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`Patent Application Publication
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`14
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`FIG la
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`Patent Application Publication
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`FIG. 2a
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`Patent Application Publication
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`102
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`FIG2c
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`Patent Application Publication
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`FIG2d
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`Patent Application Publication
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`FIG2e
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`Patent Application Publication
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`FIG2f
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`150
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`FIG3a
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`104
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`102
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`104
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`104
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`104
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`106
`104
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`150
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`FIG3b
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`Patent Application Publication
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`Jun. 7, 2007 Sheet 11 of 15
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`FIG. 4a
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`FIG4c
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`FIG. 4d
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`Patent Application Publication
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`Patent Application Publication
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`FIG4g
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`US 2007/0126020 Al
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`Jun. 7,2007
`
`1
`
`HIGH-POWER LED CHIP PACKAGING
`STRUCTURE AND FABRICATION METHOD
`THEREOF
`BACKGROUND OF THE INVENTION
`[0001] 1. Field of the Invention
`[0002] The present invention generally relates to light
`emitting diodes, and more particularly to a packaging struc(cid:173)
`ture for a high-power light emitting diode chip and a related
`fabrication method thereof.
`[0003] 2. The Prior Arts
`[0004] Spirited research activities have been focused on
`high-power light emitting diodes (LEDs) in the relevant
`industries in recent years. One of the most important con(cid:173)
`siderations for the package of a high-power LED chip is
`about the appropriate handling of the high temperature and
`the heat produced by the high-power LED chip, so that the
`functionality, performance, and operational life of the LED
`chip is not compromised.
`[0005] FIG. la is a schematic sectional view showing a
`conventional packaging structure of a LED chip. As illus(cid:173)
`trated, the LED chip (or, some people refer to it as a LED
`die) 16 is positioned on top of a substrate 19 made of
`Bismaleimide Triazine (BT) resin. The electrodes (not
`shown) of the LED chip 16 are connected, by bonding wires
`(or, some people refer to them as gold wires) 13, to the
`copper foil 15 previously configured on the substrate 19 for
`establishing electrical connection to external circuitry. The
`LED chip 16 is surrounded by a reflection mirror 14. A resin
`17 is filled to seal and protect the LED chip 16 and the
`bonding wires 13 inside. This conventional packaging struc(cid:173)
`ture is applicable in mass production and, therefore, con(cid:173)
`tributes to a lower production cost. However, in this con(cid:173)
`ventional structure, the heat produced by the LED chip 16
`could only be dissipated through the thin copper foil 15 as
`resin is not an acceptable thermal conductor. In other words,
`the copper foil 15 functions as a conduction channel for both
`electricity and heat for the LED chip 16, and, if the LED chip
`16 is a high-power one, such an arrangement is not appro(cid:173)
`priate for handling the high-volume heat produced by the
`high-power LED chip 16.
`[0006] U.S. Pat. No. 6,274,924 discloses a packaging
`structure which offers separate conduction channels for
`electricity and heat. To facilitate the explanation, the refer(cid:173)
`ence diagram of U.S. Pat. No. 6,274,924 is included here as
`the accompanied drawing FIG. lb. As shown in FIG. lb, the
`disclosed packaging structure molds a metallic lead frame
`12 in an electrically insulating plastic body that can with(cid:173)
`stand high temperature. The LED chip 16 is positioned on
`top of a thermally conductive but electrically insulating
`submount 18. The LED chip 16 and the submount 18 are
`then positioned on top of a metallic heat sinking element 10
`which is usually made of copper. Also on top of the heat
`sinking element 10, there could be an optional reflection
`mirror 14 under the LED chip 16 and the submount 18. The
`heat sinking element 10, along with the LED chip 16 and the
`submount 18, is then positioned inside a preserved space of
`the lead frame 12's plastic body. The electrodes (not shown)
`of the LED chip 16 are connected to the lead frame 12 also
`by bonding wires (not shown). At last, the LED chip 16 and
`the bonding wires is covered and protected by a previously
`prepared transparent protection lens 20 filled with resin (not
`shown).
`
`[0007] The packaging structure provided by the U.S. Pat.
`No. 6,274,924 offers satisfactory heat dissipation by sepa(cid:173)
`rating the conduction channels for electricity and heat.
