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`US 6,914,779 B2
`(10) Patent N0.:
`(12)Un1ted States Patent
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`Askeland et al.
`(45) Date of Patent:
`Jul. 5, 2005
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`USOO6914779B2
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`(54) CONTROLLING THERMAL, ACOUSTIC,
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`AND/0R ELECTROMAGNETIC
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`PROPERTIES OFA COMPUTING DEVICE
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`(75)
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`Inventors 1E); $is Askéland’ koilfAlttOS’Ci‘A
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`)’
`3‘”
`gner’
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`0 15 CL
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`(Us)
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`(73) Assignee: Microsoft Corporation, Redmond, WA
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`(US)
`Subject to any disclaimer, the term of this
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`patent is extended or adjusted under 35
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`U.S.C. 154(b) by 162 days.
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`( * ) Notice:
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`(21) Appl. No.: 10/077,385
`Filed:
`Feb. 15, 2002
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`(22)
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`(65)
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`Prior Publication Data
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`US 2003/0156385 A1 Aug. 21, 2003
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`(51)
`Int. Cl.7 .................................................. H05K 7/20
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`(52) US. Cl.
`....................... 361/687; 361/695; 361/724;
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`454/184; 700/304
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`(58) Field of Search ................................. 361/683, 686,
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`361/687, 690—695, 699, 700—707, 709—710,
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`720—729, 802, 803, 816, 818; 257/706—727;
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`174/151, 16.3, 252, 35 R; 454/184; 165/802,
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`80.3, 80.4, 121—122, 106, 106.33, 104,
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`106.32, 104.33, 185; 360/67 R, 91
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`(56)
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`References Cited
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`U.S. PATENT DOCUMENTS
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`2/1986 Schubert et al.
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`4,971,520 A * 11/1990 Van Houten ............ 416/169 A
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`5,000,079 A *
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`8/1995 Lau etal.
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`174/35 R
`......
`6/1996 Dais etal.
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`.............. 165/80.3
`5,566,749 A * 10/1996 Jordan et al.
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`5,838,551 A * 11/1998 Chan .......................... 361/818
`5,867,365 A *
`2/1999 Chiou ................. 361/690
`
`..... 318/471
`3/2000 Alfano et al.
`6,037,732 A *
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`5/2000 Noble ................. 361/695
`6,064,571 A *
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`.................... 361/700
`6,122,169 A *
`9/2000 Liu et al.
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`........ 361/687
`6,141,213 A * 10/2000 Antonuccio et al.
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`6,163,454 A * 12/2000 Strickler ..................... 361/695
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`6,172,872 B1 *
`1/2001 Katsui .................. 361/695
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`6,219,236 B1 *
`4/2001 Hirano etal.
`............... 361/695
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`6,247,898 B1 *
`6/2001 Henderson et al.
`............ 417/3
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`6,351,380 B1 *
`2/2002 Curlee etal. ........... 361/695
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`6,362,977 B1 *
`3/2002 Tucker et al. ........... 361/818
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`6,400,049 B1 *
`6/2002 Lai
`.......................... 310/67 R
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`(Continued)
`OTHER PUBLICATIONS
`
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`Chang JY et al., Identification ofMinimumAir Flow Design
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`for a Desktop Computer Using CFD Modeling, 2000 Inter
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`Society Conference on Thermal Phenomena, pp. 330—338,
`
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`2000*
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`
`
`Lundquist
`and Carey, Microprocessor—Based Adaptive
`Thermal Controlfor anAir—Coolea' Computer CPUModule,
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`
`
`Seventeenth IEEE Semi—Therm Symposium, pp. 168—173,
`
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`2001.*
`
`Yu and Webb, Thermal Design of a Desktop Computer
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`System Using CFDAnalysis, Seventeenth IEEE Semi—Therm
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`Symposium, pp. 18—26, 2001.*
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`Primary Examiner—Michael Datskovskiy
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`(74) Attorney, Agent, or Firm—Workman Nydegger
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`ABSTRACT
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`(57)
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`A computing device includes a housing With various elec-
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`trical and/or mechanical components included therein. Dis-
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`posed Within the housing is a processor assembly that
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`includes a fan. The fan is configured to draw air into the
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`interior of the housing and force air heated by the internal
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`components of the computing device from the interior of the
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`housing. The fan has a diameter that is larger than the
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`smallest dimension of the three orthogonal dimensions of
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`the housing of the computing device and generates low
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`levels of acoustic noise having a
`low frequency.
