`
`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`First Inventor Name: Hirofumi ICHIKAWA
`
`Title:
`
`LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN(cid:173)
`MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE,
`RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Prior Appl. No.:
`
`13/969,182
`
`Prior Appl. Filing
`Date:
`
`8/16/2013
`
`Examiner:
`
`Unassigned
`
`Art Unit:
`
`Unassigned
`
`CONTINUING PATENT APPLICATION
`TRANSMITTAL LETTER
`
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-14 5 0
`
`Commissioner:
`
`Transmitted herewith for filing under 37 C.F.R. § 1.53(b) is a:
`
`[ X] Continuation
`
`[ ] Division
`
`[ ] Continuation-In-Part (CIP)
`
`of the above-identified copending prior application in which no patenting, abandonment, or
`
`termination of proceedings has occurred. Priority to the above-identified prior application is
`
`hereby claimed under 35 U.S.C. § 120 for this continuing application. The entire disclosure of
`
`the above-identified prior application is considered as being part of the disclosure of the
`
`accompanying continuing application and is hereby incorporated by reference therein.
`
`Enclosed are:
`
`[ X ] Description, Claim(s ), and Abstract ( 48 pages).
`
`4810-7351-7354.1
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`-1-
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`VIZIO Ex. 1002 Page 0001
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`Atty. Dkt. No. 100415-0198
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`[ x] Formal drawings (13 sheets, Figures 1-19D).
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`[ x] Executed Declaration ( 4 pages).
`
`[ x] Power of Attorney (1 pages).
`
`[ x] 3.73(c) statement.
`
`[ x]
`
`Information Disclosure Statement.
`
`[ x] Form PTO-SB08.
`
`[ x] Preliminary Amendment ( 4 pages)
`
`[ x] Application Data Sheet (37 CFR 1.76).
`
`The adjustment to the number of sheets for EFS-Web filing follows:
`
`Number of
`Sheets
`65
`
`x
`
`EFS-Web
`Adjustment
`75%
`
`Number of Sheets for EFS-Web
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`49
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`The filing fee is calculated below at the large entity rate:
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`4810-7351-7354.1
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`-2-
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`VIZIO Ex. 1002 Page 0002
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`Atty. Dkt. No. 100415-0198
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`Number
`Filed
`
`Included
`in
`Basic Fee
`
`Extra
`
`Rate
`
`Fee
`Totals
`
`$280.00
`
`$600.00
`$720.00
`
`$0.00
`$800.00
`$420.00
`$0.00
`$0.00
`
`$0.00
`$0.00
`$2820.00
`$0.00
`$0.00
`
`$2820.00
`
`$280.00
`
`$600.00
`$720.00
`
`$400.00
`$80.00
`$420.00
`$780.00
`$140.00
`
`Basic Filing
`Fee
`Search Fee
`Examination
`Fee
`49
`Size Fee
`100
`20
`Total Claims:
`30
`4
`Independents:
`3
`If any Multiple Dependent Claim(s) present:
`Surcharge under 3 7 CFR 1.16( e) for late filing of
`Executed Declaration or late payment of filing fee
`Prioritized Examination fee (Track I) under 3 7 C .F .R. § 1.17 ( c)
`Processing Fee (Track I) under 37 C.F.R. § 1.17 (i)
`TOTAL FILING FEE:
`+
`Assignment Recordation Fee:
`$40.00
`Processing Fee under 37 CFR 1.17(i) for Late Filing +
`$140.00
`of English Translation of Application:
`TOTAL FEE
`
`0
`10
`1
`
`x
`x
`x
`+
`+
`
`The above-identified fees of $2820.00 are being paid by credit card via EFS-Web.
`
`The Commissioner is hereby authorized to charge any additional fees which may be
`
`required regarding this application under 3 7 C.F.R. § § 1.16-1.17, or credit any overpayment, to
`
`Deposit Account No. 19-0741. Should no proper payment be enclosed herewith, as by the credit
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`card payment instructions in EFS-Web being incorrect or absent, resulting in a rejected or
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`incorrect credit card transaction, the Commissioner is authorized to charge the unpaid amount to
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`Deposit Account No. 19-0741.
