' JEDEC
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`STANDARD
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`CONFGURATEONS FOR
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`SQLED STATE MEMORIES
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`
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`
`
`JEDEC Stafidard No. ZIEC
`Reieage 7
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`
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`ELECTRONIC INDUSTRIES ASSOCIATION
`
`? ENGINEERING DEPARTMENT
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`9
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`o
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`%-%M§
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`1
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`IPR2018-OOO47
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`ASUS Computer EX1006 Page 1
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`IPR2018-00047
`ASUS Computer EX1006 Page 1
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`NOTICE
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`_
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`,, j
`
`EIA/JEDEC Standards and Publications contain material that has been prepared, progressively reviewed, and
`approved through the JEDEC Council level and subsequently reviewed and approved by the EIA General
`Counsel.
`
`EIA/JEDEC Standards and Publications are designed to serve the public interest through eliminating
`misunderstandings between manufacturers and purchases, facilitating interchangeability and improvement
`of products, and assisting the purchaser is selecting and obtaining with minimum delay the proper product
`.for his particular need. Existence of such standards shall not in any respect preclude any member or
`'nonmernber of JEDEC from manufacturing or selling products not conforming to such standards, nor shall
`the existence of such standards preclude their voluntary use by those other than EIA members, whether the
`standard is to be used either domestically or internationally.
`
`EIA/JEIDEC Standards and Publications are adopted without regard to whether their adoption may involve
`patents or articles, materials, or processes. By such action, ElA/JEDEC does not assume any liability-to any
`patent owner, nor does it assume any obligation whatever to parties adopting the EWJEDEC Standards or
`Publications.
`
`The information included in BIA/JEDEC Standards and Publications represents a sound approach to product
`specification and application, principally from the solid state device manufacturer viewpoint. Within the
`IEDEC organization there are procedures whereby an EIA/JEDEC Standard or Publication may be further
`processed andultimately becomes an EIA Standard.
`
`Inquiries. comments, and suggestions relative to the content of this EIA/JEDEC Standard should be addressed
`:to the JEDEC Executive Secretary at ElA Headquarters, 2500 Wilson Boulevard, Arlington, VA 22201.
`
`
`
`Published by
`
`©ELECTRONIC INDUSTRIES ASSOCIATION 1997
`Engineering Department
`2500 Wilson Boulevard
`
`Arlington, VA 22201
`
`"Copyright” does not apply to JEDEC member companies as they are free
`to duplicate this document in accordance with the latest revision of the
`JEDEC Publication 21 "Manual of Organization and Procedure".
`
`PRICE: Please refer to the current
`Catalog of EIA. JEDEC. and TIA STANDARDS and ENGINEERING PUBLICATIONS -
`or call Global Engineering Documents, USA and Canada (1-800-854-71 79)
`International (303-397-7956)
`
`‘
`
`Prim“ in USA.
`
`All rights reserved
`
`st,
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`IPR2018-00047
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`ASUS Computer EX1006 Page 2
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`IPR2018-00047
`ASUS Computer EX1006 Page 2
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`21-C Release 7 Insertion Instructions
`Page - 1
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`JESD 21—C, Release 7 Insertion Instructions
`Instructions for adding Release 7 to JEDEC Standard 21—C.
`Inclosed with this instruction sheet are new and replacement pages for JEDEC Standard 21—C. Those pages which contain
`new material are labeled “Release 7” at the bottom of the page.
`In some cases, there will be old material on the back of the
`sheet containing a Release 7 page. This old material will be labeled Release 1 , Release 2, Release 3, Release 4, Release 5. or
`Release 6 as there are no changes from the original release. All new text is marked bya "Revision Bar" in the outside margin in
`addition to the ”Release 7” label in the inside footer of the page.
`
`'
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`In this release, I have introduced a new feature in the Release#. In the pastwhen an older sheet was replaced with a new one, either to
`makea correction, or to revise the original sheet, the new release number simply replaced the old number, thus loosing the information ofthe
`original release number. In this release, the old number will be retained followed by the letter "c” for correction, or ”r” for revised, this
`followed by the new release number (e.f 407 or 6r7)
`The following is a series ofsheet by sheet instructions to be used to print the pages forthis release. The instruction numbers correspond
`directly the instructions intended for the holders of the Standard. These are also included with the new originals for R—6. These instructions
`should be included as the first pages in Release 6. In the printing instructions, the Release # s are refered to as R#.
`In the following 75 instructions, the material is arranged in 3 columns. The first column tells which sheet to remove from the
`21-C binder. The second column tells which sheet to add to the binder. The third column gives an explanation cfthe reason for
`the change or addition.
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`REMOVE
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`REASON
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`1. Remove Cover Page
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`Contains new Release level and date.
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`2. Remove Title Page;
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`Contains revision Log for Standard.
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`3. Remove TOC, 8 sheets;
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`21—0 Release 7 insertion Instructions
`Page -— 2
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`26- Remove PP 3.7.8—9/10
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`Terminology corrections.
