`

`Patent Application Publication Sep. 29, 2005 Sheet 1 of 6
`
`US 2005/0211991 Al
`
`FIG. 1
`
`5
`
`6
`
`3a
`
`FIG.2
`
`6 3a
`
`ylA
`
`3
`
`2
`
`LOWES Ex. 1005 Page 0002
`
`

`

`Patent Application Publication Sep. 29, 2005 Sheet 2 of 6
`
`US 2005/0211991 Al
`
`FIG.3
`
`18~
`
`3a
`
`5
`
`6
`~ Sb Sa
`
`3
`
`2
`
`LOWES Ex. 1005 Page 0003
`
`

`

`Patent Application Publication Sep. 29, 2005 Sheet 3 of 6
`
`US 2005/0211991 Al
`
`FIG.4
`
`1, 1 A, 1 B
`-
`
`/
`
`D D D
`D D
`D D D
`D D
`D D D
`D D
`D D D
`D D
`~ D D
`D· D
`D
`1 0
`D
`D D
`D D D
`D D
`D D D
`D D
`D D D
`D D
`D D D
`
`/
`
`/ -
`
`8
`
`i . - 9
`
`LOWES Ex. 1005 Page 0004
`
`

`

`Patent Application Publication Sep. 29, 2005 Sheet 4 of 6
`
`US 2005/0211991 Al
`
`FIG. 5
`
`8
`
`9
`
`LOWES Ex. 1005 Page 0005
`
`

`

`

`

`Patent Application Publication Sep. 29, 2005 Sheet 6 of 6
`
`US 2005/0211991 Al
`
`FIG.8 PRIOR ART
`
`105
`
`103a
`
`FIG. 9 PRIOR ART
`
`111~
`
`113a 115
`
`116
`,----A---,
`116a 116b
`
`103
`
`113
`
`112
`
`LOWES Ex. 1005 Page 0007
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`

