of Congress Cataloging in Publication Data
`O'Mara, William C.
`Liquid crystal flat panel displays: manufacturing sciece &
`technology / William C. O'Mara.
`p.
`cm.
`‘Includes index
`ISBN 0-442-01428-7
`1. Liquid crystal display. I. Title
`TK7872.L56046 1993
`621.38—dc20
`
`:
`
`92-43119
`cIP
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`LIQUID CRYSTAL FLAT PANEL DISPLAY
`
`
`Table of Contents
`
`LARGE AREA LIQUID CRYSTAL DISPLAYS.....ccccssssssssseresscssrsnseeneees 1
`1.1 Computer Displays ........sessceseserenereensensnensenensnsensecssenansenssnsensensnanansessessoers3
`1.1.1 Desktop Computer.............:csssseeesessrenseeessneseesescnsseecansesetenssnenennennenans 3
`1.1.2 Portable Computer...........-:cccscerereseseeeeeeeeessenesentseneesesenenessrensesassaeeneeens a
`1.1.3 Engineering Workstations........:..iccsseceseseretsessessenssesnesseseeneneseeaneeneees 7
`1.1.4 Computer Display Summary ...........eccceseeseesetsensesesseeestesteeseneeetees aeons 7
`1.2 Television Displays..........cccsssscensessesenssessersessersessersersessennenscensssnsarseneaseesons 9
`1.2.1 Portable TVS........:c.s:cesscssecscsssceessssccssecesneecseseeeessssceserseneesessesoarssneeresoess 9
`1.2.2 Projection Displays .........:::::sssssseeetseeeecesnseensceenseseecsensnesseneseseenaneaeees 10
`1.2.3 High Definition TV ..........csccecsseeseeeseesesensneeeecssnsneseesnsnsesereeneneeaseaaaes 11
`1.2.4 Video Camera Viewfinder...............sccsssessceeesssecessseennreestecsesecscoenens 11
`1.3 Automotive Applications.........sscssesssseesrscsserssresesecensseeseessonsesensessassaes 11
`1.4 Other Applications..........scscsccsssssessssesseenersnsssecssreesesensennseneesenessengseneaoens 12
`1.5 Liquid Crystal Display Technology...........sssessssssenrensererssssorsesensererenss 13
`1.5.1 Types of Liquid Crystal Display ........-..:csscsessseessessssenenetersenenenenenes 16
`1.5.2 Passive vs Active Addressing ............:ccseceeeeseeeeseeeseeeceseeeeaeeenneensneeees 21
`1.5.3 Workstation B/W Display ..........-.:scccssccsssceerseseeesseeerecensseenseessneaneeees 23
`1.5.4 Polymer Dispersed Display.........:.:s-ssssssessessesessssescsesseneevessescenssnees D4
`1.5.5 Automotive Display .......:..scsscccessessssersecrseseerenteeesneeenesenneesnneseeenenen sees 26
`1.6 Active Matrix Devices ........csosecscvscsssrecesersersessrssssssnessesenenersacensensnseeees 27
`1.6.1 Two Terminal Devices...........::c:sceeeeeeeest sscgsaassaane gap eaedaatbassesWyeMSsEaeNs 28
`1.6.2 AmorphousSilicon Transistors.........::ccsssecesseseeeeseeeseeneseceeetereeeseseseeee OL
`1.6.3 Polysilicon Transistors ..........sssssescesssensensencssseseeecsarensesnenesenseseseenen sens 35
`1.6.4 Comparison of Device Performance...........scseereeccectessereesesesneceeeee 39
`1.6.5 Ferroelectric Polymer...........-..scscsccsssccesssesessserserssnssersccssensesenseeeseasens 43
`1.6.6 Printed TransistorS...........--:0++. icbiieuuibed SHAMAAUCUEESSUdasDanscerubsoubsaenncnscwerdine 45
`1.7 Display Manufacturer........ssssssesesessececssseseeenencncnrsssesenesenensasnsnenensncees 47
`1.7.1 Japan ......cescsscscsssessssssecessscsesececseenessesseseesscesessanenscscseasenensnanasacseensnennees 47
`Current Suppliers ..........ccscessesecssenseesesceeeseaeseeasestessenensanensassseanensnnsnesesnen 48
`1.7.2 USAWececsecsssesccssecsneecesesseneneenesensensanencessnsnesaseneneanenssnencenenenennearenseneagens 48
`NELOK ..-cervorerereeerersnenacosshiasetiessesstessuaite dubstavseesvasd syiensiessesvensiecesinaasnnscaaees 48
`Department of Defense TNitiatives oo... cccsesesseceecceseeseeeeeseeecescereececserereeeee48
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`TABLE OF CONTENTS
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`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`BIRME ssssssecesss sazsasecececea suisercsseesyecoastaearenasnonazevennervaneneaxewernoccsoxicisuaeveswecivesss 48
`Advanced Display Manufacturers .............ccccccecesssssssecceeseseesesesesseseesseecees 50
`OUNCTS 20... eeecccceseseseseenesesesasceencsscessceecsccsesssecscnarasesacsacascececssseeeeeeeskeees 51
`DFS REGU OE WWUU isescc cccssucnissuederarenconnenrnreeenesavsreenenierensnestapsovcsabstupres SI
`FMS sascanssnsvencscszssunsceiissesecens vis pesusuaneutetsscaycstesscetisasi26; beseeeresnenerereceseroeencers 51
`BRQLCR nessnresonsensasvasvinvasenusnss cnenoeseasanivussvaiisatou tossed tits dove Neeesiceses ores cen 53
`Other Asian Firms oc eeceeeesesesessseceecseseecsescscscececssavscscsessnsestaseeasssseseeees 53
`GLCPOTCOS assacscscasccccaccsasescsessncnssicccssavccstesiuoeesaszidicitossosaererenesnseseanaresnensanenntsvors 54
`
`FIGURES
`1-1 Portable and laptop computer............::ccsesssesescsesesesescasssseseseecscesessececscevers 3
`1-2 Active matrix liquid crystal display screen size in recent years.......0.........5
`1-3 Pixel count versus display diagonalsize for flat panels ..
