TRANSPERFFCT
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`City of New York, State of New York. County of New York
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`1, Aurora Landman, hereby certify that the document is a true and accurate translation
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`from Japanese (JP) into English of Japanese Examined Patent Application Publication
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`Number [-17-99345.
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`I declare under penalty of perjury that the foregoing is true and correct. Executed on
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`August 21, 20”.
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`(W
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`Aurora Landman
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`Sworn to before me this
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`August 21, 2017
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`"\i {We ._
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`Signature, Notary Public
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`_._._______ __ MW ..
`Stamp, mt’yiPWIlb
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`TCL 1009, Page 1
`TCL 1009, Page 1
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`(19) Japan Patent Office (JP)
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`(51) Int. Cl6
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`(21) Application Number
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`(22) Date of Application
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`(54) [Title of the Invention] Light-emitting diode
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`(57) [Abstract]
`[Purpose] To increase an LED’s luminance by improving
`the capability to condense light emission when converting
`the light-emitting chip’s wavelength by including a wave
`length conversion substance in an LED resin, and to
`provide an LED that does not have mixed color, even when
`an LED with a different wave length is installed in close
`proximity, when a fluorescent pigment is used.
`[Constitution] The LED’s sealing resins are composed of
`the first resin, 11, which fills the inside of Cup 3, and the
`2nd resin, 12, which surrounds the 1st resin, and since the 1st
`resin, 11, contains a fluorescent substance which converts
`the light-emitting chip’s emission wavelength to a different
`wavelength, or the wavelength conversion material 5, such
`as a filter material, etc. which absorbs some of the emission
`wavelengths, the resulting wavelength conversion light is
`reflected to Cup 3, so the luminance and condensing
`efficiency.
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`(12) Japanese Unexamined Patent (A)
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`(11) JP Unexamined Patent
`Application Publication 1995-99345
`(43) Publication Date April 11, Heisei 7 (1995)
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`Identification Code
`N
`A
`H
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`JPO File Number
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`8617-4M
`8617-4M
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`JP Patent Application
`1993-241449
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`September 28, Heisei 5 (1993)
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`(71) Applicant
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`(72) Inventor
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`(72) Inventor
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`(74) Inventor
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`Basis for Classification
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`FI
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`B
`H01L 23/30
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`C
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`Not yet requested for examination Number of claims 2 OL
`(4 pages total) Continued to the last page
`000226057
`Nichia Corporation
`491-100 Oka, Kaminaka-cho, Anan-shi, Tokushima
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`Kosuke Matoba
`C/O Nichia Corporation
`491-100 Oka, Kaminaka-cho, Anan-shi, Tokushima
`Akihito Kishi
`C/O Nichia Corporation
`491-100 Oka, Kaminaka-cho, Anan-shi, Tokushima
`Shuji Nakamura
`C/O Nichia Corporation
`491-100 Oka, Kaminaka-cho, Anan-shi, Tokushima
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`TCL 1009, Page 2
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`(2)
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`JP Unexamined Patent Application Publication 1995-99345
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`[Scope of Patent Claims]
`[Claim 1] It is a light-emitting diode made by sealing the
`entire light-emitting element where the light-emitting chip is
`installed at the bottom of a cup with resins which reflect the
`luminance from the light-emitting chip on the light emission
`observing plane, and it is the light-emitting diode,
`characterized by the fact that the aforementioned resins are
`composed of the 1st resin that fills the aforementioned cup and
`the 2nd resin that surrounds the 1st resin, and that the
`aforementioned 1st resin contains a fluorescent substance that
`converts the light-emitting chip’s emission wavelength to a
`different wave length, or employs a filter substance that
`absorbs some of the light-emitting chip’s luminance
`wavelengths.
`[Claim 2] It is the light-emitting diode described in Claim 1
`which is characterized by the fact that the substance contained
`in the aforementioned 1st resin is a fluorescent substance, and
`that the aforementioned 1st resin is filled so that it will be
`lower than the level of the aforementioned cup’s edge.
`[Detailed Description of the Invention]
`[0001]
`[Field of Industrial Application] This invention concerns a
`light-emitting diode (hereinafter referred to as an LED),
`especially an LED that converts the light-emitting chip’s
`emission wavelength or absorbs some of the light-emitting
`chip’s emissions.
