Michael Gerard Pecht
`Professional Engineer
`
`
`EDUCATION
`Ph.D. Engineering Mechanics (1982); M.S. Engineering Mechanics (1979); M.S. Electrical Engineering (1978); B.S.
`Acoustics-Physics (1976); Univ. of Wisconsin, Madison.
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`EXPERIENCE
`Faculty: George E. Dieter Chair Professor in Mechanical Engineering (1983–present), Professor of Applied Mathematics,
`Statistics and Scientific Computation (2008–present), and Professor in Systems Engineering at the University of Maryland
`(1990–1994). Adjunct Professor in Risk Management at Yokohama National University (2016), Visiting Professor of
`Electrical Engineering at City University of Hong Kong (2008–2010). Visiting Professor in Reliability Engineering at
`Beihang University—China (2005–2013). Visiting Professor in Physics at Shanghai—JiaoTong University (2004–2007).
`Managed over 200 programs funded by both government and industry. Developed 12 courses associated with electronics
`products and systems, and prognostics and systems health management, authored more than 30 books, and graduated over
`100 M.S. and 50 Ph.D. students.
`
`Founder and Director: Center for Advanced Life Cycle Engineering (CALCE), having consortia in both Electronic
`Products and Systems, and Prognostics and Health Management, and supported by over 150 industry and government
`members, with a budget of over $6 million/yr, and graduating over 30 M.S. and Ph.D. students per year.
`
`National Academy of Science/Engineering (NAE/NAS) Committees (invited to participate): Committee for reliability
`growth; Committee to investigate printed circuit board manufacturing in the U.S.; Committee to examine research needs in
`materials engineering; Committee to investigate automotive sudden acceleration and reliability (gave presentation but
`declined to participate).
`
`Expert for Congressional Investigations: Committee on Energy & Commerce to investigate automotive reliability
`issues: Toyota sudden acceleration (2009–2010); and GM ignition – air bag recalls and NHTSA responses (2014).
`
`FDA Expert: Taught reliability and aided FDA in assessing the reliability capability maturity assessment of
`manufacturers of medical devices, the techniques used to qualify devices, and medical device reliability and safety. (Sept.
`2007–Sept. 2008)
`
`Editor in Chief:
`IEEE Access (2012–present): first editor of the journal; 2015 PROSE Award winner in the subject category of
`•
`“Journal/Best New STM (Scientific, Technical, and Medical).” : Selected for Thomson Reuters Science Citation
`Index in 2015.
`SRESA Journal of Life Cycle Reliability and Safety Engineering (2012–present)
`•
`• Microelectronics Reliability, Elsevier (1996–2012)
`International Journal of Performability Engineering (2009–2012)
`•
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`IEEE Transactions on Reliability (1988–1997)
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`Vice President: PASS Inc., Initiated programs under both U.S. Army and Air Force contracts to determine the storage
`reliability of electronic equipment and to develop assessment methods for long term storage and dormancy reliability.
`Resigned as Vice President but still serves as a consultant (company is now called ERS Inc.) (1990–1993)
`
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`Vice President: Ramsearch Inc., Established company and awarded $1.5M to develop a concurrent electrical engineering
`decision support system. Won contracts to research temperature-dependent IC failures. Was bought out in 1991. (1988–
`1991)
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`Scientist: Engineering Research Center, Madison, WI: Worked on reliability assessment of Astro I Space Telescope.
`(1983)
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`Civil Service Electronics Technician: High Energy Physics at the University of Wisconsin and at the National
`Accelerator Laboratory in Batavia, Illinois. Developed electronics instrumentation. (1971–1975)
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`Selected Research and Organizational Accomplishments
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`2012, Selected to be the Editor in Chief of the new IEEE Access journal. This journal was awarded the 2015 PROSE
`Award in the subject category of “Journal/Best New STM (Scientific, Technical, and Medical).”
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`2010, Established a battery health management and prognostics research program at CALCE, with over $1M funding
`from NSF, U.S. Navy, and the CALCE members.
