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`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
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`BEFORE THE PATENT TRIAL AND APPEAL BOARD
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`HP INC.
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`Petitioner
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`v.
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`JAMES B. GOODMAN
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`Patent Owner
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`Case No. IPR2017-01994
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`U.S. Patent No. 6,243,315
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`DECLARATION OF DR. NADER BAGHERZADEH
`UNDER 37 C.F.R. § 1.68
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`HP EXHIBIT 1002
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`Case No. IPR2017-01994
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`I, Nader Bagherzadeh, declare as follows:
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`1.
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`I am making this declaration at the request of HP Inc. (“HP”) in
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`support of HP’s petition for Inter Partes review of U.S. Patent No. 6,243,315.
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`This declaration includes Appendices A and B.
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`2.
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`I am being compensated for my services in this matter at the rate of
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`$525/hour plus expenses. My compensation is not contingent upon the
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`outcome of this proceeding.
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`3.
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`4.
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`5.
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`6.
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`In preparing this declaration, I considered the following materials:
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`the ’315 patent, attached as Exhibit 1001;
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`the ’315 patent file history;
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`U.S. Patent No. 5,600,605 to Schaefer (“Schaefer”), attached as
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`Exhibit 1003;
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`7.
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`U.S. Patent No. 5,793,776 to Qureshi et al. (“Qureshi”), attached as
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`Exhibit 1004;
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`8.
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`U.S. Patent No. 5,204,840 to Mazur (“Mazur”), attached as Exhibit
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`1005;
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`9.
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`U.S. Patent No. 4,005,395 to Fosler, Jr. et. al. (“Fosler”), attached as
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`Exhibit 1006;
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`HP EXHIBIT 1002 – PAGE 1
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`10. Reengineering the Curriculum: Design and Analysis of a New
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`Undergraduate Electrical and Computer Engineering Degree at Carnegie Mellon
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`University, Director et al., IEEE 1995, attached as Exhibit 1007;
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`11. Micron Technology, Inc. Functional Specification for
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`MT48LC4M4R1(S) SDRAM, attached as Exhibit 1008;
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`12. Micron Technology, Inc. Data Sheet for MT48LC4M4A1/A2
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`SDRAM, attached as Exhibit 1009; and
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`13. Decision Instituting Inter Partes Review, Paper 6, IPR2015-01675
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`(PTAB February 11, 2016), attached as Exhibit 1010.
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`I.
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`PROFESSIONAL BACKGROUND
`14. My Curriculum Vitae is attached hereto as Appendix A. I earned a
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`bachelor’s degree in electrical engineering in 1977 from the University of Texas at
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`Austin. In 1979 and 1987, respectively, I earned a master of science in electrical
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`engineering and a doctorate degree in computer engineering from the University of
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`Texas at Austin.
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`15.
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`I am currently a professor in the department of Electrical Engineering
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`and Computer Science at the University of California, Irvine – a position I have
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`held since 2003. Previously, from 1987 to 1992, I was an assistant professor in the
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`Department of Electrical & Computer Engineering at the University of California,
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`Irvine. Thereafter, from 1993 to 1997, I was an associate professor in the
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`HP EXHIBIT 1002 – PAGE 2
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`Department of Electrical & Computer Engineering at the University of California,
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`Irvine. In 1998, I was promoted to Professor and Chair of the Department of
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`Electrical Engineering at the University of California, Irvine. I held that position
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`until 2003, when I assumed my current role with the Department. I was elected as
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`an IEEE Fellow in 2014.
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`16.
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`I have been involved in design and development of digital systems for
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`more than 30 years. While at AT&T Bell Labs in the early 1980’s, I worked on an
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`interface card for T1 lines as part of a support R&D team for the design of the first
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`#5ESS digital switches. I was responsible for design of the hardware and software
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`of this board which included memory devices (EEPROM, DRAM, and SRAM).
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`17. Since joining University of California, Irvine in 1987, I have been
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`teaching, researching, and consulting regarding almost all aspects of memory
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`design for high performance computer systems, including but not limited to
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`DRAMs and SRAMs. In 2000, I became a cofounder of a high-tech company
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`called Morpho Technologies, which was focused on the design and development of
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`low power and high performance digital signal processors for mobile applications.
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`As part of my duties as the chief technologist for the company, I evaluated patents,
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`technical reports and presentations related to memory chip designs, DSPs, and
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`parallel processing algorithms for mobile platforms.