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`Additionally,
`the processor assembly includes a support
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`structure that supports the fan and reduces the effects of
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`electromagnetic emissions generated by a processor of the
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`processor assembly upon electrical devices adjacent to the
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`computing device.
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`21 Claims, 6 Drawing Sheets
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`SONY - Ex.-1008
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`1
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`Sony Corporation - Petitioner
`
`Y Ex 1008
`Sony Corporation - Petitioner
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`1
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`SONY - Ex.-1008
`Sony Corporation - Petitioner
`
`

`

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`US 6,914,779 B2
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`Page 2
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`...... 340/815.45
`6,462,670 B1 * 10/2002 Bolognia et a1.
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`......... 700/300
`6,526,333 B1 *
`2/2003 Henderson et a1.
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`6,587,337 B2 *
`7/2003 Sasaki
`........................ 361/687
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`7/2003 Emberty et a1.
`6,597,972 B2 *
`............ 700/304
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`6,659,292 B2 * 12/2003 Gough et a1.
`................. 211/26
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`* cited by examiner
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`2
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`US. Patent
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`Jul. 5, 2005
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`US. Patent
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`Jul. 5, 2005
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`US 6,914,779 B2
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`US. Patent
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`US 6,914,779 B2
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`1
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`CONTROLLING THERMAL, ACOUSTIC,
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`AND/OR ELECTROMAGNETIC
`
`
`PROPERTIES OF A COMPUTING DEVICE
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`BACKGROUND OF THE INVENTION
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`1. The Field of the Invention
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`The present
`invention generally relates to computing
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`devices and their thermal, acoustic, and electromagnetic
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`properties. More specifically, the present invention relates to
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`controlling thermal, acoustic, and/or electromagnetic prop-
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`erties or characteristics of a computing device, while reduc-
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`ing costs associated with manufacturing such a computing
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`device.
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`2. Background and Related Art
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`In recent years, there has been significant development in
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`computer technology,
`ranging from advances in server
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`design, personal and oflice computers,
`laptops, personal
`digital assistants, or the like. These computing devices
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`provide individuals and businesses alike with the ability to
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`perform various functions, obtain entertainment, perform
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`word processing, develop graphics, or the like. Further,
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`many computing devices are capable of providing multime-
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`dia entertainment to a viewer, such as set-top boxes, digital
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`video recorders (DVR), personal video recorders (PVR), or
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`the like.
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`Generally, each type of computing device is designed to
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`operate within a given ambient temperature. For instance,
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`many set-top boxes are designed to operate at an ambient
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`temperature in a range from about 35° C. to about 40° C. To
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`enable operation at such temperatures, computing devices
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`are configured to radiate the heat energy generated by
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`various internal electrical components to the environment
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`external to the computing device. For instance, many com-
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`puting devices include a power supply that generates a
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`significant amount of heat energy that must be dissipated
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`from the computing device to protect the internal electrical
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`components from overheating.
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`Additionally, many computing devices include micropro-
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`cessors that perform various calculations and control the
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`operation of the computing device. As the microprocessor
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`performs such functions,
`the processor generates heat
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`energy. To dissipate the heat energy generated by the
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`microprocessor, many computing devices include one or
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`more heat sinks mounted to the microprocessor. Each heat
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`sink transfers a portion of the heat generated by the micro-
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`processor to the air surrounding the heat sink. The air
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`surrounding the heat sink is often moved to enhance the
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`convective transfer of heat to the air. In the absence of the
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`forced advection of air in the computing device, the air can
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`become stagnant, which reduces the convective transfer of
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`heat from the heat sink.