`However, the production process as described above is
`rather complex and a higher production cost is therefore
`inevitable. In addition, the lead frame 12 and the protection
`lens 20 have to be prepared in advance by molding, leading
`to a very inflexible production process, let alone the cost
`involved for the molds. For example, if the packaging
`structure depicted in FIG. lb is to be used to package two or
`more LED chips 16, the lead frame 12 and the protection
`lens 20 have to be re-designed and manufactured.
`
`SUMMARY OF THE INVENTION
`
`[0008] Accordingly, the major objective of the present
`invention is to provide a packaging structure and a related
`fabrication method for packaging a high-power LED chip
`which, in one way, achieve superior heat dissipation effi(cid:173)
`ciency and, in another way, are applicable in mass produc(cid:173)
`tion for a significantly reduced production cost.
`
`[0009] The packaging structure provided by the present
`invention mainly contains a base, a reflection plate, the LED
`chip being packaged, bonding wires for connecting the
`electrodes of the LED chip, and a transparent filler or lens
`for sealing and protecting the LED chip and the bonding
`wires. The base, having a flat form factor, is made of a
`metallic material and an electrically insulating material
`integrated into a single object. The metallic material forms
`a heat sinking seat in the middle of the base having appro(cid:173)
`priate distances to the edges of the base. The heat sinking
`seat is exposed from the top surface of the base, and from the
`bottom surface or a side surface of the base. The metallic
`material also forms a plurality of electrodes surrounding the
`heat sinking seat. The electrodes are exposed from the top
`surface of the base, and from the bottom surface or a side
`surface of the base. The electrically insulating material is
`interposed between the electrodes and the heat sinking seat
`so that they are adhere together, and so that the heat sinking
`seat and any one of the electrodes, and any two electrodes
`are electrically insulated.
`
`[0010] The LED chip being packaged is adhered to the
`exposed top surface of the heat sinking seat. The positive
`and negative electrodes of the LED chip are connected
`separately to the exposed top surfaces of the base's elec(cid:173)
`trodes respectively. The reflection plate is fixedly attached to
`the base via an appropriate means so that a vertical through
`hole of the reflection plate exposes the LED chip on top of
`the heat sinking seat of the base. The light emitted from the
`LED chip, as a result, is able to radiate outward. The
`reflection plate is made of a metallic material having high
`reflectivity, or of a non-metallic material in which the wall
`of the through hole is coated with a film or a layer of high
`reflectivity material. The filler or the protection lens is made
`of a transparent material such as resin, and is placed inside
`the through hole so as to seal and protect the LED chip and
`the bonding wires.
`
`[0011] The base of the packaging structure has a simplified
`structure and, therefore, is very suitable for mass production.
`The fabrication method provided by the present invention
`use a single metallic plate to produce the bases for a large
`number of units of the packaging structure simultaneously.
`The heat sinking seats and the electrodes of the bases are
`
`LOWES Ex. 1010 Page 0017
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`Jun. 7,2007
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`2
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`formed by etching the metallic plate in a single operation or
`by etching the two major surfaces of the metallic plate in
`separate operations. Then, the insulating material is filled
`between the heat sinking seats and the electrodes. Subse(cid:173)
`quently, the reflection plate is adhered to the base; the LED
`chip is fixed to the top of the heat sinking seat; bonding wires
`are connected between the electrodes of the LED chip and
`the exposed top surfaces of the base's electrodes; the filler
`is stuffed inside the through hole of the reflection plate; and,
`at last, the units of the packing structure are separated by
`cutting.
`
`[0012] The foregoing and other objects, features, aspects
`and advantages of the present invention will become better
`understood from a careful reading of a detailed description
`provided herein below with appropriate reference to the
`accompanying drawings.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0013] FIG. la is a schematic sectional view showing a
`conventional packaging structure of a LED chip.
`
`[0014] FIG. lb is the reference diagram of U.S. Pat. No.
`6,274,924.
`
`[0015] FIG. 2a is a schematic sectional view showing the
`packaging structure according to a first embodiment of the
`present invention.
`
`[0016] FIG. 2b is a blown-up view showing the packaging
`structure of FIG. 2a.
`
`[0017] FIG. 2c is a schematic sectional view showing the
`packaging structure according to a second embodiment of
`the present invention.