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`HP EXHIBIT 1002 – PAGE 3
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`18. For the Morpho project, I designed, developed and tested the key
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`memory block responsible for exchanging data between the host processor and the
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`slave processor (array processor). This subcomponent was designed to meet the
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`power and performance requirements of the architecture for mobile embedded
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`applications. I also designed the main data storage of the microcontroller (Tiny
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`RISC) that was used for storing temporary data, as is the case for synchronous
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`random-access memory (SRAM), which is a type of volatile memory. I was a
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`primary contributor for the prototype board design for the Morpho device, which
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`was integrated with DRAMs, FPGA, and other prototype board components.
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`19. As part of my teaching and research experience, I was responsible for
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`developing circuits, electronic modules, and related architectures for memory
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`systems. For the multithreaded superscalar DSP that was developed at UCI, I
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`designed the memory block responsible for managing out-of-order execution of
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`data registers corresponding to different threads. I also designed the original
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`temporary data storage subcomponents for the VLIW processor, ViPER, and for
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`the original Tiny RISC processor. I have done extensive work on the design of
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`efficient data correction schemes for NAND flash memory circuits.
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`HP EXHIBIT 1002 – PAGE 4
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`II. RELEVANT LEGAL STANDARDS
`I have been asked to provide my opinion whether the prior art I
`20.
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`reviewed would render Claims 1, 5, 10, and 16 of the ’315 patent anticipated or
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`obvious to a person of ordinary skill in the art at the time of the alleged invention.
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`21. My background and training is in engineering. The opinions I express
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`in this declaration involve the application of my engineering knowledge and
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`experience to the evaluation of certain prior art with respect to the ’315 patent.
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`Given that I have a lay person’s knowledge of patent law, I have requested that the
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`attorneys from Shelton Coburn LLP, who represent HP, provide me with guidance
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`as to the applicable patent law in this matter. The paragraphs below express my
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`understanding of how I must apply current principles related to patent validity in
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`my analysis.
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`22.
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`It is my understanding that in an Inter Partes review, the Patent Office
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`must construe the claims by giving the claim terms their broadest reasonable
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`interpretation consistent with the specification.
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`23.
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`It is my understanding that a claim is obvious under 35 U.S.C. § 103 if
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`the differences between the invention and the prior art are such that the subject
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`matter as a whole would have been obvious to a person of ordinary skill in the art
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`at the time of the alleged invention. It is also my understanding that an obviousness
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`analysis must take into account the scope and content of the prior art, the
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`HP EXHIBIT 1002 – PAGE 5
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`differences between the claimed subject matter and the prior art, and the level of
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`ordinary skill in the art at the time of the invention.
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`24.
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`It is my understanding that to assess the differences between prior art
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`and the claimed subject matter, 35 U.S.C. § 103 requires the claimed invention to
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`be considered as a whole. This “as a whole” assessment requires showing that one
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`of ordinary skill in the art at the time of invention, confronted by the same
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`problems as the inventor and with no knowledge of the claimed invention, would
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`have selected the elements from the prior art and combined them in the claimed
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`manner.
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`25.
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`It is my understanding that in determining the scope and content of the
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`prior art, a reference is considered appropriate prior art if it falls within the field of
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`the inventor’s endeavor. In addition, a reference is prior art if it is reasonably
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`pertinent to the particular problem with which the inventor was involved. A
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`reference is reasonably pertinent if it logically would have commended itself to an
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`inventor’s attention in considering his problem. If a reference relates to the same
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`problem as the claimed invention, that supports use of the reference as prior art in
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`an obviousness analysis.
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`26.
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`It is also my understanding that there are several specifically
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`recognized rationales for combining references or modifying a reference to show
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`obviousness of claimed subject matter. Some of these rationales include:
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`HP EXHIBIT 1002 – PAGE 6
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`combining prior art elements according to known methods to yield predictable
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`results; simple substitution of one known element for another to obtain predictable
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`results; a predictable use of prior art elements according to their established
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`functions; applying a known technique to a known device (method or product)
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`ready for improvement to yield predictable results; choosing from a finite number
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`of identified, predictable solutions, with a reasonable expectation of success; and
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`some teaching, suggestion, or motivation in the prior art that would have led one of
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`ordinary skill to modify the prior art reference or to combine prior art reference
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`teachings to arrive at the claimed invention. It is also my understanding this list is
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`not exhaustive.