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`Section 4 on Modules has been completely re—organized. Remove and discard all of the old
`pages from Section 4 and replace them with the new ones supplied. No sub—dividers are sup-
`plied, but it will enhance the usability of the section by adding your own dividers. The individual
`sheets are not listed here as they are supplied in correct order for insertion.
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`IPR2018-OOO47
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`IPR2018-00047
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`

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`CGNFIGURA‘TIONS FOR SOLID STATE MEMORIES
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`
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`Formulated under the cognizance of Committees JC—42.1 , PLD devices, JC-42.3, volatile memories, JC—42.4,
`non-volatile memories, and JC—42.5, memory modules and cards, and approved by the JEDEC Council.
`
`Standard 21—C Revision Log.
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`Release 1, August 1990
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`Release 2, September 1991
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`Release 3, November 1992
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`Release 4, November 1993
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`Release 5, February 1995
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`Release 6, January 1996
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`Release 7, January 1997
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`Release 7
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`_a_
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`IPR2018-OOO47
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`ASUS Computer EX1006 Page 5
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`IPR2018-00047
`ASUS Computer EX1006 Page 5
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`Section
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`Contents
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`JEDEC Standard No. 21-0
`
`Release #
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`Page #
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`,,,,,
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`1 BACKGROUND ...................................................... Release1 ....... Page1 —1
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`' 2 TERMS AND DEFINITIONS ............................................ Release1 ....... Page 2 - 1
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`2.1 Conventional Device Pin Names ................................... Release 6 ....... Page 2 - 2
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`2.2 Multiport DRAM Pin Names ........................................ Release 3 ....... Page 2 — 5
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`2.3 Power Pin Names ................................................. Release 5 ....... Page 2 -— 6
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`2.4 Device Type Names ............................................... Release 6 ....... Page 2 — 7
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`2.5 Miscellaneous Device Related Terms ............................... Release 1 ....... Page 2 — 9
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`2.6 Special Operational Cycles for MPDRAM ........................... Release 1 ..... Page 2 — 10
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`2.7 Package—Related Terms ........................................... Release 5 ..... Page 2 - 12
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`2.8 Memory Card Pin Names .......................................... Release 3 ..... Page 2 - 13
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`2.9 SRAM and SSRAM special Pin Names ............................. Release 6 ....... Page 2—14
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`
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`3 MEMORY DEVICE STANDARDS ....................................... Release 1 ....... Page 3 — 1
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`3.1 General Standards ................................................ Release1 ..... Page 3 .1 —1
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`3.1.1 Bytewide ...................................................... Release1 ..... Page 3 .1 -1
`3.1.1.1 -— 32K TO 256K BY 8 NA MX FAMILY IN DIP .................... Release 1 ..... Page 3 .1 —1
`FIGURE 3.1—1 , 32K TO 256K A/A MULTIPLEXED MEMORY IN DIP ............... Release 1 ....... Page 3 .1 —2
`
`3.2 Read Only Memory (ROM) ......................................... Release1 ...... Page 3.2-1
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`3.2.0 ROM General Standards ....................................... Release 5 ...... Page 3.2—2
`3.2.0.1 — Mask ROM Fast Address Mode Definition ..................... Release 5 ...... Page 3.2—2
`
`. . . . Page 3.2.1—1
`3.2.1 ROM, Byte Wide ............................................... Release 1
`3.2.1.1 — 2K TO 8K BY 8 ROM FAMILY IN DIP, TYPE A ................. Release 1 .... Page 3.2.1-1
`3.2.1.2 — 4K BY 8 ROM IN DIP, Type B ................................ Release 1
`. . . . Page 3.2.1—1
`3.2.1.3 - 8K TO 128K BY 8 ROM FAMILY IN DIP, ....................... Release 1
`. .
`. . Page 3.2.1—1
`3.2.1.4 —— 2K TO 32K BY 8 ROM FAMILY IN RCC ....................... Release1 .
`. . . Page 3.2.1—1
`3.2.1.5 — 32K TO 512K BY 8 ROM. FAMILY IN SOJ, ..................... Release 1
`.
`. .. Page 3.2.1—~1
`3.2.1.6 —— 128K TO 1M BY 8 ROM IN DIP, .............................. ReIease1 .. .. Page 3.2.1-1
`3.2.1.7 —- 64K TO 512K BY 9 ROM IN DIP, ............................. Release1 .... Page 3.2.1—1
`3.2.1.8 — 2 TO 64 X 16K BY 8 PAGE SELECT ROM IN DIP, .............. ReIease1 .... Page 3.2.1-—1
`3.2.1.9 — 512K and 1M BY 8 ROM IN QFP, ............................ Release 2 .... Page 3.2.1-1
`FIGURE 3.2.1—1, 2K TO 8K BY 8 ROM IN DIP, TYPES A & B .................... Release 1 ....... Page 3.2.1—2
`FIGURE 3.2.1-2, 8K TO 128K BY 8 ROM IN DIP ............................. Release 1 ....... Page 3.2.1—3
`FIGURE 3.2.1-3, 2K TO 32K BY 8 ROM IN CC ............................... ReIease 1 ....... Page 3.2.1—4
`FIGURE 3.2.1—4, 32K TO 512K BY 8 ROM IN SOJ ............................ Release 1 ....... Page 3.2.1—5
`FIGURE 3.2.1—5, 128K TO 1M BY 8 ROM IN DIP ............................. Release 1 ....... Page 3.2.1—6
`FIGURE 3.2.1—6, 64K TO 512K BY 9 ROM IN DIP ............................ Release 1 ....... Page 3.2.1—7
`FIGURE 3.2.1—7, 2 TO 64 X 16K BY 8 PAGE SELECT ......................... Release 1 ....... Page 3.2.1—8
`FIGURE 3.2.1—8, 512K AND 1M BY 8 ROM IN QFP ........................... Release 2 ....... Page 3.2.1—9
`
`3.2.2 ROM, Word Wide ............................................... Release1 . . . . Page 3.2.2—1
`3.2.2.1 —- 32K TO 256K BY 16 ROM IN DIP ............................ Releasel
`. .
