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`W 0 2007 /05 5486 A 1
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`I lllll llllllll II llllll lllll lllll lllllllll I II Ill lllll lllll lllll 111111111111111111111 111111111111
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`For 1wo-le11e r codes and other abbre11iatio11s. refer 10 the "Guid(cid:173)
`ance Notes on Codes and Abbreviations" appearing at the begin(cid:173)
`ning of each regular issue of the PCf Gazelle.
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`LOWES Ex. 1011 Page 0002
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`WO 2007/055486
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`PCT/KR2006/004.U7
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`(DESCRIPTION]
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`(Invention Title]
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`LED OF SIDE VIEW TYPE AND THE METHOD FOR MANUFACTURING
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`THE SAME
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`5
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`[Technical Field]
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`The present invention relates to a method of manufacturing a diode, more
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`particularly to a method of manufacturing a side view type light emitting diode.
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`10
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`[Background Art]
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`Witjl reference to Figs. 1 and 2, the composition of a backlight device in a liquid
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`crystal display (LCD) in a mobile communication equipment is typically as illustrated in
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`Fig. 1. That is, in a backlight device 10, a flat light guide plate 14 is arranged on the board,
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`and side light emitting diodes, i.e. LED:s 20, are arranged at the sides of this light guide
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`15
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`plate 14. Typically, a plurality of LED's 20 are arranged in the fopn of arrays. The light L
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`from the LED's 20 incident on the light guide plate 14 is reflected upwards by means of
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`minute reflective patterns or a reflective sheet 16 arranged at the bottom surface of the
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`light guide plate 14, and is emitted from the light guide plate 14 to provide a back.light for
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`the LCD panel 18 above the light guide plate 1.4.
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`20
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`Fig. 2 is a front view showing an example of a conventional LED 20 such as that
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`LOWES Ex. 1011 Page 0003
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`illustrated in Fig. 1. Referring to Fig. 2, an LED 20 includes a cup-shaped groove 28
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`housing an LED chip 22 (see Fig. 1) within, and a package body 23 having thin walls 24
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`at the top and bottom and relatively thick walls 26 to the left and right of the groove 28. In
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`order to guide the light generated at the LED chip 22 to the exterior, the cup-shaped
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`5
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`groove 28 is open towards the front of the drawing to form an LED window, which is
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`filled with a transparent resin to seal the LED chip from the exterior. Here, a fluorescent
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`element, etc., may be included in the resin for converting a s~gle color light into white
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`light. Also, a pair of terminals 29 are installed on both sides of the package body 23 to
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`electrically connect the LED chip 22 to an exterior power source.
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`10
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`With this composition, the terminals 29 are not superposed with the groove 28, so
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`that the overall thickness of the LED 20 is reduced.
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`In particular, there is currently a demand for the reduction of thickness in LCD
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`backlight devices, and a thickness reduction in the LED's is advantageous for the
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`thickness reduction in backlight .devices. At present, there is a demand for a thickness of
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`15
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`about 0.6 mm or lower for side view type light emitting diodes (LED's) in LCD backlight
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`devices, and it is expected that the demand will be for thicknesses of 0.5mm or lower in
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`the future.
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`However, with the LED 20 having a structure such as that illustrated in Figs. 1
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`and 2, it is difficult to ensure a package thickness, i.e. fitted height, of 0.5 mm or lower.
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`20
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`This is becaus~ the opening of the groove 28, i.e. the LED window, requires a certain
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`LOWES Ex. 1011 Page 0004
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`amount of width for guiding the light generated at the LED chip 22 to the exterior, the
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`walls 24 at the top and bottom of the LED window also require a certaill' amount of
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`thickness to ensure a desired strength, and it is difficult to make this thickness go be\ow a
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`certain amount with only the injection-molding type of manufacturing method.