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`III. PERSON OF ORDINARY SKILL IN THE ART
`It is my understanding that when interpreting the claims of the ’315
`27.
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`patent, I must do so based on the perspective of one of ordinary skill in the art at the
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`relevant priority date. My understanding is that the earliest alleged priority date of
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`the ’315 patent is December 31, 1999.
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`28. The ’315 patent relates to a volatile memory system with data
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`retention capabilities in low power situations. Specifically, as stated in the Abstract
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`of the ’315 patent, it pertains to volatile solid-state memory devices that retain
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`information when an electrical power source is applied to the memory devices
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`within a predetermined voltage range.
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`HP EXHIBIT 1002 – PAGE 7
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`29. Volatile memory systems typically include only volatile memory
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`devices, such as dynamic random access memories (DRAM) that are subject to
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`loss of data in the absence of electrical power. Such volatile memory devices,
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`however, typically include a self-refresh mode that requires lower electrical power
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`than during normal operations.
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`30. Further, volatile memory devices are typically configured to interface
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`with a memory controller of a host computer system for regular operation. Once
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`connected with the memory controller of the computer system, the volatile
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`memory devices receive power for operation and instructions for various
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`computing processes.
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`31.
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`In my opinion, a person of ordinary skill in the art for the ’315 patent
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`in December 1999 would have a bachelor’s degree in electrical, electronics, or
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`computer engineering, or a related discipline; or the equivalent training or
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`experience in electrical, electronics, or computer engineering, or a related
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`discipline. The person would also have an additional two or more years of
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`experience in computer hardware, including the use of computer memory.
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`32. A person having a bachelor’s degree in electrical, electronics,
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`computer engineering, or a related discipline would have experience with
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`memories and computer architecture. The additional two or more years of
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`experience in experience in computer systems, circuits, electronics, or a related
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`HP EXHIBIT 1002 – PAGE 8
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`disciple would provide practical experience required to address issues such as low
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`power backup for volatile memories.
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`33. The curriculum of a bachelor’s degree program in computer,
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`electronics, or a related discipline typically includes courses pertaining to circuit
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`design from component parts, including building complex systems from basic
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`building blocks, and interconnecting digital elements and circuit elements. Such
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`courses also include design for electronic memory components. For example, the
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`bachelor’s degree program in electrical and computer engineering at Carnegie
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`Mellon University includes the following course requirements:
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`• Building Complex Systems from Basic Building Blocks
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`• Interconnecting digital elements
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`• Interconnecting circuit elements . . .
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`• Dealing with the system: memory, programmed, and hardwired control.
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`Ex. 1007, pp. 1255-56 & Table 2. With an additional 2 or more years of
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`experience in memory related circuits, a POSITA would have the
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`prerequisite skill to take the memory controller from Qureshi and connect
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`it to the SDRAM of Schaefer, and further to combine the teachings of
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`Qureshi and Schaefer with the secondary power supply features of Mazur.
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`34.
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`In my experience, this bachelor’s degree program is not unique to
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`Carnegie Mellon University. Many other universities offer similar courses and
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`HP EXHIBIT 1002 – PAGE 9
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`programs of study at the bachelor’s level for electrical, electronics, and computer
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`engineering, or a related discipline.
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`35. A POSITA, with this level of experience, would be capable of reading
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`and understanding the open literature (including patents) related to memory system
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`design and would be able to modify an existing process based on the teachings
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`found in the literature.
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`IV. SUMMARY OF PRIOR ART
`36. Volatile memories, such as dynamic random access memory (DRAM)
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`and its subset, synchronous dynamic random access memory (SDRAM), must have
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`their contents “refreshed” electrically periodically or information will be lost over
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`time. Early systems had external circuitry to refresh the DRAM, as illustrated in
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`U.S. Patent No. 4,005,395 to Fosler, Jr. et al. (Ex. 1006).
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`37. DRAMs have included self-refresh modes since at least the mid-
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`1990s, in which the DRAM or SDRAM memory chip refreshes itself
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`automatically. See Ex. 1003, U.S. Patent No. 5,600,605 to Schaefer, 1:14-17 (filed
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`June 7, 1995). During the self-refresh mode, the power consumption is reduced in
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`comparison to the normal operation of the SDRAM.