`
`2008, Initiated prognostics and system’s health management research at the City University of Hong Kong and within
`southern China. Received over US $3M in grant funding from the Hong Kong government.
`
`2007, Established the CALCE Prognostics and Health Management Consortium at the University of Maryland. This
`was the first diagnostics, prognostics, and system health management consortium for electronics in the world.
`
`2005, Developed a new paradigm for reliability prediction of electronics based on prognostics, whereby sensor data
`can be integrated with models that enable in-situ assessment of the deviation or degradation of a product from an
`expected normal operating condition and the prediction of the future state of reliability. Developed prognostics
`roadmap for inclusion in the ITRI semiconductor roadmap.
`
`2005, Chairman for IEEE Organizational Reliability Capability Standard 1624, which defines the reliability capability
`of organizations and identifies the criteria for assessing the reliability capability of an organization.
`
`2004, Developed the concept of physics-of-failure for electronics reliability and the Failure Modes, Mechanism and
`Effects Analysis (FMMEA), which became formalized in a series of JEDEC Standards, including: JEDEC-STD-148,
`titled “Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity
`Assessment;” JESD34, titled “Failure-Mechanism-Driven Reliability Qualification of Silicon Devices;” JESD47,
`titled “Stress-Test Driven Qualification of Integrated Circuits;” and JESD94, titled “Application Specific
`Qualification Using Knowledge Based Test Methodology.”
`
`2002, Established electronics prognostics and health monitoring program at CALCE Electronic Products and Systems
`Center. Developed prognostics and physics-of-failure techniques to prove (under 2 NASA contracts) that the
`electronics on a NASA space shuttle robot arm and on NASA booster rockets can survive additional missions after the
`completion of the 2001 designed-for life. This was used to certify future missions.
`
`2002, Chairman for IEEE Reliability Prediction Assessment Guidebook #1413.1 (1999–2002).
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`2001, Established $4M lead-free electronics research program at CALCE. This was the only research program to
`assess the long-term (6 years +) reliability of lead-free devices and products.
`
`1999, Established CALCE Electronic Products and Systems Center as the first academic research facility in the world
`to be ISO 9001 certified.
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`1999, Developed Pecht’s Law, which provides an estimate of semiconductor device reliability trends and the
`requirements for accelerated testing.
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`1998, As IEEE chairperson, led the development of both the IEEE #1332 Reliability Program Standard, and IEEE
`#1413 Standard Methodology for Reliability Prediction and Assessment for Electronic Systems and Equipment.
`Received IEEE Standards Award in 2000.
`
`1997, Developed the concept of “up-rating”, which is the process to assess the capability of semiconductor devices to
`meet functionality and performance requirements outside the manufacturers’ specification. The up-rating approach
`was institutionalized into IEC/PAS 62240: Use of Semiconductor Devices Outside Manufacturers’ Specified
`Temperature Ranges, Edition 1, 2001; as well as GEIA 4900, 2001, and is currently used for all commercial avionics
`systems.
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`1996, Led program to develop production-quality design and reliability assessment methods and software used by
`Texas Instruments, Westinghouse, AlliedSignal, Lockheed, and Rockwell International.
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`1995, Won $4.8M in NSF contracts to enhance the research and educational programs in electronic products and
`systems development.
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`1995, Modeled IC endurance and assessed the risks of replacing ceramic IC packages with plastic packages for
`avionics and military applications. The studies (and book “Plastic Encapsulated Microcircuits” John Wiley
`Publishing), were fundamental to the use of plastic encapsulated microcircuits for the Boeing 777 and for the general
`use of commercial parts in military and aerospace applications.
`
`1995, Formalized the concept of the physics-of-failure of electronic components, a methodology which includes
`modeling root-cause failure mechanisms and the impact of defects and loads on product reliability.
`
`1993, Designed and fabricated an opto-electronics semiconductor package for the automotive industry (with Dr.
`David Bigio).