`iegacenrerensoneesec
`1-4 No.of pixels & display diagonal for high information contentat displays...ot
`1-5 Basic liquid crystal polymer molecule ...........c.cccscscssecsssescesccceceesecseceeceees 14
`1-6 Principle of operation of a twisted nematic liquid crystal display.............15
`1-7 Transmission versus voltage curves for TN and STN materials............... 18
`1-8 Schematic representation of passive and active matrix color LCD’s,......22
`1-9 Polymerdispersed liquid crystal projection TV system ...........::c.ss00000002..24
`1-10 Structure of the dispersed liquid crystal droplets ...............ececececesseeeseeeee 25
`1-11 Projection display using polysilicon thin film transistors ..........0........... 28
`1-12 Amorphoussilicon PIN diode ..........c..ccccccsscssssessesseceeseecesecesesscssesscesseecese 29
`1-13 MIM diode structure ..0....cececcccsssesesecescssesesescececscssceassceeracsarassecsavscaveees 30
`1-14 Double pixel design for MIM diode. o......cccccccccescceseesssesesececessssecesceceseces 30
`1-15 Cross-section view of three TFT configurations .0.0...........cccessececsececeeecee 32
`1-16 Aluminum gate a-Si TFT .u........ccceccccsssssccscsecesessssesscesesssesssessesesseeseeevees 33
`1-17 Light leakage in TFT structure 20.........0.ccccccceccscececssverescecsseceetscaceacseensees 33
`1-18 Plan view of TFT structure with light shield. 20.0... c.ccccccsececcscecseeseeeceeees 33
`1-19 Hitachi TFT array equivalentcircuit................. sacs e a saeeeeeneaenens 34
`1-20 Relative cost of silicon TFT processes ..........c:cccssessscedececcececceceseeeeeveceees 42
`1-21 Data rate of driver circuits for complex TFT displays.........0:c:0c0ses0s00000- 43
`1-22 Construction of ferroelectric matrix active deViCe ........eeccceccecceceecseceeeeee 44
`1-23 LCD panelstructure with ferroelectric matrix device .......c.cccesecceceeceseee. 44
`1-24 Comparison of photolithography andprinting for imaging on FPD’s....46
`1-25 Photoresist application by offset printing .........0..cccccessesececesseccseeeeeesees 46
`1-26 Polysilicon transistors madebyoffset printing and photolithography...47
`
`TABLES
`1-1 Classification of Portable Computers .0.........ccccsssssesesecesecesesecececscsecessseseeeees 4
`1-2 Japanese Large Flat Panel DisplayS..........::sssccssesesesesssesessescececesesecseseesseeees 8
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`10
`
`1-3 Japanese LCD TV and VCR Display.......----ssssersesessseststereseeeetsetersnenensnes
`wh
`1-4 Calculation of S for various values Of Nmax..........::::-eseeeeeeseeeeeeeeeeeeeees
`19
`1-5 Requirements for Vertical TN LCD Display........----.::ssseseseeeeeererereereees
`..-20
`1-6 Types of Liquid Crystal Displays...
`1-7 Processing and Relative Costof ActiveandPassiveDisplays iiscessasitaws
`31
`exeoon dl
`1-8 TFT Array Process and Specifications..
`woo
`1-9 Resistivity of Metals..
`é
`Serene ene Renee Tee TT?
`1-10 Comparisonofa-Si andpoly-SiTFTs.ecnemnnnansasnegadasinnceveunaeies
`sccdauasiacwsatevs 37
`sctcasaasesiwavene 38
`1-11 Polysilicon Fabrication Methods and TFT Properties..........
`1-12 Comparison of TFT, PIN Diode, and MIM Diode es
`Seren ener 40
`41
`1-13 CMOSpoly-Si TFT and a-Si:H TFT Comparison..
