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`Certification of Translation
`
`Translator's Declaration: August 3, 2017
`
`I, Martin Cross, hereby declare:
`
`That I possess advanced knowledge of the Japanese and English languages. My
`qualifications are as follows:
`
`.
`
`.
`
`over 25 years as a Japanese-English translator focusing primarily on patents,
`and technical and scientific documents;
`co-author of the Japanese Patent Translator's Handbook, published by
`American Translators Association;
`. United States district court recognition as an expert in Japanese technical
`translation for patent litigation; and
`a work experience including design and testing of electronic circuits for
`Research and Development Laboratories Waterloo Ltd.
`
`l hereby certify that i have prepared the attached translation of Japanese Unexamine
`Patent Publication No. JP-11-053061-A, from Japanese to English and that, to the best
`of my ability, the English translation, attached hereto, is a true and correct translation.
`
`1 further certify that i am competent in both English and Japanese to render and certify
`such translation.
`i understand that willful false statements and the like are punishable by
`a fine" or imprisonment, or both (18 U.S.C. 1001).
`i declare under penalty of perjury
`under the laws of the United States of America that all statements made herein of my
`own knowledge are true, and all statements made on information and belief are believed
`to be true.
`
`Martin Cross /
`
`
`
`SONY - Ex.—1005
`Sony Corporation - Petitioner
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`1
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`. 1005
`SON -
`Sony Corporation - Petitioner
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`1
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`SONY - Ex.-1005
`Sony Corporation - Petitioner
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`(19) Japanese Patent Office (JP)
`
`(12) Unexamined Patent
`Application Bulletin (A)
`
`(11) Laid Open Patent Application No.
`11-53061
`(43) Publication Date
`February 26, 1999
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`(51) Int. Cl.6
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`
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`Identification Code
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`FI
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`G06F 1/20
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`C06F 1/00
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`360C
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`Examination Request: not yet made Number of Claims: 5 OL (Total 5 pages)
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`(21) Application No.:
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`9-208838
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`(71) Applicant:
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`(22) Application Date:
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`August 4, 1997
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`(72) Inventor:
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`(72) Inventor:
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`(72) Inventor:
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`(74) Agent:
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`000005821
`Matsushita Electric Industrial Co., Ltd.
`1006 Oazakadoma, Kadoma-shi, Osaka-fu
`HANAGUCHI, Noboru
`Matsushita Electric Industrial Co., Ltd.
`1006 Oazakadoma, Kadoma-shi, Osaka-fu
`KAINO, Shinji
`Matsushita Electric Industrial Co., Ltd.
`1006 Oazakadoma, Kadoma-shi, Osaka-fu
`SUWA, Katsuhiko
`Matsushita Electric Industrial Co., Ltd.
`1006 Oazakadoma, Kadoma-shi, Osaka-fu
`Patent Attorney, TAKIMOTO, Tomonori
`(and one other person)
`Continued on the last page
`
` (54) Title of the Invention: Electronic Device Having an Air-Cooling Structure
`
`
`(57) [Abstract]
`[Problem to Be Solved] An object is to provide an
`electronic device having an air-cooling structure, which
`can increase the air-cooling effect in a simple manner,
`without changing the size of a cooling fan or a heatsink.
`[Means for Solving the Problem] Air taken in from
`the exterior of an electronic device casing 3 through
`suction holes 3b is suctioned by a cooling fan 1, with an
`airflow flow-path constituted by the space formed by a rib
`3a, a plate 4, as well as a hard disk drive 5, a CD-ROM
`drive 6, and a battery 7, which are functional-unit
`components, the ceiling of the electronic device casing 3,
`a circuit board 2 and the like, and after air-cooling a
`heatsink, the air that has become a warm airflow is
`discharged, from discharge holes 3c. Further, electronic
`components 8, 9 such as filter chokes and electrolytic
`capacitors, which have a volume that blocks the flow of the
`airflow in this space, are aligned along the direction of flow
`of the airflow, and the orientations of the shapes are
`arranged in a direction that decreases the flow resistance
`of the airflow, so as to maximize the airflow velocity of the
`inflow.
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`Translation by Patent Translations Inc. 206-684-9312 mail@PatentTranslations.com
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`2
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`[Claims]
`[Claim 1] An electronic device having an air-cooling
`structure characterized: by a cooling fan, which is provided in
`the vicinity of a heat-generating component and cools the heat-
`generating component by suctioning and discharging air within
`the electronic device; and in that a path for the flow of air toward
`the cooling fan is constituted by a space that communicates with
`the cooling fan and is bounded by the sidewalls of a casing, ribs,
`structural members, constituent components or the like, while a
`plurality of electronic components that have been mounted on a
`printed circuit board, which is disposed in the space, are arrayed
`in a direction such as to have little resistance to the flow of air,
`or the orientations of the shapes of the individual electronic
`components are arranged in a direction such as to have little
`resistance to the flow of air.
