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`Home > Developers > Documents > USB 2.0 Documents
`USB 2.0 Documents Index
`
`Developers
`
`Members
`
`Products
`
`USB 2.0 Specification
`
`USB 2.0 Adopters Agreement
`
`USB 2.0 On-The-Go Specification Supplement Adopters Agreement
`Low Voltage Inter-Chip Adopters Agreement Amendment
`High-Speed Inter-Chip Adopters Agreement Amendment
`Intellectual Property Rights Notice
`USB 2.0 Icon Design Guideline
`
`
`
`
`
`USB 2.0 Specification
`Universal Serial Bus Revision 2.0 specification (.zip file format, size 78.8 MB) provides the technical
`details to understand USB requirements and design USB compatible products. Modifications to the USB
`specification are made through Engineering Change Notices (ECNs). Enclosed in this zip file are the
`following documents:
`
`1. The Original USB 2.0 specification released on April 27, 2000
`2. USB 2.0 Adopters Agreement
`3. Errata to the USB 2.0 specification as of December 7, 2000
`4. Mini-B connector Engineering Change Notice to the USB 2.0 specification
`5. Pull-up/pull-down Resistors Engineering Change Notice to the USB 2.0 specification
`6. Errata to the USB 2.0 specification as of May 28, 2002
`7. Interface Association Descriptor Engineering Change Notice to the USB 2.0 specification
`8. Rounded Chamfer Engineering Change Notice to the USB 2.0 specification as of October 8, 2003
`9. Unicode Engineering Change Notice to the USB 2.0 specification as of February 21, 2005
`10. Inter-Chip USB Supplement Revision 1.0 as of March 13, 2006
`11. Micro-USB Cables and Connectors Specification Revision 1.01 as of April 4, 2007 and
`corresponding Adopters Agreement
`12. USB 2.0 Link Power Management Addendum Engineering Change Notice to the USB 2.0
`specification as of July 16, 2007
`13. High-Speed Inter-Chip USB Electrical Specification Revision 1.0 as of September 23, 2007
`14. Suspend Current Limit Changes Engineering Change Notice to the USB 2.0 Specification as of
`April 9, 2008
`15. 5V Short Circuit Withstand Requirement Change Engineering Change Notice to the USB 2.0
`Specification as of December 22, 2008
`16. Device Capacitance Engineering Change Notice to the USB 2.0 Specification as of December 22,
`2008
`17. Material Change Engineering Change Notice to the USB 2.0 Specification as of December 22,
`2008
`18. USB 2.0 Phase-locked SOFs Engineering Change Notice to the USB 2.0 Specification as of
`December 22, 2008
`19. Micro-USB Micro-B ID Pin Resistance and Tolerance stack-up between D+ and D- Engineering
`Change Notice to the MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 as of
`December 22, 2008
`20. Quad Type Cable Additional for Micro USB ECN as of December 29, 2009
`21. Clarification on the Chamfer on USB 2.0 Micro Connectors ECN as of March 23, 2010
`22. Maximum Unmating Force Value Definition to USB 2.0 Micro Connectors ECN as of March 23,
`2010
`23. "On-The-Go Supplement to the USB 2.0 Specification" Adopters Agreement
`24. USB TEST_MODE Selector Values ECN as of July 26, 2010
`25. Errata for USB 2.0 ECN: Link Power Management (LPM) - 7/2007 as of October 11, 2011
`26. On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0
`version 1.1a as of July 27, 2012
`27. HSIC ECN as of May 21, 2012
`28. USB 2.0 Connect Timing ECN Update as of April 4, 2013
`29. HSIC Disconnect Supplement ECN as of September 18, 2013
`30. USB 2.0 VBUS Max Limit ECN as of August 11, 2014
`
`

