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`US 20080261339Al
`
`c19) United States
`c12) Patent Application Publication
`KOUNG et al.
`
`c10) Pub. No.: US 2008/0261339 Al
`Oct. 23, 2008
`(43) Pub. Date:
`
`(54) PACKAGING METHOD TO MANUFACTURE
`PACKAGE FOR A HIGH-POWER LIGHT
`EMITTING DIODE
`
`(76)
`
`Inventors:
`
`Chia-Yin KOUNG, Xindian City
`(TW); Wen LIN, Fuzhou City (CN)
`
`Correspondence Address:
`PATENTTM.US
`P. 0. BOX 82788
`PORTLAND, OR 97282-0788 (US)
`
`(21) Appl. No.:
`
`12/062,406
`
`(22) Filed:
`
`Apr. 3, 2008
`
`(30)
`
`Foreign Application Priority Data
`
`Apr. 17, 2007
`
`(TW) ................................. 096113537
`
`Publication Classification
`
`(51)
`
`Int. Cl.
`HOJL 21160
`(2006.01)
`(52) U.S. Cl. ............. 438/27; 257/E31.117; 257/E21.512
`ABSTRACT
`(57)
`
`A packaging method to manufacture a package for a high(cid:173)
`power light emitting diode (LED) has steps of (a) obtaining a
`metal board, (b) treating the metal board, ( c) molding a cell
`matrix with multiple reflective bases, ( d) attaching LED chips
`onto the dissipating boards and bonding conductive wires in
`each corresponding reflective base of the cell matrix, ( e)
`encapsulating the LED chips and conductive wires in the
`reflective base of the cell matrix to form a after-packaging
`board and (f) cutting off the after-packaging board to form
`multiple individual high-power LED packages. Most heat
`from the LED chips is conducted via the dissipating board
`thereby improving thermal conduction efficiency and allow(cid:173)
`ing more powerful and numerous LED chips to operate per
`package so increasing applications of LEDs. Therefore, the
`present invention provides different pass ways for conducting
`heat and electricity to improve heat conduction of the LED.
`
`230
`
`210
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 1 of 7
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`130
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`130
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`FIG.1
`PRIOR ART
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 2 of 7
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`US 2008/0261339 Al
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`230
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`200
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`FIG.2A
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`260
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`FIG.28
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`230
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 3 of 7
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`US 2008/0261339 Al
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`FIG.2C
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`230
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`230
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`220
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`220
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`FIG.20
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 4 of 7
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`US 2008/0261339 Al
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`230
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`230
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`, .
`I
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`'-240
`o
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`FIG.3A
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`FIG.38
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 5 of 7
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`US 2008/0261339 Al
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`FIG.4A
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`FIG.48
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`311
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`220
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`210
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`220
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 6 of 7
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`US 2008/0261339 Al
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`FIG.4C
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`FIG.40
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`VIZIO Ex. 1008 Page 0007
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`Patent Application Publication
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`Oct. 23, 2008 Sheet 7 of 7
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`US 2008/0261339 Al
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`220-,
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`310
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`FIG.4E
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`FIG.4F
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`US 2008/0261339 Al
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`Oct. 23, 2008
`
`1
`
`PACKAGING METHOD TO MANUFACTURE
`PACKAGE FORA HIGH-POWER LIGHT
`EMITTING DIODE
`
`BACKGROUND OF THE INVENTION
`
`1. Field oflnvention
`[0001]
`[0002] The present invention relates to a packaging method
`to manufacture a package for a light emitting diode, and more
`particularly to a packaging method to manufacture a package
`for a high-power light emitting diode, which provides differ(cid:173)
`ent pass ways for conducting heat and electricity. Therefore,
`the present invention improves heat conduction of the light
`emitting diode.
