`Jan. 25, 1977
`Fosler, Jr. et al.
`[45]
`
`
`11]
`
`4,005,395
`
`,.5,
`
`(54]
`
`[75]
`
`COMPATIBLE STANDBY POWER DRIVER
`FOR A DYNAMIC SEMICONDUCTOR
`
`Inventors: Dick E. Fosler, Jr.; Thomas L.
`Krocheski, both of St. Paul, Minn.
`
`{73] Assignee:
`
`Sperry Rand Corporation, New
`York, N.Y.
`
`(22]
`(21]
`
`[52]
`[51]
`[58]
`
`[56]
`
`Filed:
`
`May 8, 1975
`
`Appl. No.: 575,541
`US. Ch. oe 340/173 DR; 340/173 R
`Int. Ch?eee ere G1IC 7/00
`Field of Search 2.0.0.0... 340/173 R, 173 DR
`References Cited
`
`UNITED STATES PATENTS
`Hume on... ee 340/173 R
`Smith et abo. 340/173 FF
`
`L/1975
`3/1975
`
`3,859,638
`3,870,901
`
`OTHER PUBLICATIONS
`
`Harroun, Storage Refresh Control and Synchroniza-
`tion, IBM Technical Disclosure Bulletin, vol. 15, No. 1,
`pp. 257-258, 6/72.
`
`Primary Examiner—Stuart N. Hecker
`Attorney, Agent, or Firm—ThomasJ. Nikolai, Kenneth
`T. Grace; Marshall M. Truex
`
`ABSTRACT
`[57]
`A compatible standby power driving circuit for a dy-
`namic semiconductor memory includes a low imped-
`ance, high power driving circuit connected in parallel
`with a high impedance, low power driving circuit. The
`outputs of the high power and low power driving cir-
`cuits are mutually connected to the column driving
`circuit output andthe inputs of both driving circuits are
`connected to the refresh address selection line so that
`both the output of the high power driving circuit and
`the low power driving circuit are available under nor-
`mal or regular power conditions and the low power
`driving circuit output is available under standby power
`conditions.
`
`10 Claims, 2 Drawing Figures
`
`TO DYNAMIC
`
`REGULAR POWER
`
`ALWAYS ON
`
`MEMORY
`
`NORMAL ADDRESS
`
`
`
`
`REFRESH ADDRESS
`
`
`33
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`NORMAL ADDRESS GATE
`REFRESH ADDRESS GATE
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`13
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`U.S. Patent
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`4,005,395
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`Oo =
`y &
`ADDRESS
`no 2
`DRIVING
`” o
`MEANS
`
`=
`
`aa 2:
`
`Oo
`s
`
`
`
`
`ay 2
`
`
`
`COLUMN
`REFRESH
`
`
`ADDRESS
`ADDRESS
`
`
`DRIVING
`
`MEANS
`
` REFRESH 3
`
`
`ADDRESS GATE
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`
`
`
`REFRESH
`
`TIMING &
`
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`CONTROL
`REFRESH
`Osc.
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`TO DYNAMIC
`
`ALWAYS ON
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`MEMORY
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`33
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`REFRESH AODRESS GATE
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`REFRESH ADDRESS
`
`Fig. 2
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`COMPATIBLE STANDBY POWER DRIVER FOR A
`DYNAMIC SEMICONDUCTOR
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`This invention relates to dynamic semiconductor
`memory systems. Moreparticularly, this invention re-
`lates to a novel standby driving circuit for refreshing
`the information stored in a dynamic semiconductor
`memory system during powerfailure.
`2. Description of the Prior Art
`Dynamic semiconductor memory systems are well-
`known. The semiconductor industry is presently sup-
`plying packaged modules which may be arranged in X,
`Y and Z memoryplanes to create solid state memories
`for the largest and fastest commercial computers being
`made today. One disadvantage of a dynamic semicon-
`ductor memory system isthat it is a volatile medium,
`ie., there is a tendency for the information which is
`stored in the memory to be lost during power failures.
`Also, such memories have destructive readout (DRO)
`properties and during normal
`read-in and read-out
`operations, the information must be resupplied or re-
`written into the semiconductor memory. Furthermore,
`dynamic semiconductor memories tend to lose their
`information with passage of time and therefore must be
`periodically ‘‘refreshed.””