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`5
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`Another problem in the conventional LED applied to LCD backlight devices is
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`that the opening of the groove 28, i.e. the LED window is separated upwards by a
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`thickness th of the lower wall 24 from the bottom of the light guide plate 14. Thus, the
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`light L generated at the LED chip 22 and emitted downwards towards the exterior of the
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`groove 28 proceeds along a predetermined length before reaching the reflective sheet 16
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`10
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`at.the bottom of the light guide plate 14. This creates first dark spots 33, in which the light
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`Lis dim, on the reflective sheet 16, to degrade the overall efficiency of the LCD backlight
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`device.
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`Meanwhile, with the miniaturization of mobile communication equipment on
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`which the LCD backlight device is equipped, there is also a trend of reducing the
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`15
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`thickness of the light guide plate for the LCD backlight device. That is, the thickness of
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`the light guide plate is being reduced to 0.5 mm and lower.
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`In this case, another problem occurs in the LCD backlight device that employs
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`conventional LED's, as described below with reference to Fig. 3. As illustrated in Fig. 3,
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`when .the thickness of the light guide plate 14a is 0.5 mm or lower, the thickness of the
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`20
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`LED's 20a is made greater than that of the light guide plate 14a. Then, a substantial
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`amount of light generated at the LED chip 22a within the LED 20a does not reach the
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`light guide plate l 4a, and light loss occurs. Thus, to prevent this problem, an LCD
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`backlight device lOa has reflectors 35 installed at the upper ends of the sides of the light
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`guide plate 14a to guide the light to the inside of the light guide plate l 4a and prevent
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`5
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`light loss.
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`However, this further complicates the composition of the LCD backlight device
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`1 Oa, as well as its manufacturing process, which in turn increases the work times and
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`costs.
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`Moreover, as illustrated in Fig. 4, there are a plurality of side view type light
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`·10
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`emitting diodes, i.e. LED 's 20, arranged in the form of arrays on the board 12 at the sides
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`of the light guide plate 14, where second dark spots 36, in which the light generated at the
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`LED chips 22 are dim, exist between the plurality of LED's 20, to also degrade the overali
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`efficiency of the LCD backlight device.
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`Furthermore, as the depth of the groove 28 of the LED 20 (i.e. the distance from
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`the surface of the terminal 29 on which the LED chip 22 is mounted to the upper surface
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`of the wall 24) is typically 0.6 mm or greater, the number of times the light emitted from
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`LED chip 22 is reflected between the inner surfac.es of the walls 24 is high, so that light
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`loss is increased.
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`20
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`[Disclosure]
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`4
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`LOWES Ex. 1011 Page 0006
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`PCT /KR2006/0044.J7
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`[Technical Problem]
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`An aspect of the present invention is to provide a side view type light emitting
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`diode and a method of manufacturing the same, in which, with a low cost, the thicknesses
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`of the walls are made to be 0.04 to 0.05 mm for an overall thickness of 0.5 mm or lower,
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`5
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`according to the trend of the thickness of the light guide plate in a backlight device
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`decreasing to 0.5 mm or lower.
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`Another aspect of the present invention is to provide a side view type light
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`emitting diode and a method of manufacturing the same, in which the manufacturing
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`process is simplified by forming straight type electrodes without additional processes of
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`10
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`folding or bending, etc., when forming the lead frames, and in which the electrical contact
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`between the lead frames and· the conductive pattern on the PCB and the supply of
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`electricity are made more efficient by providing cutting-grooves on the lead frames (at the
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`ends of the lead frames), when mounting the side view type light emitting diode on the
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`PCB.
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`15
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`Yet another aspect of the present invention is to provide a side view type light
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`emitting diode and a method of manufacturing the same, in which the height of the walls
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`forming the reflectors is minimized, so that the total quantity of light emitted is increased,
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`and the occurrence of dark spots is minimized when fitting onto a backlight device of an
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`LCD.
