`
`[19]
`
`[11,
`
`4,005,395
`
`
`
`
`
` Fosler, Jr. et al. [45] Jan. 25, 1977
`
`[54] COMPATIBLE STANDBY POWER DRIVER
`FOR A DYNAMIC SEMICONDUCTOR
`Inventors: Dick E. Fosler, Jr.; Thomas L.
`Krocheski, both of St. Paul, Minn.
`
`[75]
`
`[73] Assignee: Sperry Rand Corporation, New
`Y k, N.Y.
`or
`.
`Flled:
`May 8’ 1975
`[22]
`[2]] Appl. No.: 575,541
`[52] U.S. Cl.
`..................... 340/173 DR; 340/173 R
`[51]
`Int. Cl.2 .......................................... 611C 7/00
`[58]
`Field of Search
`340“.” R I73 DR
`"""""""""
`’
`References Cited
`UNITED STATES PATENTS
`
`[56]
`
`3333332:
`'
`‘
`
`Eur": “”"l"""""""""" 3:39:12
`5:32:
`m"
`e! d ‘ """""""""
`OTHER PUBLICATIONS
`
`Harroun, Storage Refresh Control and Synchroniza-
`tion, IBM Technical Disclosure Bulletin, vol. 15, No. 1,
`pp. 257—258, 6/720
`
`Primary Examiner—Stuart N. Hecker
`Attorney, Agent, or Firm—Thomas J. Nikolai; Kenneth
`T- Grace; Marsha“ M- Truex
`
`[57]
`ABSTRACT
`.
`.
`.
`.
`.
`A compatible standby power drivmg CerUIt for a dy-
`namic semiconductor memory includes a low imped-
`ance, high power driving circuit connected in parallel
`with a high impedance. low power driving circuit. The
`.
`.
`.
`.
`outputs 0f the my, power and low power drivmg S".—
`cults are mutually connected to the column drivmg
`circuit output and the inputs of both driving circuits are
`connected to the refresh address selection line so that
`both the output of the high power driving circuit and
`the low power driving circuit are available under nor—
`mal or regular power conditions and the low power
`driving circuit output is available under standby power
`conditions.
`
`10 Claims, 2 Drawing Figures
`
`TO DYNAMIC
`M EMORY
`
` ALWAYS 0 N
` NORMAL ADDRESS
`
`REFRESH ADDRESS
`
`
`I3
`
`33
`NORMAL ADDRESS GATE
`REFRESH ADDRESS GATE
`
`
` 19 29
`
`Samsung EX. 1012
`Page 1 of 5
`
`Samsung Ex. 1012
`Page 1 of 5
`
`
`
`US. Patent
`
`Jan. 25, 1977
`
`4,005,395
`
`ADDRESS
`
`2 7
`I2
`IA
`I5
`INFORMATION IN
`
`
`
`
`
`
`3 ?
`Row
`ROW
`DYNAMIC
`
`
`u:
`‘9
`ADDRESS
`ADDRESS
`SEMI-
`22
`
`
`
`
`a) g
`DRIVING
`CONDUCTOR
`INFORMATION OUT
`
`
`8 5
`MEANS
`MEMORY
`
`‘0‘D
`
`<
`.
`32
`
`
`
`a
`00W
`283%
`
`
`
`
`o
`COLUMN
`25522:: Remssn
`
`
`
`
`E
`ADDRESS
`ADDRESS
`
`
`
`
`2
`DRIVING
`c
`
`OUNTER
`MEANS
`
`
`
`
`
`REFRESH
`3‘
`ADDRESS GATE
`
`
`NORMAL
`
`
`
`COUNTER
`
`
`TIMING BI
`
`
`
`REFRESH
`ADVANCE
`
`CONTROL
`TIMING BI
`
`
`
`CONTROL
`
`
`REFRESH
`
`050.
`
`
`T0 DYNAMIC
`M EMORY
`
`ALWAYS 0 N
`
`
`
`
`
` NORMAL ADDRESS
`REFRESH ADDRESS
`
`l3
`33
`NORMAL ADDRESS GATE
`REFRESH ADDRESS GATE
`
`
` l9 ' 29
`
`
`Samsung EX. 1012
`Page 2 0f 5
`
`Samsung Ex. 1012
`Page 2 of 5
`
`
`
`1
`
`4,005,395
`
`2
`
`COMPATIBLE STANDBY POWER DRIVER FOR A
`DYNAMIC SEMICONDUCTOR
`
`BACKGROUND OF THE INVENTION
`
`I. Field of the Invention
`This invention relates to dynamic semiconductor
`memory systems. More particularly, this invention re-
`lates to a novel standby driving circuit for refreshing
`the information stored in a dynamic semiconductor
`memory system during power failure.