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`4810-7351-7354.1
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`VIZIO Ex. 1002 Page 0003
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`Atty. Dkt. No. 100415-0198
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`Please direct all correspondence to the undersigned attorney or agent at the address
`
`indicated below.
`
`Respectfully submitted,
`
`Date October 30, 2015
`
`By /Stephen B. Maebius/
`
`FOLEY & LARDNER LLP
`Customer Number: 22428
`Telephone:
`(202) 672-5569
`Facsimile:
`(202) 672-5399
`
`Stephen B. Maebius
`Attorney for Applicant
`Registration No. 35,264
`
`4810-7351-7354.1
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`-4-
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`VIZIO Ex. 1002 Page 0004
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`
`
`PTO/AIN14 (07-14)
`Approved for use through 04/30/2017. OMB 0651-0032
`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
`
`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`Title of Invention
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`The application data sheet is part of the provisional or nonprovisional application for which it is being submitted. The following form contains the
`bibliographic data arranged in a format specified by the United States Patent and Trademark Office as outlined in 37 CFR 1.76.
`This document may be completed electronically and submitted to the Office in electronic format using the Electronic Filing System (EFS) or the
`document may be printed and included in a paper filed application.
`
`Secrecy Order 37 CFR 5.2
`D Portions or all of the application associated with this Application Data Sheet may fall under a Secrecy Order pursuant to
`37 CFR 5.2 (Paper filers only. Applications that fall under Secrecy Order may not be filed electronically.)
`
`Inventor Information:
`
`1
`Inventor
`Legal Name
`
`I Remove I
`
`Prefix Given Name
`
`Middle Name
`
`Family Name
`
`Suffix
`
`ICHIKAWA
`Hirofumi
`Residence Information (Select One) 0 US Residency
`(!) Non US Residency 0 Active US Military Service
`Komatsushima-shi
`I JP
`City
`!country of Residence i
`
`Mailing Address of Inventor:
`
`Address 1
`
`c/o NICHIA CORPORATION
`
`Address 2
`
`491-100, Oka, Kaminaka-cha
`I Anan-shi, Tokushima
`Postal Code
`1 774-8601
`
`City
`
`2
`Inventor
`Legal Name
`
`I State/Province
`I JP
`I Country i
`
`I
`
`I Remove I
`
`Prefix Given Name
`
`Middle Name
`
`Family Name
`
`Suffix
`
`HAYASHI
`Masaki
`Residence Information (Select One) 0 US Residency
`(!) Non US Residency 0 Active US Military Service
`Anan-shi
`I JP
`City
`!country of Residence i
`
`Mailing Address of Inventor:
`
`Address 1
`
`c/o NICHIA CORPORATION
`
`City
`
`Address 2
`
`491-100, Oka, Kaminaka-cha
`I Anan-shi, Tokushima
`I 774-8601
`Postal Code
`
`3
`Inventor
`Legal Name
`
`EFS Web 2.2.12
`
`I State/Province
`I JP
`I Country i
`
`I
`
`I Remove I
`
`VIZIO Ex. 1002 Page 0005
`
`
`
`PTO/AIN14 (07-14)
`Approved for use through 04/30/2017. OMB 0651-0032
`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
`
`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`Title of Invention
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Prefix Given Name
`
`Middle Name
`
`Family Name
`
`Suffix
`
`SASAO KA
`Shimpei
`Residence Information (Select One) 0 US Residency
`(!) Non US Residency 0 Active US Military Service
`Tokushima-shi
`City
`!country of Residence i
`I JP
`
`Mailing Address of Inventor:
`
`Address 1
`
`c/o NICHIA CORPORATION
`
`City
`
`Address 2
`
`491-100, Oka, Kaminaka-cha
`I Anan-shi, Tokushima
`I 774-8601
`Postal Code
`
`4
`Inventor
`Legal Name
`
`I State/Province
`I JP
`I Country i
`
`I
`
`I Remove I
`
`Prefix Given Name
`
`Middle Name
`
`Family Name
`
`Suffix
`
`MIKI
`Tomohide
`(!) Non US Residency O Active US Military Service
`Residence Information (Select One) 0 US Residency
`Tokushima-shi
`City
`!country of Residence i
`
`I JP
`
`Mailing Address of Inventor:
`
`Address 1
`
`c/o NICHIA CORPORATION
`
`City
`
`Address 2
`
`491-100, Oka, Kaminaka-cha
`I State/Province
`I Anan-shi, Tokushima
`I 774-8601
`I JP
`I Country i
`Postal Code
`All Inventors Must Be Listed - Additional Inventor Information blocks may be
`generated within this form by selecting the Add button.