`Heretofore, it was known that a dynamic semicon-
`ductor memory system could be refreshed by periodi-
`cally interrupting the normal read and write operations
`and supplying a refresh address or refresh signal on the
`address lines of the semiconductor matrix. Heretofore,
`it also has been commonpractice to provide an inde-
`pendent and secondary refresh address driving means
`which is turned on at the time power failure is sensed.
`Such prior art standby refresh address driving systems
`require a time lag to become operable and as a result
`the memory may lose the information which is sup-
`posed to be refreshed. Further, standby refresh address
`power driving systems have heretofore required an
`inordinately large amount of power to sustain or re-
`fresh the dynamic semiconductor memory which has
`resulted in rapid drain of the standby power source.
`SUMMARYOF THE INVENTION
`
`The present invention provides a novel low power
`driving circuit which may be added to a conventional
`refresh address driving circuit of a dynamic memory.
`The principal object of the present invention is to
`provide a refresh address driving circuit which is always
`active and does not require any switching time to turn
`on once power is lost.
`Anotherobject of the present invention is to provide
`a refresh address driving circuit which requires less
`powerdrain than known prior art refresh address driv-
`ing circuits.
`Another object of the present invention is to provide
`a standby refresh address driving circuit which is al-
`ways active and is compatible with the normal active
`refresh address driving circuit.
`invention is to
`Yet another object of the present
`provide circuit means for converting normal dynamic
`semiconductor memories into non-destructive readout
`(NDRO) dynamic semiconductor memories.
`According to the above objects and principles of the
`present invention there is provided in a dynamic semi-
`conductor memory system a low power and high im-
`
`2
`pedance refresh address driving circuit which is pow-
`ered by an always-on power source. The low power
`refresh address driving circuit is connected in parallel
`with the normal high power and low impedancedriving
`circuit which is powered by an interruptible power
`supply so that the refresh address signals on the refresh
`address selection line generate driving signals indica-
`tive of a column address for refreshing information
`stored in the dynamic semiconductor memory system
`during power interruptions.
`Other objects, features and advantagesof the present
`invention will become apparent to those skilled in the
`art from a reading of the following detailed description
`of the preferred embodiment, in light of the following
`drawings in which:
`BRIEF DESCRIPTION OF THE DRAWINGS
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`FIG. 1 is a block diagram ofa typical dynamic semi-
`conductor memory system in which the present inven-
`tion is embodied.
`FIG. 2 is a schematic block diagram of one of the
`column addressdriving circuits embodying the present
`invention.
`
`DESCRIPTION OF THE PREFERRED
`EMBODIMENT
`
`For purposesof this invention it will be assumed that
`the dynamic semiconductor memory matrix comprises
`MOSFET single transistor per cell devices with a
`chargeable capacitorin the gate to provide the memory
`for the individual transistors. The dynamic semicon-
`ductor memory matrix to be explained will be assumed
`to have 64 rows and 64 columns which are accessible
`by a six bit row address and a six bit column address.
`Dynamic memory devices having 64 columns and 64
`rows are commercially available as MOS random ac-
`cess memory (RAM) devices such as the TMS 4030
`device made by Texas Instruments, Inc. The principles
`to be applied in the above described dynamic semicon-
`ductor memory matrix are applicable to other dynamic
`semiconductor memories which employ more than a
`single MOSFETpercell such as memories which em-
`ploy three MOSFETtransistors per active cell.