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`20
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`[Technical Solution]
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`One aspect of the present invention provides a method of manufacturing a side
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`view type light emitting diode comprising: (a) providing lead frames which include a
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`cathode terminal and an anode terminal; (b) forming a ref).ector which surrounds the lead
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`5
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`frames, such that portions of the cathode tenninal and anode terminal protrude from both
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`sides, and which includes a groove open in the upward direction and a wall surrounding
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`the groove; ( c) die-attaching an LED chip onto the lead frames inside the groove; ( d)
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`bonding the LED_ chip to the cathode terminal or to the anode terminal with a conductive
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`wire; (e) dispensing a liquid curable resin into the groove to form a lens part; and (f)
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`10
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`sawing the walls facing each other using a sawing machine, such that the thicknesses at
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`the upper surfaces are 0.04 to 0.05 mm.
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`Here, the lead frames may be formed by punching a copper (Cu) board plated
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`with silver (Ag) using a press cast, and may include cutting-grooves on both side portions
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`of the outer ends of the cathode terminal and the anode terminal.
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`15
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`Meanwhile, the reflector may be formed by plastic injection molding such that
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`the width of the groove is 0.3 to 0.35 mm. Also, the inner surface of the wall may be
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`formed to have a predefined inclination with respect to the bottom surface.
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`Anyone of the (b) forming, the (c) die-attaching, and the (d) bonding may further
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`include coating a reflective substance or joining a reflective plate of a metal material on
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`·20
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`the inner surface of the wall.
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`LOWES Ex. 1011 Page 0008
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`The liquid curable resin may include liquid epoxy with a fluorescent substance
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`mixed in, which may be in correspondence with the color of the LED chip.
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`Another aspect of the present invention provides a side view type light emitting
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`diode comprising: a pair of lead frames; a reflector which surrounds the lead frames and
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`5 which includes a groove that is open in an upward direction and a wall that surrounds the
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`groove; an LED chip mourited in the groove and electrically connected by wire bonding
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`to the lead frame; and a lens part filled in the groove, where the walls facing each other
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`have thicknesses of 0.04 to 0.05 mm at the upper surfaces.
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`The pair oflead frames may be in the form of a strip, and the lead frames facing
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`10
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`each other may be arranged in a straight type configuration and separated by a predefined
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`gap, and may have portions protruding out of the reflector. Here, the portions protruding
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`out of the reflector may have a tapered shape, such that the width is narrower towards the
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`end. Also, the height of the wall maybe 0.25 to 0.35 mm.
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`Still another aspect of the present invention provides a side view type light
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`15
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`emitting diode comprising: a pair of lead frames; a reflector which surrounds the lead
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`frames and which includes a groove that is open in an upward direction and a wall that
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`surrounds the groove; an LED chip mounted in the groove and electrically connected by
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`wire bonding to the lead frame; and a lens part filled in the groove, where .the height of the
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`wall is 0.25 to 0.35 mm. The reflector may include a plastic material, the side view type
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`20
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`light emitting diode may ~e formed by injection molding, and the inner surface of the wall
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`may be fonned to have a predefined inclination with respect to the bottom surface of the
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`groove.
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`The lens part may be formed by curing liquid epoxy that includes a fluoresc~nt
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`substance in correspondence with the color of the light emitted by the LED chip.
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`5
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`Also, the pair of lead frames may be in the form of a strip, and the lead frames
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`facing each other may be arranged in a straight type configuration and separated by a
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`predefined gap, and may have portions protruding out of the reflector. Here, the portions
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`protruding out of the reflector may have a tapered shape, such that the width is narrower
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`towards the end.
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`10
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`[Adv!iJltageous Effects]
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`.According to an aspect of the present invention, a side view type light emitting
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`diode and a method of manufacturing the same can be provided which has an overall
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`thickness of 0.5 mm or lower, by sawing the mold that surrounds the lead frames and
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`15
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`forms the reflector using blades, such that the thickness of the walls is 0.04 to 0.05 mm.