`2. Description of the Prior Art
`Dynamic semiconductor memory systems are well—
`known. The semiconductor industry is presently sup—
`plying packaged modules which may be arranged in X.
`Y and Z memory planes to create solid state memories
`for the largest and fastest commercial computers being
`made today. One disadvantage of a dynamic semicon-
`ductor memory system is' that it is a volatile medium.
`i.e., there is a tendency for the information which is
`stored in the memory to be lost during power failures.
`Also, such memories have destructive readout (DRO)
`properties and during normal
`read—in and read-out
`operations, the information must be resupplied or re—
`written into the semiconductor memory. Furthermore,
`dynamic semiconductor memories tend to lose their
`information with passage of time and therefore must be
`periodically “refreshed.“
`Heretofore, it was known that a dynamic semicon—
`ductor memory system could be refreshed by periodi—
`cally interrupting the normal read and write operations
`and supplying a refresh address or refresh signal on the
`address lines of the semiconductor matrix. Heretofore,
`it also has been common practice to provide an inde-
`pendent and secondary refresh address driving means
`which is turned on at the time power failure is sensed.
`Such prior art standby refresh address driving systems
`require a time lag to become operable and as a result
`the memory may lose the information which is sup-
`posed to be refreshed. Further, standby refresh address
`power driving systems have heretofore required an
`inordinately large amount of power to sustain or re~
`fresh the dynamic semiconductor memory which has
`resulted in rapid drain of the standby power source.
`SUMMARY OF THE INVENTION
`
`The present invention provides a novel low power
`driving circuit which may be added to a conventional
`refresh address driving circuit of a dynamic memory.
`The principal object of the present invention is to
`provide a refresh address driving circuit which is always
`active and does not require any switching time to turn
`on once power is lost.
`Another object of the present invention is to provide
`a refresh address driving circuit which requires less
`power drain than known prior art refresh address driv-
`ing circuits.
`Another object of the present invention is to provide
`a standby refresh address driving circuit which is al—
`ways active and is compatible with the normal active
`refresh address driving circuit.
`invention is to
`Yet another object of the present
`provide circuit means for converting normal dynamic
`semiconductor memories into non-destructive readout
`(NDRO) dynamic semiconductor memories.
`According to the above objects and principles of the
`present invention there is provided in a dynamic semi~
`conductor memory system a low power and high im—
`
`pedance refresh address driving circuit which is pow-
`ered by an always—on power source. The low power
`refresh address driving circuit is connected in parallel
`with the normal high power and low impedance driving
`circuit which is powered by an interruptible power
`supply so that the refresh address signals on the refresh
`address selection line generate driving signals indica-
`tive of a column address for refreshing information
`stored in the dynamic semiconductor memory system
`during power interruptions.
`Other objects, features and advantages of the present
`invention will become apparent to those skilled in the
`art from a reading of the following detailed description
`of the preferred embodiment, in light of the following
`drawings in which:
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. I is a block diagram of a typical dynamic semi—
`conductor memory system in which the present inven-
`tion is embodied.
`FIG. 2 is a schematic block diagram of one of the
`column address driving circuits embodying the present
`invention .
`
`DESCRIPTION OF THE PREFERRED
`EMBODIMENT
`
`For purposes of this invention it will be assumed that
`the dynamic semiconductor memory matrix comprises
`MOSFET single transistor per cell devices with a
`chargeable capacitor in the gate to provide the memory
`for the individual transistors. The dynamic semicon-
`ductor memory matrix to be explained will be assumed
`to have 64 rows and 64 columns which are accessible
`by a six bit row address and a six bit column address.
`Dynamic memory devices having 64 columns and 64
`rows are commercially available as MOS random ac-
`cess memory (RAM) devices such as the TMS 4030
`device made by Texas Instruments, Inc. The principles
`to be applied in the above described dynamic semicon-
`ductor memory matrix are applicable to other dynamic
`semiconductor memories which employ more than a
`single MOSFET per cell such as memories which em-
`ploy three MOSFET transistors per active cell.