`Refer now to FIG. 1 where an address online 11 from
`the CPU 10 is first entered into the memory address
`register 12. The 12 bit address on cable 11 is stored in
`stages 0 to 11 of register 12. Bits 0 to 5 define the
`column address on cable 13 and bits 6 through 11
`define the row address on cable 14. The row addressis
`gated and amplified in row address driving means 15
`and the active signals from the plurality of drivers de-
`fining the row address are transmitted on a plurality of
`driving lines in cable 16 to the cell matrix 17A of dy-
`namic semiconductor memory matrix 17. Bits 0 to 5
`generate the normal column address on normal column
`address cable 13 and are transmitted to the column
`address driving means 18. Normal address gating sig-
`nals on line 19 cause the normal column addresssignals
`on the lines in cable 13 to be gated and amplified in
`column address gating means 18 to generate a plurality
`of signals on the lines in cable 21 indicative of the
`column address. The plurality of signals on cable lines
`16 and 21 are decoded and applied to cell matrix (17B)
`inside of dynamic semiconductor memory 17 toselect
`a single row and column line. When information is read
`into the dynamic semiconductor memory, it is passed
`via information read-in lines 22 and when information
`is read-out it is passed via information read-out lines
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`23. The read-in and read-out information is passed in
`parallel to and from active registers (not shown) in the
`CPU 10.
`Dynamic semiconductor memory system 20 of FIG. 1
`includes normal timing and control circuits 24 which
`are implemented by the CPU 10 via lines 25 and 26.
`Whenthe refresh address oscillator 34 is active, it pro-
`ducesa signal on line 35 whichinitiates a refresh cycle.
`The refresh timing and control circuits 28 generate the
`refresh address gating signals on lines 29.
`It will be
`understood that in the present system the normal ad-
`dress gating signal on line 19 inhibits the refresh ad-
`dress gating signal on line 29 and the refresh address
`gating signal on line 29 inhibits the normal address
`gating signal on line 19.
`In the dynamic semiconductor memory system 20
`whenever a “read” or ‘write’? operation occurs, the
`semiconductor devices associated with the column
`being accessed are refreshed during the read/write
`operation. For example, if a transistor in column 7 of
`the memory 17 is written into or read out, the other
`transistors in column 7 are refreshed during the read/-
`write cycle. During normal access to the dynamic semi-
`conductor memory matrix,
`it cannot be assured that
`the transistors or cells in all 64 columns will be sub-
`jected to a read or a write operation during the critical
`time for refreshing or recharging the capacitors in the
`gate electrodes of the transistors. Accordingly,
`it
`is
`necessary to generate “‘refresh”’ signals similar to read
`and write signals on all of the columns in the dynamic
`semiconductor memory matrix 17 to refresh or re-
`charge the capacitorsin the gate circuits of the memory
`transistor cells. The normal timing and control circuits
`24 will continue normal read and write operations by
`generating normal addressgating signals on lines 19 but
`will not interrupt the normal read and write operations
`for a refresh operation. When a refresh cycle is initi-
`ated during a normal read or write operation, the re-
`fresh cycle will begin at the end of the read or write
`cycle, Approximately every thirty-two microseconds
`the refresh oscillator 34 will energize the refresh timing
`and control circuits 28 via line 35. When permitted by
`the normal timing and control circuits 24 via line 27,
`the refresh timing and control circuits 28 will generate
`refresh address gating signals on line 29 which permit
`one of the series of columns to be recharged and re-
`freshed as will be explained further hereinafter. The
`refresh timing and control circuits 28 also generate a
`timing or counter advancesignal on line 31 to the re-
`fresh address counter circuits 32 which generates the
`scanning or refresh address signals on lines 33 indica-
`tive of one of the 64 column addresses. The counter
`advance timing signals on line 31 are enabled by re-
`fresh oscillator 34 via line 35.
`Refer now to FIG. 2 showing one of the plurality of
`driving circuits which are embodied in the column
`address driving means 18. For purposesof this explana-
`tion it has been assumed that there are bits 0 to 5 in
`memory address register 12 which define six column
`address bits and bits 6 to 11 define six row addressbits.
`In the binary coded decimal! system these bits wilt de-
`fine one of 2° or 64 columns or rows. Accordingly,
`there are provided in column address driving means 18
`six such driving circuits as are shown in FIG. 2. It will
`be understood that each oneofthe six column address
`signals on line 13 will connect to one of thesix drivers.