`
`I
`
`I Add
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`I
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`Correspondence Information:
`Enter either Customer Number or complete the Correspondence Information section below.
`For further information see 37 CFR 1.33(a).
`D An Address is being provided for the correspondence Information of this application.
`22428
`Customer Number
`
`Email Address
`
`IPDocketing@foley.com
`
`I I Add Email I
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`!Remove Emaill
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`EFS Web 2.2.12
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`VIZIO Ex. 1002 Page 0006
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`PTO/AIN14 (07-14)
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`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
`
`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`Title of Invention
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Application Information:
`LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITIING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`I Small Entity Status Claimed D
`Attorney Docket Number 100415-0198
`
`Title of the Invention
`
`Application Type
`
`Nonprovisional
`
`Subject Matter
`
`Utility
`
`Total Number of Drawing Sheets (if any)
`Filing By Reference:
`Only complete this section when filing an application by reference under 35 U.S.C. 111 (c) and 37 CFR 1.57(a). Do not complete this section if
`application papers including a specification and any drawings are being filed. Any domestic benefit or foreign priority information must be
`provided in the appropriate section(s) below (i.e., "Domestic Benefit/National Stage Information" and "Foreign Priority Information").
`
`I Suggested Figure for Publication (if any) I
`
`I 13
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`For the purposes of a filing date under 37 CFR 1.53(b), the description and any drawings of the present application are replaced by this
`reference to the previously filed application, subject to conditions and requirements of 37 CFR 1.57(a).
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`Application number of the previously
`filed application
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`Filing date (YYYY-MM-DD)
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`.-
`Intellectual Property Authority or Country 1
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`Publication Information:
`D Request Early Publication (Fee required at time of Request 37 CFR 1.219)
`Request Not to Publish. I hereby request that the attached application not be published under
`D 35 U.S.C. 122(b) and certify that the invention disclosed in the attached application has not and will not be the
`subject of an application filed in another country, or under a multilateral international agreement, that requires
`publication at eighteen months after filing.
`
`Representative Information:
`
`Representative information should be provided for all practitioners having a power of attorney in the application. Providing
`this information in the Application Data Sheet does not constitute a power of attorney in the application (see 37 CFR 1.32).
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`Number will be used for the Representative Information during processing.
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`Please Select One:
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`Customer Number
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`® Customer Number
`22428
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`I 0 US Patent Practitioner lo Limited Recognition (37 CFR 11.9)
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`EFS Web 2.2.12
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`VIZIO Ex. 1002 Page 0007
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`
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`PTO/AIN14 (07-14)
`Approved for use through 04/30/2017. OMB 0651-0032
`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
`
`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`Title of Invention
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Domestic Benefit/National Stage Information:
`This section allows for the applicant to either claim benefit under 35 U.S.C. 119(e), 120, 121, 365(c), or 386(c) or indicate National
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`Prior Application Status
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`Application Number
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`Continuity Type
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`Prior Application Number
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`Continuation of
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`13/969182
`
`Prior Application Status
`
`Application Number
`
`Continuity Type
`
`Prior Application Number
`
`13/969182
`
`Continuation of
`
`12/737940
`
`Prior Application Status
`
`Application Number
`
`Continuity Type
`
`Prior Application Number
`
`I Remove I
`Filing Date (YYYY-MM-DD)
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`2013-08-16
`I Remove I
`Filing Date (YYYY-MM-DD)
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`2011-05-13
`I Remove I
`Filing Date (YYYY-MM-DD)
`
`12/737940
`
`a 371 of international
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`PCT/JP2009/004170
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`by selecting the Add button.