`wasuunecaesoucene 42
`1-14 AMLCDDrive Circuit Types............:cccecesersecsneetertesesesneeeees
`45
`1-15 Characteristics of Ferroelectric Liquid Crystal Display ....................:+++
`een erer: 49
`1-16 Liquid Crystal Display Status in Japan .........sssceseeeeeeeereees
`edaagtacastes ious 50
`1-17 Advanced Display Manufacturers Association Members...
`1
`1-18 US Liquid Crystal Displayae
`aren De
`1-19 European LCD Activity ...
`1-20 Liquid Crystal Display StatusiinKorea.
`seve D3
`siussgupesseesssse 53
`1-21 LCD Manufacturing in ASia .........:.cceseeeseeessereeereeseeeseeteneees
`
`CHAPTER TWO
`
`DISPLAY MANUFACTURING PROCESS....cccssssssseseesseeseeneeneeesseenseneens 57
`2.1 Color Filter Manufacturing........ccsssssssssssessscscsssrsssessreserersssseessssseseseraes 58
`2.1.1 Glass Substrate PHRTOmenenerennnenrnin
`Glass Fabrication..
`seuntesnarnzesenuesnenarasrsiidisioi velo eee LENDS
`Cutting, Beveling, Polishing.catenesisaactcaeraeuenaucuNWlaatubuaduuedssssubnacnanest 59
`Annéaling........-SetecuoaicaldavuaseveddaTITUSSEERbtwRbmabmnearenantinentmnmcannEneneneneed 61
`Clearing .........scssssecssseceesssceesseceeesssecessssensnsensensenencsseseenecenseacsnonnentsnascnesiee 63
`ITO Deposition ..........scsscccesesseesseesessceseceseseesestenssnenesserenessensneneacecensnerssses 66
`2.1.2 ColorFilter Process........-.-:csssssccsscccssssssceecesssnresenenegseneanerssecscssssnceeees 70
`Black: Matrix DeGnitiOn sis sseccmacupexscessceqevserenuscenraccacesncescacanosonowsnnevensnnate db
`Dye Method..........sessssesssreesesesesneenssnencenssesesncsssnsnesnsnensncenenanseananensnensersases 71
`Pigment Method ..........c.sccceseseceseseseseeecssssrensesesecessenenenenenssneserenensssesrenes tes 71
`Blectrodeposition........ssscssescssecssessssssnssssnecenecssnecsnsesssecencesseessessnsesssssecnsees 12
`beseeeeeees=k73
`Overcoating ...
`vag si vasUeRcreulncL He eae DEORE doveNGemCeeee neE”
`ITO Desosition.eeteeeateroerfeces
`2.2 Active Matrix Display Manufacturing.........sessesserseeerenes
`
`seems eosegonaes 73
`sieeagianeseviens 74
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`TABLE OF CONTENTS
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`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`2.2.1 Thin Film Transistor Manufacturing..0............0.cccsesesceceseeeeenseeseeeeeeees 74
`PlasmaVD Se SPUN siccssssancanccuas ssvascesonsaueravcsnervenccuvaraasssczsavensmne 75
`Photolithography «2.0.2.0...cccseseseseceeseeeeseceeceeseseeeneceeeeseseceseeseeneeteeeeeenes 77
`Etching oo... eeeteeeceeeeececeesencceeesseseeeeescetesseceessseecetscnaseceeeesensrssacencnenees 78
`TLAnsiStOr PROCESSES seccssecscssscssaviesuseerssvautaseanestaaissseenbaussteesiesierecemsaeeuin 79
`DZD:2 AR. PROCESS VOSHNG iscciscevssssvusceseseccesssausvensseacenersveevnersecscastaenesscinsesssenee OF
`Optical IMSPCCtiON ............::ccscceeeceseesseeesereceetenceneeneceeeeeeeeeeeeneesenreensceneenes 84
`BICCIICAL INSPOCRON os sescseecseusisssnsereeicisceseeiialencaaseueaseiceseaureneteeseaIS 85
`Punctional InspectiOn -.cciscccrsvessvccssszssecsscssavenssnnen vvcensssnsennscveusascouassnetests 85
`2.2.3 Defect Repair............sceecseeeeceeeeeesae uanmnnnunanesity cage aarolounsaenadaaennernnsecret 85
`23 Display ASSeMALY issiconscintacicaescacsssscsenciucstsncminsaaaacicessitetanasd ouassuatinecsiaess 86
`2.3.1 Orientation Film Deposition and Rubbing..............eceeeeeeeeseeseeneeeeee OO
`Di die SCRL, PONG so icastesccsueneececastawes teaneevanononesumavenacorensituavevaaevecuanarvesncsaee 87
`2.3.3 Spacer Placement and Sealing...........--ccrecorconsccsesserssesenssanersetennrennes 90
`2.3.4 Liquid Crystal Injection 2... ee eeceeecceeeeeeeeceeeneeeeeeecesseeeeceseeeeeeeeneees 90
`2:39 INSPECHON ANG: TESis siciacersrsivesevacerensstencecaiayountinudsiaaieiraatyesestees 91
`2D POZE BUACN vancccsnecxaseesrnencensssceennvastronenrsveaiavnvessansncnunennemensesaonesienst 91
`2.3.7 Die Attach 200... ceescssscecescceseseessessecceessaessssensessteeseeseneeseeacersneeeaaeseess 94
`Pde, POOLENE oe ssaes sass sasvesnsscasscaucocsnciesecnsesaeesganssep nese saa aaa ass aah ees 97
`2.4 DISPLAY MANUFACTURING.........ccsccssscssssssecssesessercssseesssessseeesseees 98
