USOO7980736B2
`
`(12) Unlted States Patent
`(10) Patent No.:
`US 7,980,736 B2
`
`Soderman et al.
`(45) Date of Patent:
`Jul. 19, 2011
`
`(54) LIGHT FIXTURE ASSEMBLY HAVING
`IMPROVED HEAT DISSIPATION
`CAPABILITIES
`
`(75)
`
`Inventors: Daryl Soderman, Fort Lauderdale, FL
`(US); Dale B. Steppsa Mountain Ranch,
`CA (US)
`
`(73) Assignee:
`
`.
`( * ) Not1ce:
`
`Inteltech Corporation, Fort Lauderdale,
`FL (US)
`.
`.
`.
`.
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(21) Anal. No.: 11/985,056
`
`3%??? E;
`a
`a
`7,186,000 B2
`7,252,385 B2
`7,722,227 B2 *
`2005/0213047 A1
`2007/0139923 A1
`2007/0242461 A1
`2007/0223230 A1
`
`Ifiiao 6t 31~
`15588;
`1
`erguson et a .
`3/2007 Lebens et al.
`8/2007 Engle et al.
`.................. 362/364
`5/2010 Zhang et al.
`9/2005 Slobodjn et al.
`6/2007 Negley et 31-.
`10/2007 Reisenauer et al.
`9/2007 TrOJanowski et al.
`
`4/2009 Stepps et 31'
`2009/0109052 A1
`FOREIGN PATENT DOCUMENTS
`W0 W0 2009/064433 A1
`5/2009
`wo
`WO 2009/064434 A1
`5/2009
`>x< cited by examiner
`
`Primary Examiner 7 John A Ward
`(74) Attorney, Agent, or Firm i Malloy & Malloy, PA.
`
`(22)
`
`Filed:
`
`Nov. 13, 2007
`
`(57)
`
`ABSTRACT
`
`(65)
`
`Prior Publication Data
`
`US 2009/0122553 A1
`
`May 14, 2009
`
`(51)
`
`Int. Cl.
`(2006.01)
`F21 V29/00
`(52) US. Cl.
`.................... 362/373; 362/249.02; 362/294
`(58) Field of Classification Search ............. 362/249.01
`362/249 02 145 404 373 294’
`See application file for complete search history ’
`.
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`5 738 436 A *
`4/1998 Cummings et al
`6:375:338 B1
`4/2002 Cummings et al.
`6,388,388 B1
`5/2002 Weindorfet 31.
`6,472,828 B1
`10/2002 Pruett et a1.
`
`362/294
`
`A light fixture assembly including an illumination assembly
`in the form of one or more light emitting diodes is intercon-
`nected to an electrical energy source by control circuitry. A
`mounting assembly supports the illumination assembly and a
`cover structure is disposed in heat transferring relation to the
`mounting assembly, wherein both the mounting assembly
`and the cover structure are formed of conductive material,
`thereby effectiVely dissipating the heat generated by the LED
`illumination assembly. The illumination assembly is con-
`nected to a source and electric energy by a conductor assem-
`bly comprising one or more conductive material connectors
`mechanically interconnecting components ofthe light fixture
`into an assembled orientation. A non-conductive insulation
`
`assembly isolates each of the one or more conductive con-
`nectors from the mounting assembly to avoid electrical con-
`ta“ there between
`
`22 Claims, 6 Drawing Sheets
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`US. Patent
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`Jul. 19, 2011
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`Sheet 1 of6
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`US 7,980,736 B2
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`FIG. 2
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`US. Patent
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`Jul. 19, 2011
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`Sheet 2 of6
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`US 7,980,736 B2
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`PETITIONERS, Ex. 1013
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`US. Patent
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`Jul. 19, 2011
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`Sheet 3 of6
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`US 7,980,736 B2
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`FIG. 5
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`U.S. Patent
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`Jul. 19, 2011
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`Sheet 4 of 6
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`US 7,980,736 B2
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`29'
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`FIG. 6
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`US. Patent
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`Jul. 19, 2011
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`Sheet 5 of6
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`US 7,980,736 B2
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`PETITIONERS, Ex. 1013
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`US. Patent
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`Jul. 19, 2011
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`Sheet 6 0f6
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`US 7,980,736 B2
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`US 7,980,736 B2
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`1
`LIGHT FIXTURE ASSEMBLY HAVING
`IMPROVED HEAT DISSIPATION
`CAPABILITIES
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`
`This invention is directed to a light fixture assembly com-
`prising an illumination assembly incorporating a light emit-
`ting diode (LED) array electrically connected to a source of
`electrical energy by a conductor assembly segregated from
`conductive transfer to a heat sink portion of the light fixture.