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`2009-08-27
`I Add I
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`constitutes the claim for priority as required by 35 U.S.C. 119(b) and 37 CFR 1.55. When priority is claimed to a foreign application
`that is eligible for retrieval under the priority document exchange program (POX) ~he information will be used by the Office to
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`property office, or a certified copy of the foreign priority application is filed, within the lime period specified in 37 CFR 1.55(g)(1 ).
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`2008-225408
`2008-09-03
`JP
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`PTO/AIN14 (07-14)
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`
`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`Title of Invention
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Statement under 37 CFR 1.55 or 1. 78 for AIA (First Inventor to File) Transition
`Applications
`
`This application (1) claims priority to or the benefit of an application filed before March 16, 2013 and (2) also
`contains, or contained at any time, a claim to a claimed invention that has an effective filing date on or after March
`D 16, 2013.
`NOTE: By providing this statement under 37 CFR 1.55 or 1.78, this application, with a filing date on or after March
`16, 2013, will be examined under the first inventor to file provisions of the AIA.
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`Authorization to Permit Access:
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`~ Authorization to Permit Access to the Instant Application by the Participating Offices
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`the Japan Patent Office (JPO), the Korean Intellectual Property Office (KIPO), the World Intellectual Property Office (WIPO),
`and any other intellectual property offices in which a foreign application claiming priority to the instant patent application
`is filed access to the instant patent application. See 37 CFR 1.14(c) and (h). This box should not be checked if the applicant
`does not wish the EPO, JPO, KIPO, WIPO, or other intellectual property office in which a foreign application claiming priority
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`to: 1) the instant patent application-as-filed; 2) any foreign application to which the instant patent application
`claims priority under 35 U.S.C. 119(a)-(d) if a copy of the foreign application that satisfies the certified copy requirement of
`37 CFR 1.55 has been filed in the instant patent application; and 3) any U.S. application-as-filed from which benefit is
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`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`Title of Invention MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`I Remove I
`
`Applicant 1
`If the applicant is the inventor (or the remaining joint inventor or inventors under 37 CFR 1.45), this section should not be completed.
`The information to be provided in this section is the name and address of the legal representative who is the applicant under 37 CFR
`1.43; or the name and address of the assignee, person to whom the inventor is under an obligation to assign the invention, or person
`who otherwise shows sufficient proprietary interest in the matter who is the applicant under 37 CFR 1.46. If the applicant is an
`applicant under 37 CFR 1.46 (assignee, person to whom the inventor is obligated to assign, or person who otherwise shows sufficient
`proprietary interest) together with one or more joint inventors, then the joint inventor or inventors who are also the applicant should be
`identified in this section.
`
`Clear
`
`I
`lo Joint Inventor
`
`I
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`lo Legal Representative under 35 U.S.C. 117
`® Assignee
`lo
`0 Person to whom the inventor is obligated to assign.
`If applicant is the legal representative, indicate the authority to file the patent application, the inventor is:
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`Person who shows sufficient proprietary interest
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`Name of the Deceased or Legally Incapacitated Inventor : I
`
`If the Applicant is an Organization check here.
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`~
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`Organization Name
`
`I NICHIA CORPORATION
`
`Mailing Address Information For Applicant:
`
`I
`
`Address 1
`
`Address 2
`
`City
`
`Country ii JP
`
`Phone Number
`
`Email Address
`
`491-100, Oka, Kaminaka-cha
`
`Anan-shi, Tokushima
`
`State/Province
`
`Postal Code
`
`774-8601
`
`Fax Number
`
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`
`I Add I
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`have an assignment recorded by the Office.
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`Assignee 1
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`Complete this section if assignee information, including non-applicant assignee information, is desired to be included on the patent
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`publication as an applicant. For an assignee-applicant, complete this section only if identification as an assignee is also desired on the
`patent application publication.