`[0003] 2. Description of the Related Art
`[0004] With reference to FIG.1, a conventional package for
`standard light emitting diodes (LED) has a lead frame, an
`LED chip (140), two electrically conductive wires (150) and
`resin (160). The lead frame has a reflective base (130) and two
`electrodes (120). The reflective base (130) has a top, a bottom,
`a front edge and an inverted trapezoidal recess. The recess is
`formed in the top of the reflective base (130) and has a surface
`(131) and a planar LED chip carrier. The planar LED chip
`carrier is mounted in the recess. The electrodes (120) are
`mounted through the reflective base (130), adjacent to each
`other and each electrode (120) has a proximal end (i.e. inter(cid:173)
`nal electrode) and a distal end (i.e. external electrode). The
`proximal end is mounted in the recess of the reflective base
`(130). The distal end is bent around and mounted on the
`bottom of the reflective base (130) and connects to a power
`source. The LED chip (140) is mounted on the planar LED
`chip carrier in the recess. The electrically conductive wires
`(150) connect electrically to the LED chip (140) and the
`electrodes (120). Resin (160) is formed in and fills the recess
`(131) to hold the LED chip (140) and the electrically conduc(cid:173)
`tive wires (150) securely.
`[0005] Since the resin is thermally insulating, heat gener(cid:173)
`ated by the LED chip (140) and electrodes (120) can only be
`dissipated through the electrodes (120) that are very thin.
`Therefore, heat and electricity both pass through the elec(cid:173)
`trodes, so the heat is conducted inefficiently. Moreover, the
`conventional package for standard light emitting diodes can(cid:173)
`not be used for high-power light emitting diodes that generate
`more heat than standard light emitting diodes.
`[0006] To overcome the shortcomings, the present inven(cid:173)
`tion provides a packaging method to manufacture a package
`for high-power light emitting diodes to mitigate orobviate the
`aforementioned.
`
`SUMMARY OF THE INVENTION
`
`[0007] The primary objective of the present invention is to
`provide a packaging method to manufacture a package for
`high-power light emitting diodes, which provides different
`pass ways for conducting heat and electricity.
`[0008] To achieve the objective, the packaging method to
`manufacture the package for a high-power light emitting
`diode in accordance with the present invention comprises
`steps of (a) obtaining a metal board, (b) treating the metal
`board to form an after-treating metal board, ( c) molding a cell
`matrix with multiple reflective bases on the after-treating
`metal board to form a after-molding board, ( d) attaching LED
`chips onto the dissipating boards and bonding conductive
`wires in each corresponding reflective base of the cell matrix
`of the after-molding board, (e) encapsulating the LED chips
`
`and conductive wires in the reflective base of the cell matrix
`to form a after-packaging board and (f) cutting off the after(cid:173)
`packaging board to form multiple individual high-power
`LED packages. Most heat from the LED chips is conducted
`via the dissipating board thereby improving thermal conduc(cid:173)
`tion efficiency and allowing more powerful and numerous
`LED chips to operate per package so increasing applications
`of LEDs. Therefore, the present invention provides different
`pass ways for conducting heat and electricity to improve heat
`conduction of the LED.
`[0009] Other objectives, advantages and novel features of
`the invention will become more apparent from the following
`detailed description when taken in conjunction with the
`accompanying drawings.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0010] FIG. 1 is a cross sectional side view of a conven(cid:173)
`tional package for a standard light emitting diode in accor(cid:173)
`dance with the prior art;
`[0011] FIG. 2A is a cross sectional side view of a package
`for a high-power light emitting diode in accordance with the
`present invention;
`[0012] FIG. 2B is an exploded perspective view of the
`package for the high-power light emitting diode in FIG. 2A;
`[0013] FIG. 2C is a perspective view of the package forthe
`high-power light emitting diode in FIG. 2A, shown with a lens
`covering a recess;
`[0014] FIG. 2D is a cross sectional side view of the package
`for the high-power light emitting diode in FIG. 2A showing
`fluorescer formed in and filling a recess of a reflective base;
`[0015] FIG. 3A is a perspective view of the package forthe
`high-power light emitting diode in FIG. 2A, shown with two
`LED chips;
`[0016] FIG. 3B is a perspective view of the package forthe
`high-power light emitting diode in FIG. 2A, shown with three
`LED chips; and
`[0017] FIGS. 4A to 4F are perspective views of steps of a
`packaging method to manufacture a package for a high-power
`light emitting diode in accordance with the present invention.