`
`[0018] FIG. 2d is a schematic sectional view showing the
`packaging structure according to a third embodiment of the
`present invention.
`
`[0019] FIG. 2e is a schematic sectional view showing the
`packaging structure according to a fourth embodiment of the
`present invention.
`
`[0020] FIG. 2/ is a schematic sectional view showing the
`packaging structure according to a fifth embodiment of the
`present invention.
`
`[0021] FIG. 3a is a perspective view showing the base and
`the packaging structure for two LED chips according to an
`embodiment of the present invention.
`
`[0022] FIG. 3b is a perspective view showing the base and
`the packaging structure for three LED chips according to an
`embodiment of the present invention.
`
`[0023] FIGS. 4a-4g show the results of the processing
`steps of a fabrication method according to an embodiment of
`the present invention.
`
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENTS
`
`[0024] The following descriptions are exemplary embodi(cid:173)
`ments only, and are not intended to limit the scope, appli(cid:173)
`cability or configuration of the invention in any way. Rather,
`the following description provides a convenient illustration
`for implementing exemplary embodiments of the invention.
`Various changes to the described embodiments may be made
`
`in the function and arrangement of the elements described
`without departing from the scope of the invention as set forth
`in the appended claims.
`
`[0025] FIGS. 2a and 2b are schematic sectional view and
`blown-up view of the packaging structure according to a first
`embodiment of the present invention. As illustrated, the
`packaging structure provided by the present embodiment
`contains at least a base 100, a reflection plate 110, the LED
`chip being packaged 150, a plurality of the bonding wires
`120, and a transparent filler 130. The base 100, having a flat
`form factor, is composed of a heat sinking seat 102, a
`plurality of electrodes 104, and an insulator 106, integrated
`together into a single solid object. The heat sinking seat 102
`and the electrodes 104 are made of a metallic material
`having high electrical and thermal conductivities. The insu(cid:173)
`lator 106, on the other hand, is made of an insulating
`material such as resin or the like.
`
`[0026] The heat sinking seat 102 is positioned in the
`middle of the flat base 100 with appropriate distances to the
`edges of the base 100. The heat sinking seat 102 is exposed
`both from the top surface of the base 100, and from at least
`one of the bottom surface and a side surface of the base 100.
`In the present embodiment, the heat sinking seat 102 has
`multiple exposures on the top surface of the base 100 so as
`to enhance the heat dissipation by increasing its contact area
`with air. Please note that the shape of the heat sinking seat
`102 as shown in FIGS. 2a and 2b is only exemplary; other
`appropriate shapes could also be adopted by the heat sinking
`seat 102. The electrodes 104 are positioned at appropriate
`locations around the heat sinking seat 102. Similarly, the
`electrodes 104 are exposed both from the top surface of the
`base 100, and from at least one of the bottom surface and a
`side surface of the base 100, respectively. Please also note
`that the shapes of the electrodes 104 as shown in FIGS. 2a
`and 2b are only exemplary. Generally, for the single-chip
`packaging of the present embodiment, there are two elec(cid:173)
`trodes 104 for connecting to the positive and negative
`electrodes of the chip 150 respectively. In alternative
`embodiments which provide multiple-chip packaging, the
`number of the electrodes 104 is twice the number of the
`chips 150. The insulator 106 makes up the rest of the base
`100. The insulator 106 therefore is located between the heat
`sinking seat 102 and the electrodes 104 so as to, for one
`thing, adhere the heat sinking seat 102 and the electrodes
`104 together and, for another thing, form the insulation
`between the heat sinking seat 102 and any one of the
`electrodes 104, and between any two electrodes 104. The
`fabrication of the base 100 will be described in details later.