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`Many computing devices utilize fans to draw relatively
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`cool air into the housing of the computing device and expel
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`relatively warm air from the housing. For instance, in many
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`home computers, a first fan is mounted to receive air directly
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`from outside the housing of the computing device and a
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`second fan mounted to the processor and/or heat sink. In
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`such a case, the cooler air is drawn into the computing
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`device, passes over
`a heat sink mounted to the
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`microprocessor, and is expelled from the computing device.
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`Other computing devices include fans that expel the air from
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`the internal area of the housing.
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`Unfortunately, such two-fan systems do not efliciently
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`eliminate hot spots within the internal area of the computing
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`2
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`device. For instance, the air drawn into and expelled from
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`the housing may not evenly cool internal components or
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`internal areas of the computer, resulting in components or
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`internal areas of the computing device being cooled to a
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`lesser degree than other components or areas of the com-
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`puting device. Consequently, the components within these
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`hot spots may become damaged from exposure to excessive
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`heat
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`Additionally, computing devices with fans mounted to a
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`wall of the housing generate acoustic noise as the fans
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`operate. In an oflice setting, such acoustic noise may be
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`acceptable to the owner or operator of the computing device.
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`However, within a home environment, such acoustic noise
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`generated by the fan may become irritating to individuals as
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`they utilize the computing device. Illustratively, where the
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`computing device is a set-top box, DVR, or PVR,
`the
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`acoustic noise associated with the computing device can
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`become distracting to viewers watching broadcast program-
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`ming that is presented via an associated display device.
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`Furthermore, the inclusion of two fans within a computing
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`device is expensive.
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`In addition to the above problems with existing comput-
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`ing devices, computing devices generate electromagnetic
`energy that radiates from the computing device. Such elec-
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`tromagnetic energy can interfere with other electronic
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`devices located in close proximity to the computing device.
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`The amount of such electromagnetic interference (EMI)
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`allowable by each computing device is controlled by gov-
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`ernment standards. Consequently, computing devices are
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`often designed to suppress,
`to varying degrees, the EMI
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`generated by the internal components of the computing
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`devices. Typically,
`the processor of a computing device
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`generates a significant portion of the EMI among the internal
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`components of the computing device.
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`In light of the above, it would be beneficial to develop a
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`computing device that is capable of eliminating hot spots
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`within the computing device, reducing acoustic noise asso-
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`ciated with the cooling mechanisms of the computing
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`device, and/or eliminate or prevent excessive EMI, and do
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`so in a simple, efficient, and cost-effective manner.
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`BRIEF SUMMARY OF THE INVENTION
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`The present
`invention generally relates to computing
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`devices and the thermal, acoustic, and/or electromagnetic
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`properties or characteristics associated therewith. In one
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`embodiment of the present invention, a computing device
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`comprises a housing with various electrical and mechanical
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`components included therein.
`Illustratively,
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`includes such components as a hard disk assembly, a pro-
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`cessor assembly,
`a motherboard assembly,
`a power
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`assembly, and a baffle. Formed in the housing are one or
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`more vents that allow air to pass into the interior of the
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`housing and to enable air to be expelled from the housing.
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`The configuration of the computing device can be varied to
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`accommodate differing environments and differing limits
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`upon the thermal energy, acoustic noise, and/or electromag-
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`netic interference generated by the computing device.
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`Consequently,
`the particular position of the hard disk
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`assembly,
`the processor assembly,
`the motherboard
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`assembly, the power assembly, and the baffle are variable to
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`accommodate or result in differing flow paths of the air
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`circulate through the interior of the computing device.
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`According to one aspect of the invention, the processor
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`assembly draws air into the interior of the housing and forces
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`air heated by the internal components of the computing
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`device from the interior of the housing. Further, the proces-
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`9
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`US 6,914,779 B2
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`3
`sor assembly reduces the quantity of electromagnetic emis-
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`sions generated by a processor of the processor assembly.