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`38. As “refresh” is a low-power operation, a secondary power source may
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`provide the low power required for operation. The secondary power source may be
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`a temporary power source. The use of a secondary power source for providing
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`HP EXHIBIT 1002 – PAGE 10
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`temporary low power during refresh modes was well-known in the art since at least
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`May 8, 1975, as taught by Fosler. For example, Fosler discloses “[d]ynamic
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`memory devices [that] are commercially available as MOS random access memory
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`(RAM) devices” configured so that “[d]uring the refresh address mode, should the
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`high power [be lost], low power output . . . will be sufficient to generate a refresh
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`signal.” Fosler, 2:35-38 and 4:49-56. Fosler specifically discloses that “when
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`operating from standby power there is very little drain on the battery or always-on
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`power source.” Id., 5:31-35.
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`Schaefer
`A.
`39. Schaefer (Ex. 1003) is assigned to Micron Technology Inc. and issued
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`on February 4, 1997. Schaefer discloses an SDRAM chip that includes power
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`down and self refresh modes to retain data with reduced power requirements.
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`Specifically, Schaefer explains that a low-power self refresh mode is in an
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`SDRAM chip (e.g., Micron’s MT48LC4M4R1 SDRAM chip), in which the
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`amount of electrical energy drawn from the computer system is reduced. Id. 3:58-
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`61, 3:21-26 & 6:56-58. Schaefer expressly incorporates the functional specification
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`of Micron’s MT48LC4M4R1 SDRAM chip by reference. Id., 3:3-8. I also
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`understand that “incorporation by reference” is a term of art that means that the
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`entire disclosure of the Micron functional specification is part of the specification
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`of Schaefer.
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`HP EXHIBIT 1002 – PAGE 11
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`40.
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`I located the functional specification for the Micron SDRAM
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`referenced in Schaefer. See Ex. 1008, Micron Technology, Inc. Functional
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`Specification for MT48LC4M4R1(S) (“Micron Functional Specification”). This
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`functional specification is dated April 1994 and in my opinion, was the functional
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`specification incorporated by reference in Schaefer, which was filed in June 1995.
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`I also located a Micron data sheet for the MT48LC4M4A1/A2 SDRAM (“Micron
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`Data Sheet”), attached as Ex. 1009. Although the Micron Data Sheet is dated
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`March 1998, in my opinion it is a reliable source of information regarding the
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`SDRAM referenced in Schaefer and consistent with the MT48LC4M4R1
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`functional specification incorporated by reference into Schaefer (Ex. 1008).
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`41. Both the Micron Functional Specification and Micron Data Sheet
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`describe the self refresh mode. See Ex. 1008, 1 (“SELF REFRESH (for low-power,
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`data-retention operation”); Ex. 1009, 12. The Micron Data Sheet provides a timing
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`diagram for self refresh mode. Micron Data Sheet, 37. The specifications for the
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`Micron SDRAM show that in self refresh mode, the chip only draws 1 or 2 mA of
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`current, compared to 90 or 105 mA in normal operation. Id., 29. Thus, in self
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`refresh mode the power consumption is reduced in comparison to the normal
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`operation of the SDRAM.
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`HP EXHIBIT 1002 – PAGE 12
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`42. Fig. 1 of Schaefer is a functional block diagram of the SDRAM
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`memory device described in the patent, such as Micron’s MT48LC4M4R1
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`SDRAM memory chip. Annotated Fig. 1 of Schaefer is shown below:
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`Schaefer, Fig. 1.
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`43.
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`In my opinion, a POSITA would understand that the SDRAM of
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`Schaefer is a type of DRAM.
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`B. Qureshi
`44. Qureshi (Ex. 1004) is assigned to Samsung and issued on August 11,
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`1998. Qureshi teaches a memory controller for SDRAM chips, such as the Micron
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`SDRAM chip described in Schaefer. Qureshi’s memory controller is a test
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`controller that is configured to place a connected SDRAM chip into a low power
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`self-refresh mode to retain the existing data. Qureshi, Abstract.
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`HP EXHIBIT 1002 – PAGE 13
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`C. Mazur
`45. Mazur (Ex. 1005) issued on April 20, 1993. Mazur teaches the use of
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`a battery as an alternative low power source (e.g., a rechargeable battery”) to drive
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`a DRAM device in a low power refresh mode. For example, Mazur discloses
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`“methods [to] back up the dynamic RAM memory of the associated computer
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`system in the event of a power loss or outage.” Mazur, 2:24-26. Mazur discloses
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`corresponding hardware that includes “a power loss detection circuit, an
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`independent power supply, a continuously rechargeable battery which is recharged
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`by the independent power supply, a standby refresh circuit, a switch-over circuit,
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`address and data busses, and an address control circuit, all of which are in addition
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`to and augment the existing conventional computer circuits.” Id., 2:6-14.