`The heat sink is at least partially defined by a mounting
`assembly disposed in heat transferring engagement with the
`illumination assembly and in confronting, heat transferring
`engagement to a cover portion of the light fixture. The cover
`structure may include decorative characteristics which
`enhance the appearance of the light fixture while facilitating
`the dissipation of excessive heat therefrom.
`2. Description of the Related Art
`Various types of illumination assemblies which incorpo-
`rate light emitting diodes (LED) as the light generating com-
`ponent have become increasingly popular in recent years.
`Such an increase in popularity is due, at least in part, to their
`overall efficiency as well as the ability to define various light-
`ing arrays readily adaptable to numerous practical installa-
`tions or applications.
`Accordingly, LEDs are known for use in high power appli-
`cations such as spotlights, automotive headlights, etc. How-
`ever, due to their recognized versatility LEDs are also utilized
`extensively in various types of luminaires and/or like fixtures
`installed in conventional domestic and commercial environ-
`
`ments. Such applications allow for the illumination of a given
`area in an efficient and variably decorative manner in that
`associated light fixtures may take the form of standard or
`customized lighting arrays, wall or ceiling mounted fixtures,
`inset lighting, etc. Further, LEDs provide increased energy
`efficiency and effective illumination output from the various
`types of light fixtures installed, while reducing maintenance
`costs associated therewith.
`
`Therefore, the use of illumination assemblies incorporat-
`ing collective LED arrays offer significant advantages in
`terms of increased lighting and efficiency of operation. How-
`ever, certain disadvantages and problems associated with the
`use of LED based illumination assemblies are commonly
`recognized. More specifically, a primary concern with the
`structuring and use of LED illumination assemblies is the
`management or dissipation of excessive heat generated by the
`LED array. More specifically, the light intensity generated by
`an LED light source is generally a proportional function of its
`operational temperature. As such, LED illumination assem-
`blies tend to generate a significant amount ofheat during their
`operation, which in turn may derogatorily affect the light
`generated by the LED array as well as reduce the reliability
`and operational life thereof. Accordingly, the operable life of
`many LED based illumination assemblies may be signifi-
`cantly reduced due to premature failure of one or more light
`emitting diodes associated with a light fixture or other device.
`Therefore, it is commonly recognized in the lighting indus-
`try that heat management and more specifically, heat dissipa-
`tion is a critical structural and operational consideration in the
`manufacture, use, installation and overall viability of illumi-
`nation assemblies incorporating light emitting diodes as the
`primary or exclusive light generating structure. Known
`attempts to overcome the problems associated with the gen-
`eration of excessive heat involve the creation of diverse heat
`
`dissipating structures. By way of example, printed circuit
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`boards have been disposed in a multi-layered or stacked array
`in attempt to transfer heat away from the LED array. Alter-
`natively, one or more printed circuit boards associated with
`the operational control ofthe LED light generating structures
`include a metal core disposed and structured to further effect
`heat dissipation.
`Other known or conventionally proposed solutions to the
`heat management problem include the utilization of a heat
`absorber including a heat conductive resin disposed in com-
`municating relation with the circuitry ofthe LED array. Also,
`heat absorbing structures may be utilized which have a large
`physical configuration such as, but not limited to, a multi-
`finned structure providing a conductive path of heat transfer
`towards an area of dissipation. However, many known
`attempts do not effectively accomplish optimal heat transfer,
`resulting in lower operational performance and a reduced
`operational life as generally set forth above.