`Refer now to FIG. I where an address on line II from
`the CPU 10 is first entered into the memory address
`register I2. The 12 bit address on cable 11 is stored in
`stages 0 to 11 of register 12. Bits 0 to 5 define the
`column address on cable 13 and bits 6 through 11
`define the row address on cable I4. The row address is
`gated and amplified in row address driving means 15
`and the active signals from the plurality of drivers de-
`fining the row address are transmitted on a plurality of
`driving lines in cable 16 to the cell matrix 17A of dy—
`namic semiconductor memory matrix 17. Bits 0 to 5
`generate the normal column address on normal column
`address cable 13 and are transmitted to the column
`
`address driving means 18. Normal address gating sig-
`nals on line 19 cause the normal column address signals
`on the lines in cable I3 to be gated and amplified in
`column address gating means 18 to generate a plurality
`of signals on the lines in cable 21 indicative of the
`column address. The plurality of signals on cable lines
`I6 and 21 are decoded and applied to cell matrix (178)
`inside of dynamic semiconductor memory I7 to select
`a single row and column line. When information is read
`into the dynamic semiconductor memory. it is passed
`via information read—in lines 22 and when information
`is readvout it is passed via information read-out lines
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`4O
`
`45
`
`50
`
`55
`
`60
`
`65
`
`Samsung Ex. 1012
`Page 3 0f 5
`
`Samsung Ex. 1012
`Page 3 of 5
`
`
`
`3
`23. The read-in and read—out information is passed in
`parallel to and from active registers (not shown) in the
`CPU 10.
`
`4,005,395
`
`Dynamic semiconductor memory system 20 of FIG. 1
`includes normal timing and control circuits 24 which
`are implemented by the CPU 10 via lines 25 and 26.
`When the refresh address oscillator 34 is active, it pro-
`duces a signal on line 35 which initiates a refresh cycle.
`The refresh timing and control circuits 28 generate the
`refresh address gating signals on lines 29.
`It will be
`understood that in the present system the normal ad—
`dress gating signal on line '19 inhibits the refresh ad-
`dress gating signal on line 29 and the refresh address
`gating signal on line 29 inhibits the normal address
`gating signal on line 19.
`In the dynamic semiconductor memory system 20
`whenever a “read“ or “write” operation occurs, the
`semiconductor devices associated with the column
`being accessed are refreshed during the read/write
`operation. For example. if a transistor in column 7 of
`the memory 17 is written into or read out, the other
`transistors in column 7 are refreshed during the read/-
`write cycle. During normal access to the dynamic semi-
`conductor memory matrix,
`it cannot be assured that
`the transistors or cells in all 64 columns will be sub-
`jected to a read or a write operation during the critical
`time for refreshing or recharging the capacitors in the
`gate electrodes of the transistors. Accordingly,
`it
`is
`necessary to generate “refresh" signals similar to read
`and write signals on all of the columns in the dynamic
`semiconductor memory matrix 17 to refresh or re-
`charge the capacitors in the gate circuits of the memory
`transistor cells. The normal timing and control circuits
`24 will continue normal read and write operations by
`generating normal address gating signals on lines 19 but
`will not interrupt the normal read and write operations
`for a refresh operation. When a refresh cycle is initi-
`ated during a normal read or write operation, the re-
`fresh cycle will begin at the end of the read or write
`cycle. Approximately every thirty-two microseconds
`the refresh oscillator 34 will energize the refresh timing
`and control circuits 28 via line 35. When permitted by
`the normal timing and control circuits 24 via line 27,
`the refresh timing and control circuits 28 will generate
`refresh address gating signals on line 29 which permit
`one of the series of columns to be recharged and re-
`freshed as will be explained further hereinafter. The
`refresh timing and control circuits 28 also generate a
`timing or counter advance signal on line 31 to the re-
`fresh address counter circuits 32 which generates the
`scanning or refresh address signals on lines 33 indica-
`tive of one of the 64 column addresses. The counter
`advance timing signals on line 31 are enabled by re-
`fresh oscillator 34 via line 35.
`Refer now to FIG. 2 showing one of the plurality of
`driving circuits which are embodied in the column
`address driving means 18. For purposes of this explana-
`tion it has been assumed that there are bits 0 to 5 in
`memory address register 12 which define six column
`address bits and bits 6 to 1 I define six row address bits.
`In the binary coded decimal system these bits will de~
`fine one of 2“ or 64 columns or rows. Accordingly,
`there are provided in column address driving means 18
`six such driving circuits as are shown in FIG. 2. It will
`be understood that each one of the six column address
`signals on line 13 will connect to one of the six drivers.