`A signal on normal column address line 13 is supplied
`to AND gate 41 and is gated through gate 41 by a
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`normal address gating signal on line 19 to create an
`output on line 42. The output on line 42 is applied to
`NORgate 43 to produce an output on line 44 which is
`applied to the decoding circuits (not shown) in dy-
`namic semiconductor memory matrix 17 to select one
`of the columnsof the cell matrix 17A. For purposes of
`this invention, NOR gate 43 may be a Series 7451 dual,
`two wide,
`two input AND-OR-INVERT gate of the
`type made by Texas Instruments, Inc. The bipolar NOR
`gate 43 has a characteristic output impedance of the
`order of 50 ohms and can drive or sink approximately
`20 milliamperes with a + regular voltage supply B+ of
`the order of 5 volts.
`During normal read and write operations, the high
`powerdriving gates 43 are selected by the normalad-
`dress lines 13 via normal address gating signals on line
`19 applied at AND gate 41. During the read and write
`operationsit will be understood that row addresses and
`rowsare also selected by the row address driving means
`andthe gating signals on line 19, as explained hereinbe-
`fore. During the refresh mode of operation the refresh
`address counter 32 is sequencing or sequentially scan-
`ning the six high power driving gates 43 on refresh
`address selection lines 33 and are selected by the re-
`fresh address gating signals on line 29 which are ap-
`plied to AND gate 46. The refresh column address
`signal is generated at the output of AND gate 46 online
`47 andis buffered and amplified through NORgate 43
`to generate a signal of equal intensity and magnitude as
`the read or write signal on line 44. Since the refresh
`address selection signal on line 33 is only generated or
`implemented during the refresh mode, the signal may
`be applied directly via line 48 to the inverter 49, which
`is a low powerdriving gate, to produce an output signal
`on line 51 which is applied to the output or driving line
`44, It will be understood that during the refresh address
`mode, there is a signal generated by the high power
`driving gate 43 and the low powerdriving gate 49.
`The low powerdriving gate 49 is preferably a C-MOS
`device such as a 74 CO4 made by National Semicon-
`ductor, Inc. Gate 49 has a characteristic impedance of
`approximately 1000 ohms and will drive or sink ap-
`proximately 1.75 milliamperes. The output of low
`powerdriving gate 49 will not interfere with the driving
`power of NORgate 43 during the normal refresh ad-
`dress selection mode. Low power driving gate 49 is
`powered by an always-on power supply (not shown)
`connected to line 53 which will be active even during
`power interruptions and power failures. During the
`refresh address mode, should the high power driving
`gate 43 lose its regular power source connectedto line
`§2 there will be no output from NORgate 43. How-
`ever, the low power output from driving gate 49 will be
`sufficient to generate a refresh signal on line 44 which
`will maintain the dynamic semiconductor memoryre-
`charged and effective.
`The dynamic semiconductor memory matrix 17 in
`the preferred embodiment can be restored or main-
`tained with a 2.2 volt minimum signal to maintain the
`logic “1” level. A 0.8 volt maximum signal will main-
`tain the logic “0” level. Thus, the low power driving
`circuit 49 will maintain the columns of the dynamic
`semiconductor memory matrix active even during
`powerfailure.
`in the preferred embodiment shown in FIGS. f and 2
`the always-on power supply connected to line 53 is
`coupled to column address driving means 18, refresh
`timing and control circuits 28, refresh address counter
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`circuits 32 and the refresh oscillator 34. The always-on
`power supply can be connected in a manner which will
`always maintain its power level without dissipating the
`backup or battery supply.
`Having explained the preferred embodiment of the
`presentinvention, it will be understood that a plurality
`of driving circuits such as shown in FIG. 2 are em-
`ployed to implement read and write operations and are
`further employed to implement
`the refresh address
`mode operation. The normal address is always gated
`through AND gate 41 of the individual driving circuits
`and the refresh address is always gated through AND
`gate 46 when poweris normally on. Both AND gates 41
`and 46 are normally off when poweris interrupted or
`normal poweris off. Thus, during the refresh mode, the
`refresh address selection line 33 is effective, via line 48
`and inverter 49, to generate the refresh address signal
`on line 51. The refresh address mode, once in opera-
`tion, always has priority and will completeits cycle and
`will block any normal address mode operations. The
`normal address mode is operable approximately 60
`times more often than the refresh address mode, even
`though the refresh address mode could be operated at
`less frequent intervals. The normal read or write opera-
`tion requires only a few nanoseconds and the refresh
`address mode may beefficiently interposed at the end
`of a normal memory cycle. Both the refresh address
`mode andthe read and write modeact to lock out other
`operable modes until their mode or cycle of operation
`is complete.