`[Claim 2] The electronic device having an air-cooling
`structure according to claim 1, characterized in that a heat-
`generating component requiring cooling is disposed midway in
`the air flow-path.
`[Claim 3] An electronic device having an air-cooling
`structure, characterized: by a cooling fan provided within a
`casing; and in that surfaces other than the top surface and the
`bottom surface in an air flow-path communicating with the
`cooling fan are formed only by functional-unit components, or by
`functional-unit components and sidewalls of the casing.
`[Claim 4] An electronic device having an air-cooling
`structure, characterized: by a cooling fan provided within a
`casing; and by being formed by bounding an air flow-path
`communicating with the cooling fan with an elastic structural
`material.
`[Claim 5] An electronic device having an air-cooling
`structure, characterized by comprising: a cooling fan provided
`within a casing; a discharge hole provided in a side face of the
`casing; and a duct provided between the cooling fan and the
`discharge hole.
`[Detailed Description of the Invention]
`[0001]
`[Technical Field of the Invention] The present invention
`relates to a thin, portable electronic device, and more
`particularly relates to an electronic device having a heat-
`generating component requiring cooling, at the interior, such as
`a so-called notebook computer.
`[0002]
`[Prior Art] In recent years, thin, portable electronic devices
`such as notebook computers have
`internal electronic
`components
`that generate heat, and with
`increases
`in
`performance over the years, the temperature of the heat
`generated has also become higher. Particularly when the casing
`of the electronic device is made thin, there is little internal space,
`and the impact of the malfunctions and the like due to the
`generated heat have become problematic. For this reason,
`cooling fans and heatsinks have come into use for dissipating
`the generated heat and for air-cooling.
`[0003] A perspective view of the interior of a conventional
`electronic device having an air-cooling structure is show in FIG.
`5. In FIG. 5, 51 is a CPU, which is a heat-generating component,
`constituting an object for cooling, which is mounted on a circuit
`board 52. [Reference numeral] 53 is a heatsink, made from a
`thermally conductive metallic material such as aluminum and
`mounted in close contact with the CPU 51, which conducts,
`diffuses and dissipates the heat generated by the CPU 51.
`[Reference numeral] 54 is a cooling fan, which is mounted on
`the heatsink 53, and serves to generate a flow of air and thus
`increase the cooling effect, by suctioning and discharging air
`within the electronic device.
`[0004] In a conventional electronic device configured in this
`manner, heat generated by the CPU 51 is dissipated by the
`heatsink 53, but this will be further forcibly air-cooled by the
`cooling fan 54.
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`(2) JP-11-053061-A
`[0005]
`[Problems to Be Solved by the Invention] However, in
`conventional electronic devices having an air-cooling structure
`such as described above, there were problems insomuch as,
`with increases to the heat generated by the CPU, the size of the
`cooling fan and the sizes of the heat dissipation components
`such as the heatsink or a heatpipe increased in order to increase
`the discharge capacity, making it difficult to reduce the weight
`and reduce the thickness of the electronic device.
`[0006] An object of the present invention is to provide an
`electronic device having an air-cooling structure, which can
`increase the air-cooling effect in a simple manner, without
`changing the size of the cooling fan or the heatsink.
`[0007]
`[Means for Solving the Problems] In order to solve
`aforementioned problems, the electronic device of the present
`invention is such that an air flow-path is constituted by a space,
`which is bounded by the ribs of a casing, structural members,
`constituent components or the like, and which communicates
`with a cooling fan provided in close contact with a heat-
`generating component, and electronic components present
`within the air flow-path space are arrayed, or the orientations of
`the shapes thereof are arranged, in a direction that does not
`oppose the air flow.
`[0008] By adopting the configuration described above, the
`airflow velocity of the inflow to the cooling fan can be maximized,
`and this air rapidly carries away the heat generated by the heat-
`generating component, which is an object for cooling, producing
`the effect of limiting temperature rises. Furthermore, not only
`heat-generating components that are objects for cooling in the
`vicinity of the cooling fan, but also other heat-generating
`components in the air flow-path space can be air-cooled
`together therewith.
`[0009]
`[Modes of Embodiment of the Invention] The invention
`according to claim 1 of the present invention is characterized: by
`a cooling fan, which is provided in the vicinity of a heat-
`generating component, and cools
`the heat-generating
`component by suctioning and discharging air within the
`electronic device; and in that a path for the flow of air toward the
`cooling fan is constituted by a space that communicates with the
`cooling fan and is bounded by the sidewalls of a casing, ribs,
`structural members, constituent components or the like, while a
`plurality of electronic components that have been mounted on a
`printed circuit board, which is disposed in the space, are arrayed
`in a direction such as to have little resistance to the flow of air,
`or the orientations of the shapes of the individual electronic
`components are arranged in a direction such as to have little
`resistance to the flow of air, whereby the airflow velocity of the
`inflow to the cooling fan can be maximized, and this air rapidly
`carries away the heat generated, which has the effect of limiting
`temperature rises of the heat-generating component, which is
`an object for cooling.