`
`DETAILED DESCRIPTION OF THE INVENTION
`
`[0018] With further reference to FIGS. 2B and 4A to 4F, a
`packaging method to manufacture quantities of the high(cid:173)
`power LED packages in accordance with the present inven(cid:173)
`tion comprises steps of: (a) obtaining a metal board (300), (b)
`treating the metal board (300) to form an after-treating metal
`board (301), (c) molding a cell matrix (320) with multiple
`reflective bases (230) on the after-treating metal board (301)
`to form a after-molding board (302), ( d) attaching LED chips
`(240) onto the dissipating boards (210) and bonding conduc(cid:173)
`tive wires (250) in each corresponding reflective base (230) of
`the cell matrix (320) of the after-molding board (302), (e)
`encapsulating the LED chips (240) and conductive wires
`(250) in the reflective base of the cell matrix (320) to form a
`after-packaging board (303) and (f) cutting off the after(cid:173)
`packaging board (303) to form multiple individual high(cid:173)
`power LED packages (330).
`[0019] The step of (a) obtaining a metal board (300) com(cid:173)
`prises obtaining a metal board (300) (as shown in FIG. 4A).
`[0020] The step of (b) treating the metal board (300) com(cid:173)
`prises treating the metal board (300) using etching or machin(cid:173)
`ing (such as punching) to form an after-treating metal board
`(301) with a margin (310) and multiple units (as shown in
`
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`US 2008/0261339 Al
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`Oct. 23, 2008
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`2
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`FIG. 4B). The after-treating metal board (301) comprises the
`margin (310) and multiple units to connect integrally to each
`other. Each unit has at least one pair of electrodes (220), a
`dissipating board (210) and multiple gaps (311). Each elec(cid:173)
`trode (220) connects to an electrode (220) of an adjacent unit.
`The electrode (220) adjacent to the margin (310) further
`connect to the margin (310). Each dissipating board (210) is
`surrounded by at least one pair of the electrodes (220) and
`connects to a dissipating board (210) of an adjacent unit. The
`dissipating boards (210) adjacent to the margin (310) further
`connect to the margin (310). The gaps (311) are formed
`between each one pair of the electrodes (220) and the dissi(cid:173)
`pating board (210).
`[0021] The step of (c) molding the cell matrix (320) com(cid:173)
`prises forming a cell matrix (320) on the after-treating metal
`board (301) and filling the gaps (311) with an insulating
`material simultaneously to form an after-molding board (302)
`with multiple substrates (200). The step of (c) molding the
`cell matrix (320) may be using injection-compression mold(cid:173)
`ing (as shown in FIG. 4C). The insulating material may be
`resin, ceramic or the like. The cell matrix (320) has multiple
`reflective bases (230). The reflective bases (230) correspond
`respectively to the units. Each substrate (200) comprises at
`least one pair of electrodes (220), a dissipating board (210)
`and a reflective base (230). Each reflective base (230) has a
`recess (233). At least a portion of an upper surface of the
`dissipating board (210) and at least a portion of an upper
`surface of the electrode (220) are exposed to the recess (233)
`and at least a portion of an lower surface of the dissipating
`board (210) and at least a portion of an lower surface of the
`electrodes (220) are exposed from a lower surface of the
`reflective base (230).
`[0022] The step of(d) attaching LED chips (240) and bond(cid:173)
`ing a pair of conductive wires (250) comprises wire bonding
`at least one LED chip (240) onto the dissipating boards (210)
`of each substrate (200) to connect electrically to the elec(cid:173)
`trodes (220) by the conductive wires (250) (as shown in FIG.
`4D).
`[0023] The step of ( e) encapsulating the LED chips (240)
`and conductive wires (250) comprises filling the recesses
`(233) in the reflective bases (230) of the cell matrix (320) with
`an encapsulant (260) that is pervious to light to form an
`after-packaging board (303) (as shown in FIG. 4E).
`[0024] The step of (f) cutting off the after-packaging board
`(303) comprises separating the reflective bases (230) of the
`cell matrix (320) and the units of the after-treating metal
`board (301) to obtain multiple individual packages (330) for
`high-power LEDs (as shown in FIG. 4F).
`[0025] According to the method of the present invention,
`multiple LED substrates (200) can be formed on the after(cid:173)
`treating metal board (301) by once-molding technique, which
`accelerates to proceed the step of (d) to (f). Therefore, the
`present invention provides a packaging method that can save
`time and cost.