`It will be understood that C-MOS devices require
`very low powerdrain and display relatively high imped-
`ance. Therefore, when operating from standby power
`there is very little drain on the battery or always-on
`power source connected to line 53. Further, it will be
`understood that the C-MOS device 49 described above
`is a NAND gate which operates normally in the off
`condition with no power drain.
`While there has been described an exemplary em-
`bodimentofthe invention, it will be apparent that vari-
`ous modifications and substitutions may be made to the
`arrangement and, therefore, the scope of the invention
`is to be limited only as set forth in the following claims.
`Whatis claimed is:
`1.
`In a dynamic semiconductor memory system, a
`compatible circuit driven by always-on standby power
`for refreshing the information stored in said memory
`system during normal powerfailure, comprising:
`a dynamic semiconductor memory matrix;
`row address driving means for generating an address
`indicative of a row in said matrix;
`column address driving means for generating an ad-
`dress indicative of a column in said matrix,
`said column address driving means comprisinga plu-
`tality of column address drivers, each said column
`address drivers comprising:
`a high powerdriving gate adapted to be connected
`to a source of normal interruptible power;
`a low power driving gate adapted to be connected
`to a source of always-on power,
`said driving gates of each said column addressdriv-
`ing means being connected together in a logical
`ORattheir outputs,
`a normal address selection gate connected to the
`input of said high power driving gate,
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`a refresh address selection gate connected to the
`input of said high powerdriving gate;
`mode enabling lines connected to said selection
`gates for enabling one of said selection gates;
`a refresh address selection line connected to the
`input ofsaid refresh address selection gate and to
`the input of said low powerdriving gate, whereby
`an input signal on said refresh address selection
`line always produces a signal outputat said col-
`umn address driver.
`2. In a dynamic semiconductor memory system asset
`forth in claim 1 wherein each said low power driving
`gate comprises a normally off inverter.
`3. In a dynamic semiconductor memory system asset
`forth in claim 2 wherein each said low powerdriving
`gate comprises a normally off NAND gate connected as
`a single input inverter.
`4. In a dynamic semiconductor memory system asset
`forth in claim 3 wherein said low power driving gate
`comprises a low power drain NANDgate.
`5. In a dynamic semiconductor memory system asset
`forth in claim 4 wherein said low power driving gate
`comprises a CMOS NANDgate.
`6. In a dynamic semiconductor memory system asset
`forth in claim 5 wherein said high power driving gate
`comprises a bipolar NOR gate.
`7. Ina dynamic semiconductor memory system as set
`forth in claim 1 wherein said low power driving gate
`comprises a high impedance load in the output circuit
`of said high power driving gate.
`8. In a dynamic semiconductor memory system as set
`forth in claim 1 which further includes a refresh ad-
`dress counter for generating signals on said refresh
`address selection lines indicative of a column in said
`matrix.
`9, In a dynamic semiconductor memory system as set
`forth in claim 8 which further includes a refresh timing
`and control means wherein said refresh address
`counter and said refresh timing and control means are
`connected to said source of always-on power.
`10. In a dynamic semiconductor memory system of
`the type having a matrix comprised of rows and col-
`umns of dynamic semiconductor memory elements,
`row address driving means for generating address rep-
`resenting signals indicative of a row in said matrix,
`column address driving means for generating address
`representing signals indicative of a columnin said ma-
`trix, the improvement comprising X column address
`driver circuits including
`a. a high powerdriving gate adapted to be connected
`to a source of normal interruptible power,*
`b. a low powerdriving gate adapted to be connected
`to a source of always-on power,
`c. meansfor logically combining the output terminals
`of said high powerdriving gate and said low power
`driving gate;
`d. means forselectively applying normal or refresh
`address representing signals to the input of said
`high powerdriving gate; and
`e. means for also connecting said refresh address
`representing signals to the input of said low power
`driving gate, whereby an outputis produced at the
`output of said column address driver circuit even in
`the absence of said normal interruptible power.
`*
`*
`*
`*
`*
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