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`V. CLAIM CONSTRUCTION
`It is my understanding that the claims are to be given their broadest
`46.
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`reasonable interpretation to a POSITA at the time of the alleged invention in an
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`inter partes review. I have applied that standard in my invalidity analysis set forth
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`in Section VI below. In its decision instituting inter partes review in IPR2015-
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`01675 on the same grounds as presented in this declaration, the Board indicated
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`that it did not need to construe any claim terms of claims 1, 5, 10 and 16. See Ex.
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`1010, Decision Instituting Inter Partes Review, Paper 6, IPR2015-01675 at 6
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`(PTAB February 11, 2016).
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`HP EXHIBIT 1002 – PAGE 14
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`VI.
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`Case No. IPR2017-01994
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`INVALIDITY OF CLAIMS 1, 5, 10 AND 16
`A. Obviousness over Schaefer in View of Qureshi
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`Obviousness of Claims 1 and 5
`1.
`47. Claims 1 and 5 of the ’315 patent are obvious over Schaefer in view of
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`Qureshi. Attached as Appendix B is a claim chart showing how and where each
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`limitation of Claims 1 and 5 is disclosed by Schaefer in view of Qureshi.
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`a. Motivation to Combine and Predictability of the Art
`48. A POSITA would be motivated to combine Schaefer with Qureshi,
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`because the functional electronic modules of Schaefer and Qureshi are configured
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`to work together. For example, Schaefer teaches an SDRAM memory (e.g., Micron
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`MT48LC4M4R1 chip) that includes a low power self refresh mode used to retain
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`data in low power situations (Schaefer, 3:3-6); and Qureshi teaches a memory
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`controller that is configured to place any SDRAM memory into a low power self-
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`refresh mode, for the purposes of data retention during testing (Qureshi, 1:65-2:2).
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`49. Schaefer and Qureshi also disclose that their respective teachings are
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`merely exemplary modules that a POSITA may apply, in a variety of ways,
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`without departing from the scope of their corresponding functions. For example,
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`Schaefer discloses that “those of ordinary skill in the art [would appreciate] that a
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`wide variety of alternate and/or equivalent implementations calculated to achieve
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`the same purposes may be substituted . . . without departing from the scope of the
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`HP EXHIBIT 1002 – PAGE 15
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`present invention.” Schaefer, 10:25-33. Qureshi explains that “in accordance with
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`[its] invention, memory such as SDRAMs are put into self-refresh mode while
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`JTAG testing is performed. Self refresh is a refresh mode available in some
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`memory and is preferred for data retention and low power operation.” Qureshi,
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`1:63-67.
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`50. As Schaefer and Qureshi provide that their respective disclosures are
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`understood by a POSITA, and may be modified, altered or adapted, while retaining
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`their corresponding expected functions, the prior art teaches that the field of the
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`’315 patent is very predictable. Accordingly, combination of Schaefer with
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`Qureshi does not stray from the scope and spirit of each respective electronic
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`module corresponding to each reference. Each reference is merely an independent
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`electronic module, which performs a specific function, and which may be
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`combined with another, while retaining their functions and providing a unified
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`overall function.
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`51. The ’315 patent states that the invention is in a predictable field,
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`where a POSITA would understand that multiple components may be combined,
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`so long as the function of each is maintained: “[i]t is evident that those skilled in
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`the art may now make numerous uses and modifications of and departures from the
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`specific embodiments described herein without departing from the inventive
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`concepts.” ’315 patent, 13:9-12.
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`HP EXHIBIT 1002 – PAGE 16
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`52. A POSITA at the time of the alleged ’315 invention would possess the
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`requisite skill to combine basic electrical components or modules in an expected or
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`natural way (as described in each reference) to meet the claimed limitations,
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`because the teachings in the references provide the requisite inputs, the functions,
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`and the corresponding outputs, which are not changed in the proposed
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`combinations of prior art.