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`1992–1994, Guided the U.S. DoD to reform the military reliability standards, which led to the “Perry Memo” on
`Standards Reform. Pecht’s work led to Army’s establishment of a Physics-of-Failure Branch and their use of software
`generated by CALCE for military systems. Similarly, GM transitioned from military reliability standards and now
`requires the use of CALCE reliability software in their vehicles under GM specification GM-3172.
`
`1992, Conducted physics-of-failure methodology for the reliability assessment of electronics in NASA’s Zeno Space
`Shuttle Experiment. Demonstrated the applicability of the physics-of-failure approach in the design and assessment of
`the Zeno Program, as a replacement for Mil-Hdbk-217 and progeny.
`
`1991, Developed techniques to monitor quality and logistics parameters and to aid in decision support during the
`design of electronic assemblies, under DARPA’s Initiative in Concurrent Engineering (DICE). These techniques were
`incorporated into Texas Instruments’ (Raytheon) CARMA software and commercially marketed.
`
`1990, Conducted experimental study of AWACs cooling to determine the temperature profiles of AWACs
`convectively cooled electronic equipment and developed models for reliability design and assessment.
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`1988–1990, Developed microelectronic packaging design guidelines for the U.S. Air Force. This was the first
`document of its kind to incorporate physics-of-failure in design (DfR). These guidelines were extended to incorporate
`commercial and industrial microelectronic packaging trade-offs.
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`1987–1989, Developed reliability models for very high speed integrated circuit (VHSIC) devices and semiconductor
`packages for the U. S. Air Force.
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`1986–1988, Developed methodologies and computational techniques for derating and preferred parts selection for the
`U.S. Integrated Electronics Warfare Systems (INEWS) program.
`
`1984–1986, Developed the first Reliability and Maintainability Computer Aided Design (RAMCAD) software. Lead
`to the development of RAMCAD software by more than ten commercial companies.
`
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`PROFESSIONAL SOCIETIES
`Fellow
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`Institute of Electrical and Electronics Engineers (IEEE)
`American Society of Mechanical Engineers (ASME)
`Society of Automotive Engineers (SAE)
`Int’l Microelectronics and Packaging Society (IMAPS)
`Institute of Environmental Sciences and Technology (IEST)
`Association for the Advancement of Artificial Intelligence (AAAI)
`Institute for Interconnecting and Packaging Electronic Circuits (IPC)
`American Society of Materials Int’l (ASM)
`ASM - Electronic Device Failure Analysis Society (EDFAS)
`Surface Mount Technology Association (SMTA)
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`Senior Member
`Member
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`PROFESSIONAL SERVICES
`Scientific Advisory Board: Alstom- France (2015 – present)
`Board of Directors
`
`
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`Early-Bird Alert Inc. (2008–present).
`The Prognostics and Health Management Society (2009–2010).
`Energetic Technology Center, Maryland (2007).
`Airpax, a Subsidiary of Philips (1998)
`IEEE Access (2012–present)
`SRESA Journal of Life Cycle Reliability and Safety Engineering (2012–present)
`International Journal of Performability Engineering (2011–2012)
`Microelectronics Reliability International (1996–2012)
`IEEE Transactions on Reliability (1988–1997)
`The Wisconsin Engineer Magazine (1979–1980)
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`Editor-in-Chief
`
`
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`Associate Editor
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`
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`IEEE Transactions on Electronic Components, Packaging and Manufacturing Tech. (1995–2010).
`International Microelectronics Journal (1995–2002).
`SAE Journal of Reliability, Maintainability and Supportability (1993–1997).
`IEEE Transactions on Reliability (1987–1988).
`
`Editor-at-Large
`Editorial Board
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`
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` Marcel Dekker: Electrical Engineering and Electronics (1991–1993)
`
`Energies, MDPI AG, Switzerland (2015 – present)
`Journal of Electronic Measurement and Instrument (2014 – present)
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`Editor from U.S. (2013–present).