`[0026] For further increasing reflectivity of the substrate
`(200), the dissipating board (210) and the electrodes (220) of
`each substrate (200) may be coated or plated with a reflective
`coating after the step of (b) and before the step of ( c) or after
`the step of ( c) and before the step of ( d). The dissipating board
`(210) and the electrodes (220) may be plated with silver
`coating or other conductive materials.
`[0027] The recess (233) may be coated or plated with a
`reflective coating after the step of ( c) and before the step of
`
`(d). The reflective sidewall (232) of the recess (233) may be
`plated with aluminum coating, silver coating or the like.
`[0028] With reference to FIGS. 2A, 2B, 3A and 3B, each
`package for a high-power light emitting diode (LED) in
`accordance with the present invention, manufactured by the
`packaging method outlined above, has a substrate (200), at
`least one LED chip (240), at least one pairof conductive wires
`(250) and an encapsulant (260).
`[0029] The substrate (200) has a reflective base (230), a
`dissipating board (210) and at least one pair of electrodes
`(220).
`[0030] The reflective base (230) may be reflective, is elec(cid:173)
`trically insulating and may be resin or ceramic and has a top,
`a recess (233) and a bottom. The recess (233) is formed in the
`top of the reflective base (230) and has a reflective bottom
`(231) and a reflective sidewall (232). The bottom of the reflec(cid:173)
`tive base (230) has a central slot (234) [for engaging the
`dissipating board (210)] and at least one pair of electrode
`mounts (235). The central slot (234) is defined through the
`bottom of the reflective base (230), communicates with the
`recess (233) and has a shoulder. Each pair of the electrode
`mounts (235) is formed on opposite sides of the central slot
`(234) and each electrode mount (235) has an electrode slot
`formed through the bottom of the reflective base (230) and
`communicating with the recess (233) and the electrode mount
`(235).
`[0031] With further reference to FIG. 2C, each package for
`a high-power LED further has an optical lens (280). The
`optical lens (280) is mounted on the reflective base (230) to
`cover the reflective base (230) for adjusting a light path.
`[0032] With further reference to FIG. 2D, the dissipating
`board (210) is made of metal, is mounted on the bottom of the
`reflective base (230), may correspond to and be mounted in
`the central slot (234) and has an upper surface and a chip(cid:173)
`bonding recess (290). The upper surface of the dissipating
`board (210) is adjacent to the recess (233). The chip-bonding
`recess (290) is formed in the upper surface of the dissipating
`board (210) and is filled with fluorescer (270). The fluorescer
`(270) allows light produced by the package to be tailored to
`different colors.
`[0033] Each pair of the electrodes (220) are metal, are
`mounted on the bottom surface of the reflective base (230),
`may correspond to and be mounted in one pair of electrode
`mounts (235) and are separated by a gap from the dissipating
`board (210) has an upper surface. The upper surface of the
`electrodes (220) are adjacent to the recess (233). Each LED
`chip (240) connects electrically to one pair of the electrodes
`(220) and is adhered to the dissipating board (210) and may be
`mounted in the chip-bonding recess (290), may be sur(cid:173)
`rounded by the fluorescer (270) to excite the fluorescer (270)
`and has two terminals. When the LED chip (240) is blue LED,
`the fluorescent agent (270) will be excited to generate yellow
`light. A balanced mixing of yellow and blue lights results in
`an appearance of white light. Each LED chip (240) has two
`terminals. When there are more than one LED chip (240) in
`the recess (233), the LED chips (240) may have a single color
`or different colors. In one aspect of the present invention,
`there are three LED chips (240) that emit respectively red
`light, green light and blue light. A balanced mixing of those
`lights emitted from the LED chips (240) results in an appear(cid:173)
`ance of white light.
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`3
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`[0034] Techniques for mixing lights and utilizing fluoresc(cid:173)
`ers (270) are well known by those possessing ordinary skill in
`the art. Therefore, a number of LED chips (240) is not limited
`in the present invention.
`[0035] Light emitted by the package can be tailored using
`the fluorescer (270) or multiple lights emitting different
`wavelengths that are mixed, techniques for mixing lights and
`utilizing fluorescer (270) is well known by those possessing
`ordinary skill in the art. Therefore, a number of LED chips
`(240) is not limited in the present invention.