`[0002]
`[Prior Art] Figure 2 is a schematic cross-section view that
`shows the structure of a traditional LED. Number 1 indicates
`the light -emitting chip made of a chemical semiconductor,
`Number 2 is the lead frame, Number 3 is the cup installed to
`reflect the light-emitting chip’s luminance on the light
`emission observing plate, and 4 is the resin that seals the
`entire light-emitting element. Usually, a resin with high
`transparency that efficiently releases the light-emitting chip’s
`emissions into the air is selected for Resin 4, however, a
`fluorescent substance that converts the light-emitting chip’s
`emission to a different wavelength, or a filter substance 5 that
`absorbs some of the emission wavelengths (hereinafter
`referred to as Wavelength Conversion Material 5) is mixed
`with the Resin 4 to convert the light-emitting chip’s
`luminance color, or to correct the color. In such a case, the
`Wavelength Conversion Material 5 is usually mixed so that it
`is evenly dispersed in Resin 4.
`[0003]
`[Problem to Be Solved by the Invention] However, when the
`Wavelength Conversion Material 5 is evenly dispersed in
`Resin 4 for the aforementioned purpose, as shown in this
`diagram, there is a problem in that the light, whose
`wavelength is converted, or whose unnecessary wavelength is
`cut, is scattered in all directions, which deteriorates light
`condensation. The arrows in Figure 2 schematically show
`light from the light-emitting chip hitting the Wavelength
`Conversion Material 5 and wavelength-converted light being
`scattered. In other words, the quantity of light at the
`luminescence observation surface is reduced by the scattering
`of wavelength-converted light, thereby reducing brightness.
`[0004] Moreover, if the Wavelength Conversion Material 5 is
`limited to the fluorescent substance, there is a new problem in
`that when a different luminance color LED is installed in
`close proximity, there is an unnecessary fluorescent substance
`light emission by another LED light-emission. For example, if
`a green LED containing a fluorescent substance from which a
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`green luminance is obtained using a blue color light emitting chip,
`and a simple blue LED made of only a blue light-emitting chip are
`aligned in close proximity at the same
`Horizontal level plane when the green LED is turned off and the
`blue LED is turned on, the green LED’s fluorescent substance is
`excited by the light leaked from the blue LED, in short, by the
`scattered light, which leads to a condition as if the green LED
`were turned on, causing both LED color to mix.
`[0005] Therefore, the purpose of this invention is to increase the
`LED brightness by first improving the converted light emission
`condensing when converting the light-emitting chip’s wavelength
`by having the LED resin contain a wavelength conversion
`material, and the other purpose is to provide an LED that does not
`cause color mixing even if an LED with a different wavelength is
`installed in a close proximity, when using a fluorescent pigment.
`[0006]
`[Means for Solving the Problem] The LED in this invention is
`made by sealing the LED element with the resins, the entire light-
`emitting element wherein the light-emitting chip is installed at the
`bottom of a cup that reflects the light-emitting chip’s emission
`onto a light-emission observing plane, characterized by the fact
`that the aforementioned resins are composed of the 1st resin that
`fills the aforementioned cup, and the 2nd resin that surrounds the
`1st resin, and that the aforementioned 1st resin contains a
`fluorescent substance that converts the light-emitting chip’s
`emission wavelength to a different wave length, or a filter
`substance that absorbs some of the light-emitting chip’s luminance
`wavelengths.
`[0007]
`[Operation] The LED in this invention converts the light-emitting
`chip’s emission, or absorbs some of the unnecessary wavelengths
`inside the 1st resin, to obtain the desired wavelength. The lights,
`whose wavelengths are converted as such scatter in all directions,
`however, most of the scattered light is reflected by the cup and
`condensed on the light emission observing plane. In short, because
`the cup in this application can reflect and condense the lights
`whose wavelengths are converted by the wavelength conversion
`material inside the 1st resin, the converted lights’ condensing
`efficiency improves significantly.
`[0008] Furthermore, when selecting a fluorescent substance as the
`wavelength conversion material, if the 1st resin containing a
`fluorescent substance is filled to a level that is lower than the level
`of the cup’s edge, the lights entering from outside are blocked by
`the cup’s edge and do not reach the fluorescent substance, hence
`the color mixing between LEDs can be prevented. Simply stated,
`by increasing the cup depth so that the 1st resin containing the
`fluorescent substance will not protrude from the cup, we control
`the fluorescent substance’s excitation source by the light-emitting
`chip’s emission length alone.
`[0009]
`[Examples of Embodiment] Figure 1 is a schematic cross-section
`drawing that indicates the structure of the LED in an example of
`embodiment of this application, in which the entire light-emitting
`element equipped with a light-emitting chip 1 composed of a
`chemical semiconductor on a Lead frame 2 with Cup 3 is sealed
`with resins in the same manner as in Figure 2. However, the
`difference from Figure 2 is that the sealing resins are composed of
`the 1st resin 11 that fills inside Cup 3, and the 2nd resin 12 that
`surrounds the 1st resin, and that the 1st resin 11 contains a
`Wavelength conversion material 5 which converts the light-
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`TCL 1009, Page 3
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`(3)
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`JP Unexamined Patent Application Publication 1995-99345
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`absorbs some of them.