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`31. Embedded USB2 (eUSB2) Physical Layer Supplement to the USB Revision 2.0 Specification
`dated August 1, 2014
`32. USB OTG EH ECN Maximum Vbus Voltage dated November 26, 2014
`33. USB Type-CTM Cable and Connector Specification Revision 1.3, July 14, 2017 and ECNs
`34. USB Type-CTM Port Controller Interface Specification as of November, 2016
`35. USB Power Delivery Specification Rev. 3.0, Version 1.1, January 12, 2017, ECNs, and
`corresponding Adopters Agreement
`
`36. USB Authentication Specification Rev. 1.0 including ECN and Errata through February 2, 2017
`
`Please check this site for any future updates to the USB 2.0 specification.
`
`LIMITED COPYRIGHT LICENSE
`
`The USB 3.0 Promoters grant a conditional copyright license under the copyrights embodied in the USB
`Type-CTM Cable and Connector Specification to use and reproduce the Specification for the sole
`purpose of, and solely to the extent necessary for, evaluating whether to implement the Specification in
`products that would comply with the specification. Without limiting the foregoing, use of the Specification
`for the purpose of filing or modifying any patent application to target the Specification or USB compliant
`products is not authorized. Except for this express copyright license, no other rights or licenses are
`granted, including without limitation any patent licenses. In order to obtain any additional intellectual
`property licenses or licensing commitments associated with the Specification a party must execute the
`USB 3.0 Adopters Agreement. NOTE: By using the Specification, you accept these license terms on
`your own behalf and, in the case where you are doing this as an employee, on behalf of your employer.
`
`LEGAL DISCLAIMER
`
`THIS SPECIFICATION IS PROVIDED "AS IS" AND WITHOUT ANY WARRANTY OF ANY KIND,
`EXPRESSED OR IMPLIED. WITHOUT LIMITATION, THERE IS NO WARRANTY OF NON-
`INFRINGEMENT, NO WARRANTY OF MERCHANTABILITY, AND NO WARRANTY OF FITNESS FOR
`A PARTICULAR PURPOSE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED.
`
`USER ASSUMES THE FULL RISK OF USING THIS SPECIFICATION. IN NO EVENT SHALL USB-IF
`BE LIABLE FOR ANY ACTUAL, DIRECT, INDIRECT, PUNITIVE, OR CONSEQUENTIAL DAMAGES
`ARISING FROM SUCH USE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
`
`USB 2.0 Adopters Agreement
`USB 2.0 Adopters Agreement (.pdf file format, size 28k)
`The USB 2.0 Adopters Agreement allows a signing company to participate in a reciprocal, royalty-free
`licensing arrangement for compliant products. Any USB 2.0 Adopters Agreement shall only be effective
`if received within one (1) year after first sale of products that include 'Compliant Products'. See the USB
`2.0 Adopters Agreement for details.
`
`USB 2.0 On-The-Go Specification Supplement Adopters Agreement
`The USB 2.0 Promoters have voted to adopt an addendum to the USB 2.0 Specification designated
`"On-The-Go Supplement to the USB 2.0 Specification" (the "Specification Supplement"). A copy of the
`Specification Supplement is located at: www.usb.org/developers/onthego). This letter is to provide USB
`2.0 Adopters the option of extending their Adopter Agreement to address this new Spec Supplement (the
`Spec Supplement exceeds the scope of your original USB 2.0 Adopters Agreement, which is specific to the
`USB 2.0 Specification).
`
`Adopters are under no obligation to amend their Adopters Agreement. However, those Parties that are
`Adopters as of the date of this Amendment Letter wishing to amend their Adopters Agreement must have
`the Amendment Letter (.pdf file format, size 16k) executed by a duly authorized representative and return
`the original signed letter to the address below to expand the scope of their Adopters Agreement. Once you
`have signed the Amendment Letter, return the original to the USB 2.0 Promoter Group at:
`
`USB 2.0 Promoter Group
`
`3855 SW 153rd Drive
`Beaverton, OR 97003
`USA
`
`Low Voltage Inter-Chip Adopters Agreement Amendment
`
`The USB 2.0 Promoters have voted to adopt an addendum to the USB 2.0 Specification designated
`"Low Voltage Inter-Chip Supplement to the USB 2.0 Specification" ("Spec Supplement", posted with the
`USB 2.0 spec above) and to provide USB 2.0 Adopters the option of extending their Adopter Agreement
`to address this new Spec Supplement (the Spec Supplement exceeds the scope of your original USB
`2.0 Adopters Agreement, which is specific to the USB 2.0 Specification).
`
`Adopters are under no obligation to amend their Adopters Agreement. However, those Parties that are
`Adopters as of the date of this Amendment Letter wishing to amend their Adopters Agreement must
`have the Amendment Letter (.pdf file format, size 12k) executed by a duly authorized representative and
`return the original signed letter to the address below by no later than March 20, 2007 to expand the
`
`

`

`scope of their Adopters Agreement. Parties becoming Adopters after the date of this Amendment Letter
`may amend their Adopters Agreement by signing and returning this Amendment Letter to the address
`below within their Adoption Period. Responses from existing USB 2.0 Adopters post marked after the
`applicable deadline are considered null and void. Once you have signed the Amendment Letter, return
`the original to the USB 2.0 Promoter Group at:
`
`USB 2.0 Promoter Group
`
`3855 SW 153rd Drive
`
`Beaverton, OR 97003
`USA
`
`High-Speed Inter-Chip Adopters Agreement Amendment
`
`The USB 2.0 Promoters have voted to adopt an addendum to the USB 2.0 Specification designated "High-
`Speed Inter-Chip Supplement to the USB 2.0 Specification" ("Spec Supplement", posted with the USB 2.0
`spec above) and to provide USB 2.0 Adopters the option of extending their Adopter Agreement to address
`this new Spec Supplement (the Spec Supplement exceeds the scope of your original USB 2.0 Adopters
`Agreement, which is specific to the USB 2.0 Specification).
`
`Adopters are under no obligation to amend their Adopters Agreement. However, those Parties that
`are Adopters wishing to amend their Adopters Agreement must have the Amendment Letter (.pdf file
`format, size 68k) executed by a duly authorized representative to expand the scope of their Adopters
`Agreement. Once you have signed the Amendment Letter, return the original to the USB 2.0 Promoter
`Group at:
`
`USB 2.0 Promoter Group
`
`3855 SW 153rd Drive
`
`Beaverton, OR 97003
`USA
`
`Intellectual Property Rights Notices
`This page contains links to a reproduction of letters received by the USB-IF from patent owners asserting
`intellectual property rights that may be pertinent to the implementation of a USB specification. For specific
`information regarding the licensing of intellectual property rights arising from a particular USB Specification,
`the reader should consult the appropriate USB Adopters Agreement for that specification.
`
`Notice to all readers: The USB-IF is providing this information as a courtesy to our members 'AS IS' and
`without warranty of any kind. The USB-IF is not responsible for content of the individual postings. The
`USB-IF will not be responsible for identifying patents for which a license may be required by a USB
`Specification nor for conducting inquiries into the legal validity or scope of those patents that are brought to
`its attention.
`
`USB 2.0 Design Guideline
`
`USB 2.0 Icon Design Guideline This design guideline provides a recommendation to PC OEMs on how to
`distinguish USB 2.0 ports to address the scenario where a high-speed device is plugged into a Original
`USB (full/low-speed) port
`
`Compliance Updates
`
`Please review the USB-IF Compliance Updates webpage frequently and subscribe to the news feed for the
`latest information regarding the USB-IF Compliance Program.
`
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