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`Also, an aspect of the present invention can provide a side view type light
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`emitting diode and a method of manufacturing the same, in which the manufacturing
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`process is simplified by forming straight type electrodes without additional processes of
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`folding or bending, etc., when forming the lead frames, and in which the electrical contact
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`20
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`between the lead frames and the conductive pattern on the PCB and the supply of
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`LOWES Ex. 1011 Page 0010
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`electricity are made more efficient by providing cutting-grooves on the lead frames (at the
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`ends of the lead frames), when mounting the side view type light emitting diode on the
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`PCB.
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`Also, an aspect of the present invention can provide a side view type light
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`5
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`emitting diode with which the total quantity oflight emitted is improved, by minimizing
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`the height of the walls forming the reflector.
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`Also, as the height of the walls fonning the reflector is minimized, the angle of
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`the light emitted may be increased, whereby the forming of dark spots can be minimized
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`when fitting onto the backlight device of an LCD.
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`10
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`[Description ofD~awings]
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`Fig. 1 is a cross-sectional view for describing a problem in a conventional LED
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`applied to an LCD backlight device.
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`Fig. 2 is a front-elevational view illustrating an example of a conventional LED.
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`15
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`Fig. 3 is a cross-sectional view for describing another problem in a conventional
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`LED applied to an LCD backlight device.
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`Fig. 4 is a plan view of a conventional side view type light emitting diode arrayed
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`in an LCD backlight device.
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`Fig. 5 is a flowchart schematically representing a method of manufacturing a side
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`20
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`view type light emitting diode according to an embodiment of the present invention.
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`Fig. 6 is a plan view illustrating lead frames according to an embodiment of the
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`present inventi.on.
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`Fig. 7 is a plan view illustrating the lead frames of Fig. 6 after forming a reflector
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`on the lead frames.
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`5
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`Fig. 8 is a cross-sectional view across line A-A' of Fig. 7.
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`Fig. 9 is a cross-sectional view across line B-B' of Fig. 7.
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`Fig. 10 is a cross-sectional view after mounting an LED chip and performing
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`wire bonding.
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`Fig. 11 is a perspective view illustrating a side view type light emitting diode
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`10 manufactured according to an embodiment of the present invention.
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`Fig. 12 is a perspective view of a side view type light emitting diode according to
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`an embodiment of the present invention.
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`Fig. 13 is a cross-sectional view across line C-C' of Fig. 12 for describing the
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`arrangement of the lead frames.
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`15
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`Fig. 14 is a cross-sectional view across line D-D' of Fig. 12 with the walls of the
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`reflector at a common height h1•
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`Fig. 15 is a cross-sectional view across line D-D' of Pig. 12 with the walls of the
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`reflector at an advantageous height h2•
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`Fig. 16 is a cross-sectional view across line E-E' of Fig. 12.
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`20
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`Fig. 17 is a perspective view illustrating an exainple of the side view type light
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`emitting diode of Fig. 12 applied to an LCD backlight device.
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`Fig. 18 is a plan view of Fig. 17.
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`<Description of Reference Numerals for Major Components>
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`5
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`100 : side view type light emitting diode
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`110 : lead frame plate
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`111 (11 la, l llb) : lead frame
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`113 : connection piece
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`115 : cutting-groove
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`120 : reflector
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`121(121a,121b, 123a, 123b): walls
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`C : cutting lines
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`10
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`130 : LED chip
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`133 : conductive paste
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`135 : gold (Au) wire
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`137 : lens part
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`[Best Mode]
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`Embodiments of the side view type light emitting diode and a method of
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`15 manufacturing the san_ie, according to the present invention, will be described below in
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`more detail with reference to the accompanying drawings. In the description with
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`reference to the accompanying drawings, those components are rendered the same
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`reference number that are the same or are in correspondence regardless of the figure
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`number, and redundant explanations are omitted.