`A signal on normal column address line 13 is supplied
`to AND gate 41 and is gated through gate 41 by a
`
`5
`
`l()
`
`15
`
`20
`
`25
`
`3O
`
`35
`
`4O
`
`45
`
`50
`
`55
`
`60
`
`65
`
`4
`normal address gating signal on line 19 to create an
`output on line 42. The output on line 42 is applied to
`NOR gate 43 to produce an output on line 44 which is
`applied to the decoding circuits (not shown) in dy-
`namic semiconductor memory matrix 17 to select one
`of the columns of the cell matrix 17A. For purposes of
`this invention. NOR gate 43 may be a Series 7451 dual.
`two wide,
`two input AND—OR~INVERT gate of the
`type made by Texas Instruments, Inc. The bipolar NOR
`gate 43 has a characteristic output impedance of the
`order of 50 ohms and can drive or sink approximately
`20 milliamperes with a + regular voltage supply B+ of
`the order of 5 volts.
`During normal read and write operations, the high
`power driving gates 43 are selected by the normal ad-
`dress lines 13 via normal address gating signals on line
`19 applied at AND gate 41. During the read and write
`operations it will be understood that row addresses and
`rows are also selected by the row address driving means
`and the gating signals on line 19, as explained hereinbe—
`fore. During the refresh mode of operation the refresh
`address counter 32 is sequencing or sequentially scan—
`ning the six high power driving gates 43 on refresh
`address selection lines 33 and are selected by the re-
`fresh address gating signals on line 29 which are ap-
`plied to AND gate 46. The refresh column address
`signal is generated at the output of AND gate 46 on line
`47 and is buffered and amplified through NOR gate 43
`to generate a signal of equal intensity and magnitude as
`the read or write signal on line 44. Since the refresh
`address selection signal on line 33 is only generated or
`implemented during the refresh mode, the signal may
`be applied directly via line 48 to the inverter 49, which
`is a low power driving gate, to produce an output signal
`on line 51 which is applied to the output or driving line
`44. It will be understood that during the refresh address
`mode, there is a signal generated by the high power
`driving gate 43 and the low power driving gate 49.
`The low power driving gate 49 is preferably a C—MOS
`device such as a 74 CO4 made by National Semicon-
`ductor, Inc. Gate 49 has a characteristic impedance of
`approximately IOOO ohms and will drive or sink ap-
`proximately l.75 milliamperes. The output of low
`power driving gate 49 will not interfere with the driving
`power of NOR gate 43 during the normal refresh ad—
`dress selection mode. Low power driving gate 49 is
`powered by an always-on power supply (not shown)
`connected to line 53 which will be active even during
`power interruptions and power failures. During the
`refresh address mode, should the high power driving
`gate 43 lose its regular power source connected to line
`52 there will be no output from NOR gate 43. How-
`ever, the low power output from driving gate 49 will be
`sufficient to generate a refresh signal on line 44 which
`will maintain the dynamic semiconductor memory re-
`charged and effective.
`The dynamic semiconductor memory matrix 17 in
`the preferred embodiment can be restored or main—
`tained with a 2.2 volt minimum signal to maintain the
`logic “I” level. A 0.8 volt maximum signal will main-
`tain the logic “0” level. Thus, the low power driving
`circuit 49 will maintain the columns of the dynamic
`semiconductor memory matrix active even during
`power failure.
`In the preferred embodiment shown in FIGS. 1 and 2
`the always-on power supply connected to line 53 is
`coupled to column address driving means 18, refresh
`timing and control circuits 28, refresh address counter
`
`Samsung Ex. 1012
`Page 4 0f 5
`
`Samsung Ex. 1012
`Page 4 of 5
`
`
`
`4,005,395
`
`5
`circuits 32 and the refresh oscillator 34. The always-on
`power supply can be connected in a manner which will
`always maintain its power level without dissipating the
`backup or battery supply.
`Having explained the preferred embodiment of the
`present invention, it will be understood that a plurality
`of driving circuits such as shown in FIG. 2 are em-
`ployed to implement read and write operations and are
`further employed to implement
`the refresh address
`mode operation. The normal address is always gated
`through AND gate 41 of the individual driving circuits
`and the refresh address is always gated through AND
`gate 46 when power is normally on. Both AND gates 41
`and 46 are normally off when power is interrupted or
`normal power is off. Thus, during the refresh mode, the
`refresh address selection line 33 is effective, via line 48
`and inverter 49, to generate the refresh address signal
`on line 51. The refresh address mode, once in opera—
`tion, always has priority and will complete its cycle and
`will block any normal address mode operations. The
`normal address mode is operable approximately 60
`times more often than the refresh address mode. even
`though the refresh address mode could be operated at
`less frequent intervals. The normal read or write opera—
`tion requires only a few nanoseconds and the refresh
`address mode may be efficiently interposed at the end
`of a normal memory cycle. Both the refresh address
`mode and the read and write mode act to lock out other
`operable modes until their mode or cycle of operation
`is complete.