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`53. For example, Schaefer teaches that “[a]ll the input and output signals
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`of SDRAM 20, with the exception of the CKE input signal during power down and
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`self refresh modes, are synchronized to the active going edge. . . of the CLK
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`signal.” Schaefer, 3:20-25 (references to the figures omitted). Qureshi teaches a
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`memory controller to provide signals that would “place an SDRAM in a self-
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`refresh mode,” such that when “the self-refresh mode is entered[, the] SDRAM
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`ignores all inputs other than a CKE (clock enable) pin while in self-refresh state.”
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`Qureshi, Abstract & 5:49-51. A POSITA would understand from these teachings
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`the signals that are required from the memory controller of Qureshi to place the
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`SDRAM device of Schaefer into a low power self-refresh mode.
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`Claim 1
`b.
`54. As to limitation 1.a, “[a] memory system for use in a computer
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`system,” this limitation is disclosed by the combination of Schaefer and Qureshi.
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`Specifically, Schaefer discloses an application using Micron’s MT48LC4M4R1
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`HP EXHIBIT 1002 – PAGE 17
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`SDRAM chip. Schaefer, 3:1-8. Based on these disclosures, a POSITA would
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`understand that the SDRAM memory device of Schaefer is part of a memory
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`system for use in a computer system.
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`55. Qureshi teaches a memory controller for providing testing signals to
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`SDRAM devices. Qureshi, 2:3-6 and Fig. 1. Accordingly, a POSITA would
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`understand that the memory controller of Qureshi, along with the SDRAM of
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`Schaefer form a memory system. In this system, the SDRAM of Schaefer is
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`connected to receive test signals from Qureshi’s memory controller. This reasoning
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`is supported, because Schaefer discloses that “alternate and/or equivalent
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`implementations calculated to achieve the same purposes may be substituted . . .
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`without departing from the scope of the present invention.” Schaefer, 10:25-33.
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`The SDRAM of Schaefer is a familiar functional electronic component that may be
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`taken as described and combined with the memory controller of Qureshi, which is
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`also a familiar functional electronic component that may be taken as described.
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`Integrating these two components together does not depart from the teachings of
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`either reference, but combines the teachings by utilizing the signals from the
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`memory controller, as taught by Qureshi, to operate the SDRAM of Schaefer in the
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`way that is explicitly contemplated and intended by Qureshi.
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`56. As to limitation 1.b, “a plurality of volatile solid state memory devices
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`that retain information when an electrical power source is applied to said memory
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`devices within a predetermined voltage range,” this limitation is disclosed in
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`Schaefer. Specifically, a POSITA would understand that Schaefer discloses a
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`volatile memory that includes two banks - bank 0 and bank 1, that are powered by a
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`nominal voltage of 3.3V on power pin Vcc. Schaefer, 3:14-17; Micron Functional
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`Specification, 1; Micron Data Sheet, 1. Additionally, each bank includes a plurality
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`of volatile solid state memory devices. A POSITA would also understand that the
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`SDRAM of Schaefer—like all DRAM and SDRAM chips—has a range of
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`allowable voltage for optimal functioning, e.g., 3.3V ±0.3V. See Micron
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`Functional Specification, 1; Micron Data Sheet, 1. Accordingly, such a
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`predetermined voltage range would range from 3.0 to 3.6V for the two memory
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`banks in the SDRAM of Schaefer.
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`57. As to limitation 1.c, “capable of being placed in a self refresh mode,”
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`Schaefer discloses that its SDRAM is configured to operate in accordance with “a
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`SELF-REFRESH command.” Schaefer, 3:58-61.
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`58. As to limitation 1.d, “said memory devices having address lines and
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`control lines,” this limitation is disclosed in Schaefer. The ’315 patent describes
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`the control lines as “/CAS, /RAS and /WE.” ’315 Patent, 9:66-67. Specifically,
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`Schaefer discloses a volatile memory that receives “control signals including a row
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`address strobe (RAS*) signal on a RAS* pin, column address strobe (CAS*) signal
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`on a CAS* pin, and a write enable (WE*) signal on a WE* pin,” as well as
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`“address bits on input pins A0-A10.” Schaefer, 3:30-33 & 4:19-21.
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`59. As to limitation 1.e, “a control device for selectively electrically
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`isolating said memory devices from respective address lines and respective control
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`lines so that when said memory devices are electrically isolated, any signals
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`received on said respective address lines and respective control lines do not reach
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`said memory devices,” this limitation is disclosed by Schaefer in view of Qureshi.