`.
`. Page 3.2.2—3
`3.2.2.2 — 32K TO 256K BY 16 ROM IN 800 ........................... Release1 . .
`.
`. Page 3.2.2—3
`3.2.2.3 — 16K TO 256K BY 16 ADDRESS/DATA MX ROM IN DIP ......... Release 1
`. .
`. . Page 3.2.2-3
`3.2.2.4 — 16K TO 256K BY 16 ADDRESS/DATA MX ROM IN RCC ........ Release 1
`. .
`. . Page 3.2.2—3
`3.2.2.5 —— 256K and 512K BY 16 ROM IN QFP .......................... Release 2 . .
`. . Page 3.2.2—3
`3.2.2.6 — 512K TO 128M BY 16 ROM IN DIP AND SOP ................. Release 6 .... Page 3.2.2-3
`3.2.2.7 — 512K and 1M BY 16 ROM IN 800 ........................... Release 3 .
`.
`. . Page 3.2.2-3
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`_
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`-
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`””””
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`FIGURE 3.2.2—1, 32K TO 256K BY 16 ROM IN DIP ........................... Release 1 ....... Page 3.2.2-5
`FIGURE 3.2.2-2, 32K TO 256K BY 16 ROM IN CC ............................ Release 1 ....... Page 3.2.2—s
`Release 7
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`”i—
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`IPR2018-00047
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`ASUS Computer EX1006 Page 6
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`IPR2018-00047
`ASUS Computer EX1006 Page 6
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`JEDEC Standard No. 21—C
`
`Section
`
`Release #
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`Page #
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`FIGURE 3.2.2—3, 16K TO 256K BY 16 A0 MX ROM IN DIP ...................... Release 1 ....... Page 3.2.2—7
`FIGURE 3.2.2—4, 16K TO 256K BY 16 A0 MX ROM lN CC ...................... Release 1 ....... Page 3.2.2—8
`FIGURE 3.2.2—5, 256K AND 512K BY 16 ROM IN QFP ......................... Release 2 ....... Page 3.2.2—9
`FIGURE 3.2.2—6, 4M TO 128M BY 16 ROM IN DIP AND SOP .................... Release 2 ...... Page 3.2.2~10
`FIGURE 3.2.2—7, 512K & 1M BY 16 ROM IN SCC ............................. Release 3 ...... Page 3.2.2—11
`FIGURE 3.2.2—8, 512K TO 2M BY 16 ROM IN DIP AND SOG .................... Release 6 ...... Page 3.2.2—12
`
`3.3 Programmable Read Only Memory (PROM) ......................... Release 1 ...... Page 3.3—1
`
`. . . . Page 3.3.1—1
`3.3.1 PROM, Nibble Wide ............................................ Release 1
`3.3.1.1 — .25K & .5K BY 4 'ITL PROM IN DIP .......................... Release1 .... Page 3.3.1—3
`3.3.1.2 -— .25K BY 4 ECL PROM IN DIP ............................... Release1 . . .
`. Page 3.3.1—3
`3.3.1.3 — 1K & 2K BY 4 ‘I‘I'L PROM IN DIP ............................. Release 1
`.. .. Page 3.3.1—3
`3.3.1.4 —- 1K & 2K BY 4 ‘I‘I'L PROM IN SOP ............................ Release 1
`.. .. Page 3.3.1—3
`3.3.1.5 - 4K TO 8K BY 4 ‘ITL PROM IN DIP ........................... Release 2 . .
`. . Page 3.3.1-3
`3.3.1.6 —~ .25K TO 2K BY 4 ‘ITL PROM FAMILY IN RCC ................. Release 1
`. .
`. . Page 3.3.1—3
`3.3.1.7 - 4K BY 4 'I‘I'L PROM, 4K BY 4 'ITL RPROM IN SCC ............ Release 1
`. .
`. . Page 3.3.1—3
`3.3.1.8 — 1K TO 8K 'I‘I'L BY 4 PROM FAMILY IN RCC ................... Release 1
`. . .
