`Exhibit Description
`
`1001
`
`1002
`
`1003
`
`1004
`
`1005
`
`1006
`
`1007
`
`1008
`
`1009
`
`1010
`
`1011
`
`1012
`
`1013
`
`1014
`
`1015
`
`U.S. Patent No. 7,256,486 (“’486 patent”)
`
`Prosecution History of U.S. Patent No. 7,256,486 (“Prosecution
`History”)
`
`Declaration of Michael Pecht, Ph.D. (“Pecht”)
`
`Modern Dictionary of Electronics (7th ed. 1999)) pg. 239 and 467
`
`Microchip Fabrication (4th ed. 2000) pg. 396
`
`Pecht et al. “Plastic Encapsulated Microelectronics” (1995) pg. 459
`
`Meriam Webster’s Collegiate Dictionary (10th ed. 1997) pg. 730
`
`Japanese Patent Application Publication No. 2003-17754, English
`translation of Japanese Patent Application Publication No. 2003-
`17754 and Translator Declaration (Rohm)
`
`Japanese Patent Application Publication No. 2001-352102 English
`translation of Japanese Patent Application Publication No. 2001-
`352102 and Translator Declaration (Matsushita)
`
`U.S. Patent No. 5,376,580 (“Kish”)
`
`U.S. Patent No. 5,523,589 (“Edmond 589)
`
`U.S. Patent No. 6,791,119 (”Slater”)
`
`U.S. Patent No. 5,416,342 (“Edmond 342”)
`
`CV of Pecht
`
`Pecht, M., R. Agarwal, P. McCluskey, T. Dishongh, S. Javadpour,
`and R. Mahajan, Electronic Packaging Materials and their
`Properties, CRC Press, Boca Raton, FL, 1999 pg. 37 (“Electronic
`Packaging”)
`
`1016
`
`Infringement Contentions for Patent U.S. Patent No. 7,256,486 in
`Case No. 8:17-cv-00981-JVS-JCG in CDCA
`
`
`
`