`
`Chinese Journal of Aeronautics (2013–present)
`Journal of COMADEM, Honorary Regional (2013)
`Proceedings of the ICMR (2013)
`Journal of Systems Engineering and Electronics, China (2011–present)
`Journal of Reliability and Risk Analysis: Theory and Applications (2009)
`KSME International Journal, Korean Society of Mechanical Engineers (1997–2005)
`IEEE Spectrum (1993–1995)
`Journal of Electronics Manufacturing (1990–1999)
`Journal of Concurrent Engineering (1990–1992)
`
`Chairperson
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`Conference Chair
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`IEEE Reliability Prediction Assessment Guidebook #1413.1 (1999–2002)
`IEEE Standard Methodology for Reliability Prediction and Assessment for Electronic Systems and
`Equipment #1413 (1995–1998)
`IEEE Reliability Program Standard #1332 (1995–1998)
`
`Symposium on Solder Interconnect Reliability, National University of Singapore, Singapore,
`December 8 – 11, 2015,
`IEEE PHM 2015, 2015 Prognostics and System Health Management Conference, Beijing, China,
`October 21-24, 2015
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`
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`IEEE PHM 2014, 2014 Prognostics and System Health Management Conference, Zhangjiajie,
`Hunan, China, August 24–27, 2014
`IEEE Prognostics and System Health Management Conference, May 23–25, 2012, Beijing, China
`(General Chair, Founder, and Organizer) Battery Management Systems for High Operational
`Availability and Safety Conference, Shenzhen, China, May 21, 2012
`IEEE Prognostics and Systems Health Management Conf., May 24–27, Shenzhen, China, 2011
`International Conference on Reliability, Maintainability and Safety (ICRMS 2011), Guiyang,
`China, June 2011 (2011)
`2nd International Conference on Reliability, Safety and Hazard-2010 (ICRESH 2010), New
`Mumbai, India, Dec. 14–16, 2010 (2010)
`IEEE Prognostics and Health Management Conference 2010 (PHM-2010 Macau), Macau, P.R
`China, Jan. 12–14, 2010 (2010)
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`Prognostics and Health Management, ASME 2009 DETC & CIE Conference, San Diego, CA,
`Aug. 30-Sept. 2, (2009)
`2009 8th International Conference on Reliability, Maintainability and Safety (ICRMS 2009),
`Chengdu, China, July 20–24, 2009
`Int’l Conf. on Reliability, Maintainability and Safety 2007, Beijing, China (2007)
`2004 Int’l Conf. on the Business of Electronic Product Reliability and Liability, Shanghai, China,
`April 27–30, 2004
`IEEE Conf. on Business of Electronic Product Reliability and Liability, Hong Kong and Shenzhen,
`China, Jan 13–17, 2003
`
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`Education committee; EDFAS- ASM (2015 – present)
`Association for the Advancement of Medical Instrumentation: Cochlear Implant Committee
`IEEE Publications and Strategic Planning Board (2012–present)
`IEEE Standards Association (2000–2009)
`U.S. Army Research, Development Engineering Command Reliability Focus Team (2008)
`UL Standards Committee (2001–2008)
`IEEE Representative to Int’l Reliability Standards Committee (1993–1995)
`SAE Automotive Reliability Standards Committee (1990–1993)
`Navy Electronics Manufacturing-Policy Committee (1992)
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`Member
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`MEDIA PRESENTATIONS
`1. CNN’s Drew Griffin Investigates a Toyota Engineering Memo that Suggests an Electronic Problem in a Prototype
`Car, CNN Video, http://www.cnn.com/video/#/video/bestoftv/2012/03/02/ac-griffin-toyota-investigation.cnn;
`http://www.cnn.com/2012/03/01/us/toyota-acceleration-documents/index.html?iref=allsearch, March 1, 2012.
`2. Zuga, L. and M. Pecht, “The Politicization of Counterfeit Electronics,” Battlespace Update, Vol. 15, Issue 01, Jan. 5,
`2012; “Misplaced Blame: The Politicization of Counterfeit Electronics,” SLD (sldinfo.com) website, Dec. 14, 2011.