`2:4... STN Display Mannfactawtng sii.cisessncsevesonsossscesvssssusssnseessuensnssssonsvseasives 98
`2.4.2 Color Filter Manufacturing ......... cc cescseseecescestecssensessesssteseeneeneeeees 100
`2.4.3 Equipmentfor Color Filter Manufacturing ............-ee:ceeeeeeeeeeeeeeeeees 101
`2.5 AMLCD BPactory ssssssscsssssssssassssscievercsvscsssecsvecscssevastencesseseciastassesesesvcessess 101
`2.5.1. PRrouphput and: PrOduCHLYy cscesaccsvecssconerssesnaavscnanacrsesnsaeren LOL
`2.5.2 Manufacturing Cost and Yield occ ceceeeseeseeeceessrseeeeseeseesanaeeeenes 103
`Yield VS ASP ccscnnnsnncasens: ps suena caassvenasscaausitcmssnasaetiedemsaesaincanente 103
`Manufacturing Cost Model essisscsssciessnesecessesrsssvisonssevsessvonssassetseusseessess LOS
`Manufacturing Yield Model............:cccccccscecesssesecscessseecescesessessraceeeeceees 106
`AMLCD Factory .........:cccseeeceeessesceecssecateceseseassccnaseneeseseseesensesasessereseeness 108
`
`FIGURES
`2-1 Schematic outline of the display manufacturing process...........:cseeeeee 7
`2-2 Fusion process for glass sheet formation ...............ccccsccseccceeseceeeeeceseceeeeees 58
`2-3 Thermal expansion of Corning 7059 glass .0.........ccccceceseseceeeseeesrenceesenennes 62
`2-4 Thermal shrinkage of NA 35 glass: heat treatment time & temperature .62
`2-5 Cleaning methods evaluated by contact angle measurement.............-.+++- 66
`2-6 Sputtering voltage, deposition temperature, and ITO film resistivity ...... 69
`2-7 Plasma-assisted electron beam evaporation equipment............. eee 70
`2-8 Color Piltet POMGHON esis cs ccesiicnsttepecessiacsencenscacanteacsinmasimpseneiieensaneess 72
`
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`TABLE OF CONTENTS
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`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`2-0 AAIVE! DEVICE PORATION cicisceccss sacacssasessncsesemurenivasennenanorecnemacasnennienentens 76
`2-10 Photoresist adhesion by side etch for various precoating processes.......78
`2-11 Cross-section view of three TFT configurations............:.:scccccseeseseeeene 1D
`2-12 Assembly, Packaging & Test sccssecssssssinssssectcconcstsnsesccassencisasesasavactananes 88
`2-13 Automated flat patiel assembly Wie ecsccssccseccssseons. sssocecscoxonnovonsnsensnnsorsesnen 89
`2-14 Variations in external pressure & spacer size lead to cell gap variations....91
`2-15 Active matrix liquid crystal display cross SCCtiON.........:.s::eeeeeeeeeeeee ee 93
`2-16 Packaging configurationsin flat panel displayS.............:ssceseeseeeeeeeeeees 94
`2-17 Numberandpitch of leads forflat panel displayS. ............::c:cesccesseseeeees 95
`2-18 Connection of TAB tape to flat panel leads w/ anisotropic conductivepaste. .96
`2-19 Schematic of backlight arrangementwith lightpipe.................eeee 97
`2-20 Factory layout for passive matrix LCD manufacturing......................-.-98
`2-21 Simulated yield curves: defect densities in TFT manufacturing.......... 104
`2-22 Cost components offlat panel display production. .............:sseseereeereees 106
`2-23 NEC two story AMLCDfabrication facility layout .......0.....eeseeseereees 109
`
`TABLES
`2-1 Glass Substrates for Flat Panel Display Manufacturing ............20:--sesee0 60
`2-2 Glass Substrate Specification for Active Matrix Display...............:::s00 63
`2-3 Proposed Substrate Standard Sizes for Flat Panel Displays.............:0+464
`2-4 Cleaning Processes for Plat Panel Displays ..<.--ce-rescrsensserserenrnereareveneens 65
`2-5 DI Water Quality and Substrate Particle Count«2.0.2.0... ccececceeeeceeeeeeeeeeees 66
`2-6 Types of Color Filters for LCDS sissscssasavsssensnssissvennevasieecoornsinetnaasesesuacezece 71
`2-7 Color Filter Process COMparisOd csscsscccrcccscisscssacscsossasenessrsacssvieresecexeencins 74
`2-8 Process Flow Chart for Inverted-Staggered Back Channel Etched TFT ..80
`2-9 Inverted-Staggered Trilayered TFT Process............::ccccscseseeseeseeeseeeeeeeeees 81
`2-10 Process Flow for Normal Staggered TET sisccscsccscisccssccssssscssnessecasessesevee 82
`2-11 TFT Array Process and Specifications......:cicssreccsssresassccerserssorseassessors 83
`2-12 Defects in LCD TFT Array Manufacturing...