`

`US 2005/0211991 Al
`
`Sep.29,2005
`
`1
`
`LIGHT-EMITTING APPARATUS AND
`ILLUMINATING APPARATUS
`
`BACKGROUND OF THE INVENTION
`
`[0001] 1. Field of the Invention
`[0002] The present invention relates to a light-emitting
`apparatus and illuminating apparatus for radiating out light
`that has been emitted from a light-emitting element such as
`a light-emitting diode and then wavelength-converted by
`phosphors.
`
`[0003] 2. Description of the Related Art
`[0004] FIG. 8 is a sectional view showing a light-emitting
`apparatus 101 of conventional design for giving forth light
`of any given color using phosphors 106 which convert light
`such as near-ultraviolet light or blue-color light emitted from
`a light-emitting element 104 such as a light-emitting diode
`(LED) into red-color light, green-color light, blue-color
`light, yellow-color light or the like. In FIG. 8, the light(cid:173)
`emitting apparatus 101 is mainly composed of a base body
`102 made of an insulator; a frame body 103; a light
`transmitting member 105; and the light-emitting element
`104. The base body 102 has, at the center of its top surface,
`a placement portion 102a for emplacing thereon the light(cid:173)
`emitting element 104. The base body 102 is also provided
`with a wiring conductor (not shown) formed of, for example,
`a metallized wiring line and a lead terminal for electrically
`conductively connecting within and without the light-emit(cid:173)
`ting apparatus 101 by way of the placement portion 102a
`and its environs. The frame body 103 is fixedly bonded to
`the top surface of the base body 102. In the frame body 103,
`a through hole is drilled in such a way that its upper opening
`is larger than its lower opening. The frame body 103 has its
`inner peripheral surface 103a, which defines the through
`hole, shaped into a reflection surface for reflecting light
`emitted from the light-emitting element 104. The light
`transmitting member 105 is charged inside the frame body
`103. The light transmitting member 104 contains phosphors
`106 which perform wavelength conversion on the light
`emitted from the light-emitting element 104.
`[0005] FIG. 9 is a sectional view showing a light-emitting
`apparatus 111 of conventional design in which any color
`lights are emitted by two kinds of phosphors 116a, 116b
`which convert near-ultraviolet light, blue-color light or the
`like emitted from a light-emitting element 114 such as a
`light-emitting diode (LED) into light such as red-color light,
`green-color light, blue-color light, or yellow-color light. In
`FIG. 9, the light-emitting apparatus 111 is mainly composed
`of a base body 112 made of an insulator; a frame body 113;
`a light transmitting member 115; and the light-emitting
`element 114. The base body 112 has, at the center of its top
`surface, a placement portion 112a for emplacing thereon the
`light-emitting element 114. The base body 112 is also
`provided with a wiring conductor (not shown) formed of, for
`example a metallized wiring line and a lead terminal for
`electrically conductively connecting within and without the
`light-emitting apparatus 111 by way of the placement por(cid:173)
`tion 112a and its environs. The frame body 113 is fixedly
`bonded to the top surface of the base body 112. In the frame
`body 113, a through hole is drilled in such a way that its
`upper opening is larger than its lower opening. The frame
`body 113 has its inner peripheral surface 113a, which defines
`the through hole, shaped into a reflection surface for reflect-
`
`ing light emitted from the light-emitting element 114. The