`Accordingly, there is a long recognized need in the lighting
`industry for an efficient and practical heat dissipation assem-
`bly preferably ofthe type which may be easily included in the
`structure of a light fixture. Such a proposed assembly would
`allow the light fixture to assume any number of design con-
`figurations best suited to a specific application which is struc-
`tured to effectively dissipate heat. As such, an LED based
`light assembly would be capable of an optimal level of light
`generation, while at the same time enjoying an extended
`operational life. Also, such an improved proposed light fix-
`ture should also include structural components which serve to
`effectively isolate or segregate the conductive material com-
`ponents associated with heat dissipation from direct contact
`with any type of electrical conductor.
`Therefore,
`the proposed light fixture assembly would
`accomplish effective heat dissipation from a LED based illu-
`mination assembly, while at the same time assuring opera-
`tional safety. Further, the proposed light fixture would be
`capable of sufficient structural and operational versatility to
`permit the light fixture to assume any ofa variety ofutilitarian
`and aesthetic configurations.
`
`SUMMARY OF THE INVENTION
`
`The present invention is directed a light fixture assembly
`structured to include efficient heat dissipating capabilities
`and effective isolation ofthe conductive material components
`associated with the heat dissipating capabilities, from electri-
`cal components which serve to interconnect an illumination
`assembly with a source of electrical energy. Accordingly, the
`light fixture assembly ofthe present invention may be utilized
`for a variety of practical applications including installations
`within commercial, domestic, and specialized environments.
`More specifically, the light fixture assembly of the present
`invention includes an illumination assembly including a light
`generating structure in the form of a light emitting diode
`(LED) array. As such, the light generating structure can com-
`prise at least one or alternatively a plurality of LEDs. More-
`over, each of the one or more LEDs is operatively intercon-
`nected to control circuitry which serves to regulate the
`operation and activation thereof. In at least one preferred
`embodiment of the present invention, the control circuitry is
`in the form of a printed circuit structure electrically intercon-
`nected to the one or more LEDs. Further, the light fixture
`assembly of the present
`invention includes a conductor
`assembly disposed in interconnecting, current conducting
`relation between the illumination assembly and an appropri-
`ate source of electrical energy, as generally set forth above.
`As is well known in the lighting industry, particularly in the
`category of LED based light generating structures, thermal
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`US 7,980,736 B2
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`3
`management and more specifically, the dissipation of exces-
`sive heat generated from the LED array is a primary consid-
`eration. Adequate heat dissipation allows for optimal opera-
`tive efficiency of the LED array as well as facilitating a long,
`operable life thereof. Accordingly, the light fixture assembly
`of the present invention accomplishes effective heat dissipa-
`tion utilizing light fixture components which serve the normal
`structural, operational and decorative purpose of the light
`fixture assembly, while transferring heat from the illumina-
`tion assembly to the surrounding environment.
`Concurrently, the aforementioned components of the light
`fixture may enhance the overall decorative or aesthetic
`appearance of the light fixture assembly while being dimen-
`sioned and configured to adapt the installation of the light
`fixture assembly to any of a variety of locations. As such, the
`light fixture assembly of the present invention includes a
`mounting assembly connected in supporting engagement
`with the illumination assembly. The mounting assembly is
`formed of a conductive material and is disposed and struc-
`tured to dissipate heat directly from the illumination assem-
`bly. The conductive material of the mounting assembly may
`be a metallic material and is accordingly both capable of
`efficient heat transfer as well as being electrically conductive.
`In order to maintain the mounting assembly within prede-
`termined or preferred dimensional or other structural param-
`eters, the light fixture assembly of the present invention also
`includes a cover structure. The cover structure serves to at
`
`least partially cover the mounting assembly in a manner
`which provides for effective channeling or directing of light
`generated by the one or more LEDs outwardly from the cover
`structure, so as to properly illuminate the proximal area.
`However, one feature of the present invention is the cover
`structure also being formed ofa heat conductive material such
`as, but not limited to, a metallic material similar to or different
`from the conductive material from which the mounting
`assembly is formed. In addition, the cover structure is opera-
`tively disposed, when in an assembled orientation, in direct
`confronting and/or mating engagement with the mounting
`assembly. It is therefore emphasized that the cover structure
`and mounting assembly define at least a portion of a heat sink
`and a path of thermal flow along which excessive heat may
`travel so as to be dissipated into the surrounding area.