`. Page 3.3.1—3
`3.3.1.9 - 1K TO 8K 'I‘I'L BY 4 PROM FAMILY IN SCC ................... Release 1
`... . Page 3.3.1—3
`3.3.1.10 — 1K TO 4K BY 4 DPROM FAMILIES IN DIP & SCC ............ Release 1
`. . .. Page 3.3.1—4
`3.3.1.11 — 1K TO 16K BY 4 ECL PROM FAMILY IN DIP ................. Release 1 .... Page 3.3.1—4
`FIGURE 3.3.1—1, .25K TO 2K BY 4 TI'L PROM IN DIP ......................... Release 1 ....... Page 3.3.1-5
`FIGURE 3.3.1—2, 256 BY 4 ECL PROM IN DIP ............................... Release 1 ....... Page 3.3.1—6
`FIGURE 3.3.1—3, 1K & 2K BY 4 TI'L PROM IN SOG ........................... Release 1 ....... Page 3.3.1—7
`FIGURE 3.3.1—4, 4K AND 8K BY 4 TI'L PROM IN DIP ......................... Release 2 ....... Page 3.3.1—8
`FIGURE 3.3.1—5, .25K TO 4K BY 4 TI'L PROM FAMILY IN CC .................... Release 1 ....... Page 3.3.1—8
`FIGURE 3.3.1—6, 1K TO 8K BY 4 TI'L PROM IN RCC .......................... Release 1 ...... Page 3.3.1—1 0
`FIGURE 3.3.1—7, 1K TO 8K BY 4 TIL PROM IN 300 .......................... Release 1
`.
`. .. .
`. Page 3.3.1-11
`FIGURE 3.3.1—8, 1K TO 4K BY 4 TI'L DPROM IN DIP ......................... Release 1 ...... Page 3.3.1—12
`FIGURE 3.3.1-9, 1K TO 4K BY 4 DPROM IN CC ............................. Release 1 ...... Page 3.3.1—13
`FIGURE 3.3.1—10, 1K TO 16K BY 4 ECL PROM IN DIP ......................... Release 1 ...... Page 3.3.1—14
`
`. . . . Page 3.3.2—1
`3.3.2 PROM, Bytewide ............................................... Release 1
`. . . . Page 3.3.2—3
`3.3.2.1 —- 32 BY 8 ‘ITL PROM IN DIP & SCC ........................... Release 1
`.. .
`. Page 3.3.2—3
`3.3.2.2 -— 32 BY 8 ECL PROM IN DIP & SCC ........................... Release 1
`.. . . Page 3.3.2—3
`3.3.2.3 — .25K & .5K BY 8 ‘ITL PROM IN DIP & SCC .................... Release 1
`. . . . Page 3.3.2—3
`3.3.2.4 — .25K TO 8K BY 8 'I‘I'L PROM FAMILY IN DIP .................. Release 1
`. .
`.
`. Page 3.3.2—3
`3.3.2.5 — .5K TO 4K BY 8 TI'L LPROM FAMILY IN DIP .................. Release 1
`. . .
`. Page 3.3.2—3
`3.3.2.6 —- .5K TO 4K BY 8 ‘ITL RPROM FAMILY IN DIP .................. Release 1
`. . .
`. Page 3.3.2—3
`3.3.2.7 — .5K TO 8K BY 8 'ITL PROM FAMILIES IN RCC & SCC ......... Release 1
`.. .
`. Page 3.3.2-4
`3.3.2.8 — .5K TO 2K BY 8 'ITL RPROM FAMILY lN SCC ................. Release 1
`. . .
`. Page 3.3.2-4
`3.3.2.9 —- 16K TO 64K BY 8 'I‘I'L PROM FAMILY IN DIP ................. Release 1
`3.3.2.10 —— 512 BY 8 ECL RPROM IN DIP & SCC ...................... Release 2 .
`.
`.
`. Page 3.3.2—4
`FIGURE 3.3.2—1, 32 BY 8 TI'L & ECL PROM IN DIP ........................... Release 1 ....... Page 3.3.2—5
`FIGURE 3.3.2—2, 32, 256, & 512 BY 8 'I'IL PROM IN CC, 32 BY 8 ECL PROM IN CC .
`.