`ceteeeeeeseneeee
`...84
`2-13 Causes of Defects in Assembled Flat Panel Displays.sandomearasseueepencesicaes92
`2-14 Clean room Conditions for STN ProcessLine..
`sseseriwsieatieets
`..99
`2-15 Production Lines for Large Liquid Crystal Displaysin Jatapan.. =.99
`
`sesaseeeeaceateatererereaseee LOZ
`2-16 AMLCD EquipmentProductivity and Price...
`2-17 AMLCDProduction Equipment Categories ............ceeeeseeeeeeeeeeseeee LOZ
`2-18 In-Process Inspection and Repair EquipmentList...............0c cece eee LOB
`2-19 Assembly and Die Attach Equipment.............ssecscsssesssrsscsseesssressesenee LOF
`2-20 TFT Array Yield Summary (No Repair) ..........:0secsscsrssseassersesseeeenrses 107
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`TABLE OF CONTENTS
`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`CHAPTER THREE
`
`MATERIALSFOR FLAT PANELDISPLAYS.....ccsccsssssesneesetssesseceeneee 113
`3.1 Glass Substrates.........ssscccscercccsscsssesesssccensssscencceseseseasenasensessenesesnscoess 113
`3.2 ITO Sputtering .............ccsssssesessersesresscercssenarsessscessnascesssssessesssssossoeses 114
`3.2. LITO Powder and Thin Pile ProperGes sccscasscsisseccarncssscoueccccaassenes 116
`3.3 Other Sputtering Materials...........c.scsccssesssesssserscesnsseoeessresessessssssnees 117
`3.4 Color Filters .......sccccssccccsssceesecssscscccccoscssessccsesasssnscscssaccescsesosssrossnscosooes 118
`SA] Dye Method .....--scensssiacsasocessceassscsssncenateeessensecsentevevansnesdoudcabdsteseeeressss 119
`3.4.2 Pigment Dispersion sj ccisissscrsscscccsvecsnscsiccsesasorseessensresanscosecsseresvecceceeses 121
`5A. Electrodeposition «..1<..erenenesenressononasesnnessenanenensasenseneuntenranaenesseocepecens 124
`FAA Electromist .....-c-cnercereronenseersnsnsssnhaensdedousandasuescacduneisossecescassseieventeaveite 125
`3AS QVELCOAL. co ccccciscectscctiesacscstscacicussaseanseesveesessei vere eennct annwentasnanaveressels 126
`3.4.6 Two Color Approach ..0.:...cccsccccsassesssesrsvsevesanevenseernanncesnsanenssvonssnns 126
`3.5 Process Chemicals & Gases........-ccscccsssssssccssecccsrsccnsessssssecesesecesesscneoes 126
`3.6 PROtOresists ........cccorcsserssssssssssssssccesconcccecccccsassocossosurssencnsseussteseeusessesesoess 129
`3.7 PRGtGIIASKS sicsssisscsccniccncnianacmamnnincncsmsmnesinimsneninvess 129
`3.8 Orientation Films .........scsccssccsscscscesessessssesesceveseneessesssesssssssssssssssseneceoees 130
`3.8.1 Polyimide Orientation Films .........cscssecssesrssrsoseneeasensessenersnscsnenees 131
`3.9 SPacer .....ccesccccccssesccersersnssccserencsessessnssecsesssessssssssossesscseesorssesseesjedeesuasnanual 135
`3.10 Sealing Materials..........ccsssssesssssssrsessenssesesssesserensssaresssessesseseeasarseessees 137
`3.11 Liquid Crystals .........ssccssssscscssesessceseessssessnsessscserssscssssssscsnssessonsossaees 138 °
`3.11.1 Other Liquid Crystal Materials ........cscsessecerroesescenensnrsesenaeseresesse 142
`3.11.2 Polymer Dispersed Display..............:ssssscsececssssserersssssessereceserseese LAA
`3.11.3 Polymer Network DisplayS ...........::sssssscsssssessssssssresesesssasnessseeeeseee L4G
`3.12 Polarizers/Compensation Films ........ssscscerssseseeessesrseseassecsocasersereeres 146
`3.13 Die Attach/Connector Materials..........cscccsscssscesrersnrssssssssssesesssesscsens 149
`3.14 Display Backlighting ...........:cescccsecssssseseeseceenesscsnrseseesareessnseeenesseneees 152
`Reference ciccssiscssssessccosssescesesessessscscessscsosucescoetsecsacsonsseessvsnscesssenssesssensenssensss 157
`
`FIGURES
`3-1 CIE Chromaticity Diagram forcolorfilters.. Asbaseimee REL
`3-2 Resistance to fading of dyed and printed colorfilters
`setesjenrccusicec kod
`3-3 Comparison of spin-coated andprintedfilter element