`[0010] The invention according to claim 2 of the present
`invention is characterized in that, in the electronic device
`according to claim 1, a heat-generating component requiring
`cooling is disposed midway in the air flow-path, whereby not only
`heat-generating components that are objects for cooling in the
`vicinity of the cooling fan, but also other heat-generating
`components in the air flow-path space can be air-cooled.
`[0011] The invention according to claim 3 of the present
`invention is characterized: by a cooling fan provided within
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`Translation by Patent Translations Inc. 206-684-9312 mail@PatentTranslations.com
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`(3) JP-11-053061-A
`generating component 10 in the air flow-path space can also be
`air-cooled together therewith.
`[0016] (Mode of Embodiment 2) FIG. 2 is a perspective
`view of the interior of an electronic device having an air-cooling
`structure in another mode of embodiment of the present
`invention. In the figure, the structure around the cooling fan 1 is
`the same as in Mode of Embodiment 1. The difference is that
`the surfaces other than the top surface and the bottom surface
`of the air flow-path are formed by the side faces of the functional-
`unit components, which are the hard disk drive 5, the CD-ROM
`drive 6, the battery 7, and the IC card unit 11, and by the sidewall
`3d of the electronic device casing 3.
`[0017] The air that is taken in through the suction holes 3b
`flows to the cooling fan 1 through the flow-path that is bounded
`by the hard disk drive 5, the CD-ROM drive 6, the battery 7, the
`IC card unit 11 and the sidewall 3d, as indicated by the arrows.
`[0018] As a result, the air flow-path is formed only by
`arranging the functional-unit components, and thus there is no
`need to provide a rib on the casing, or to mount a dedicated
`plate, which allows for reductions in parts and materials.
`[0019] (Mode of Embodiment 3) FIG. 3 (a) is an interior
`perspective view showing another mode of embodiment of an
`electronic device having an air-cooling structure of the present
`invention. In the figure, the structure around the cooling fan 1 is
`the same as in Mode of Embodiment 1. The difference is that
`the air flow-path is formed by enclosing it with elastic plates 12.
`As shown in the sectional view in FIG. 3 (b), the elastic plates
`12 are mounted in pressing contact between the circuit board 2
`and the ceiling 3e of the electronic device casing 3, and between
`the bottom surface 3f and the ceiling 3e of the electronic device
`casing 3.
`[0020] The air that is taken in through the suction hole 3b
`passes through the flow-path that is bounded by the elastic
`plates 12, and flows to the cooling fan 1 as indicated by the
`arrows.
`[0021] Because of the elastic plates 12, no gap occurs in the
`air flow-path between the ceiling 3e and the circuit board 2, and
`the bottom surface 3f and the ceiling 3e, such that substantially
`no air leaks from the air flow-path, allowing for efficient cooling.
`[0022] (Mode of Embodiment 4) FIG. 4 is an interior
`perspective view of another mode of embodiment of an
`electronic device having an air-cooling structure of the present
`invention. The differences are: the mounting position of the
`cooling fan 1; and a duct 13 provided between the cooling fan 1
`and the discharge holes 3c.
`[0023] In the figure, the warmed air that is discharged by the
`cooling fan 1 passes through the duct 13 and is discharged from
`the discharge holes 3c.
`
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`a casing; and in that surfaces other than the top surface and the
`bottom surface in an air flow-path communicating with the
`cooling fan are formed only by functional-unit components, or by
`functional-unit components and sidewalls of
`the casing,
`whereby dedicated structural members, casing ribs and the like
`for configuring the air flow-path become unnecessary, because
`the air flow-path can be configured by the arrangement of the
`functional-unit components and by the sidewalls of the casing.
`[0012] The invention according to claim 4 of the present
`invention is characterized: by a cooling fan provided within a
`casing; and by being formed by bounding an air flow-path
`communicating with the cooling fan with an elastic structural
`material, whereby substantially no air leaks from the air flow-
`path, allowing for efficient cooling.
`[0013] The invention according to claim 5 of the present
`invention is characterized by comprising: a cooling fan provided
`within a casing; a discharge hole provided in a side face of the
`casing; and a duct provided between the cooling fan and the
`discharge hole, whereby even if the cooling fan is in a position
`distant from the side face of the casing, the discharged warmed
`air will not be once again suctioned.
`[0014] Hereafter, modes of embodiment of the present
`invention are described using drawings.