`3. “Don’t Blame the Chinese-Blame Raytheon,” Letter to the Editor, Circuitnet website:
`(http://www.circuitnet.com/articles/article_85572.shtml), Nov. 23, 2011.
`4. The Counterfeit Electronics Problem - Trying to Reach Harmony in a Storm, Int’l Conf. on Economics, Politics, and
`Security of China and the USA, Nov. 19, 2011 (televised live on Voice of America)
`5. ACTUS, L’Offensive Made in China (in French), pp. 26-27, June 2011.
`6. CNN, interviews on Toyota and sudden acceleration and congressional hearing, March 2, 2010.
`7. NPR, Toyota Recalls Spur worries-Sudden Acceleration in Toyota Vehicles, Feb. 3, 2010.
`8. History Channel Modern Marvels: Engineering Disasters, Tin Whiskers, March 22, 2006.
`9. CNN with Lou Dobbs, China’s Semiconductor Industry and exporting, Sept 16, 2004.
`10. Newsnight Maryland, Maryland Public Television: Electronics Industry, June 8, 1998.
`
`PATENTS
`1. 3D RF Mems Biosensor for Multiplexed Label Free Detection, A. Vasan, M. Pecht and A. Kluger, U.S. Patent
`#9,151,723, Oct. 6, 2015 (USA).
`2. Energy Harvesting Using RF MEMS, Ravi Doraiswami M. Pecht, A. Vasan, Y. Huang and A. Kluger, U.S. Patent
`#8,859,879, Oct. 14, 2014 (USA). US 8,878,667
`3. Wireless Biosensor Network for Point of Care Preparedness for Critical Patients, Ravi Doraiswami M. Pecht, A.
`Vasan, Y. Huang and A. Kluger, U.S. Patent #8,878,667, Oct. 14, 2014 (USA).
`4. Method to Extract Parameters from in-situ Monitored Signals for Prognostics, Vichare, N., and M. Pecht, U.S. Patent
`# 8,521,443, Aug. 27, 2013 (USA).
`5. Prognostics and Health Management Implementation for Self Cognizant Electronic Products, M. Pecht, and J. Gu,
`U.S. Patent #8,494,807, Jul. 23, 2013 (USA).
`6. MEMS Barcode Device for Monitoring Medical Systems at Point of Care, R. Doraiswami, M. Pecht, A. Vasan, Y.
`Huan, and A. Kluger, U.S. Patent # 8,424,765, Apr. 23, 2013 (USA).
`7. A Prognostics and Health Management Method for Aging Systems, M. Pecht and S. Cheng, U.S. Patent # 8,423,484,
`Apr. 16, 2013 (USA).
`8. Electromechanical Device Having a Plurality of Bundles of Fibers for Interconnection of Two Planar Surfaces, U.S.
`Patent # 7,220,131, May 22, 2007 (USA).
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`HONORS AND AWARDS
`
`1. The most highly cited article in Microelectronics Reliability for the years 2012, 2013, 2014, 2015, 2016: Chang, M.
`H., D. Das, P. V. Varde, and M. Pecht, “Light Emitting Diodes Reliability Review,” Microelectronics
`Reliability, Vol. 52, No. 5, pp. 762–782, May 2012.
`1. Awarded: IEEE CPMT Technical Field Award (2016)
`2. Awarded: 2015 Applied Energy Award – most highly cited research paper. Xing, Y., W. He, and M. Pecht, “State of
`Charge Estimation of Lithium-ion Batteries Using the Open-circuit Voltage at Various Ambient Temperatures,”
`Applied Energy, Vol. 113, pp. 106–115, Jan. 2014.
`3. Best Student Paper Award of Conference (2016): N. Jordan Jameson, Kai Wang, Carlos Morillo, Michael H. Azarian,
`and Michael Pecht, “Health Monitoring of Solenoid Valve Electromagnetic Coil Insulation under Thermal
`Deterioration,” Proceedings of MFPT 2016/ISA's 62nd IIS, Dayton, OH, May 24-26, 2016.