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`20
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`Fig. 5 is a flowc~art schematically representing a method of manufacturing a side
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`view type light emitting diode according to an embodiment of the present invention. In
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`describing the method of manufacturing a side view type light emitting diode, the
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`respective operations will be described with reference to Figs. 6 to 11.
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`Fig. 6 is a plan view illustrating lead frames according to an embodiment of the
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`5
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`present invention, Fig. 7 is a plan view illustrating the lead frames of Fig. 6 after f~rming
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`a reflector on the lead fraines, Fig. 8 is a cross-sectional view across line A-A' of Fig. 7,
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`Fig. 9 is a cross-sectional view across line B-B' of Fig. 7, Fig. 10 is a cross-sectional view
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`after mounting an LED chip and performing wire bonding, and Fig. 11 is a perspective
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`view illustrating a side view type light emitting diode manufactured according to an
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`10
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`embodiment of the present invention.
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`First, lead frames 110 (see Fig. 6) are prepared (SI).
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`In this embodiment, a lead frame plate 110 such as that in Fig. 6 is formed by
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`punching a copper (Cu) board plated with silver (Ag) using a press cast. Here, it is given
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`a thickness of 0.2 mm, so that it can release the heat generated in the LED chip to the
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`15
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`exterior.
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`A pair of lead frames 111 in the form of a strip is arranged such that the ends on
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`the inside facing each other are separated by a predefined gap G, and the ends on the
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`outside are connected on both sides by connection pieces 113. One side of the pair of lead
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`frames 111 becomes the cathode terminal 111 a, while the other side becomes the anode
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`20.
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`terminal lllb.
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`Meanwhile, cutting-grooves 115 are fonned on the outer parts of the portions
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`where the outer ends of the lead frames meet the connection pieces. The function of the
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`cutting-grooves 115 will be described later.
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`Second, a reflector 120 (see Figs. 7 to 9) is fonned on the lead frame plate 110
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`5
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`(82).
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`A reflector 120 is fonned, which surrounds the pair of lead frames 111 such that
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`the ends protrude out at both the left and right sides, and which has a cup-shaped
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`elongated groove 125 that houses the LED chip 130 (see Fig. 10) within, and thin upper
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`and lower walls 121a, 121b and relatively thick left and right walls 123a, 123b
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`10
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`surrounding it. The reflector 120 is fonned on the upper and lower parts of the pair oflead
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`frames 111, and is fonned by a general plastic injection molding technique.
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`In this embodiment, the upper and lower thin walls 121a, 121b are made with a
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`thickness of 0.2 mm each, with the distance between the inner surfaces of the upper and
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`lower thin walls 121a, 12lb being 0.3 mm (the thickness of the bottom surface on which
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`15
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`the LED chip is placed) at the bottom of the groove 125.
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`However, with plastic injection molding, the thickness cannot be made under
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`0.07 mm for the walls, especially the thin walls at the top and bottom, and the
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`mai:iufacturing cost is increased the more the thickness is decreased, and even if the
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`reflector is manufactured at a high cost with 0.07 mm for the thickness of the walls, there
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`20
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`are still problems remaining, in that the overall thickness of the . side view type light
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`emitting diode is made greater than 0.5mm, to be unable to satisfy the trends for a light
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`guide plate 14a (see Fig. 3) having a thickness of 0.5 mm or lower, and that reflectors 35
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`(see Fig. 3) may have to be used. A technical solution to these problems is achieved by the
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`final operation of the method of manufacturing a side view type light emitting diode
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`5
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`according to an aspect of the present invention, the sawing of the lead frames and walls
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`(S6, see Fig. 5). Detailed descriptions on this will be provided later.
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`Meanwhile, in consideration of the light emission efficiency of the side view type
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`light emitting diode, the inner surfaces of the walls 121a, 121 b, 121a, 121b are formed to
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`have inclinations, while reflective substances may be coated on or a reflective plate of a
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`IO metal material may be joined to the inner surfaces of the walls 121a, 121b, 121a, 12lb.