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`Stated another way,
`in one embodiment,
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`assembly reduces the potential for electromagnetic interfer-
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`ence with other electronic components situated in close
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`proximity to the computing device, whether or not such
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`other electronic components are in contact with or separated
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`from the computing device. In addition, one configuration of
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`the processor assembly encloses the processor and associ-
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`ated heat sink within a support structure within the overall
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`housing of the computing device. This support structure is in
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`turn grounded to the overall housing, thereby reducing the
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`EMI transmitted and/or amplified by the housing.
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`The heat sink of the processor assembly is adapted to
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`dissipate heat generated by the processor as the processor
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`performs the functions associated with the computing
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`device. Surrounding the heat sink and the processor is the
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`support structure with a fan mounted thereupon. The support
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`structure positions the fan to direct air toward the heat sink
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`and processor or to draw air from the heat sink and the
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`processor. The fan is very close to the processor and heat
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`sink combination,
`thereby allowing the heat sink to be
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`smaller than otherwise required.
`Illustratively,
`in one
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`embodiment, the support structure is configured to direct air
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`toward at least one of a power assembly, a motherboard
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`assembly, and a hard disk assembly, whether or not such air
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`is drawn into the support structure before passing through
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`the fan.
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`In addition to the above, the fan optionally has a diameter
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`greater than a height dimension of the housing of the
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`computing device. By configuring the fan with a large
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`diameter, a relatively large flow of air is drawn into and
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`forced from the housing of the computing device to cool the
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`components of the computing device using a fan having a
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`relatively low number of revolutions per minute. The rela-
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`tively low rotational velocity results in a relatively low
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`amount of acoustic noise generated by the fan.
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`Consequently, the computing device generates low acoustic
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`n01se.
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`These and other features of the present invention will
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`become more fully apparent from the following description
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`and appended claims, or may be learned by the practice of
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`the invention as set forth hereinafter.
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`BRIEF DESCRIPTION OF THE DRAWINGS
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`To further clarify the above and other advantages and
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`features of the present invention, a more particular descrip-
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`tion of the invention will be rendered by reference to specific
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`embodiments thereof which are illustrated in the appended
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`drawings. It is appreciated that these drawings depict only
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`typical embodiments of the invention and are therefore not
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`to be considered limiting of its scope. The invention will be
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`described and explained with additional specificity and
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`detail through the use of the accompanying drawings in
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`which:
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`FIG. 1 illustrates an exemplary system according one
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`embodiment of the present invention;
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`FIG. 2 depicts an exploded perspective view of a com-
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`puting device of the exemplary system of FIG. 1;
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`FIG. 3 depicts an exploded perspective view of a proces-
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`sor assembly of the computing device of FIG. 2;
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`FIG. 4 illustrates still another embodiment of air flowing
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`through a processor assembly of the system of FIG. 1;
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`FIG. 5 illustrates one embodiment of the manner by which
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`the air flows through the computing device of FIG. 2; and
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`FIG. 6 illustrates a cross-sectional side view of the
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`computing device of FIG. 2.
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`DETAILED DESCRIPTION OF THE
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`PREFERRED EMBODIMENTS
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`The present invention relates to systems, methods, and
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`devices for controlling various properties and operating
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`characteristics of computing devices. Embodiments of the
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`present invention provide systems, methods, and devices for
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`controlling thermal properties and operating characteristics
`of the computing device. Further, embodiments of the
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`present invention provide systems, methods, and devices for
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`controlling the acoustic noise generated by the computing
`device. Additionally, embodiments of the present invention
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`facilitate controlling the electromagnetic interference effects
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`on other electronic devices that are in close proximity to the
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`computing device. Furthermore, embodiments of the present
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`invention perform one or more of the above-recited
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`functions, thereby providing systems, methods, and devices
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`for controlling thermal properties, acoustic noise, and/or the
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`effects of electromagnetic interference upon other electronic
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`devices. Consequently, embodiments of the present inven-
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`tion enable computing devices to be adapted for use in
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`different locations and environments. For instance, comput-
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`ing devices can be adapted for locations where high ambient
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`temperatures, acoustic noise limitations, and/or EMI restric-
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`tions are prevalent.