`4. Awarded: 2016 Chinese Academy of Sciences President's International Fellowship
`5. Best paper award: Fan, J., ChengQian, Fan, X., Zhang, G., and M. Pecht, “In-situ Monitoring and Anomaly Detection
`for LED Packages Using a Mahalanobis Distance Approach,” The First International Conference on Reliability
`System Engineering & Prognostics and System Health Management Conference-Beijing (2015 ICRSE & PHM-
`Beijing), Beijing, China, October 23, 2015.
`6. Awarded the distinction of “Honorary Professor” by the Harbin Institute of Technology (HIT) in Harbin, China, on
`July 16, 2015. The Honorary Professor award was granted to Prof Pecht for his technical expertise batteries and for
`his involvement with HIT in battery research. HIT was established in 1954 and is a member of the prestigious C9
`League of Chinese universities. HIT was ranked 10th in the ranking of “Best Global Universities for Engineering” by
`U.S. News & World Report in 2015.
`7. Awarded: 2015 Distinguished Scientist: Chinese Academy of Sciences President’s International Fellowship.
`IEEE Access was awarded the 2015 PROSE Award winner in the subject category of “Journal/Best New STM
`8.
`(Scientific, Technical, and Medical).” Prof. Pecht is the Editor-in-Chief of IEEE Access. The American Publishers
`Award for Professional and Scholarly Excellence (PROSE) annually recognize the very best in professional and
`scholarly publishing by bringing attention to distinguished books, journals, and electronic content. IEEE Access was
`also a finalist for the Award for Excellence in Physical Sciences and Mathematics.
`9. “Academic Excellence Award” by the Electronics Components Industry Association (ECIA). The award is used to
`recognize outstanding academic projects ‘that reference the application of advanced technologies for passive
`electronic components’. Peter, Anto, Michael H. Azarian, Michael Pecht, “Step Stress Testing of Electric Double
`Layer Capacitors,” International Capacitor and Resistor Technology Symposium, Santa Clara, CA, April 2014.
`10. 2014 Corporate Connector of the Year from the University of Maryland, College Park: The Corporate Connector
`Award celebrates those individuals or units on campus that do the most to promote and connect UM with the private
`sector to advance research, partnerships, and scholarship.
`11. 4th most cited article in Transactions of the Institute of Measurement and Control over five years (2009 -2014): Pecht,
`M. and Gu, J., “Physics-of-failure-based Prognostics for Electronic Products,” Trans. of the Institute of Measurement
`and Control, Vol. 31, No. 3/4, pp. 309–322, 2009, DOI: 10.1177/0142331208092031
`12. 2013: Received gift of $750k for research into automotive reliability from Hagans, Berman, Sobol, Shapiro LLP
`13. 2013 IEEE Educational Activities Board/Standards Association (EAB/SA) Standards Education Award “for
`continued leadership in developing and promoting standards education in the field of reliability engineering.”
`14. Outstanding Paper Award (2013): for Williard, N., W. He, M. Osterman, and M. Pecht, “Reliability and Failure
`Analysis of Lithium Ion Batteries for Electronic Systems,” International Conference on Electronic Packaging
`Technology and High Density Packaging (ICEPT-HDP), Aug. 2012.
`15. University of Wisconsin-Madison College of Engineering Distinguished Achievement Award (2013). In recognition
`of the eminent Professional contributions as a “world-renowned professional engineer and educator whose
`innovations in reliability and prognostic methods have made a significant contribution to the field of electronics”
`16. Most downloaded article in Microelectronics Reliability for the years 2012, 2013, 2014: Chang, M-H, D. Das, P.V.
`Varde, and M. Pecht, “Light Emitting Diodes Reliability Review,” Microelectronics Reliability, Vol. 52, No. 5, pp.
`762–782, May 2012.
`17. First Place, IEEE PHM 2012 Prognostic Challenge, Academic Category (2012): for successfully extracting
`degradation features from vibration data and developing fault propagation models to accurately predict the remaining
`useful life of bearings. The CALCE team included Arvind Vasan, Edwin Sutrisno, Wei He, Moon-Hwan Chang, Jing
`Tian, Yan Ning, Hyunseok Oh, and Surya Kunche.