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`Third, the LED CHIP 130 (see Fig. 9) is die-attached (S3).
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`In this embodiment, the LED chip, 130 is attached onto the le~d frame 111 a inside
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`the groove 125 using conductive paste 133, and an LED chip 130 of dimensions 0.24 x
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`0.48 X 0.1 mm is used.
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`15
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`Fourth, the LED chip 130 is bonded to the lead frame 111 b with a conductive
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`wire 135 (see Fig. 10) (S4). In this embodiment, a gold {Au) wire 135 was used.
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`While in this embodiment, the LED chip 130 is attached to the lead frame 111 a of
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`one side by means of conductive paste 133 and bonded afterwards to the lead frame 11 lb
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`of the other side with a gold {Au) wire 135 for electrical connection, the case may also be
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`20 . considered in which the LED chip is attached onto the mold of the reflector 120 between
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`the opposing ends at the insides of the pair of lead frames 111 a, 111 b by means of
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`non-conductive paste (not shown), with wire bonding respectively to the lead frames 111 a,
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`111 b of both sides.
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`Fifth, a lens part is formed in the groove 125 of the reflector (SS).
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`5
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`The lens part 137 is formed by dispensing liquid epoxy, mixed with a fluorescent
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`substance in correspondence with the color of the LED chip 130, in the groove 125.
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`Meanwhile, while in this embodiment, the lens part 137 was formed by mixing a
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`fluorescent substance in liquid epoxy, the case may also be considered in which the lens
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`part 137 is formed by potting the fluorescent substance on the LED chip 130 and
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`10
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`afterwards injecting a curable resin such as liquid epoxy into the groove 125 of the
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`reflector.
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`Finally, the lead frame plate and the walls are sawed (S6).
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`Using a sawing machine that utilizes blades, both of the walls 121 a, 121 b facing
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`each other are sawed along cutting lines C (see Figs. 7 and 8) such that the thickness of
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`15
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`each at the upper surface is 0.04 mm, whereby the side view type light emitting diode I 00
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`and the method of manufacturing the same are completed.
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`As described above, it is difficult to make the thicknesses of the walls be 0.07
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`mm or lower with injection molding, so that in this embodiment, a sawing machine
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`utilizing blades is used to make the thicknesses t2 of the walls 121a, 121b be 0.04 mm
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`20
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`each and to make the top width t3 of the groove of the reflector be 0.32 mm, whereby the
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`overall thickness t (see Fig. 11) of the side view type light emitting diode is made 0.4 mm.
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`By thus radically reducing the overall thickness of the side view type light
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`emitting diode without incurring high costs, the thickness of the LCD backlight device
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`employing the side view type light emitting diode may be reduced, to satisfy the trends of
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`5
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`using light guide plates of 0.5 mm or lower.
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`Moreover, by reducing the thicknesses t2 of the walls 12la, 12lb to 0.4 mm each,
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`the first dark spots 33 (see Fig. 1) may be minimized, to increase light emission efficiency
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`when applying a .~ide view type light emitting diode based on an aspect of the present
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`invention to an LCD backlight device.
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`10
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`Meanwhile, when the lead frames 110 (see Fig. 7) and the reflector 120 are sawed
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`along the cutting lines C, the cutting-grooves 115 give the pair of lead .frames 11 la, 111 b
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`a tapered shape such that the width is narrower towards the end, whereby the ends may be
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`formed without sawing.
`
`Thus, the problem in using a copper (Cu) board plated with silver (Ag), of having
`
`15
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`~e plated silver (Ag) detached from the copper (Cu) board during sawing, such that the
`
`efficiency is degraded in electrical contact between the lead frames and the conductive
`
`patterns on the PCB and in the supply of electricity when mounting the side view type
`
`light emitting diode on the PCB, is resolved for the lead frames.