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`For purposes of illustration, the present invention will be
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`described herein primarily in the context of a set-top box or
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`other similar device that is used to provide access to broad-
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`cast programming received through a cable network, a
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`satellite network, or the like. Such a set-top box is used in
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`close proximity to individuals in the home and is so con-
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`figured to not affect other electrical appliances or the enjoy-
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`ment of the individuals utilizing the set-top box to obtain and
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`watch broadcast programming. However, the invention is
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`applicable to a wide variety of computing devices that may
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`benefit from systems, methods, and devices that perform one
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`or more of the functions of controlling thermal properties,
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`reducing acoustic noise, and/or suppressing electromagnetic
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`energy generated by such a computer device. Illustrative
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`computing devices include, but are not limited to, digital
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`video recorders, personal video recorders, game consoles or
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`platforms, personal computers,
`laptops, personal digital
`assistants, servers, or other computing devices.
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`FIG. 1 is a perspective view of an exemplary system
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`within which the features and functions of the present
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`system may be embodied. As illustrated, system 10 includes
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`a computing device 12 connected to a display device 14. As
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`illustrated, computing device 12 is connected to a satellite or
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`a cable provider via a communication line 16 and connected
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`to a wide area network, a local area network, or the Internet
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`by communication line 18. Generally, communication lines
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`16, 18 can have a variety of different configurations, such as
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`but not limited to,
`telephone lines, cable lines, wireless
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`transmission lines, microwave transmission lines, or the
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`like, and, in some embodiments, can be combined into a
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`single communication line.
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`FIG. 2 illustrates an embodiment of computing device 12
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`and depicts one example of the manner in which the thermal,
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`acoustical, and electromagnetic interference properties of
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`the computing device can be controlled according to the
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`invention. It is understood that the design and configuration
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`of computing devices utilizing the benefits of the present
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`invention vary based upon the environment within which the
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`computing device is used and the particular tolerances of the
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`10
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`10
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`US 6,914,779 B2
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`5
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`components employed. The present invention provides illus-
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`trative methods, systems, and devices that can be used,
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`either collectively or independently, to vary one or more of
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`the thermal, acoustical, and electromagnetic properties or
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`characteristics of the computing device. For instance, certain
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`computing devices can utilize methods or systems of the
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`present invention to control only thermal properties, while
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`another computing device controls only acoustical or EMI
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`properties using the relevant aspects of the present inven-
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`tion. Consequently,
`the methods, systems, and devices
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`described herein can be used independently or collectively
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`from one another to effect one or more of the thermal,
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`acoustical, or electromagnetic properties or characteristics
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`of a computing device.
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`Reference is now made to an illustrative computing
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`device that embodies methods, systems, and devices to
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`effect, to varying degrees, the computing device’s thermal,
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`acoustical, and/or electromagnetic properties or character-
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`istics. As illustrated, computing device 12 includes a hous-
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`ing 20 formed from a cover 22 and a carriage 24. Disposed
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`within the interior of housing 20 are various components,
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`including but not limited to, a hard drive assembly 60 and a
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`processor assembly 62, including a fan 80 and a support
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`structure 82 (FIG. 3). Further, housing 20 includes a moth-
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`erboard assembly 64, a power assembly 66, and a baflle 120.
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`One or more of these components 60, 62, 64, 66, 120
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`generate the heat, acoustic noise, and electromagnetic
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`energy associated with computing device 12. By varying the
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`placement of assemblies 60, 62, 64, and 66 with respect to
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`one another and baffle 120 within housing 20, one or more
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`of the thermal, acoustical, and electromagnetic properties of
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`computing device 12 can be varied to accommodate differ-
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`ing goals, environments, and safety standards. For instance,
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`by varying one or more dimensions of fan 80, computing
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`device 12 can have differing thermal and acoustical prop-
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`erties. Similarly, by varying the configuration of support
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`structure 82, computing device 12 have differing thermal,
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`acoustical, and electromagnetic properties. Other combina-
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`tions and resulting effects upon the thermal, acoustical, and
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`electromagnetic properties of computing device 12 will be
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`understood by one skilled in the art based upon the following
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`discussion.