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`PTO/AIN14 (07-14)
`Approved for use through 04/30/2017. OMB 0651-0032
`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
`
`Application Data Sheet 37 CFR 1.76
`
`Attorney Docket Number
`
`100415-0198
`
`Application Number
`
`Title of Invention
`
`LIGHT EMITIING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Organization Name
`
`I NICHIA CORPORATION
`
`Mailing Address Information For Assignee including Non-Applicant Assignee:
`
`Address 1
`
`Address 2
`
`City
`
`Country i
`
`I JP
`
`Phone Number
`
`Email Address
`
`491-100, Oka, Kaminaka-cha
`
`I Anan-shi, Tokushima
`
`State/Province
`
`Postal Code
`
`774-8601
`
`Fax Number
`
`Additional Assignee or Non-Applicant Assignee Data may be generated within this form by
`selecting the Add button.
`
`I Add
`
`I
`
`.
`Signature·
`NOTE: This form must be signed in accordance with 37 CFR 1.33. See 37 CFR 1.4 for signature requirements and
`certifications.
`
`Remove
`
`Signature
`
`/Stephen B. Maebius/
`
`Date (YYYY-MM-DD) 2015-10-30
`
`First Name
`
`Stephen B.
`
`I Last Name
`
`I Maebius
`
`Additional Signature may be generated within this form by selecting the Add button.
`
`35264
`Registration Number
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`This collection of information is required by 37 CFR 1.76. The information is required to obtain or retain a benefit by the public which
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`EFS Web 2.2.12
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`VIZIO Ex. 1002 Page 0011
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`Privacy Act Statement
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`VIZIO Ex. 1002 Page 0012
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`
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`Atty. Dkt. No. 100415-0198
`
`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`First Inventor Name:
`
`Hirofumi ICHIKAWA
`
`Title:
`
`LIGHT EMITTING DEVICE, RESIN PACKAGE,
`RESIN-MOLDED BODY, AND METHODS FOR
`MANUFACTURING LIGHT EMITTING DEVICE,
`RESIN PACKAGE AND RESIN-MOLDED BODY
`
`Appl. No.:
`
`Unassigned
`
`Filing Date:
`
`10/30/2015
`
`Examiner:
`
`Art Unit:
`
`Unassigned
`
`Unassigned
`
`Confirmation Number: Unassigned
`
`PRELIMINARY AMENDMENT UNDER 37CFR1.115
`
`Mail Stop AMENDMENT
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-14 5 0
`
`Commissioner:
`
`Prior to examination of the present Continuing Application, Applicant respectfully
`
`requests that the application be amended as follows:
`
`Amendments to the Specification begin on page 2 of this document.
`
`Remarks/ Arguments begin on page 3 of this document.
`
`Please amend the application as follows:
`
`4834-2167-2234.1
`
`-1-
`
`VIZIO Ex. 1002 Page 0013
`
`
`
`Amendments to the Specification:
`
`Please amend paragraph [0001] of specification as follows:
`
`Atty. Dkt. No. 100415-0198
`
`L~,1,~gEitJ.fa, .. ;~.QJI, .. :..:Yl!,i.'o~LLiXU~UJILJ,i .. ~~--continuation of U.S. Patent Application No. 12/737,940,
`
`filed on May 13, 2011, which issued as U.S. Patent No. 8,530,250 on September 10, 2013.
`
`4834-2167-2234.1
`
`-2-
`
`VIZIO Ex. 1002 Page 0014
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`
`
`Atty. Dkt. No. 100415-0198
`
`REMARKS
`
`Applicant respectfully requests that the foregoing amendments be made prior to
`
`examination of the present application.
`
`Applicant believes that the application is in condition for allowance. Favorable
`
`consideration is respectfully requested.
`
`The Examiner is invited to contact the undersigned by telephone if it is felt that a
`
`telephone interview would advance prosecution.
`
`Respectfully submitted,
`
`Date Oct. 30, 2015
`
`By /Stephen B. Maebius/
`
`FOLEY & LARDNER LLP
`Customer Number: 22428
`Telephone:
`(202) 672-5569
`Facsimile:
`(202) 672-5399
`
`Stephen B. Maebius
`Attorney for Applicant
`Registration No. 35,264
`
`4834-2167-2234.1
`
`-3-
`
`VIZIO Ex. 1002 Page 0015
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`
`
`Attv. Dkt. No. 100415-0134
`
`LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND
`
`METHODS FOR MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE
`
`AND RESIN-MOLDED BODY
`
`CROSS-REFERENCE TO RELATED APPLICATIONS
`
`[0001]
`
`This application is a continuation of U.S. Patent Application No. 12/737,940, filed on
`
`May 13, 201 I, which issued as U.S. Patent No. 8,530,250 on September JO, 2013.