`18. Best Student Paper Award of Conference (2012): for Chauhan, P., M. Osterman, and M. Pecht, “Canary Approach for
`Monitoring BGA Interconnect Reliability under Temperature Cycling,” MFPT 2012: The Prognostics and Health
`Management Solutions Conference, Dayton, OH, April 24–26, 2012.
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`19. Overall Best Conference Paper from Academia (2011): for Haddad, G., P. Sandborn, and M. Pecht, “Method for
`Valuating Options Arising in PHM,” Proc. of 2011 IEEE PHM Conference, Denver, CO, June 2011.
`20. Inducted to 2011 Innovation Hall of Fame at the A. James Clark School of Engineering, University of Maryland
`(2011): for pioneering innovations in advanced reliability and prognostic methods for electronics.
`21. Maurice Simpson Technical Editors Award for best paper of the 2010 year (2010): for Gu, J. and M. Pecht,
`“Prognostics and Health Assessment Implementation for Electronic Products,” J. of the IEST, Vol. 53, Num 1, pp. 44-
`58, April 2010.
`22. Indian Society of Reliability, Maintainability and Safety Lifetime Reliability Achievement Award (2010): On Dec.
`16, 2010 in Mumbai, India, Dr. Pecht received the first and highest reliability award of its kind of India for his
`“significant contributions in the area of product reliability, prognostics & health management of electronic
`components.”
`23. CPMT Society Exceptional Technical Achievement Award (2010): to recognize for exceptional technical
`achievement in the fields encompassed by the CPMT Society. “Dr Pecht is recognized worldwide for his seminal
`contributions in the area of electronics reliability from which he has developed a new and significant field of
`prognostics for electronics. This includes models that enable in-situ assessment of the deviation or degradation of a
`product from expected normal operating conditions and the prediction of the future state of reliability of that product.
`Michael’s contributions in this area span more than 20 years and his subject matter expertise is disseminated in a
`book, several book chapters, handbooks, numerous articles, invited talks and short courses presented worldwide.”
`24. Society of Automotive Engineering (SAE) Fellow (2010): for his research and promotion of the reliability of the
`electronic parts and systems used in automotive and aerospace applications.
`25. National Defense Industrial Association award (2009) for CALCE for demonstrating outstanding achievement in the
`practical application of Systems Engineering principles, promotion of robust systems engineering principles
`throughout the organization, and effective systems engineering process development.
`26. University of Maryland Outstanding Faculty Research Award (2009): to recognize research contributions and
`exceptionally influential research accomplishments by engineering faculty.
`27. Outstanding Paper, I-Connect (Connecting the Global Electronics Supply Chain), (2009): for the paper, He, X., M.
`Azarian, and M. Pecht, “Comparative Assessment of Electrochemical Migration on PCBs with Lead-Free and Tin-
`Lead Solders,” SMT Online Magazine.
`28. The Alexander Schwarzkopf Prize for Technological Innovation (2008): awarded to National Science Foundation
`(NSF) Industry/University Cooperative Research Centers that have had a significant impact on the world. CALCE
`won the award for its research on physics-of-failure reliability analysis methods and advanced supply chain
`management concepts for electronic products and systems.
`29. Best Paper Award (2008): for the 62nd Meeting of the Society for Machinery Failure Prevention Technology. Gu, J.,
`Barker D., and M. Pecht, “Prognostics of Electronics under Vibration Using Acceleration Sensors,” Proceeding for
`62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), Virginia Beach, VA, May 2008,
`pp. 253-263.
`30. Maurice Simpson Technical Editors Award (2008) for best 2007 article in IEST. Sony Mathew, Diganta Das, Michael
`Osterman, Michael Pecht, Robin Ferebee, and Joseph Clayton, for their paper, “Virtual Remaining Life Assessment of
`Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads,” Journal of the IEST, Vol. 50, No.