`light transmitting member 105 is charged inside the frame
`body 113. The light transmitting member 104 contains
`phosphors 116a, 116b which perform wavelength conver(cid:173)
`sion on the light emitted from the light-emitting element
`114. Optionally, the two kinds of phosphors 116a, 116b are
`hereinafter collectively referred to as phosphors 116.
`[0006] The base bodies 102, 112 are made of ceramics
`such as sintered aluminum oxide (alumina ceramics), sin(cid:173)
`tered aluminum nitride, sintered mullite or glass ceramics, or
`a resin material such as epoxy resin. In a case where the base
`bodies 102, 112 are made of a ceramics material, on the top
`surface thereof is formed a wiring conductor (not shown) by
`firing a metal paste of tungsten (W) or molybdenum (Mo)(cid:173)
`manganese (Mn) at high temperature. On the other hand, in
`a case where the base bodies 102, 112 are made of a resin
`material, a molded lead terminal made of copper (Cu) or an
`iron (Fe )-nickel (Ni) alloy is fixedly arranged within the
`base bodies 102, 112.
`[0007]
`In the frame bodies 103, 113, shaped like frames,
`a through hole is drilled in such a way that its upper opening
`is larger than its lower opening. On the inner peripheral
`surfaces 103a, 113a of the frame bodies 103, 113 which
`define the through hole, are formed a reflection surface for
`reflecting light. Specifically, the frame bodies 103, 113 are
`formed of a metal material such as aluminum (Al) and an
`Fe-Ni-cobalt (Co) alloy, or a ceramics material such as
`alumina ceramics, or a resin material such as epoxy resin, by
`a cutting process or a molding technique such as die(cid:173)
`molding or extrusion.
`[0008] The reflection surface of the frame bodies 103, 113
`are formed by polishing and flattening the inner peripheral
`surfaces 103a, 113a, or formed by coating a metal such as
`Al on the inner surfaces 103a, 113a of the frame bodies 103,
`113 by means of vapor deposition or plating. The frame
`bodies 103, 113 are finally joined to the top surface of the
`base bodies 102, 112, with use of a bonding material such as
`solder, a brazing filler material such as silver (Ag) paste, or
`a resin adhesive, in such a way that the placement portions
`102a, 112a are surrounded by the inner surfaces 103a, 113a
`of the frame bodies 103, 113.
`
`[0009] As the light-emitting elements 104, 114 are used
`light-emitting diodes (LED) or the like which are constituted
`by forming light-emitting layer on, for example, a sapphire
`substrate, for example, by the liquid-phase growth method
`or MOCVD method. The examples of materials used for the
`light-emitting layer include a semiconductor such as: a
`gallium (Ga)-an aluminum (Al)-nitride (N) compound; a
`zinc (Zn)-sulfur (S) compound; a Zn-selenium (Se) com(cid:173)
`pound; a silicon (Si)-carbon (C) compound; a Ga-phospho(cid:173)
`rus (P) compound; a Ga-Al-arsenic (As) compound; an
`Al-indium (In)-Ga-P compound; an In-Ga-N com(cid:173)
`pound; a Ga-N compound; and an Al-In-Ga-N com(cid:173)
`pound. The semiconductor may have a homo junction struc(cid:173)
`ture, a heterojunction structure, or a double-hetero structure
`including an MIS junction or pn junction. The luminescence
`wavelength of the light-emitting elements 104, 114 can be
`selected according to the material used for the semiconduc(cid:173)
`tor layer and its mix crystal ratio, for example, in a range
`from ultraviolet to infrared regions.
`
`[0010] The phosphors 106, 116 are excited by visible or
`ultraviolet light with the luminescence wavelength emitted
`
`LOWES Ex. 1005 Page 0008
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`