`. Release 1 ....... Page 3.3.2—6
`FIGURE 3.3.2—3, 256 & 512 BY 8 'I'I'L PROM IN DIP .......................... Release 1 ....... Page 3.3.2—7
`FIGURE 3.3.2—4, .25K TO 8K BY 8 TI'L PROM IN DIP ......................... Release 1 ....... Page 3.3.2—8
`FIGURE 3.3.2—5, .5K TO 4K BY 8 TI'L LPROM IN DIP ......................... Release 1 ....... Page 3.3.2—9
`FIGURE 3.3.2—6, .5K TO 4K BY 8 I'll RPROM IN DIP ......................... Release 1 ...... Page 3.3.2—1 0
`FIGURE 3.3.2—7, .5K TO 8K BY 8 TI'L PROM IN SCC ......................... Release 1 ...... Page 3.3.2-11
`FIGURE 3.3.2—8, .5K TO 8K BY 8 TI'L PROM IN RCC ......................... Release 1 ...... Page 3.3.2—12
`FIGURE 3.3.2—9, .5K TO 2K BY 8 RPROM IN CC ............................. Release 1 ...... Page 3.3.2—1 3
`FIGURE 3.3.2—10, 16K TO 64K BY 8 'I'IL PROM IN DIP ........................ Release 1 ...... Page 3.3.2—14
`FIGURE 3.3.2—11, 512 BY 8 10K & 100K ECL RPROM IN DIP AND SCC ............ Release 2 ...... Page 3.3.2—15
`Release 7
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`IPR2018-00047
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`ASUS Computer EX1006 Page 7
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`IPR2018-00047
`ASUS Computer EX1006 Page 7
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`

`

`Section
`
`JEDEC Standard No. 21—0
`
`Release #
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`Page #
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`3.3.3 PROM, Word Wide ............................................. Release1 . . . . Page 3.3.3—1
`3.3.3.1 - 32 AND 64 BY 16 PROM IN DIP AND SCC ................... Release 1 .... Page 3.3.3—3
`FIGURE 3.3.3—1, 32 AND 64 BY 16 TTL PROM IN DIP ......................... Release 1 ....... Page 3.3.3—5
`FIGURE 3.3.3—2, 32 AND 64 BY 16 TTL PROM IN CC ......................... Release 1 ....... Page 3.3.3—6
`
`3.3.4 PROM Package Conversion .................................... Release1 . . . . Page 3.3.4-1
`3.3.4.1 — PROM DIP TO SO CONVERSION, 16, 18, 20, 24 DIP .......... ReIease1 .. .. Page 3.3.4—1
`FIGURE 3.3.4—1, 1K AND 2K TTL PROM 18 DIP TO 20 SO CONVERSION .......... Release 1 ....... Page 3.3.4—3
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`3.4 ErasableProgrammable Read Only Memory (EPROM) ............... Release1 ...... Page 3.4—1
`
`. . . . Page 3.4.1—1
`3.4.1 EPROM, Byte Wide ............................................. Release 1
`3.4.1.1 — 4K BY 8 EPROM IN DIP, TYPE A ............................ ReIease1 . . . . Page 3.4.1——3
`3.4.1.2 -— 4K AND 8K BY 8 EPROM IN DIP, ............................ Release1 . . . . Page 3.4.1-3
`3.4.1.3 — 8K TO 64K BY 8 EPROM FAMILY IN DIP, ..................... ReIease1 .. . . Page 3.4.1-3
`3.4.1.4 —— 2K TO 512K BY 8 EPROM FAMILY IN RCC ................... ReIease1 .... Page 3.4.1—3
`3.4.1.5 - 32K TO 512K BY 8 EPROM FAMILY IN SOJ, .................. Release1 .. .. Page 3.4.1-3
`3.4.1.6 —~ 128K TO 1M BY 8 EPROM FAMILY IN DIP, .................... Release1 . . . . Page 3.4.1—3
`3.4.1.7— 64K TO 512K BY 9 EPROM FAMILY IN DIP, ................... ReIease1 .. . . Page 3.4.1—3
`3.4.1.8 — 2 TO 64 X 16K BY 8 PAGE SELECT EPROM FAMILY IN DIP,
`.
`. . Release1 .... Page 3.4.1-3
`3.4.1.9 — 128K TO 512K BY 8 EPROM FAMILY IN TSOP—1, ............. Release 4 .... Page 3.4.1—3
`FIGURE 3.4.1—1, 4K AND 8K BY 8 EPROM IN DIP, TYPES A & B ................. Release 1 ....... Page 3.4.1—5
`FIGURE 3.4.1—2, 8K TO 64K BY 8 EPROM IN DIP ............................ Release 1 ....... Page 3.4.1—6
`FIGURE 3.4.1-3, 2K TO 512K BY 8 EPROM IN CC ........................... Release 1 ....... Page 3.4.1—7
`FIGURE 3.4.1—4, 32K TO 512K BY 8 EPROM IN SOJ .......................... Release 1 ....... Page 3.4.1—8
`FIGURE 3.4.1-5, 128K TO 1M BY 8 EPROM IN DIP ........................... Release 1 ....... Page 3.4.1—9
`FIGURE 3.4.1—6, 64K TO 512K BY 9 EPROM IN DIP .......................... ReIease 1 ...... Page 3.4.1—1 0
`FIGURE 3.4.1-7, 2 TO 64 X 16K BY 8 PAGE SELECT EPROM IN DIP .............. Release 1 ...... Page 3.4.1 ~11
`FIGURE 3.4.1—8, 128K TO 512K BY 8 EPROM IN TSOP—1 ...................... Release 4 ...... Page 3.4.1—12
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`3.4.2 EPROM, Word Wide ............................................ Release1 . . . . Page 3.4.2—1
`3.4.2.1 — 32K TO 256K BY 16 EPROM IN DIP ......................... ReIease1 .... Page 3.4.2—3
`3.4.2.2 — 32K TO 256K BY 16 EPROM IN 800 ......................... ReIease1 . . .. Page 3.4.2-3
`3.4.2.3 ~16K TO 256K BY 16 ADDRESS/DATA MX EPROM IN DIP ...... Release1 .