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`As shown, cover 22 and carriage 24, and hence housing
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`20, have a height h. Although use of the term “height” of
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`cover 22 or carriage 24, and housing 20, is used herein,
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`height h of housing 20 is the smallest of the three orthogonal
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`dimensions of housing 20, including cover 22 and carriage
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`24. Thus, the dimension defined as height h is made regard-
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`less of the orientation of housing 20 with respect to the
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`surface on which the housing rests. Thus, height h can be
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`horizontal or vertical.
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`Cover 22 is adapted to slidably or otherwise engage with
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`carriage 24 to form housing 20. Cover 22 includes a top
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`portion 34 with integrally formed or coupled front portion
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`26, rear portion 28, and/or side portions 30, 32. Disposed
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`through side portions 30, 32 and top portion 34,
`in this
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`illustrated example, are a plurality of vents 36. Each vent 36
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`is configured to either allow passage of air into the interior
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`of cover 22 and therefore carriage 24 and/or allow air to be
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`discharged therefrom. Each vent 36 can have various con-
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`figurations so long as each vent 36 is capable of performing
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`this desired function. For instance, each vent can have an
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`elongate form, can include slanted portions that prevent an
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`individual from placing his fingers within the interior of
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`cover 22 or carriage 24, can include one or more apertures
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`or holes disposed through cover 22, combinations thereof, or
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`the like. Further, vents 36 can take the form of a mesh that
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`covers one or more holes or apertures in housing 20.
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`10
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`15
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`20
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`25
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`30
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`35
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`40
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`45
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`50
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`55
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`60
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`65
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`6
`Cover 22 can be attached to carriage 24 via one of a
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`variety of different fasteners, such as but not limited to
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`screws, bolts, slit fit fasteners, friction fit fasteners, or the
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`like. Further, cover 22 can lock to carriage 24 through
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`integrally formed fasteners. More generally, the computing
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`device includes means for coupling the cover to the carriage,
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`and the above-described fasteners are exemplary of illustra-
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`tive structures capable of performing such a function.
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`Carriage 24 includes a base 48 with a rear wall 42, a
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`sidewall 44, and a sidewall 46 integrally formed therewith or
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`otherwise coupled thereto. As mentioned above, carriage 24
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`is configured to engage with cover 22. Consequently, car-
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`riage 24 can have various configurations, such as different
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`wall or base configurations so long as carriage 24 is adapted
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`to couple with cover 22 to create housing 20. As illustrated,
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`rear wall 42 and sidewalls 44 and 46 are configured with a
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`plurality of vents 50 therethrough. Each vent 50 performs
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`the same function as vents 36 described above, i.e. to allow
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`to pass therethrough and/or be expelled therefrom,
`air
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`depending on the particular configuration of computing
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`device 12. Similarly, sidewall 44 is configured with a
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`plurality of vents 52.
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`Following hereinafter is a description of illustrative com-
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`ponents or assemblies that can be included within an interior
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`of housing 20. Through varying the particular location
`and/or configuration of such assemblies or components
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`within housing 20, one or more of the thermal, acoustical,
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`and electromagnetic properties or characteristics of comput-
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`ing device 12 are varied. For instance, by varying the path
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`taken by air flowing through housing 20 and/or the sequence
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`by which different components or assemblies are cooled by
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`the flowing air, differing thermal properties are created.
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`Similarly, by varying the amount and frequency of noise
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`created by computing device 12, the acoustical properties of
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`computing device 12 are changed. Further, the degree to
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`which computing device 12 limits the effects of EMI upon
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`other electrical appliances that contact or are adjacent to
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`computing device 12 can be varied through varying the
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`configurations of one or more of the assemblies or compo-
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`nents of computing device 12.
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`In this illustrative embodiment, attached to base 48 is a
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`smart card 54. Smart card 54 is adapted to enable computing
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`device 12 to display certa