`In at least one preferred embodiment of the present inven-
`tion, the cover assembly has a larger transverse and substan-
`tially overall dimension than that ofthe mounting assembly in
`order to provide structural and decorative versatility to the
`formation ofthe light fixture assembly. In addition, the larger
`dimensioning as well as the cooperative configuring of the
`cover assembly further facilitates an efficient dissipation of
`an adequate amount of heat from the LED array of the illu-
`mination assembly, such that the illumination assembly may
`be operated under optimal conditions without excessive heat
`build-up.
`In order to further facilitate the transfer of heat to the
`
`surrounding environment, correspondingly disposed surfaces
`of the mounting assembly and the cover structure are dis-
`posed in continuous confronting engagement with one
`another over substantially all or at least a majority of the
`corresponding surface area of the mounting assembly. As set
`forth above, the dimension and configuration of the cover
`structure is such as to extend substantially outward from the
`peripheral boundaries of the mounting assembly. Therefore,
`the confronting surface of the cover structure is large enough
`to engage and cover preferably all but at least a majority ofthe
`surface area of the corresponding surface of the mounting
`assembly. In doing so, the mounting assembly will be able to
`maintain a smaller dimension and configuration while the
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`larger cover structure facilitates efficient heat dissipation con-
`currently to enhancing preferred decorative, structural and/or
`operational features to the light fixture assembly.
`Other structural and operative features which further facili-
`tate effective heat dissipation from the illumination assembly
`is the cooperative and corresponding configuration of the
`confronting surfaces of both the cover structure and the
`mounting assembly. As such, the corresponding engaging
`surfaces of these two components may have what may be
`accurately referred to as a “stepped configuration”. Such a
`stepped configuration facilitates a “mating relation” between
`the engaging surfaces of the mounting assembly and cover
`structure thereby further defining the aforementioned con-
`tinuously engaging orientation of these corresponding sur-
`faces. The transfer from the illumination assembly to the
`mounting assembly and from the mounting assembly to the
`cover structure is thereby apparently rendered more efficient
`due to such the continuous confronting engagement between
`the correspondingly disposed surfaces. Further, the enlarged
`dimension and configuration of the cover structure relative to
`that ofthe mounting assembly further enhances the efficiency
`of the heat transfer and dissipation procedure as should be
`apparent. Therefore, when in an assembled orientation, to be
`described in greater detail hereinafter, the mechanically inter-
`connected illumination assembly, mounting assembly and
`cover structure define an effective and efficient heat sink
`
`capable of being incorporated in a light fixture assembly in a
`manner which enables its use in any of a variety of applica-
`tions and installations for purposes of illuminating the sur-
`rounding environment.
`As set forth above, the illumination assembly includes
`electrical control circuitry preferably in the form of a printed
`circuit structure which serves to regulate operation and cur-
`rent flow to the light generating structure in the form of an
`LED array. The illumination assembly is connected to an
`appropriate source of electrical energy by a conductor assem-
`bly associated with at least one or more preferred embodi-
`ments of the light fixture assembly of the present invention.
`The conductor assembly is disposed in interconnecting, cur-
`rent conducting relation between the illumination assembly
`and the aforementioned appropriate source of electrical
`energy. Further,
`the conductor assembly is incorporated
`within the overall structural and operational design of the
`light fixture assembly so as to maintain the intended features
`thereof while not interfering with the heat dissipating capa-
`bilities associated therewith.
`
`Accordingly, the conductor assembly is preferably in the
`form of at least one but more practically a plurality of con-
`nectors, which are formed of a conductive material. There-
`fore, the one or more conductive material conductors not only
`channel electrical current flow from the source of electrical
`
`energy to the illumination assembly, but also mechanically
`interconnect specific structural components of the fixture
`assembly into an assembled orientation. Such assembled ori-
`entation comprises or is at least partially defined by the illu-
`mination assembly being disposed in confronting engage-
`ment and heat transferring relation to the mounting assembly
`and the mounting assembly disposed in continuous, heat
`transferring engagement with the cover structure. Accord-
`ingly, path of heat flow extends from the illumination assem-
`bly to the cover structure as set forth above. However, due to
`the fact, that the one or more connectors are structured to
`direct electric current flow to the illumination assembly, con-
`tact with the conductive material mounting assembly must be
`avoided.