`

`US 2005/0211991 Al
`
`Sep.29,2005
`
`2
`
`from the light-emitting elements 104, 114, and used for
`converting the light into light with longer wavelength. Thus,
`various materials may be used in consideration of the
`luminescence wavelength of the light emitted from the
`light-emitting elements 104, 114, as well as desired light
`emitted from the light-emitting apparatuses 101, 111. Espe(cid:173)
`cially, the light-emitting apparatuses are allowed to emit
`white light under conditions where the light emitted from the
`light-emitting elements 104, 114 and the light emitted from
`the phosphors 106, 116 emitting fluoresce by being excited
`by the light emitted from the light-emitting elements 104,
`114 are in a complementary-color relation to each other. The
`preferred examples of the phosphors 106, 116 in use include:
`a cerium (Ce)-activated yttrium aluminum garnet-based
`phosphor; a perylene derivative; copper (Cu).Al-activated
`zinc cadmium sulfide; manganese (Mn)-activated magne(cid:173)
`sium oxide; and manganese (Mn)-activated titanium oxide.
`The phosphors 106, 116 may be formed of either a single
`substance or a mixture of two or more different substances.
`
`In general, the phosphors 106, 116 are made in the
`[0011]
`form of a fine powder. Therefore, it is difficult for the
`phosphors 106, 116 to cover the light-emitting elements 104,
`114 on their own. In light of this, the phosphors 106, 116 are
`usually mixed into the light transmitting members 105, 115
`made of resin or the like material. The mixture is so shaped
`as to cover the light-emitting elements 104, 114 and is then
`subjected to a heat-hardening process, whereupon the light
`transmitting members 106, 116 containing the phosphors
`106, 116 can be cured. For example, the phosphors 106, 116
`are admixed in the light transmitting members 105, 115
`made of epoxy resin, silicone resin, or the like. Then, the
`light transmitting members 105, 115 containing the phos(cid:173)
`phors 106, 116 are so charged inside of the frame bodies
`103, 113 as to cover the light-emitting elements 104, 114
`from above, and is then cured with heat, thereby constituting
`a phosphor layer.
`
`[0012] As shown in FIG. 8, in preparing the phosphors
`106 to be admixed in the light transmitting member 105, by
`making an adjustment to the mixing ratio of the phosphors
`106 of primary colors: red; blue; and green, it is possible to
`set a color temperature without restraint. For example, as the
`phosphor 106 for red-color light emission, a phosphor
`having the composition of La2 0 2S:Eu (Eu-doped La2 0 2S) is
`used. As the phosphor 106 for green-color light emission, a
`phosphor having the composition of ZnS:Cu, Al is used. As
`the phosphor 106 for blue-color light emission, a phosphor
`having the composition of (BaMgA1) 100 12:Eu is used.
`
`[0013] Then, the light-emitting elements 104, 114 are
`mounted on the placement portions 102a, 112a by an
`adhesive (not shown) having conductivity, such as solder or
`Ag paste, and the light-emitting elements 104, 114 are
`electrically connected to the wiring conductor (not shown)
`arranged near the placement portions 102a, 112a by way of
`a bonding wire (not shown). After that, the light transmitting
`members 105, 115 such as epoxy resin or silicone resin that
`contains the phosphors 106, 116 are charged inside the frame
`bodies 103, 113 by an injector such as a dispenser so as to
`cover the light-emitting elements 104, 114, followed by
`performing a heat-hardening process in an oven. Hereupon,
`the desired light-emitting apparatuses 101, 111 are realized