`
`[0027] The reflection plate 110 also has a flat form factor
`with a vertical through hole (not numbered) at an appropri(cid:173)
`ate location in the middle. The reflection plate 110 is made
`of a metallic material having high reflectivity (e.g., alumi(cid:173)
`num), or it could be made of an insulating material such as
`resin but the wall of the through hole has a white coating, or
`is coated with a film made of highly reflective material such
`as silver. The reflection plate 110 is adhered to the base 100
`with a layer of an appropriate adhesive 160. When the
`reflection plate 110 is made of a metallic material, the
`adhesive 160 also provides the insulation between the reflec(cid:173)
`tion plate 110 and the base llO's heat sinking seat 102 and
`electrodes 104. The location and aperture of the through hole
`are properly configured so that, after the reflection plate 110
`is joined with the base 100, the top surface of the heat
`
`LOWES Ex. 1010 Page 0018
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`3
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`sinking seat 102 and at least some portion of the top surface
`of the electrodes 104 are exposed for the fixation of the LED
`chip 150 and the connection of the bonding wires 120
`respectively. As such, when the LED chip 150 is fixed on the
`exposed top surface of the heat sinking seat 102, the light
`emitted from the LED chip 150 is able to radiate out of the
`packaging structure via the through hole. The through hole
`in the present embodiment has a circular aperture and the
`diameter of the aperture is larger as it is closer to the top.
`Please note that the geometric properties of the through hole
`here is only exemplary.
`
`[0028] The LED chip 150 is fixedly adhered to the top
`surface of the heat sinking seat 102 as mentioned earlier. The
`positive and negative electrodes (not shown) of the LED
`chip 150 are connected to separate electrodes 104 of the base
`100 respectively via the bonding wires 120. As such, the heat
`produced by the LED chip is dissipated through the heat
`sinking seat 102 (i.e., the heat dissipation channel) while the
`bonding wires 120 and the electrodes 104 jointly provide
`access to the electricity (i.e., the electricity channel). With
`this separation of the electricity and heat dissipation chan(cid:173)
`nels, superior heat dissipation efficiency is thereby achieved.
`The through hole of the reflection plate 160 is filled with the
`filler 130 made of a transparent material such as resin so as
`to seal and protect the LED chip 150 and the bonding wires
`120. In the present embodiment, the filler 130 completely
`fills up the through hole of the reflection plate 110. In a
`second embodiment as shown in FIG. 2c, a transparent
`protection lens 170 (such as a dome-shaped lens commonly
`used for LEDs) is used to cover the LED chip 150 and the
`bonding wires 120.
`
`[0029] FIGS. 2d-2f are schematic sectional views showing
`the packaging structure according to a third, fourth, and fifth
`embodiments of the present invention respectively. For the
`third embodiment shown in FIG. 2d, a concaved reflection
`mirror 103 is formed on the top surface of the heat sinking
`seat 102 and beneath the LED chip 150. The reflection
`mirror 103 could be made of a metal or a metallic oxide
`having high thermal conductivity such as silver, aluminum,
`or aluminum oxide. The reflection mirror 103 could also be
`a coating of highly reflective material, regardless of its
`thermal conductivity. The purpose of having this reflection
`mirror 103 is to enhance the brightness of the LED chip 150
`after it is packaged. The fourth embodiment shown in FIG.
`2e is to demonstrate that the present invention could also be
`applied in producing white light from various colored LEDs
`and appropriate phosphors. In this embodiment, a blue-light
`LED chip 150 is buried inside a yellow phosphor 105 before
`they are sealed by the filler 130. The yellow phosphor 105
`would produce yellow light as it is excited by the blue light
`from the LED chip 150, and the yellow light is mixed with
`the exciting blue light to produce two-wavelength white
`light. In another embodiment, an UV (ultra-violet) LED chip
`150 is buried in red, green, and blue phosphors 105, and the
`red, green, and blue lights from the excitation of the red,
`green, and blue phosphors 105 by the UV light from the
`LED chip 150 are mixed to produce three-wavelength white
`light. A fifth embodiment shown in FIG. 2/ is actually a
`combination of the third and fourth embodiments. A large
`number of research results about the reflection mirror 103
`and the phosphors 105 have already been disclosed in the
`related arts, and their implementations are not limited to
`those exemplified in the afore-mentioned embodiments.
`
`[0030] FIGS. 3a and 3b demonstrate how the present
`invention is applied in the packaging of two and three LED
`chips respectively, by showing their bases and packaging
`structures. As should be obvious from the illustrations, the
`present invention could be easily adapted to package an even
`larger number of the LED chips. The only difference
`between these multiple-chip packaging structures lies only
`in the formation of an appropriate number of electrodes 104
`at appropriate positions in the base 100. The multiple-chip
`packaging structure is also very suitable for color-mixing
`various colored LEDs. Using the three-chip packaging struc(cid:173)
`ture shown in FIG. 3b as an example, the three LED chips
`150 could be a red-light one, a green-light one, and blue(cid:173)
`light one respectively. Then, by packaging them together in
`the illustrated packaging structure, the three colored lights
`would mix with each other to form white light. As a brief
`summary, the present invention could be applied in the
`packaging of various colored LED chips, various numbers
`of LED chips, and in the production of various mono(cid:173)
`colored and full-colored lights.