`[0010] In this LED invention, the material for the 1st resin 11 and
`the 2nd resin can be the same. For example, we can compose both
`of epoxy resin, and make only the 1st resin contain a florescent
`substance 5. Moreover, it is sufficient to say that the material for
`the 2nd resin 12 can be the same as Resin 4 in Figure 2. In
`addition, as long as it is a fluorescent substance, any material that
`can convert the light-emitting chip’s emission wavelength to a
`different wavelength, such as a fluorescent dye, a fluorescent
`pigment or a phosphorous element, etc. can be used as
`wavelength conversion material 5, and if it is a filter material, a
`material that absorbs the unnecessary wavelengths of the light-
`emitting chip’s emission to improve the color purity is selected,
`hence, an inorganic or organic filter pigment which has the same
`color as the light-emitting chip’s emission color is usually used.
`[0011] In order to obtain an LED with such a structure, for
`example, we pre-dip the inside of the cup equipped with the
`light-emitting chip 1 with a resin in advance, during the LED
`manufacturing process. When pre-dipping, if the 1st resin 11
`contains wavelength conversion material 5, we can obtain the
`LED by sealing with the 2nd resin 12, when the 1st resin 11
`containing wavelength conversion material 5 is hardened. In
`addition, we can also inject the 1st resin 11 containing
`wavelength conversion material 5 inside Cup 3 in advance. The
`LED’s light condensing significantly improves by filling the 1st
`resin containing wavelength conversion material 5 inside Cup 3,
`hence causing most of the light, whose wavelengths are
`converted by the 1st resin 11, to return inside the reflecting mirror
`of Cup 3, and be reflected on the light emission observing plane.
`[0012] In addition, by making the 1st resin 11 and the 2nd resin 12
`with different materials, and by setting the refractive indexes of
`1st resin 11 and 2nd resin 12 successively smaller so that it will be
`closer to the refractive index of the air, the external quantum
`efficiency of the lights whose wavelengths are converted
`increases. Needless to say, in such case, a material with a smaller
`refraction index than the light-emitting chip 1 is selected for the
`1st resin 11 material.
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`[0013] Figure 3 and Figure 4 are schematic cross-section diagrams
`which indicate the enlarged Cup 3 of the LED concerning other
`examples of embodiment of this invention. Figure 3 shows the
`condition wherein the 1st resin 11’s surface is convex and hardened
`and filled inside Cup 3, and Figure 4 shows it in a concave condition,
`hardened and filled. In any condition, if a fluorescent substance is
`used as wavelength conversion material 5, the 1st resin 11 containing
`that fluorescent substance is filled so that it will be lower than the
`level of the edge of Cup 3, hence it does not protrude from Cup 3,
`therefore, the external light that excites the fluorescent substance can
`be blocked by the edge of Cup 3, thus the LED color mixing can be
`prevented.
`[0014]
`[Effect of the Invention] As explained above, the LED in this
`invention has the cup filled inside with 1st resin containing a
`wavelength conversion material, hence the converted lights are
`reflected inside the cup and are condensed, thus improving the
`brightness by more than double. In addition, when containing a
`fluorescent pigment in the 1st resin to convert the wavelength, by
`increasing the cup depth so that the 1st resin will not protrude from the
`cup, we can prevent color mixing between LEDs, and when we can
`realize a flat display by LED, for example, we will be able to obtain
`images with extremely good resolution.
`[Brief Description of the Drawings]
`[Figure 1] Schematic cross-section drawing that shows a LED
`structure in this invention
`[Figure 2] Schematic cross-section drawing that shows a traditional
`LED structure
`[Figure 3] Schematic cross-section drawing that shows the enlarged
`Cup 3 area of the LED concerning other examples of embodiment of
`this invention
`[Explanation of References]
`1 … Light-emitting chip
`3 …Cup
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`11 … 1st resin
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`2 … Lead frame
`5 … Wavelength conversion material
`12 … 2nd resin
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`[Figure 1]
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`[Figure 2]
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`[Figure 3]
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`TCL 1009, Page 4
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`(4)
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`JP Unexamined Patent Application Publication 1995-99345
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`[Figure 4]
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`Continued from the front page
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`(51) Int. Cl6
`H01 L
`23/29
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`23/31
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`Identification Code JPO File Number
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`Basis for Classification
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`TCL 1009, Page 5
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`

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