`«.inaneswenovarsmensdescesners 122
`
`3-4 Transmittance of green pigment material / function of particle size .....123
`3-5 Schematic of electrodeposition process for colorfilters ............:12+000+ 125
`3-6 Synthesis and structure ofaliphatic soluble polyimide................:s:se00+ 132
`3-7 Glass fibérspacet Size GiStIDMOOR: sccsscascsscsncissisiinsssvccevnernissiin Lod
`SB Ty pial lig Crystal iiss asssensasacewsssaccctsssnasenercaseoinsuamirasermenmarencnsrneninar kee
`
`viii
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`LOWES 1017, Page 11
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`TABLE OF CONTENTS
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`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`3-9 Nematic phase ............csceescccseesseececceeseensecenereeseceneeeesstseeseeeees paasasacaensscese 139
`3-10 Cholesteric PHASE «....sssas-cssasssnisaunssevancisrontceasmenareeeyicin eneawesiaes 139
`3-11 SMECHO PHASC csccccccccececcreersseces arescypsesretammntans iconsarnaseiacnareanenesiaes 139
`3-12 Structure & properties of difluorobenzene derivatives...............:+.-+-- 143
`3-13 Trans-4-n-pentylcyclohexyl (PCH-5) derivatives. .........::ccssssseeneeeeees 143
`3-14 Structure of polarizer film fOr LCD ciccsssccccsvseseissersaveserssccncseseossssscoesecnss 147
`3-15 Polarizer PUD SWUCUIUES sccvcscsseccccccsscsssnsseccsepesunicessensesveneenonaninnonceveiannes 147
`3-16 Transmittance vs polarization efficienCy ...........cescseesereereeereneseneeneenees 148
`3-17 Heatseal CONNECOL CONSIFUCTION.
`..cseisccesecseseadsosisscssnasesssnssonseatisbacecssnuts 151
`3-18 Usage tatid Of FAB ICS os. cssscciscsssssssssvasvassacvavisnsssncevscsscasvesseasonsuasesanses 151
`3-19 IC bonding methodsin chip on glass packaging ..........:.:cesssseeeeeeeeeees 153
`3-20 Construction of WedgeLightTM backlight .............::::cceessesseeseeeeeeeeteees 154
`3-21 Spatial brightness uniformity of Wedgelight TM ............. cece 155
`3-22 Flat fluorescent lamp StruClMTre. scscsscccscvsccsscccnesecssasscenssnsessisansnesscevoorenss 156
`
`TABLES
`3-1 LCD Glass Supplier Matrix in Japain ...css..cccccssssscasiessesesecssoncsssssosnssesenese 114
`3-2. TTO File Propane sscscsstsisciscssocsssssonsacsssnicnesssvescensecasvnnvievensveaneateasencenenns 115
`3-3 Characteristics Of LTO Targets cccsnveroseencnsanesenvernnsenceesserarermrnssnmacannnnseens 115
`3-4 Glass Substrates for Liquid Crystal DisplayS...........:ccsscsssssceseeseseeneeeees 117
`3-5 Specifications for High Density ITO Target..............:csscscsecsecesseereceeeeese 118
`3-6 Properties Of COlOt FAMetss sissssissesccsiasacccsisosrecasvesssstvoreavesansavesmanninesesrsans 119
`3-7 Tést Conditions for Color Piers sccscsscncseareccnsssensorovensornconsnenesnacenatennaenees 119
`3-8 Alternative Methods of Color Filter Formation..............:sccssseeeeeceereeees 123
`3-9 Solubility of Cleaning Chemicals q..2....:sccccsesecescsnsissavasnssecssseconsovesesusvs 127
`3-10 Particles ti Hlectronic Chemical ni csssescccsccscsasaxcoscesssnnsovercevevaesenssxennsars 127
`S011. DT Watt Quaty cvicessccessscnstxnonznsesensncusseernensreneanenscusanennnporannranenenoenenennss 128
`3-12 Measurementof Cleaning Efficiency ............:ccsssssseseenseerereeeneeersesseees 128
`3-13 Alignment Film Material Requirements ............:.sccsesecssesseseseeseeneeeswus bod
`3-14 Comparison of Polyimides for Orientation Film Applications.............. 134
`$215 Plastic: Spacer Size: VariateOe oa scsiccicesnsosscerersnsesrcnessanesurennasannanesnemmonnenee 136
`3-16 Plastic Spacer Thermal Expansion Coefficient.............s:cecscseeeeseeeneeees 137
`3-17 Parameters Specified in Liquid Crystal Formulations..............:::++- 140