`[0036] Each conductive wire (250) connects electrically
`one terminal of one LED chip (240) to one electrode of one
`pair of electrodes (220).
`[0037] The encapsulant (260) is pervious to light, prefer(cid:173)
`ably is transparent, may be transparent resin, transparent resin
`with fluorescer or the like and is formed in and fills the recess
`(233) of the substrate (200) to hold and protect each LED chip
`(240) and each pair of conductive wires.
`[0038] The package for high-power LED of the present
`invention in addition to the electrodes (220) further comprises
`the dissipating board (210) therefore, heat from each LED
`chip (240) is mainly conducted via the dissipating board
`(210) thereby improving thermal conduction efficiency and
`allowing more powerful and numerous LED chips to operate
`per package so increasing applications of LEDs.
`[0039] Even though numerous characteristics and advan(cid:173)
`tages of the present invention have been set forth in the
`foregoing description, together with details of the structure
`and function of the invention, the disclosure is illustrative
`only. Changes may be made in detail, especially in matters of
`shape, size and arrangement of parts within the principles of
`the invention to the full extent indicated by the broad standard
`meaning of the terms in which the appended claims are
`expressed.
`What is claimed is:
`1. A packaging method to manufacture a package for a
`high-power light emitting diode (LED) comprising steps of:
`(a) obtaining a metal board;
`(b) treating the metal board to form an after-treating metal
`board having
`a margin; and
`multiple units each having at least one pair of electrodes,
`a dissipating board and multiple gaps being formed
`between each one pair of the electrodes and the dis(cid:173)
`sipating board;
`(c) molding the after-treating metal board with an insulat(cid:173)
`ing material to form an after-molding board comprising
`filling gaps and forming multiple reflective bases on the
`units to respectively correspond to the units simulta(cid:173)
`neously and each reflective base having a recess to
`expose the dissipating board and at least one electrode
`from a bottom of the reflective base;
`( d) attaching LED chips and bonding conductive wires
`comprising wire bonding at least one LED chip onto the
`dissipating board to connect electrically to the at least
`one pair of electrodes of a corresponding one of the units
`by at least one pair of conductive wires;
`( e) encapsulating the LED chips and conductive wires
`comprising filling the recesses in the reflective bases of
`the cell matrix with an encapsulant that is pervious to
`light to form an after-packaging board; and
`
`(f) cutting off the after-packaging board to separate the
`reflective bases of the cell matrix and the units to form
`multiple packages for high-power LEDs.
`2. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 1, wherein the metal
`board is etched to form a margin and multiple units.
`3. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 1, wherein the metal
`board is machined to form a margin and multiple units.
`4. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 1, wherein
`each electrode connects to an electrode of an adjacent unit
`and the electrodes adjacent to the margin connect to the
`margin;
`each dissipating board is surrounded by at least one pair of
`the electrodes, each dissipating board connects to a dis(cid:173)
`sipating board of an adjacent unit and the dissipating
`board adjacent to the margin connect to the margin.
`5. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 1, wherein insulating
`material is injection-compression molded to form the matrix
`and fill the gaps.
`6. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 2, wherein insulating
`material is injection-compression molded to form the matrix
`and fill the gaps.
`7. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 3, wherein insulating
`material is injection-compression molded to form the matrix
`and fill the gaps.
`8. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 4, wherein insulating
`material is injection-compression molded to form the matrix
`and fill the gaps.
`9. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 1, wherein the encap(cid:173)
`sulant is transparent material.
`10. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 2, wherein the encap(cid:173)
`sulant is transparent material.
`11. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 3, wherein the encap(cid:173)
`sulant is transparent material.
`12. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 4, wherein the encap(cid:173)
`sulant is transparent material.
`13. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 5, wherein the encap(cid:173)
`sulant is transparent material.
`14. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 6, wherein the encap(cid:173)
`sulant is transparent material.
`15. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 7, wherein the encap(cid:173)
`sulant is transparent material.
`16. The packaging method to manufacture a package for a
`high-power LED as claimed in claim 8, wherein the encap(cid:173)
`sulant is transparent material.
`
`* * * * *
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