`that are capable of producing light having a desired wave(cid:173)
`length spectrum by subjecting the light emitted from the
`
`light-emitting elements 104, 114 to wavelength conversion
`effected by the phosphors 106, 116.
`
`[0014] Related arts are disclosed in Japanese Unexamined
`Patent Publications JP-A 2003-234513, JP-A 2003-298116,
`and JP-A 2002-314142.
`
`[0015] However, the conventional light-emitting appara(cid:173)
`tus shown in FIG. 8 poses the following problems. After the
`phosphors 106 are admixed in the light transmitting member
`105, the light transmitting member 105 is charged inside the
`frame 103 and is then cured with heat. At this time, the
`phosphors 106 precipitate on the bottom side of the light
`transmitting member 105, and concurrently the phosphors
`106 covers the surface of the light-emitting element 104. As
`a result, the light emitted from the light-emitting element
`104 is confined by the phosphors 106, which leads to an
`undesirable decrease in the light extraction efficiency (the
`efficiency of taking out the light emanating from the light(cid:173)
`emitting layer of the light-emitting element 104). Further(cid:173)
`more, the precipitates of the phosphors 106 are piled up in
`strata. This causes the upper phosphors 106 to interfere with
`propagation of light that has been wavelength-converted by
`the lower phosphors 106, in consequence whereof there
`results an undesirable decrease in the radiation light inten(cid:173)
`sity in the light-emitting apparatus.
`
`[0016] The second problem is occurrence of voids. After
`the light transmitting member 105 is charged inside the
`frame 103, a heat-hardening process is performed thereon.
`At this time, air finds its way into the light transmitting
`member 105, which causes a void. If the light emitted from
`the light-emitting element 104 is absorbed by the void, the
`radiation light intensity will be decreased. Furthermore, if
`the void cuts off the light, the phosphor 106 cannot be
`uniformly radiated with the light, which results in color
`unevenness or a failure in attaining the desired color tem(cid:173)
`perature and color rendering property.
`
`[0017] Further, the conventional light-emitting apparatus
`111 shown in FIG. 9 poses the following problem. Of the
`phosphors 116, the phosphors 116a of higher specific gravity
`are prone to converge on the bottom side of the light
`transmitting member 115, whereas the phosphors 116b of
`lower specific gravity are prone to converge on the upper
`side of the light transmitting member 115 or converge above
`the phosphors 116a of higher specific gravity. As a result, of
`the phosphors 116 of two or more types, some are radiated
`heavily with the excitation light emitted from the light(cid:173)
`emitting element 114, but others are radiated poorly there(cid:173)
`with, in consequence whereof there results color-tempera(cid:173)
`ture deviation. This makes it difficult to control the color
`temperature properly.
`
`SUMMARY OF THE INVENTION
`
`[0018] The invention has been devised in view of the
`above-described problems with the related art, and accord(cid:173)
`ingly its object is to provide a light-emitting apparatus that
`succeeds in exhibiting higher radiation light intensity, in
`preventing unevenness in color of light emitted therefrom, in
`providing stable color rendering property and color tem(cid:173)
`perature, and further in stably radiating the light with desired
`color temperature even when a plurality of phosphors are
`used.
`
`LOWES Ex. 1005 Page 0009
`
`