`3-18 Relation Between UV Exposure and Turn On Voltage............::eseeeeeee 145
`3-19 Polarizing Film Sucress csccenccscscssssusssvesscoseassencanssceneotecsenenensanssnnensors 148
`3-20. STN Display Cost. .....-i-s-cseceneseeserscorsscesnsenereacesencensssasanasasiaansensvaseseasseas 155
`3-21 Comparison of Backlight Technologies.............ccscccserecsscesersssesscessonees 156
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`TCL 1017, Page 12
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`LOWES 1017, Page 12
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`TABLE OF CONTENTS
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`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`CHAPTER FOUR
`
`MANUFACTURING EQUIPMENT........cccccsersceserssrsnrersssescesersereeceseesereess 159
`4.1 Substrate Cleaning cccsccsssssscssssesessecsssescssssccesscesvecssoorsescisesacceseessavssesesesses 159
`4.2 Photoresist Application/Baking..........cc.csccscessscssesscessessccssersnerssescenses 160
`4.2.1 Spin Coating ......ccecececeseeseesseeeeseceeceneeeeeeceeceseeeceeeeeseersesteseseessseereseeee LOO
`4.2.2 Roll Coane scnscauseierensceenserueeuniuninatenimmanaelOU
`4.2.3 CONCEYOF OVENS sisvcsiccccseccansterconmssvanenssnaveteonensenasesnasssncacevsnersrsirenteors 160
`4.3 Photolithography.....es.coscossecesccsscorecccrarsencsevesescovensversvonastesncvsuesssenenosvaseos 160
`AS 1) SICDPETS -.nexcerroenssnadincannonsusisinussiscuonneyies wlsscamve ie laes aca banana renauianeNs 161
`43:2 Mirror ProjeCOt a soisiccsusccisermmnrnrarsecnsesicccecissasueveou LOL
`4A Etchinie/Stripping xsoscccccrccessonssesnccrsnvenonsscesssersonssevnanvenssvennucnnnvuesserseseaneses 164
`44,1 Wet Etch Equipment ....xccsisavcsessioesseaassianicsecscasmicenmainscccscauses LO4
`449 Plasinag Etching)AShing: cciscssocsiccsssnsiscusscsscssromniscarcesivstovececaond OF
`4.5 Thin Filins DEPOSITION ...sccccsrccoeressesenscovenssssrensenconsenssevssesensssenevonsessenrseoens 165
`4.5.1 Sputtering...
`sevaseaseeseceneeaaesneeseessessersesseeseesserereeseeses LOS
`4.5.2 Chemical VaporDeposition...
`seisbjuasouisnastabaiacdesiniewseeivenenscscecenece LOT
`453 PIRSA EVD vec csccicsernnenrncncucnenanencrenenenwamsnanunecronareanteoienesanetoasnncees 170
`4.5.4 LPCVD and APCVD........:ssssssssecsersecrsssesesscnscceesensesnesseensneecstecneeenes 173
`4:55 Thera! PIOcessite ssisscucrausemcainaneumavanesnneascces ET
`4.5.6 Jon Iniplant/Doping ‘sscsssscsscvcscccssnncssessssasssacnscssnavecssssentssvesssovenvaesnevs 175
`Phased Linear Scanner.............:.ecseeeesessceseesseeceseesseseesaesseneesesescesreeesaee L76
`TO FlGX DOPINE sccensssisnicicsncsniniaenenrnasivnsmaransceneine TT
`4.6 TeSt Quiet .xsescnccvssncvsoseonessonnenevasneosvesennssuesssenestechnevtenssiecsnnesanteanensy 179
`4.6.1 Visual and Functional Test ............:.ccccccescesceeeeeceseeeceeeeeneeeeeeeeeeeeeeeeeee LTO
`4.6.2 Optical WaPing so. ccccscccecscsnesesssccasseeusnssseessrestsn chauneteataseascerisueescseussvs 180
`Optical Image Processing EquipMent ......c.c.scicssossnrrsearevecsserseseneceorsrcone LOe
`Digital Image Processing Equipment ..............eseceeceeesseesteceensreeeeeeeeseees 184
`4.6.3 Electrical Evaluation ccsscsccssscsessecascssssuscssossasscsaersssdeccacicessitesvevecsncsays 184
`DeanFee AraTOGi acccietccscennsnsasccnssnocanninciwenise ccernuenmmncsesasaanconnenrepr lO
`IBM Test Set ........ccccceeceesescesceeseceseseeeeeatenceeececeseeeeeeseasenscsetesssseeseceeseeees LO6
`AGA 'VGltaSe IMAGis secsccccccssccccssccosicesesk oc Recceienei pastes manesd aceasta saaesinis LOD
`ALT TED RODalh csscsesinscsrissssssessissccasecsesssseceunasasannanannssusnaccnasnessecsvanaansavereeanors 189
`4.7.1 Laser Cutting ........ccecccceeeseeneeceneeeceeseeesenseeesecaeereeeceasenseceenereenseeseseees 190