`. .. Page 3.4.2—3
`3.4.2.4 — 16K TO 256K BY 16 ADDRESS/DATA MX EPROM IN RCC ..... Release1 .... Page 3.4.2—3
`3.4.2.5 —— 512K TO 128M BY 16 EPROM or OTP IN DIP AND SOP ....... Release 6 . . .
`. Page 3.4.2-3
`3.4.2.6 -— 512K and 1M BY 16 EPROM IN 800 ........................ Release 3 .. . . Page 3.4.2—3
`3.4.2.7 — 64K TO 256K BY 16 EPROM IN TSOP—1 ..................... Release 4 . . .
`. Page 3.4.2—3
`FIGURE 3.4.2—1, 32K TO 256K BY 16 EPROM IN DIP ......................... Release 1 ....... Page 3.4.2—5
`FIGURE 3.4.2—2, 32K TO 256K BY 16 EPROM IN 800 ......................... Release 1 ....... Page 3.4.2—6
`FIGURE 3.4.2—3, 16K TO 256K BY 16 ADDRESS/DATA MX EPROM IN DIP ......... ReIease 1 ....... Page 3.4.2-7
`FIGURE 3.4.2—4, 16K TO 256K BY 16 ADDRESS/DATA MX EPROM IN RCC ......... Release 1 ....... Page 3.4.2—8
`FIGURE 3.4.2-5, 4M TO 128M BY 16 EPROM OR OTP IN DIP AND SOP ........... Release 1 ....... Page 3.4.2—9
`FIGURE 3.4.2—6, 512K & 1M BY 16 EPROM IN CC ........................... Release 3 ...... Page 3.4.2—1 0
`FIGURE 3.4.2——7, 64K BY 256K BY 16 EPROM IN TSOP-1 ...................... Release 4 ...... Page 3.4.2—11
`FIGURE 3.4.2—8, 512K TO 2M BY 16 EPROM IN DIP AND SOG .................. ReIease 6 ...... Page 3.4.2—12
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`3.5 Electrically Erasable Programmable Read Only Memory (EEPROM) . . . Release1 ...... Page 3.5—1
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`3.5.1 EEPROM, Byte Wide ........................................... Release1 . . . . Page 3.5.1-1
`3.5.1.1 -— .5K TO 2K BY 8 EEPROM FAMILY IN DIP ..................... ReIeaSe 1 .... Page 3.5.1—2
`3.5.1.2 — 2K & 4K BY 8 EEPROM IN RCC ............................. ReIease1 .. . . Page 3.5.1-2
`3513— 1K TO 32K BY 8 EEPROM FAMILY IN DIP .................... Release1 ... Page 3.5.1-2
`3.5.1.4 ~ .5K TO 32K BY 8 EEPROM FAMILY IN RCC .................. ReIease1 .... Page 3.5.1—2
`3.5.1.5 — 32K TO 256K BY 8 EEPROM FAMILY IN SOJ, ................. ReIease1 . .
`.
`. Page 3.5.1—2
`3.5.1.6 — 32K TO 512K BY 8 EEPROM FAMILY IN DIP, ................. Release1 .... Page 3.5.1-2
`
`Release 7
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`111
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`IPR2018-00047
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`ASUS Computer EX1006 Page 8
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`IPR2018-00047
`ASUS Computer EX1006 Page 8
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`

`

`JEDEC Standard No. 21—0
`
`Section
`
`Release #
`
`. . . .
`3.5.1.7 — 32K TO 256K BY 8 EEPFIOM FAMILY IN RCC, ................ Release 1
`. . ..
`3.5.1.8 — 32K TO 256K BY 9 EEPFIOM FAMILY IN DIP, ................. Release 1
`3.5.1.9 — 128K TO 1M BY 8 EEPROM FAMILY IN SCC, ................. Release1 ....
`3.5.1.10 — 32K TO 256K BY 8 EEPROM FAMILY IN TSOP1 ............. Release 2 . . . .
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`Page #
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`Page 3.5.1—2
`Page 3.5.1—2
`Page 3.5.1—2
`Page 3.5.1—3
`Page 3.5.1-3
`Page 3.5.1—3
`Page 3.5.1—3
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`3.5.1.11 - EXTENDED FEATURE SET FOR 256K BIT EEPROM ......... ReIease2 . . .
`3.5.1.12— OPTIONAL COMMAND SET FOR DUAL—SUPPLY EEPROM .
`. Release 3 . . .
`3.5.1.13 — 512K BY 8 DUAL—SUPPLY EEPROM IN RCC ................ Release 5 .
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`3.5.1.14— 128K to 512K BY 8 SINGLE—SUPPLY EEPFIOM FAMILY
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`IN DIP, RCC, & TSOP1 ................................... Release 5 .
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`3.5.1.15 -— 256K, 512K, &1M BY 8 DUAL—SUPPLY EEPROM IN TSOP1 .. . Release 6 .