`

`US 2005/0211991 Al
`
`Sep.29,2005
`
`3
`
`[0019] The invention provides a light-emitting apparatus
`comprising:
`
`[0020] a light-emitting element;
`
`[0021] a base body having, on its top surface, a
`placement portion for emplacing thereon the light(cid:173)
`emitting element;
`
`[0022] a frame body attached to the top surface of the
`base body so as to surround the placement portion;
`
`[0023] a light transmitting member disposed inside
`the frame body so as to cover the light-emitting
`element; and
`
`[0024] phosphors contained in the light transmitting
`member, which performs wavelength conversion on
`the light emitted from the light-emitting element,
`
`[0025] wherein the light transmitting member has a
`pre-cured viscosity ranging from 0.4 to 50 Pa.s.
`
`[0026]
`In the invention, it is preferable that the phosphors
`have a density ranging from 3.8 to 7.3 g/cm 3
`.
`[0027]
`In the invention, it is preferable that the phosphors
`are composed of a plural kinds of substances.
`
`[0028]
`In the invention, it is preferable that the phosphors
`are so prepared that a difference in specific gravity between
`the ones of highest specific gravity and the ones of lowest
`specific gravity is kept at 3.5 or below.
`
`[0029]
`In the invention, it is preferable that a phosphor
`layer made of the light transmitting member containing the
`phosphors has a thickness ranging from 0.3 to 1.5 mm and
`a volume of 1/24 to 1/6 times as much as a volume of the
`light transmitting member.
`
`[0030]
`In the invention, it is preferable that the phosphors
`have an average grain diameter ranging from 1 to 50 µm.
`
`[0031]
`In the invention, it is preferable that the light(cid:173)
`emitting element is designed to emit light exhibiting an
`emission spectrum having a peak wavelength at 450 nm or
`below, and that the light transmitting member is made of
`silicone resin or fluorine resin.
`
`[0032] The invention provides a method for manufactur(cid:173)
`ing the light-emitting apparatus, comprising the steps of:
`
`[0033] attaching a frame body on a top surface of a
`base body having a placement portion for emplacing
`a light-emitting element, so as to surround the place(cid:173)
`ment portion;
`
`[0034] emplacing the light-emitting element on the
`placement portion; and
`
`[0035] uniformly admixing phosphors in a light
`transmitting member having a pre-cured viscosity
`ranging from 0.4 to 50 Pa.s, charging the light
`transmitting member containing
`the phosphors
`inside the frame body so as to cover a surface of the
`light-emitting element, and thereafter curing the light
`transmitting member within ten minutes.
`
`[0036] The invention provides an illuminating apparatus
`constructed by setting up the above-described light-emitting
`apparatus in a predetermined arrangement.
`
`[0037] According to the invention, a light-emitting appa(cid:173)
`ratus comprises a light-emitting element; a base body hav(cid:173)
`ing, on its top surface, a placement portion for emplacing
`thereon the light-emitting element; a frame body attached to
`the top surface of the base body so as to surround the
`placement portion; a light transmitting member disposed
`inside the frame body so as to cover the light-emitting
`element; and phosphors contained in the light transmitting
`member, which performs wavelength conversion on the light
`emitted from the light-emitting element. The light transmit(cid:173)
`ting member has a pre-cured viscosity ranging from 0.4 to
`50 Pa.s. Furthermore, the phosphors have a density ranging
`from 3.8 to 7.3 g/cm3
`. In this constitution, during curing of
`the light transmitting member charged inside the frame body
`with heat, it is possible to minimize precipitation of the
`phosphors, and thereby prevent the phosphors from covering
`the surface of the light-emitting element. As a result, a
`decrease in the light extraction efficiency in relation to the
`light-emitting element, as well as light propagation loss
`ascribable to the phosphors, can be prevented successfully;
`wherefore the radiation light intensity can be increased in
`the light-emitting apparatus.
`
`[0038] Moreover, during charging of the light transmitting
`member inside the frame body, since the light transmitting
`member possesses a viscosity of appropriate level, the air
`trapped in the light transmitting member can be released
`successfully. This helps prevent appearance of a void in the
`light transmitting member effectively. As a result, several
`advantages are gained: the radiation light intensity can be
`increased; unevenness in color can be avoided; and the
`desired color temperature and color rendering property can
`be attained.
`
`[0039] According to the invention, in a case where the
`phosphors are composed of plural kinds of substances, even
`if the phosphors differ from one another in specific gravity,
`it is possible to lessen floating and precipitation of the
`phosphors. Therefore, the phosphors can be admixed and
`dispersed uniformly in the light transmitting member. Fur(cid:173)
`ther, during charging of the light transmitting member inside
`the frame body, it is possible to release bubbles into the air
`by exploiting a buoyant force with ease. The bubbles remain
`in the gap between the base body, the frame body and the
`light-emitting element, and in the light transmitting member
`and the bonding material (not shown). As a result, it is
`possible to realize a light-emitting apparatus that is excellent
`in illumination characteristics in which unevenness in color
`and unbalanced illumination distribution can be avoided on
`the light-emitting surface and on a to-be-irradiated surface,
`and light is inhibited from scattering within the light trans(cid:173)
`mitting member.
`
`[0040] According to the invention, in a case where the
`phosphors are so prepared that the difference in specific
`gravity between the ones of highest specific gravity and the
`ones of lowest specific gravity is kept at 3.5 or below, it is
`possible to reduce the difference in ascent rate and precipi(cid:173)
`tation rate among the phosphors resulting from the specific(cid:173)
`gravity difference, and thereby avoid unbalanced gathering
`of the phosphors in the light transmitting member more
`effectively. As a result, the phosphors can be dispersed
`uniformly in the light transmitting member, whereby making
`it possible to realize a light-emitting apparatus that provides
`stable color characteristics.
`
`LOWES Ex. 1005 Page 0010
`
`