`
`the connectors of the conductor assembly
`Therefore,
`mechanically interconnect the illumination assembly and the
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`PETITIONERS, Ex. 1013
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`PETITIONERS, Ex. 1013
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`US 7,980,736 B2
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`5
`mounting assembly in the aforementioned assembled orien-
`tation. In doing so, the one or more connectors pass through
`the mounting assembly so as to accomplish the mechanical
`interconnection resulting in this assembled orientation. In
`order to avoid conductive interference between the one or
`
`more connectors and the conductive material ofthe mounting
`assembly, the light fixture assembly of the present invention
`also includes an insulation assembly. The insulation assembly
`is formed of a non-conductive material and is disposed in
`isolating or segregating relation between the mounting
`assembly and each of the one or more connectors used to
`accomplish the assembled orientation of these components.
`Further, at least one preferred embodiment of the insula-
`tion assembly comprises one or more non-conductive mate-
`rial bushings, equal in number to the number of connectors
`utilized to interconnect the mounting assembly and the illu-
`mination assembly. Each of the one or more bushings is
`disposed in surrounding relation to a different one of the one
`or more connectors and is appropriately mounted on or con-
`nected to the mounting assembly in a manner which isolates
`correspondingly positioned portions of the one or more con-
`nectors from the mounting assembly in order to prevent con-
`tact therebetween.
`
`Therefore, the light fixture assembly of the present inven-
`tion overcomes the disadvantages and problems associated
`with light assemblies incorporating an LED array, wherein
`excessive heat is generated. As such, the one or more pre-
`ferred embodiments of the present invention serve to effec-
`tively dissipate excessive heat generated by an associated
`illumination assembly and further serve to isolate the various
`conductive material components of the heat sink from elec-
`trical components or the conductor assembly utilized to inter-
`connect the illumination assembly to an appropriate source of
`electrical energy.
`These and other objects, features and advantages of the
`present invention will become more clear when the drawings
`as well as the detailed description are taken into consider-
`ation.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`For a fuller understanding of the nature of the present
`invention, reference should be had to the following detailed
`description taken in connection with the accompanying draw-
`ings in which:
`FIG. 1 is a side view of a preferred embodiment of a light
`fixture assembly of the present invention in an assembled
`form.
`
`FIG. 2 is a bottom view of the preferred embodiment of
`FIG. 1.
`
`FIG. 3 is a bottom perspective view in partial cutaway
`showing details of the embodiment of FIGS. 1 and 2.
`FIG. 4 is a bottom perspective view of the embodiment of
`FIGS. 1 through 3.
`FIG. 5 is an exploded perspective view of the various
`operative and structural components associated with the
`embodiments of FIGS. 1 through 4.
`FIG. 6 is an exploded perspective view of a portion of the
`embodiments of FIGS. 1 through 5.
`FIG. 7 is a side view of the embodiment of FIG. 6.
`FIG. 8 is a bottom view of the embodiment of FIGS. 6 and
`
`7.
`
`FIG. 9 is a bottom perspective view in partial cutaway
`showing details of the embodiment of FIGS. 6 through 8.
`FIG. 10 is a bottom perspective view ofthe embodiment of
`FIGS. 6 through 9.
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`Like reference numerals refer to like parts throughout the
`several views of the drawings.
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`DETAILED DESCRIPTION OF THE PREFERRED
`EMBODIMENT
`
`the present
`As shown in the accompanying drawings,
`invention is directed to a light fixture generally indicated as
`10. The light fixture 10 is of the type which may be installed
`in any of a variety of commercial, domestic or other sites and
`is decorative as well as functional to effectively illuminate a
`given area or space in the vicinity of the installed location.
`More specifically, and with reference primarily to FIGS. 1
`through 6, the light fixture assembly 10 includes an illumina-
`tion assembly generally indicated as 12 comprising one or
`more light emitting diodes 14 connected to electrical control
`circuitry 16. The control circuitry 16 is preferably in the form
`of a printed circuit structure 16' or printed circuit board hav-
`ing the various electrical or circuitry components integrated
`therein.