`3.5.1.16 —‘ 1M TO 8M BY 8 SINGLE—SUPPLY EEPROM FAMILY IN TSOP1 .......... Release 5 . .
`3.5.1.17 —- 8K BY 256B OR 264B SERIAL ACCESS EEPROM IN TSOP2 ............ Release 6 .
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`3.5.1.18 — 1M, 2M BU 8 SINGLE OR DUAL SUPPLY EEPROM IN PSOP2 ........... Release 7 .
`FIGURE 3.5.1—1, .5K TO 2K BY 8 EEPROM IN DIP ........................... Release 1
`FIGURE 3.5.1—2, 2K & 4K BY 8 EEPROM IN RCC ............................ Release 1
`FIGURE 3.5.1~3, 1 K TO 32K BY 8 EEPROM FAMILY IN DIP ..................... Release 1
`FIGURE 3.5.1—4, .5K TO 32K BY 8 EEPROM FAMILY IN RCC .................... Release 1
`FIGURE 3.5.1-5, 32K TO 256K BY 8 EEPROM FAMILY IN SOJ ................... Release 1
`FIGURE 3.5.1—6, 32K TO 512K BY 8 EEPROM FAMILY IN DIP ................... Release 1
`FIGURE 3.5.1-7, 32K TO 256K BY 8 EEPROM FAMILY IN RCC .................. Release 1
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`.
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`FIGURE 3.5.1—8, 32K TO 256K BY 9 EEPROM FAMILY IN DIP ................... Release 1
`FIGURE 3.5.1—9, 128K TO 1M BY 8 EEPROM FAMILY IN SCC ................... Release 1
`FIGURE 3.5.1—10,32K TO 256K BY 8 EEPROM FAMILY IN TSOP1 ............... Release 2
`ADDENDUM 1, 32K X 8 BIT EEPROM EXTENDED FEATURE STANDARD .......... Release 2
`FIGURE 3.5.1—1 1, DUAL SUPPLY EEPROM COMMAND SET .................... Release 3
`FIGURE 3.5.1—12, 512K BY 8 DUAL—SUPPLY EEPROM IN RCC ................. Release 5
`FIGURE 3.5.1—13, 128K to 512K SINGLE—SUPPLY EEPROM FAMILY IN DIP ........ Release 5
`FIGURE 3.5.1—14, 128K to 512K SINGLE—SUPPLY EEPROM FAMILY IN RCC ........ Release 5
`FIGURE 3.5.1—15, 128K to 512K SINGLE—SUPPLY EEPROM FAMILY IN TSOP1 ...... Release 5
`FIGURE 3.5.1-16, 1M BY 8 DUAL—SUPPLY EEPROM IN TSOP1 ................. Release 5
`FIGURE 3.5.1—17. 1M TO 8M SINGLE—SUPPLY EEPROM FAMILY IN TSOP1 ........ Release 5
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`FIGURE 3.5.1—18,256K & 512K BY 8 DUAL—SUPPLY EEPROM IN TSOP1 .......... Release 6
`FIGURE 3.5.1—19 A=C 8K BY 256B OR 264B SERIAL ACCESS EEPROM IN TSOP2 .
`. Release 6 .
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`FIGURE 3.5.1-20. 1M, 2M BU 8 SINGLE OR DUAL SUPPLY EEPROM IN PSOP1 ..... Release 7
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`Page 3.5.1—3
`Page 3.5.1—4
`Page 3.5.1-4
`Page 3.5.1—4
`Page 3.5.1-4
`..... Page 3.5.1-5
`..... Page 3.5.1—6
`..... Page 3.5.1—7
`..... Page 3.5.1—8
`..... Page 3.5.1——9
`.. .. Page 3.5.1—1O
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`.. .. Page 3.5.1—15
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`Page 3.5.1—31:33
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`. Page 3.5.1—34
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`3.5.2 EEPROM, Word Wide ........................................... Release 1
`3.5.2.1 —— 4K TO 32K BY 16 EEPROM IN DIP .......................... Release1 ... .
`3.5.2.2 - 4K TO 256K BY 16 EEPROM IN SCC ........................ Release 1
`.. .
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`3.5.2.3 — 256K TO 128M BY 16 EEPROM IN DIP AND SOG ............. Release 6 .. .
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`3.5.2.4 -— 1M TO 4M BY 16 DS EEPROM IN SSOP ......... 4 ............ Release 6 .. . .
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`3.5.2.5 —~ 1M TO 4M DENSITY, BY 8 OR 16 FEEPROM IN PSOP ........ Release 7 . .
`3.5.2.6 — 1M TO 32M DENSITY, BY 8 OR 16 FEEPROM IN TSOP1 ...... ReIease7 ....