`

`US 2005/0211991 Al
`
`Sep.29,2005
`
`4
`
`[0041] According to the invention, a phosphor layer made
`of the light transmitting member containing the phosphors
`has a thickness ranging from 0.3 to 1.5 mm and a volume of
`1/24 to 1/6 times as much as a volume of the light trans(cid:173)
`mitting member. This makes it possible to prevent a light
`output from getting smaller by a decrease of light propaga(cid:173)
`tion loss ascribable to diffused reflection inside the phos(cid:173)
`phors layer and an increase of the density of the phosphors
`of the light transmitting member and by a decrease of
`phosphors excited by light emitted from the light-emitting
`element.
`
`[0042] According to the invention, the phosphors have an
`average grain diameter ranging 1 to 50 µm. In a case where
`the grain diameter is more than 50 µm, a rate that the
`fluorescent light emitted from the phosphors is interfered by
`the phosphors in the light transmitting member becomes
`larger, whereby the phosphors on their own becomes
`impediments to the light propagation. As a result, it becomes
`difficult for the fluorescent light to be put out to the outside
`of the light-emitting apparatus, and the light intensity is
`decreased in the light-emitting apparatus with ease.
`
`[0043] On the other hand, in a case where the grain
`diameter is less than 1 µm, a probability that the light from
`light-emitting element propagating in the light transmitting
`member is absorbed in the phosphors becomes smaller, and
`the light from light-emitting element is put out to the outside
`with ease without undergoing wavelength conversion
`through between the phosphors. As a result, color variations
`in the light output from the light-emitting apparatus tend to
`become larger. Therefore, limiting the average grain diam(cid:173)
`eter of the phosphors to a range of 1 to 50 µm prevents the
`decrease of light intensity and the large color variations in
`the output light.
`
`[0044] According to the invention, the light-emitting ele(cid:173)
`ment is designed to emit light exhibiting an emission spec(cid:173)
`trum having a peak wavelength at 450 nm or below. More(cid:173)
`over, the light transmitting member is made of silicone resin
`or fluorine resin. In this way, several advantages are gained:
`an undesirable decrease in the transmittance of the light
`transmitting member ascribable to the high-energy light of
`short wavelength emitted from the light-emitting element
`can be prevented effectively; an undesirable decrease in the
`strength of bonding between the light-emitting element and
`the base body can be prevented effectively; an undesirable
`decrease in the strength of bonding between the base body
`and the frame body can be prevented effectively; and the
`phosphors are able to allow conversion into light of varying
`colors, for example white-color light and blue-color light,
`etc.
`
`[0045] According to the invention, a method for manu(cid:173)
`facturing the light-emitting apparatus comprises the steps of:
`attaching a frame body on a top surface of a base body
`having a placement portion for emplacing a light-emitting
`element, so as to surround the placement portion; emplacing
`the light-emitting element on the placement portion; and
`uniformly admixing phosphors in a light transmitting mem(cid:173)
`ber having a pre-cured viscosity ranging from 0.4 to 50 Pa.s,
`charging the light transmitting member containing the phos(cid:173)
`phors inside the frame body so as to cover a surface of the
`light-emitting element, and thereafter curing the light trans(cid:173)
`mitting member within ten minutes. With this manufacturing
`method, the light transmitting member can be cured while
`
`the phosphors being dispersed uniformly without precipi(cid:173)
`tating on the bottom side thereof. As a result, it is possible
`to realize a light-emitting apparatus that provides stable
`color rendering property and color temperature while mini(cid:173)
`mizing unevenness in color of the light emitted from the
`light-emitting apparatus.
`
`[0046] According to the invention, the illuminating appa(cid:173)
`ratus is constructed by setting up the above-described light(cid:173)
`emitting apparatus in a predetermined arrangement. In this
`illuminating apparatus, light emission is effected by exploit(cid:173)
`ing recombination of electrons in the light-emitting element
`composed of a semiconductor. Thus, the illuminating appa(cid:173)
`ratus can be made compact and have the advantage, in terms
`of power saving and long lifetime, over a conventional
`illuminating apparatus for effecting light emission through
`electrical discharge. As a result, variation in the center
`wavelength of the light emitted from the light-emitting
`element can be suppressed; wherefore the illuminating appa(cid:173)
`ratus is capable of irradiating light with stable radiation light
`intensity and stable radiation light angle (luminous intensity
`distribution) for a longer period of time. Moreover, uneven(cid:173)
`ness in color and unbalanced illumination distribution can be
`prevented from occurring on a to-be-irradiated surface.
`
`[0047] Moreover, by setting up the light-emitting appara(cid:173)
`tuses of the invention in a predetermined arrangement as
`light sources, followed by arranging around the light-emit(cid:173)
`ting apparatuses such a component as is optically designed
`in a given configuration, for example a reflection jig, an
`optical lens, and a light diffusion plate, it is possible to
`realize an illuminating apparatus which is capable of emit(cid:173)
`ting light with given luminous intensity distribution.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0048] Other and further objects, features, and advantages
`of the invention will be more explicit from the following
`detailed description taken with reference to the drawings
`wherein:
`
`[0049] FIG. 1 is a sectional view showing a light-emitting
`apparatus in accordance with a first embodiment of the
`invention;
`[0050] FIG. 2 is a sectional view showing a light-emitting
`apparatus in accordance with a second embodiment of the
`invention;
`
`[0051] FIG. 3 is a sectional view showing a light-emitting
`apparatus in accordance with a third embodiment of the
`invention;
`
`[0052] FIG. 4 is a top view showing an illuminating
`apparatus in accordance with a fourth embodiment of the
`invention;
`
`[0053] FIG. 5 is a sectional view of the illuminating
`apparatus shown in FIG. 4;
`
`[0054] FIG. 6 is a top view showing an illuminating
`apparatus in accordance with a fifth embodiment of the
`invention;
`
`[0055] FIG. 7 is a sectional view of the illuminating
`apparatus shown in FIG. 6;
`
`[0056] FIG. 8 is a sectional view showing a conventional
`light-emitting apparatus; and
`
`LOWES Ex. 1005 Page 0011
`
`