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`Qureshi teaches a memory controller for providing a requisite signal to place
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`Schaefer’s SDRAM memory into self-refresh mode, in which all access signals are
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`ignored, which a POSITA would understand corresponds to electrically isolating
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`the SDRAM. See Qureshi, Abstract & 1:65-2:2.
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`60. Schaefer discloses that its volatile memory includes a pin for
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`receiving the requisite signal that would place it in a “don’t care” state, thereby
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`inhibiting it from responding to any requests. The “don’t care” state represents the
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`electrical isolation. Schaefer, 6:56-58.
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`61. Schaefer teaches that the SDRAM memory device is configured for a
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`self-refresh mode when the SELF-REFRESH command is received. Schaefer,
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`3:58-61. In self refresh mode, the memory is in a “don’t care” mode. Micron Data
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`Sheet, 12, 37. The “don’t care” state renders the memory device as non-responsive
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`to requests in the form of input and control signals received at the memory device.
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`Id. Accordingly, the memory device is inhibited or electrically isolated.
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`62. As to limitation 1.f, “a memory access enable control device coupled
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`to said control device and to said control lines for determining when said memory
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`system is not being accessed and for initiating a low power mode for said memory
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`system,” this limitation is disclosed by Schaefer in view of Qureshi. Schaefer
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`discloses a command controller in the SDRAM (“memory access enable device”),
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`which includes circuitry for decoding read/write commands from Qureshi’s
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`memory controller (“control device”). Schaefer, 3:28-42; Qureshi, Abstract.
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`63. Schaefer also discloses that the command controller of its SDRAM
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`(“memory access enable device”) decodes commands from the Qureshi memory
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`controller (“control device”) to determine which memory bank should be
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`addressed, including decoding Qureshi’s signal that places Schaefer’s SDRAM
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`into power down or self-refresh mode, where all access signals are ignored
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`(“memory system is not being accessed and for initiating a low power mode”).
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`Schaefer, 3:20-25; Qureshi, 5:49-51.
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`64. As to limitation 1.g, “wherein said control device electrically isolates
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`said memory devices and places said memory devices in said self-refresh mode,
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`thereby reducing the amount of electrical energy being drawn from an electrical
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`power supply for said computer system,” Qureshi discloses that its memory
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`controller (“control device”) causes Schaefer’s SDRAM to ignore all signals and to
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`go into a low power self-refresh mode, thereby reducing the amount of electrical
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`energy being drawn from a primary electrical power supply of a connected
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`computer system. Qureshi, 1:65-2:2.
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`Claim 5
`c.
`65. Schaefer and Qureshi disclose functional electrical modules for
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`SDRAM memory devices. SDRAM is a synchronous variation (and subset) of
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`DRAM memory devices. Accordingly, a claim that recites a DRAM memory
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`device is inclusive of SDRAM memory devices, unless indicated otherwise. As
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`Schaefer in view of Qureshi invalidates claim 1, from which claim 5 depends, the
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`disclosure in these references also invalidates claim 5, because the SDRAM is a
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`type of DRAM.
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`Schaefer in View of Qureshi, Further in View of Mazur
`B.
`66. Each limitation of claims 10 and 16 is disclosed by Schaefer in view
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`of Qureshi, and further in view of Mazur.
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`Obviousness of Claims 10 and 16
`1.
`67. Claims 10 and 16 of the ’315 patent are obvious over Schaefer in view
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`of Qureshi, and further in view of Mazur. Attached as Appendix B is claim chart
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`showing how and where each limitation of Claims 10 and 16 is disclosed by
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`Schaefer in view of Qureshi, and further in view of Mazur.
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`a. Motivation to Combine and Predictability of the Art
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`68. A POSITA would be motivated to combine Schaefer with Qureshi, for
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`the reasons discussed in Section (VI)(A)(1)(a). Further, a POSITA would be
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`motivated to combine Mazur with Schaefer and Qureshi, because the functional
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`electronic modules of Schaefer, Qureshi, and Mazur are configured to work
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`together.
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`69. Mazur teaches a secondary power (e.g., battery) that supports a
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`DRAM memory during a low power refresh mode (Mazur, 5:36-39). Schaefer
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`establishes that a power failure situation would require a reset of the components in
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`the memory device, stating that:
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`Mode register 40 is typically a persistent register wherein once
`programmed, the mode register retains the program op-code
`until the mode register is reprogrammed or SDRAM 20 loses
`power.
`Schaefer, 4:4-7. As Qureshi’s memory controller is configure