`4.7.2 Laser-Assisied Deposition sicscsisscsssscscscsacsiinesssasseasssosstcsssenassvessisenseve 191
`4.S ASSOMDNY sccensseccssseosissvassovcsssesossenisesveasensevaneniasaccssesaseacsssisursesveeseeneasvensent 192
`ASL Polymer Prawn ssccecscscascecsaconsercsapanecesareccasexecensansescnancaseanseanennsacaeses 192
`4.8.2 Assembly/Fimal Test ..........::csssccessecessneceseeeesereeensecersceseeneecesseneeeceeness 194
`4,83 DiciPCB AUCH sicssssisssscessivasovsisoscosensivesenicavsciassonnmencisniaesnnsetscveeses 198
`ROLEPCNCES ssicscccancessasssnscessersssssosesesssciesssiviessseveisreeeiebevetiascrunnuenaececrenseiss 199
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`TCL 1017, Page 13
`LOWES 1017, Page 13
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`VIZIO Ex. 1017 Page 0013
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`LOWES 1017, Page 13
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`VIZIO Ex. 1017 Page 0013
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`TABLE OF CONTENTS
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`LIQUID CRYSTAL FLAT PANEL DISPLAYS
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`FIGURES
`4-1 Mirror projection schematic diagram ...........c.::cssseesseeseeeeeeeeeeseeeceneeeeeenees 163
`4-2 Example of PECVDsystem forthin film deposition.............:::0::0+ 170
`4-3 Deposition chamber cutaway SChEMatic ........c:eseececereeeeeeeeeeesetseteeeates 171
`4-4 Cross section of PEVD €lectrods .....:csisssvsssoessssscosasiscssissesssasasesviscassonsss 171
`4-5 Plan view of phased linear scanner showing two substrates................++. 177
`4-6 Cross-section view of linear scanner end station............:ceccseeceeeseseseeeee LTT
`4-7 Ion bucket source and deposition chamber schematic ............:ccseeceeeeeees 179
`4-8 Optical pattern filtering for defect imaging...............:s:cseeeneeeenereeeees 182
`4-9 Transfer admittance (Sting «.ccsécccsscsesccessieciessesesenesssavssesiestivsveverseasnenseans 186
`4-10 Schematic diagram of voltage imaging of a TFT array.............-:0::+0++ 189
`4-11 Laser connect and disconnect alternatives..........::c:ccceeseeeeeeceeeeeeeeeeneeees 190
`4-12 Laser connect and disconnectusing polysiliCOM...........ccc:ccsscceeteeeeeeeees 190
`4-13 Polymerprinting Schematic .............scssssescnresscessoessarcosesnenscsssesssseneenes 193
`
`TABLES
`4-1 Canon MPA-2000 Specifications ..........:ccsscceeeesseesseeeteceeeeetseeceeneeeeeennes 163
`4-2 Nextral NE550 RIE System Specifications ..........:c:csccceseeesseeeeeeseeneeees 165
`4-3 Dry Etch Systems ............cc.sccssscessessonssesenasssssssosscsnccoesonsrsnsconsssnesenssscscuse 166
`4-4 Ulvac SDT-VTIn-line Sputtering Systems«=
`sessacececteeesetesseeeneeeeeses LOT
`4-5 CVD Systemsand Suppliers...
`seaneangenaeparnrncenakrontcansssesadiiveinasssvsiiese LOO
`4-6 AnelvaIn-Line Plasma CVD Systems...walacissueeiiaueecyadescenerinsineAnteneaxs 171
`4-7 AmorphousSilicon Deposition.............scresscssesnresrserscrcoerenersscsonsesosees 172
`4-8 Nextral ND 400 PECVDSystem Specifications ...........sccssceseseseeeeeeee 173
`4-9 LPCVDSilicon Films (Leybold LC350 Reactor) ...........::::ccccseeeeeeeeteeee 174
`4-10 Watkins-Johnson SiO2 aceilsSystem cesceceseeceeeneeeesecseeceeeesseeeaeeeens 174
`anengceneesaasskiiakbidphenioishisHRiaen see LOO
`4-11 KLA Acrotec 6000 Parameters..
`4-12 Spin Coating vs Print Coating ..........:ecsssecssssessrscssscsssoessonssonsanssessersnres 194
`4-13 L-400 Rubbing Machine...........:-cs-ssrsesseersorssrrcercerrenserssnensscrsneooneacees 194
`4-14 Villa Precision GS 110 16 L Scriber Specifications «00.0.0... eeeeeeees 195
`
`5.1 Materials Suppliers ....ssesscscssecevssvssessorescnesseccesesasecosesseesesesesessssssanssensese 201
`5.