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`Page 3.5.2—1
`Page 3.5.2—3
`Page 3.5.2—3
`Page 3.5.2—3
`Page 3.5.2-3
`Page 3.5.2—3
`Page 3.5.2—3
`FIGURE 3.5.2—1, 4K TO 32K BY 16 EEPROM FAMILY IN DIP .................... Release 1
`..... Page 3.5.2—-5
`FIGURE 3.5.2—2, 4K TO 256K BY 16 EEPROM FAMILY IN SCC .................. Release 1
`..... Page 3.5.2—6
`FIGURE 3.5.2—3, 4M TO 128M BY 16 EEPROM FAMILY IN DIP AND SOG .......... Release 2
`..... Page 3.5.2—7
`FIGURE 3.5.2—4, 256K TO 2M BY 16 EEPROM FAMILY IN DIP AND SOG ........... Release 6
`..... Page 3.5.2—8
`FIGURE 3.5.2—5, 1M TO 4M BY 16 DS EEPROM IN SSOP ............... Release 6
`..... Page 3.5.2—9
`FIGURE 3.5.2—6, 1M TO 4M DENSITY BY 8 OFI16 FEEPFIOM IN PSOP .
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`. Release 7
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`. Page 3.5.2—10
`FIGURE 3.5.2—7, 1M TO 32M DEBSITY BY 8 OFI‘I 6 FEEPROM IN PSOP .
`. Release 7
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`. Page 352—11
`. . . .
`3.5.3 EEPROM EXTENDED FEATURES ............................... Release 1
`3.5.3.1 —~ EXTENDED FEATUFIE SET FOFI 256Kb EEPROM ............ Release1 . . .
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`3.5.3.2 — DUAL SUPPLY EEPROM COMMAND SET .................. Release 7 . . .
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`Page 3.5.3—1
`Page 3.5.3—3
`Page 3.5.3—13
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`_iv_
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`Release 7
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`IPR2018—OOO47
`
`ASUS Computer EX1006 Page 9
`
`IPR2018-00047
`ASUS Computer EX1006 Page 9
`
`

`

`Section
`
`JEDEC Standard No. 21—C
`
`Release #
`
`Page #
`
`. Page 3.5.3—14
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`3.5.3.3 — SINGLE SUPPLY EEPROM COMMAND CODES .............. Release 7 .
`3.5.3.4 — EEPROM TOGGLE BIT FEATURE .......................... ReIease7 ... Page 3.5.3—15
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`3.6 Non volatile Random Access Memory (NVRAM) ..................... Release1 ...... Page 3.6—1
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`3.6.1 NVRAM, Nibble Wide ........................................... Release 1 ...... Page 3.6—3
`3.6.1.1 -— .25K & 1 K BY 4 NVRAM IN DIP .............................. ReIease1 ...... Page 3.6-3
`
`3.6.2 NVRAM, BYTE WIDE .................. - ......................... Release1 ...... Page 3.6—3
`3.6.2.1 — .5K, 1K BY 8 NVRAM IN DIP ................................ Release1 ...... Page 3.6—3
`3.6.2.2 — .5K & 1K BY 8 NVRAM IN RCC .............................. Release1 ...... Page 3.6—3
`3.6.2.3 -— .5K TO 16K BY 8 NVRAM FAMILY IN DIP ..................... Release 1 ...... Page 3.6-3
`3.6.2.4 - .5K TO 16K BY 8 NVRAM FAMILY IN RCC .................... Release1 ...... Page 3.6—3
`3.6.2.5 — 32K TO 256K BY 8 NVRAM FAMILY IN SOJ, .................. Release1 ...... Page 3.6—3
`3.6.2.6 -— 32K TO 256K BY 8 NVRAM FAMILY IN DIP, ................... Release 1 ...... Page 3.6-3
`3.6.2.7 - 16K TO 128K BY 9 NVRAM FAMILY IN DIP, ................... ReIease1 ...... Page 3.6-3
`FIGURE 3.6—1, .25K & 1K BY 4 NVRAM IN DIP .............................. Release 1 ........ Page 3.6—5
`FIGURE 3.6—2, .5K & 1K BY 8 NVRAM IN DIP ............................... Release 1 ........ Page 3.6—6
`FIGURE 3.6—3, .5K & 1K BY 8 NVRAM IN RCC .............................. Release 1 ........ Page 3.6—7
`FIGURE 3.6—4, .5K TO 16K BY 8 NVRAM FAMILY IN DIP ....................... Release 1 ........ Page 3.6—8
`FIGURE 3.6—5, .5K TO 16K BY 8 NVRAM FAMILY IN RCC ...................... Release 1 ........ Page 3.6—9
`FIGURE 3.6—6, 32K TO 256K BY 8 NVRAM FAMILY IN SOJ ..................... Release 1 ....... Page 3.6—1O
`FIGURE 3.6—7, 32K TO 256K NY 8 NVRAM FAMILY IN DIP ..................... Release 1 ....... Page 3.6—11
`FIGURE 3.6—8, 16K TO 128K BY 9 NVRAM FAMILY IN DIP ...................... Release 1 ....... Page 3.6—12
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`3.7 Static Random Access Memory (SRAM) ............................ Release1 ...... Page 3.7—1
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`3.7.1 —- JTAG Extension to Revolutionary Pinout SRAM Devices ........ Rel