`
`TECHNICAL FIELD
`
`[0002)
`
`The present invention relates to a light emitting device used for light equipment, a
`
`display, a backlight of a mobile telephone, a movie lighting auxiliary light source, and other
`
`general consumer light sources, and to a method for manufacturing a light emitting device.
`
`BACKGROUND ART
`
`[0003]
`
`A light emitting device using light emitting elements is small, provides good power
`
`efficiency, and emits light of bright color. Further, the light emitting elements are
`
`semiconductor elements, and therefore there is no concern for blowout. The light emitting
`
`elements have characteristics of good initial driving performance and are robust against
`
`vibration and repetition of on and off oflighting. The light emitting elements have these good
`
`characteristics, and therefore light emitting devices using light emitting elements such as light
`
`emitting diodes (LEDs) and laser diodes (LDs) are utilized as various light sources.
`
`(0004)
`
`4828-9823-7719.1
`
`VIZIO Ex. 1002 Page 0016
`
`
`
`Atty. Dkt. No. 100415-0134
`
`FIG. 14 is a perspective view illustrating a method for manufacturing a conventional
`
`light emitting device. FIG. I 5 is a perspective view illustrating an intermediate of the
`
`conventional light emitting device. FIG. 16 is a perspective view illustrating the conventional
`
`light emitting device.
`
`[0005]
`
`Conventionally, as a method for manufacturing a light emitting device, a method is
`
`disclosed for insert-molding a lead frame with a non-translucent, light reflecting white resin,
`
`and molding a resin-molded body which has concave cups at predetermined intervals through
`
`the lead frame (e.g., refer to Patent Document I). A !though quality of a material of a white
`
`resin is not clearly described, as is insertion-molding performed and as is clear from the
`
`figures, a general thermoplastic resin is used. As a general thermoplastic resin, for example, a
`
`thermoplastic resin such as liquid crystal polymer, PPS (polyphenylene sulfide), and nylon is
`
`often used as a light blocking resin-molded body (e.g., refer to Patent Document 2).
`
`[0006]
`
`However, the thermoplastic resin has little adhesion with a lead frame, and the resin
`
`part and lead frame are likely to be detached. Further, the thermosetting resin has lower resin
`
`fluidity of the resin and therefore is not adequate to mold a resin-molded body of a
`
`complicated shape, and has little light resistance. In recent years in particular, the output of a
`
`light emitting element is remarkably improved and, as the output of a light emitting clement
`
`is increased, light deterioration of a package made of a thermoplastic resin becomes more
`
`distinct.
`
`[0007]
`
`4828-9823-7719.1
`
`2
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`VIZIO Ex. 1002 Page 0017
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`
`
`Atty. Dkt. No. 100415-0134
`
`Jn order to solve the above problems, a light emitting device using a thermosetting
`
`resin for a material of a resin-molded body is disclosed (e.g., refer to Patent Document 3).
`
`FIG. 17 is a perspective view and sectional view illustrating a conventional light emitting
`
`device. FIG. 18 is a schematic sectional view illustrating a method for manufacturing the
`
`conventional light emitting device. It is disclosed that, with this light emitting device, metal
`
`wires are formed from a metal foil by a common method such as punching or etching and arc
`
`further arranged in a mold of a predetermined shape, and a thermosetting resin is filled in a
`
`mold resin inlet to transfer-mold.
`
`[0008]
`
`I Iowever, this manufacturing method has difficulty in manufacturing multiple light
`
`emitting devices in a short time. Further, there is a problem that a great amount of a resin of a
`
`runner part is discarded per one light emitting device.
`
`(0009]
`
`As a different light emitting device and manufacturing method therefor, an optical
`
`semiconductor element mounting package substrate which has a light reflecting thermosett