`
`Fig. 12 is a perspective view of a side view type light emitting diode according to
`
`20
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`an embodiment of the present invention, Fig. 13 is a cross-sectional view across line C-C'
`16
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`LOWES Ex. 1011 Page 0018
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`PCT /KR2006/0044.J7
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`of Fig. 12 for describing the arrangement of the lead frames, Fig. 14 is a cross-sectional
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`view across line D-D' of Fig. 12 with the walls of the reflector at a common height h1, Fig.
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`15 is a cross-sectional view across line D-D' of Fig. 12 with the walls of the reflector at an
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`advantageous height h2, and Fig. 16 is a cross-sectional view across line E-E' of Fig. 12.
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`5
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`Referring to Figs. 12 and 13, a reflector 120' is comprised, which surrounds the
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`pair of lead frames 111 ', such that an end portion protrudes on both sides, and which
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`includes a cup-shaped groove housing the LED chip 130' (see Figs. 14 to 16) within, and
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`thin walls 121'a,121 'bat the top and bottom and relatively thick walls 123'a, 123'b to the
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`left and right of the groove 125' surrounding it. The reflector 120' is formed at the upper
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`10
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`and lower portions of the pair of lead frames 111 ', and is typically formed by a general
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`plastic injection molding technique.
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`As shown in Fig. 13, the pair of lead frames 111' in the form of a strip ~ave the
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`ends facing each other separated by a predefined gap, and are arranged in a straight type
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`configuration, without any folded or bent surfaces overall. One side of the pair of lead
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`15
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`frames 111' becomes the cathode terminal 111 'a, while the other side becomes the anode
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`terminal 111 'b. The polarity of each terminal may be changed as necessary.
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`Also, in order for the plastic mold forming the reflector 120' to surround the lead
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`frames 111 ' and be vertically connected, such that the lead frames 111' are stably
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`supported, a portion of the inner sides of the lead frames 111' is made to have a narrower
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`20 width than that of either outer end.
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`17
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`LOWES Ex. 1011 Page 0019
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`PCT /KR2006/0044.J7
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`The pair of lead frames 111' used in this embodiment are formed by punching a
`
`copper (Cu) board plated with silver (Ag) using a press cast, where the lead frames 111'
`
`have a thickness of 0.2 mm, so that they can emit the heat generated in the LED chip to
`
`the exterior of the side view type light emitting diode.
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`5
`
`Also, each outer end of the pair of lead frames 111 'a, 111 'b may have a tapered
`
`shape, such that the width is narrower towards the end.
`
`This is because, this shape may solve the problem of the plated silver (Ag)
`
`becoming detached from the copper (Cu) board, when manufacturing the pair of lead
`
`frames 111 'a, 111 'b by sawing the lead frame plate made of a copper (Cu) board plated
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`10 with silver (Ag); it may increase the efficiency of electrical contact with the conductive
`
`patterns on the PCB, by providing room for the solder between the PCB and the ends of
`
`the lead frames, when mounting a side view type light emitting diode 100' based on an
`
`aspect of the present invention on the PCB; and it may improve the heat-releasing effect
`
`throu~ the lead frames, by allowing the side view type light emitting diode to closely
`
`15
`
`adhere to the PCB.
`
`Referring to Fig. 16, the LED 130' (0.24 x 0.48 X 0.1 ~)is mounted on the le~d
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`frame 111 'a of one side exposed through the inside of the groove 125' of the chip reflector
`
`120', where the LED chip 130' is attached by means of conductive paste 133' and is
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`bonded with the lead frame 111 'b of the other side by a gold (Au) wire 135' to be
`
`20
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`electrically connected.
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`18
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`LOWES Ex. 1011 Page 0020
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`PCT /KR2006/0044.J7
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`Also, instead of attaching the LED chip 130' onto the lead frame 111 ' a of one
`
`side by means of conductive paste 13 3' and afterwards bonding to the lead frame 111 'b of
`
`the other side by means of a gold (Au) wire 135', the case may also be considered in
`
`which the LED chip is attached onto the lead frame 111 'a of one side by means of
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`5
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`non-conductive paste (not shown) and then performing wire bonding respectively with
`
`the lead frames 111 'a, 111 'b of both sides.