`(Mode of Embodiment 1) FIG. 1 is a perspective view of the
`interior of the casing of an electronic device having an air-
`cooling structure of the present invention. In the figure, 1 is a
`cooling fan, which generates a flow of air, and thus increases
`the cooling effect, by suctioning and discharging air. A CPU,
`which is a heat-generating component constituting an object for
`cooling, is mounted on a circuit board 2, but it is not illustrated
`because it is under the cooling fan 1. Furthermore, while a
`heatsink may be mounted in close contact with the CPU, this is
`not illustrated. The mounting relationship for the CPU and the
`heatsink is the same as in the conventional example. [Reference
`numeral] 3a is a rib of an electronic device casing 3; 3b are
`suction holes provided in the electronic device casing for taking
`in outside air; and 3c are discharge holes. [Reference numeral]
`4 is a plate that is mounted for the purpose of forming an air
`flow-path; 5 is a hard disk drive; 6 is a CD-ROM drive; and 7 is
`a battery; and portions of the side faces of these functional-unit
`components face the air flow-path, and constitute walls serving
`to form the flow-path. [Reference numeral] 8 is an electronic
`component mounted on the circuit board 2, such as a filter choke
`or an electrolytic capacitor, which has a volume that impacts the
`air flow; 9 is an electronic component with different lengthwise
`and crosswise lengths; and 10 is another heat-generating
`component.
`[0015] The heat generated by the CPU is dissipated by a
`heatsink, but it will be further forcibly air-cooled by the cooling
`fan 1. The air taken in from the exterior of the electronic device
`casing 3 through the suction holes 3b is suctioned by the cooling
`fan 1, with an air flow-path constituted by the space formed by
`the side faces of the rib 3a, the plate 4, the hard disk drive 5, the
`CD-ROM drive 6, and the battery 7, as well as the ceiling of the
`electronic device casing 3 (not shown), the circuit board 2 and
`the like, and after air-cooling the heatsink, the warmed air is
`discharged to the exterior of the electronic device casing 3, from
`the discharge holes 3c. The direction of the air flow at this time
`is indicated by the arrows. As a result, an air flow-path is formed
`and the collected air flows therethrough, such that the airflow
`velocity of the inflow to the cooling fan 1 increases. Further,
`electronic components 8 having volumes such as will impact the
`air flow in this space are aligned along the air flow direction, and
`an electronic component 9 with a shape having different
`lengthwise and crosswise
`lengths
`is arranged with
`the
`longitudinal direction in the air flow direction, allowing the airflow
`velocity of the inflow to be maximized. This air rapidly carries
`away the heat generated by the CPU, such that CPU
`temperature rises can be limited. Furthermore, another heat-
`Translation by Patent Translations Inc. 206-684-9312 mail@PatentTranslations.com
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`[0024] As a result, in cases where the cooling fan 1 must be
`disposed at a position distant from the side face of the casing 3,
`due to the arrangement of the CPU, it is possible to prevent
`reductions in the cooling effect due to the warmed air that is
`discharged by the cooling fan 1 being discharged in the casing
`and once again suctioned by the cooling fan 1.
`[0025]
`[Effects of the Invention] With the present invention, as
`described above, an air flow-path is formed in a simple manner,
`without using high displacement cooling fans, heatsinks,
`[heatpipes] or the like, whereby the effect of air cooling heat-
`generating components can easily be increased, which is very
`useful.
`[Brief Description of the Drawings]
`[FIG. 1] Perspective view of the interior of an electronic
`device according to Mode of Embodiment 1 of the present
`invention
`[FIG. 2] Perspective view of the interior of an electronic
`device according to Mode of Embodiment 2 of the present
`invention
`[FIG. 3] (a) Perspective view of the interior of an electronic
`device according to Mode of Embodiment 3 of
`
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`[FIG. 1]
`
`(4) JP-11-053061-A
`the present invention; (b) sectional view of the same
`[FIG. 4] Perspective view of the interior of an electronic
`device according to Mode of Embodiment 4 of the present
`invention
`[FIG. 5] Perspective view of the interior of a conventional
`electronic device
`[Explanation of the Symbols]
`1 cooling fan
`2 circuit board
`3 electronic device casing
`3a rib
`3b suction hole
`3c discharge hole
`4 plate
`5 hard disk drive
`6 CD-ROM drive
`7 battery
`8, 9 electronic component
`10 other heat-generating component
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`[FIG. 2]
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`[FIG. 5]
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`[FIG. 4]
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`Translation by Patent Translations Inc. 206-684-9312 mail@PatentTranslations.com
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`(5) JP-11-053061-A
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`[FIG. 3]
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`Continued from the front page
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`(72) Inventor:
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`YOKOYAMA, Yasuyuki
`Matsushita Electric Industrial Co., Ltd.
`1006 Oazakadoma, Kadoma-shi, Osaka-fu
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`Translation by Patent Translations Inc. 206-684-9312 mail@PatentTranslations.com
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