`
`In addition, the light fixture assembly 10 includes a mount-
`ing assembly generally indicated as 18 and preferably, but not
`necessarily, comprising a plate or disk like configuration as
`also represented. It is emphasized that the specific structural
`configuration and dimension of the mounting assembly 18
`may vary from that other than the represented plate or disk
`like shape. However, the mounting assembly 18 is connected
`in supporting relation to the illumination assembly 12 such
`that the control circuitry 16, is disposed in direct confronting
`and heat transferring engagement with a corresponding por-
`tion of the mounting assembly 18 as clearly represented in
`FIGS. 5 and 8 through 10.Additional structural features ofthe
`mounting assembly 18 include its formation from a conduc-
`tive material. As such, the mounting assembly 18 may be
`formed from a metallic or other material which facilitates the
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`conductivity or transfer of heat. As expected and discussed in
`greater detail hereinafter,
`the conductive material of the
`mounting assembly 18 will also be typically be electrically
`conductive. Such confronting engagement between the illu-
`mination assembly 12 and the mounting assembly 18 serves
`to adequately support and position the illumination assembly
`12 in its intended orientation substantially co-axial to the
`mounting assembly 18 and also facilitates the transfer and
`dissipation of heat from the illumination assembly to and
`throughout the mounting assembly 18.
`In order to enhance and render most efficient, the heat
`dissipating capabilities of the light fixture assembly 10, it
`further includes a cover structure generally indicated as 20
`connected directly to the mounting assembly 18. More spe-
`cifically, the cover structure 20 is also formed of a conductive
`material and as such is capable of heat transfer throughout its
`structure. In at least one preferred embodiment, the cover
`structure 20 is formed of a heat conductive material which
`
`may be a metallic material which is also capable of being
`electrically conductive. Therefore, efficient heat
`transfer
`from the illumination assembly 12 to the mounting assembly
`18 and therefrom to the cover structure 20 is facilitated by the
`continuous confronting engagement ofcorrespondingly posi-
`tioned surfaces 18' and 20' respectively.
`Heat dissipation is further facilitated by the structuring of
`the cover structure 20 to have an overall larger dimension than
`that of the mounting assembly 18. As such, the relatively
`unexposed surface 20' of the cover structure 20 is disposed in
`substantially continuous confronting engagement with the
`correspondingly disposed surface 18' to facilitate heat trans-
`fer through the mounting assembly 18 and the cover structure
`20 when interconnected into the assembled orientation of
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`PETITIONERS, Ex. 1013
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`US 7,980,736 B2
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`7
`FIGS. 1 through 3. Further, the correspondingly positioned
`surfaces 18' and 20' may also be correspondingly configured
`to further facilitate the continuous confronting engagement
`therebetween by establishing a mating relation as best dem-
`onstrated in FIG. 3.
`
`Therefore, the corresponding configurations of the sur-
`faces 18' and 20' may, in at least one preferred embodiment,
`be defined by a substantially “stepped configuration”. Such a
`stepped configuration includes each of the confronting sur-
`faces 18' and 20' having a plurality of substantially annular
`steps, as represented throughout FIGS. 1 through 10. More
`specifically, with reference to FIGS. 5 and 6, the mounting
`assembly 18 includes a plurality of annularly shaped steps
`18" which collectively define the confronting surface 18'
`disposed in continuous engagement with the under surface or
`relatively unexposed surface 20' ofthe cover structure 20. The
`stepped configuration of the surface 20' of the cover structure
`20 is clearly represented in FIG. 3 as is the mating relation or
`engagement between the annular steps 20" and 18" as indi-
`cated. As should also be noted, the plurality of annular steps
`20" continue on the exposed or outer surface of the cover
`structure 20 in order to provide a more decorative or aesthetic
`appearance.
`In addition, due to the fact that the cover structure 20
`extends outwardly a significantly greater distance from the
`mounting assembly 18, a continuous confronting engage-
`ment between the corresponding surfaces 18' and 20' is such
`as to extend over substantially all or at least a majority of the
`surface area of the corresponding surface 18' of at least the
`cover structure 18. The enlarged dimension and the overall
`configuration of the cover structure 20, extending outward
`and in somewhat surrounding relation to the peripheral
`boundaries of the cover structure 18' further facilitates the
`
`dissipation of heat being transferred from the illumination
`assembly 12. More specifically and as should be apparent, the
`heat being removed from the illumination assembly 12 is
`transferred there from, through the mounting assembly 18
`and continuously through the cover structure 20. From the
`cover structure 20, the heat is dissipated to the surrounding
`environment.