`1, pp. 86–97, April 2007.
`31. Japan Society for the Promotion of Science Fellowship (2008): for research in prognostics in electronics.
`32. IEEE Reliability Society’s Lifetime Achievement Award (2007): recognizes Prof. Pecht’s long-term contributions to
`the Reliability Society, reliability research, and reliability education, all benefiting the reliability community.
`33. European Micro and Nano-Reliability Award (2007): for outstanding contributions to reliability research.
`34. Distinguished International Service Award (2006) for significant contributions to the development of international
`institutional programs at the University of Maryland; and a distinguished international career.
`35. Grand Fellowship of the Mirce Academy, England (2005): the highest award that the Academy can bestow upon an
`individual in recognition of their unique contribution to the understanding and/or predicting of the motion of
`functionability through system life, at the global level of significance.
`36. IEEE Best Paper of the Year (2004) Award: for paper titled “Characterization of Hygroscopic Swelling Behavior of
`Mold Compounds and Plastic Packages.”
`37. The Royal Society, United Kingdom, Kan Tong Po Electrical Engineering Visiting Professorship Award at City
`University in Hong Kong (2002).
`38. George E. Dieter Chair Professor of Mechanical Engineering, for significant contributions to the reputation of the
`Department, College and University with the establishment of CALCE Electronic Products and Systems Center
`(2001).
`39. IEEE Standards Award for chairing and developing IEEE Standard Methodology for Reliability Prediction and
`Assessment for Electronic Systems and Equipment #1413 (2000).
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`40. IEEE Standards Award for chairing and developing IEEE Reliability Program Standard #1332 (2000).
`41. 3M Research Award for “research work in the electronics reliability area that has made significant contributions to the
`scientific understanding of material properties and their complex behavior” (1999).
`42. ASME Electrical and Electronic Packaging Division (EEPD) Award “for outstanding contributions to the field of
`application of engineering mechanics to electronic packaging” (1999).
`43. IEEE Undergraduate Teaching Award, “for the development and realization of a cross disciplinary educational
`program in Computer Aided Life Cycle Engineering (CALCE)” (1999).
`44. Outstanding paper of the year for the Microelectronics Int’l Journal, “Popcorning in PBGA Packages during IR
`Reflow Soldering,” P. McCluskey, R. Munamarty, and M. Pecht, Vol. 42 Nr. 1, (1997).
`45. ISHM/IEPS William D. Ashman Memorial Achievement Award (1997), “for his numerous contributions to academia
`and the electronics packaging industry.”
`46. IEEE Reliability Society’s Annual Reliability Award (1996), “for his contributions to the IEEE Trans. on Reliability,
`his work with CALCE Electronic Packaging Research Center and his work on Reliability Standards.”
`47. Faculty Achievement Award (April 1996), “in recognition of outstanding contributions to industrial research enabled
`by the Technology Initiatives Program.”
`48. American Society for Quality Control: Reliability Division, Austin Bonis Award for the Advancement of Reliability
`Education (1996) for outstanding achievement in the advancement of reliability education.
`49. Institute of Environmental Sciences Reliability Test and Evaluation Award (1996), “for vital contribution to the
`development and promotion of physics-of-failure modeling and analysis as a valuable reliability design and test
`process in the government, commercial and academic communities.”
`50. ASME Fellow (1995), “for promoting the art, science, and practice of mechanical engineering.”
`51. National Aeronautics Space Agency (NASA) certificate of “recognition of your significant contributions in the
`preparation and execution of the successful Second U.S. Microgravity Payload (USMP-2) Mission, launched on
`March 4, 1994.”
`52. IEEE Fellow (1992), “for effectiveness in leadership in the development and realization of an exemplary program and
`successful efforts to raise the level of engineering excellence and practice within and without the organization.”
`53. Int’l Electronic Packaging Society (IEPS) Educational Award “for excellence in research and education at the
`University of Maryland CALCE Electronics Packaging Research Center (1990).”
`54. Bes