`It will be understood that C~MOS devices require
`very low power drain and display relatively high imped-
`ance. Therefore, when operating from standby power
`there is very little drain on the battery or always-on
`power source connected to line 53. Further, it will be
`understood that the C—MOS device 49 described above
`is a NAND gate which operates normally in the off
`condition with no power drain.
`While there has been described an exemplary em-
`bodiment of the invention, it will be apparent that vari—
`ous modifications and substitutions may be made to the
`arrangement and, therefore, the scope of the invention
`is to be limited only as set forth in the following claims.
`What is claimed is:
`1.
`In a dynamic semiconductor memory system, a
`compatible circuit driven by always-on standby power
`for refreshing the information stored in said memory
`system during normal power failure, comprising:
`a dynamic semiconductor memory matrix;
`row address driving means for generating an address
`indicative of a row in said matrix;
`column address driving means for generating an ad-
`dress indicative of a column in said matrix;
`said column address driving means comprising a plu—
`rality of column address drivers, each said column
`address drivers comprising:
`a high power driving gate adapted to be connected
`to a source of normal interruptible power;
`a low power driving gate adapted to be connected
`to a source of always—on power;
`said driving gates of each said column address driv—
`ing means being connected together in a logical
`OR at their outputs;
`a normal address selection gate connected to the
`input of said high power driving gate;
`/
`
`IO
`
`IS
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`6
`a refresh address selection gate connected to the
`input of said high power driving gate;
`mode enabling lines connected to said selection
`gates for enabling one of said selection gates;
`a refresh address selection line connected to the
`input of said refresh address selection gate and to
`the input of said low power driving gate, whereby
`an input signal on said refresh address selection
`line always produces a signal output at said col—
`umn address driver.
`
`2. In a dynamic semiconductor memory system as set
`forth in claim 1 wherein each said low power driving
`gate comprises a normally off inverter.
`3. In a dynamic semiconductor memory system as set
`forth in claim 2 wherein each said low power driving
`gate comprises a normally off NAND gate connected as
`a single input inverter.
`4. In a dynamic semiconductor memory system as set
`forth in claim 3 wherein said low power driving gate
`comprises a low power drain NAND gate.
`5. In a dynamic semiconductor memory system as set
`forth in claim 4 wherein said low power driving gate
`comprises a CMOS NAND gate.
`6. In a dynamic semiconductor memory system as set
`forth in claim 5 wherein said high power driving gate
`comprises a bipolar NOR gate.
`7. In a dynamic semiconductor memory system as set
`forth in claim I wherein said low power driving gate
`comprises a high impedance load in the output circuit
`of said high power driving gate.
`8. In a dynamic semiconductor memory system as set
`forth in claim I which further includes a refresh ad-
`dress counter for generating signals on said refresh
`address selection lines indicative of a column in said
`matrix.
`
`9. In a dynamic semiconductor memory system as set
`forth in claim 8 which further includes a refresh timing
`and control means wherein said refresh address
`counter and said refresh timing and control means are
`connected to said source of always-on power.
`10. In a dynamic semiconductor memory system of
`the type having a matrix comprised of rows and col-
`umns of dynamic semiconductor memory elements,
`row address driving means for generating address rep-
`resenting signals indicative of a row in said matrix,
`column address driving means for generating address
`representing signals indicative of a column in said ma-
`trix, the improvement comprising X column address
`driver circuits including
`a. a high power driving gate adapted to be connected
`to a source of normal interruptible power”
`b. a low power driving gate adapted to be connected
`to a source of always-on power;
`c. means for logically combining the output terminals
`of said high power driving gate and said low power
`driving gate;
`d. means for selectively applying normal or refresh
`address representing signals to the input of said
`high power driving gate; and
`e. means for also connecting said refresh address
`representing signals to the input of said low power
`driving gate, whereby an output is produced at the
`output of said column address driver circuit even in
`the absence of said normal interruptible power.
`*
`at
`a:
`at
`*
`
`Samsung EX. 1012
`Page 5 0f 5
`
`Samsung Ex. 1012
`Page 5 of 5
`
`