`
`[0031] FIGS. 4a-4g show the results of the processing
`steps of a fabrication method according to an embodiment of
`the present invention. Initially, a large metallic plate 190
`having high electrical and thermal conductivities is pro(cid:173)
`vided, as shown in FIG. 4a. The metallic plate 190 is used
`for the subsequent formation of the bases 100 of multiple
`packaging units 200 simultaneously. The bases 100 of the
`packaging units 200 are arranged in an array, adjacent to
`each other or to the boarder 180 of the metallic plate 190.
`The bases 100 are formed mainly by appropriate means of
`etching and machinery to remove the part of the bases 100
`for the subsequent filling of the insulator 106 and, after that,
`the heat sinking seats 102 and the electrodes 104 of the bases
`100 are left behind, as shown in FIG. 4b. Then, the part of
`the bases 100 etched away is filled with the insulator 106 and
`the result is shown in FIG. 4c.
`
`[0032] Depending on the complexity of the shapes of the
`heat sinking seat 102 and the electrodes 104, the foregoing
`etching and machinery process could be conducted to the
`two major surfaces of the metallic plate 190 simultaneously,
`producing the patterns of the heat sinking seats 102 and the
`electrodes 104 for all packaging units 200 in a single run.
`The filling of the insulator 106 is then performed subse(cid:173)
`quently. However, ifthe shapes of the heat sinking seat 102
`and the electrodes 104 are rather complex, the etching and
`the filling of the insulator 106 could be conducted to a major
`surface of the metallic plate 190 in a first run, and then
`conducted to the other major surface in a second run. The
`formation of the bases 100 of all packaging units 200 is then
`completed.
`
`[0033] Next, as shown in FIG. 4d, a previously prepared
`plate member 210 composed of multiple reflection plates
`110 is adhered to the processed metallic plate 190 of FIG. 4c
`by an appropriate adhesive. Then, for each packaging unit
`200, the fixation and wire bonding of the LED chip 150 is
`conducted, whose result is shown in FIG. 4e. The transpar(cid:173)
`ent filler 130 is then injected into the through holes of the
`reflection plates 110 to seal the packaging units 200, as
`shown in FIG. 4f At last, as illustrated in FIG. 4g, the
`packaging units 200 are separated by cutting.
`
`[0034] Although the present invention has been described
`with reference to the preferred embodiments, it will be
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`Jun. 7,2007
`
`4
`
`understood that the invention is not limited to the details
`described thereof. Various substitutions and modifications
`have been suggested in the foregoing description, and others
`will occur to those of ordinary skill in the art. Therefore, all
`such substitutions and modifications are intended to be
`embraced within the scope of the invention as defined in the
`appended claims.
`
`What is claimed is:
`1. A high-power LED chip packaging structure, compris(cid:173)
`ing
`
`at least a LED chip;
`
`a base comprising a heat sinking seat, a plurality of
`electrodes, and an insulator integrated together into a
`single object, said heat sinking seat and said plurality of
`electrodes being made of a metallic material, said
`insulator positioned among and adhering together said
`heat sinking seat and said plurality of electrodes so as
`to provide electrical insulation between said heat sink(cid:173)
`ing seat and any one of said plurality of electrodes, and
`between any two of said plurality of electrodes, said
`LED chip being positioned on a top surface of said heat
`sinking seat;
`
`a reflection plate adhered to the top surface of said base
`by an appropriate adhesive, said reflection plate having
`a vertical through hole having an appropriate aperture
`at an appropriate location so as to expose said top
`surface of said heat sinking seat and at least a portion
`of a top surface of each of said plurality of electrodes,
`the wall of said through hole having high reflectivity;
`
`a plurality of bonding wires for connecting the electrodes
`of said LED chip to said plurality of electrodes of said
`base respectively; and
`
`one of a filler and a lens made of a transparent material
`positioned inside said through hole of said reflection
`plate for sealing said LED chip and said plurality of
`bonding wires.