`
`Cooperative structural features of the illumination assem-
`bly 12, the mounting assembly 18, and the cover structure 20
`include an apertured construction comprising the provision of
`an aperture or opening 24 in a center or other appropriate
`portion of the cover structure 20. The opening 24 is disposed,
`dimensioned and configured to receive the illumination
`assembly 12 therein or at least be in alignment therewith. As
`such, the light generated by the one or more light emitting
`diodes 14 passes through the opening 24 so as to be directed
`or channeled outwardly from the exposed or outermost sur-
`face of the cover assembly 20. The surrounding area is
`thereby effectively illuminated.
`Additional structural features associated with the directing
`or channeling of light from the illumination assembly 12
`through the opening 24 include a light shield 26 which may be
`formed of a transparent and/or translucent material such as
`glass, plastic, etc. The light shield 26 may be structured to
`further direct or channel, in a more efficient manner, the
`illumination generated by the LEDs 14 of the illumination
`assembly 12. Accordingly, the light shield 26 is disposed in
`overlying or underlying, as represented in the orientation of
`the assembly 10 in the accompanying Figures, but spaced
`relation to the opening 24 and to the illumination assembly 12
`when the various components ofthe light fixture assembly 10
`are in an assembled orientation as represented in FIGS. 3 and
`4.
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`8
`Interconnection of the various components into the
`assembled orientation of FIGS. 3 and 4 may be accomplished
`by a plurality of generally conventional connectors as at 28
`and a decorative or utilitarian attachment assembly 29, 29',
`29", etc. Further, a housing, enclosure, junction box or like
`structure 30 is provided for the housing ofwiring, conductors
`and other electrical components. Housing 30 is connected to
`the under surface or rear portion ofthe mounting assembly 18
`and may further include supportive backing plates or the like
`as at 32 and 32'. These backing plates 32, 32' facilitate the
`interconnection and support ofa remainder ofthe light fixture
`assembly 10 when it is attached to or supported by ceiling,
`wall or other supporting surface or structure. Moreover, as
`schematically represented in FIG. 1, the electrical compo-
`nents or conductors stored within the housing orjunction box
`30 are schematically represented as at 33. Further, an electri-
`cal interconnection to an appropriate source of electrical
`energy is also schematically represented as at 34 in FIGS. 1,
`7 and 9.
`
`Yet another preferred embodiment of the light fixture
`assembly 10 of the present invention is represented primarily
`but not exclusively in FIGS. 6 through 10. As set forth above
`with regard to the detailed description of the structural fea-
`tures associated with FIGS. 1 through 5, the heat sink struc-
`ture which facilitates the dissipation of heat from the illumi-
`nation assembly 12 is defined, at least inpart, by the mounting
`assembly 18 being disposed in heat transferring relation with
`the illumination assembly 12 and the cover structure 20 being
`disposed in substantially continuous, confronting engage-
`ment with the mounting assembly 18 along the correspond-
`ingly positioned surfaces 18' and 20'. As such, heat is trans-
`ferred from the illumination assembly 12 through the
`mounting assembly 18 and to the cover structure 20 for even-
`tual dissipation to the surrounding area. In accomplishing
`such an efficient heat transfer, both the mounting assembly 18
`and the cover structure 20 are formed of a conductive material
`such as, but not limited to, a metallic material. The metallic
`material of which the mounting assembly 18 and the cover
`structure 20 are formed are also typically capable of conduct-
`ing electrical current. Therefore, the additional preferred
`embodiment of FIGS. 6 through 10 is directed towards struc-
`tural features which eliminate or significantly reduce the pos-
`sibility of any type of electrical conductor or electrical com-
`ponents coming into direct contact with the mounting
`assembly 18 and/or the cover structure 20.
`However, it is important that current flow is effectively
`directed to the illumination assembly 12 specifically includ-
`ing the control circuitry 16 to regulate the activation and
`operation of the one or more light emitting diodes 14. There-
`fore, the light fixture assem