`

`US 2005/0211991 Al
`
`Sep.29,2005
`
`5
`
`[0057] FIG. 9 is a sectional view showing another con(cid:173)
`ventional light-emitting apparatus.
`
`DETAILED DESCRIPTION OF IBE
`PREFERRED EMBODIMENTS
`
`[0058] Now referring to the drawing, preferred embodi(cid:173)
`ments of the invention are described below.
`
`[0059] Now, a detailed description will be given below as
`to a light-emitting apparatus according to the invention.
`FIG. 1 is a sectional view showing the light-emitting
`apparatus 1 in accordance with a first embodiment of the
`invention. The light-emitting apparatus 1 comprises a base
`body 2, a frame body 3, a light-emitting element 4, a light
`transmitting member 5, and phosphors 6. Thus, the light(cid:173)
`emitting apparatus 1 for housing therein a light-emitting
`element 4 is configured.
`
`[0060] The base body 2 has, on its top surface, a placement
`portion 2a for emplacing thereon the light-emitting element
`4. The frame body 3 is attached to the top surface of the base
`body 2 so as to surround the placement portion 2a. The
`frame body 3 has its inner peripheral surface shaped into a
`reflection surface for reflecting light emitted from the light(cid:173)
`emitting element 4. The
`light-emitting element 4 is
`emplaced on the placement portion 2a. The light transmit(cid:173)
`ting member 5 comprises the phosphors 6 for performing
`wavelength conversion on the light emitted from the light(cid:173)
`emitting element 4.
`
`[0061] The base body 2 is formed as an insulator by using
`a ceramics material such as sintered aluminum oxide, sin(cid:173)
`tered aluminum nitride, sintered mullite, or glass ceramics,
`or a resin material such as epoxy resin or liquid crystal
`polymer. The base body 2 serves also as a supporting
`member for supporting
`the
`light-emitting element 4
`emplaced on the placement portion 2a formed on the top
`surface thereof.
`
`[0062] Moreover, on the surface and in the interior of the
`base body 2 are formed metallized wiring layers (not shown)
`made of powder of a metal such as W, Mo, or Mn for
`electrically conductively connecting within and without the
`light-emitting apparatus 1. The electrode of the light-emit(cid:173)
`ting element 4 is electrically connected to the metallized
`wiring layer exposed at the placement portion 2a formed on
`the top surface of the base body 2 with use of a bonding
`material such as Au-Sn eutectic solder or a bonding wire.
`Then, a lead terminal (not shown) made of a metal such as
`Cu or an Fe-Ni alloy is bonded to the metallized wiring
`layer exposed on the outer surface, for example the under
`surface, of the base body 2.
`
`In the case of forming the base body 2 from a
`[0063]
`ceramics material, on the top surface thereof is formed a
`wiring conductor (not shown) by firing a metal paste of W
`or Mo-Mn at high temperature. On the other hand, in the
`case of forming the base body 2 from a resin material, a
`molded lead terminal made of Cu or an Fe-Ni alloy is
`fixedly arranged within the base body 2. The frame body 3
`is bonded to the top surface of the base body 2 so as to
`surround the placement portion 2a with use of solder, or a
`brazing filler material such as an Ag paste, or a resin
`adhesive such as epoxy resin.
`
`[0064]
`It is preferable that the metallized wiring layer has
`its exposed surface coated with a highly corrosion-resistant
`
`metal such as Ni and gold (Au) in the thickness ranging from
`1 to 20 µm. This makes it possible to protect the metallized
`wiring layer against oxidative corrosion effectively, and also
`to strengthen the connection between the metallized wiring
`layer and the light-emitting element 4, as well as the
`connection between the metallized wiring layer and the
`bonding wire. Accordingly, the exposed surface of the
`metallized wiring layer should preferably be coated with a 1
`to 10 µm-thick Ni plating layer and a 0.1 to 3 µm-thick Au
`plating layer successively by the electrolytic plating method
`or electroless plating method.
`
`[0065] Moreover, onto the top surface of the base body 2
`is attached the frame body 3 so as to surround the light(cid:173)
`emitting element 4 emplaced on the placement portion 2a
`formed on the top surface of the base body 2, with use of an
`inorganic adhesive such as solder, sol-gel glass, or low(cid:173)
`melting-point glass, or an organic