`2. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, wherein said heat sinking seat of said base is
`positioned to have appropriate distances to the edges of said
`base and is exposed both from the top surface of said base,
`and from at least one of the bottom surface and a side surface
`of said base.
`3. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, wherein said plurality of electrodes of said
`base are positioned around said heat sinking seat; and each
`of said plurality of electrodes is exposed both from the top
`surface of said base, and from at least one of the bottom
`surface and a side surface of said base.
`4. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, wherein said reflection plate is made of a
`metallic material having high reflectivity.
`5. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, wherein said reflection plate is made of an
`insulating material and the wall of said through hole has a
`white coating of high reflectivity.
`6. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, wherein said reflection plate is made of an
`insulating material and the wall of said through hole 1s
`coated with a film made of a highly reflective material.
`
`7. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, further comprising a reflection mirror posi(cid:173)
`tioned on said top surface of said heat sinking seat and
`beneath said LED chip.
`8. The high-power LED chip packaging structure accord(cid:173)
`ing to claim 1, further comprising an appropriate phosphor
`covering said LED chip.
`9. A fabrication method for producing a plurality of
`packaging units of high-power LED chips, comprising the
`steps of:
`
`(1) forming said plurality of packaging units' bases on a
`metallic plate, each of said bases comprising a heat
`sinking seat, a plurality of electrodes having appropri(cid:173)
`ate distances to said heat sinking seat, and an insulator,
`said insulator positioned among and adhering together
`said heat sinking seat and said plurality of electrodes so
`as to provide electrical insulation between said heat
`sinking seat and any one of said plurality of electrodes,
`and between any two of said plurality of electrodes;
`
`(2) adhering a plate member to the top surface of said
`metallic plate processed by said step (1) with an
`appropriate adhesive, said plate member previously
`prepared to comprise a plurality of reflection plates
`corresponding to said bases, each of said plurality of
`reflection plates having a vertical through hole with an
`appropriate aperture at an appropriate location so as to
`expose a top surface of said heat sinking seat and at
`least a portion of a top surface of each of said plurality
`of electrodes of a corresponding base, the wall of said
`through hole having high reflectivity;
`
`(3) fixing a LED chip on said exposed top surface of said
`heat sinking seat of each of said bases, and connecting
`the electrodes of said LED chip to said exposed top
`surfaces of said plurality of electrodes of said base by
`a plurality of bonding wires respectively;
`
`( 4) sealing said LED chip and said plurality of bonding
`wires of each of said plurality of packaging units by
`positioning one of a transparent filler and a transparent
`lens inside said through hole; and
`
`( 5) separating said plurality of packaging units by cutting.
`10. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said heat sinking seat of each of said bases
`is positioned such that said heat sinking seat has appropriate
`distances to the edges of said base and is exposed both from
`the top surface of said base, and from at least one of the
`bottom surface and a side surface of said base.
`11. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said plurality of electrodes of each of said
`bases are positioned around said heat sinking seat; and each
`of said plurality of electrodes is exposed both from the top
`surface of said base, and from at least one of the bottom
`surface and a side surface of said base.
`12. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said step (1) is conducted using etching and
`machinery on the two major surfaces of said metallic plate
`simultaneously to form said heat sinking seats and said
`plurality of electrodes of said bases; and then said insulator
`is filled to complete the formation of said bases.
`
`LOWES Ex. 1010 Page 0020
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`5
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`13. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said step (1) is conducted using etching and
`machinery first on a major surface of said metallic plate and
`said insulator is subsequently filled, and then using etching
`and machinery on the other major surface of said metallic
`plate and said insulator is subsequently filled, so as to
`complete the formation of said bases.
`14. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said reflection plate is made of a metallic
`material having high reflectivity.
`
`15. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said reflection plate is made of an insulat(cid:173)
`ing material and the wall of said through hole has a white
`coating of high reflectivity.
`16. The fabrication method for producing a plurality of
`packaging units of high-power LED chips according to
`claim 9, wherein said reflection plate is made of an insulat(cid:173)
`ing material and the wall of said through hole is coated with
`a film made of highly reflective material.
`
`* * * * *
`
`LOWES Ex. 1010 Page 0021
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`