`
`Meanwhile, a lens part 137' is comprised in the groove 125' of the reflector
`
`which protects the LED chip 130' and the gold (Au) wire 135'. In this embodiment, the
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`lens part 13 7' is formed by dispensing a liquid epoxy mixed with a, fluorescent substance
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`10
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`in correspondence with the color of the LED chip 130'. By means of the fluorescent
`
`substance, a single color light may be implemented using an LED chip 130' that emits a
`
`single color light.
`
`Meanwhile, while in this embodiment the lens part 137' was formed by mixing a
`
`fluorescent substance in liquid epoxy, the case may also be considered in which the lens
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`15
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`part 137' is formed by potting the fluorescent substance on the LED chip 130' and
`
`afterwards injecting a curable resin such as liquid epoxy into the groove 125' of the
`
`reflector.
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`With reference to Figs. 14 to 18, the following describes why the light emission
`
`efficiency and total light quantity are improved for the case of using an advantageous
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`20
`
`height h2 for the walls of the reflector according to an embodiment of the present
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`LOWES Ex. 1011 Page 0021
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`WO 2007/055486
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`PCT /KR2006/0044.J7
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`invention, in comparison to the case of using a common height hi for the walls of the
`_,.
`
`reflector.
`
`Fig. 14 shows the reflection properties of light emitted from an LED chip 130'
`
`. when the height of the wal.ls 121' confining the groove 125' of the reflector is set to 0.6
`
`5 mm (h1).
`
`The width t2' within the groove 125' is set to 0.3 mm in consideration of the width
`
`of the LED chip 130', and the thickness t1' at the upper portion of the walls 121' is set to
`
`0.1 mm in consideration of structural stability and injection-molding type manufacture.
`
`Here, the inner surfaces of the walls 121 ' are given inclinations for reflecting light, the
`
`10
`
`inclination angle of which is e,.
`
`Here, the light L1 emitted from the LED chip 130' reflects off the inner surfaces
`
`of the walls 121 ' four times, where the reflections cause the light particles to· lose certain
`
`amounts of energy due to the collisions with the inner surfaces of the walls 121 ' .
`
`Fig. 15 shows the reflection properties of light emitted from an LED chip 130'
`
`15 when the height of the walls 121' confining the groove 125' of the reflector is set to 0.3
`
`When the thickness of the chip is set to a typical value of 0.1 mm, the hei!iht of
`
`the gold (Au) wire 135' (see Fig. 16) electrically bonding the LED chip 130' and the lead
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`frames 111' typically becomes 0.15 to 0.2 mm, and since a range of 0.25 to 0.35 mm is
`
`20
`
`advantageous for the height of.the lens part to encapsulate these for protection, and in
`20
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`LOWES Ex. 1011 Page 0022
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`WO 2007/055486
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`PCT /KR2006/0044.J7
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`consideration of structural stability, the height of the walls 121' is set to 0.3 mm (h2).
`
`Here, under the condition that t1 ', t2 ', and t' are made equal, as in Fig. 14, the
`
`inclination angle of the inner surfaces of the walls becomes 92, where 92 is greater than 91•
`
`According to such increase of 92, the reflection properties of the light emitted from the
`
`5 LED chip 130' are also changed.
`
`That is, the number ofreflections of the light L2 emitted from the LED chip 130'
`
`on the inner surfaces of the walls 121' is reduced from four (the number ofreflections of
`
`Li, see Fig. 14) to one, and at the same time, the energy lost due to the collisions of light
`
`particles with the inner surfaces of the walls 121' when a reflection occurs is also reduced,
`
`10 whereby the total quantity of light outputted from the side vi