(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT)
`
`(19) World Intellectual Property Organization
`International Bureau
`
`(43) International Publication Date
`14 January 2010 (14.01.2010)
`
`PCT
`
`I lllll llllllll II llllll lllll lllll lllll llll I II Ill lllll lllll lllll 111111111111111111111111111111111
`
`(10) International Publication Number
`WO 2010/004503 Al
`
`(51) International Patent Classification:
`F21V 17114 (2006.0l)
`F21S 4100 (2006.0l)
`F21V 19100 (2006.0l)
`F21Y 101102 (2006.0l)
`F21V 29100 (2006.0l)
`
`[NL/NL]; c/o High Tech Campus Building 44, NL-5656
`AE Eindhoven (NL).
`
`(74) Agents: BEKKERS, Joost, J., J. et al.; High Tech Cam(cid:173)
`pus, Building 44, NL-5656 AE Eindhoven (NL).
`
`(21) International Application Number:
`PCT/IB2009/052934
`
`l)
`
`(
`
`8
`
`(22) International Filing Date:
`
`(25)
`
`Filing Language:
`
`(26)
`
`Publication Language:
`
`6 July 2009 (06.07.2009)
`
`English
`
`English
`
`(30)
`
`Priority Data:
`08160171.8
`
`l l July 2008 (l l.07 .2008)
`
`EP
`
`(71) Applicant (for all designated States except US): KONIN(cid:173)
`KLIJKE PHILIPS ELECTRONICS N.V. [NL/NL];
`Groenewoudseweg I, NL-5621 BA Eindhoven (NL).
`
`(84)
`
`(72) Inventors; and
`(75) Inventors/Applicants (for US only): VAN ELMPT,
`Rob, F., M. [NL/NL]; c/o High Tech Campus Building
`44, NL-5656 AE Eindhoven (NL). SIPKES, Mark, E., J.
`
`Designated States (unless otherwise indicated, for every
`kind of national protection available): AE, AG, AL, AM,
`AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ,
`CA,CH,CL,CN,CO,CR,CU,CZ,DE,DK,DM,DO,
`DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT,
`HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP,
`KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD,
`ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI,
`NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD,
`SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT,
`TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
`
`Designated States (unless otherwise indicated, for every
`kind of regional protection available): ARIPO (BW, GH,
`GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM,
`ZW), Eurasian (AM, AZ, BY, KG, KZ, MD, RU, TJ,
`TM), European (AT, BE, BG, CH, CY, CZ, DE, DK, EE,
`ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV,
`
`(54) Title: LIGHT OUTPUT DEVICE AND ASSEMBLY METHOD
`
`10
`
`(
`
`[Continued on next page]
`
`(57) Abstract: The present invention relates to a light out(cid:173)
`put device (IO) comprising a heat sink (12); a substrate
`(14) with at least one light emitting element (24) arranged
`thereon; and an optical component (16), wherein the opti(cid:173)
`cal component is mounted to the heat sink by means of a
`bayonet type mechanism, and wherein the substrate is fixed
`between the heat sink and the optical component. The
`present invention also relates to a method of assembling
`such a light output device.
`
`14
`
`FIG. Sa
`
`---
`
`----;
`
`;;;;;;;;;;;;;;
`;;;;;;;;;;;;;;;
`
`;;;;;;;;;;;;;;;
`
`;;;;;;;;;;;;;;; -
`
`;;;;;;;;;;;;;;;
`
`PETITIONERS, Ex. 1020
`
`

`

`W 0 2010/004503 Al I lllll llllllll II llllll lllll lllll lllll llll I II Ill lllll lllll lllll 111111111111111111111111111111111
`
`MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, Published:
`TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW,
`ML, MR, NE, SN, TD, TG).
`
`with international search report (Art. 21 (3))
`
`Declarations under Rule 4.17:
`
`as to applicant's entitlement to apply for and be granted
`a patent (Rule 4.17 (ii))
`
`before the expiration of the time limit for amending the
`claims and to be republished in the event of receipt of
`amendments (Rule 48.2(h))
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`Light output device and assembly method
`
`1
`
`FIELD OF THE INVENTION
`
`The present invention relates to a light output device, in particular a light
`
`output device comprising at least one light emitting diode (LED), as well as a method of
`
`assembling such a light output device.
`
`5
`
`BACKGROUND OF THE INVENTION
`
`Generally, printed circuit boards (PCBs) with LEDs are often glued, screwed
`
`or clamped to a heat sink to ensure thermal contact and sufficient heat conduction away from
`
`the LEDs. Also, often optics are placed over the LEDs to provide a desired radiation pattern
`
`10
`
`or to protect the LED.
`
`US patent no. 7,348,604 (Matheson) discloses a light-emitting module
`
`comprising heat dissipation element, a substrate coupled to one or more light emitting
`
`elements, and a housing element including fastening means for coupling the housing element
`
`to the heat dissipation element, the substrate allegedly being enclosed between the heat
`
`15
`
`dissipation element and the housing element. The housing element is provided with an optical
`
`element, and it is flexible to be slid over the heat dissipation element and clutch the latter as it
`
`resumes its unstrained shape.
`
`A drawback with the solution presented in Matheson is that the flexible
`
`property of the housing element imposes design constraints on the housing element with
`
`20
`
`respect to material and shape selection.
`
`SUMMARY OF THE INVENTION
`
`It is an object of the present invention to at least partly overcome this
`
`drawback, and to provide an improved light output device.
`
`25
`
`This and other objects that will be apparent from the following description are
`
`achieved by a light output device, and a method of assembling such a light output device,
`
`according to the appended independent claims.
`
`According to an aspect of the present invention, there is provided a light
`
`output device, comprising: a heat sink; a substrate with at least one light emitting element
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`2
`
`arranged thereon; and an optical component, wherein the optical component is mounted to
`
`the heat sink by means of a bayonet type mechanism, and wherein the substrate is fixed
`
`between the heat sink and the optical component.
`
`A bayonet type mechanism may generally be defined as an arrangement for
`
`5
`
`fastening with a short rotational movement two connecting parts of rotary symmetrical
`
`character to each other. By using a bayonet type mechanism, simply twisting the optical
`
`component may fixate the optical component in the right position and also fixate the substrate
`
`to the heat sink. The latter ensures thermal contact between the substrate and the heat sink.
`
`Fixation of the substrate to the heat sink is thus advantageously carried out without having to
`
`10
`
`use flexible elements, or screws, glue or other additional components. Also, the substrate
`
`may be forced to the heat sink where it is needed: namely around the at least one LED.
`
`In one embodiment, the bayonet type mechanism comprises two opposite
`
`lateral members protruding from the optical component and two opposite grooves in the heat
`
`sink adapted to receive said protruding members, as the optical component is rotated
`
`15
`
`appropriately. The optical element may for instance include a base plate having the shape of a
`
`rectangle with two diagonally opposite rounded comers, and the heat sink may be formed as
`
`a profiled channel with two longitudinal, inner grooves. Thus, the function of fixating the
`
`substrate to the heat sink is integrated mainly in the optical element.
`
`Preferably, the substrate is a printed circuit board, the optical component is a
`
`20
`
`collimating lens, and the at least one light emitting element is at least one light emitting diode
`
`(chip or package). Benefits of LEDs include high efficiency, long useful life, etc. Alternative
`
`substrates include, but are not limited to, a wired circuit board. Alternative optical
`
`components include, but are not limited to, a protective transparent or translucent cover, a
`
`diffusing cover, a lens, a reflector, etc. Alternative light emitting elements include, but are
`
`25
`
`not limited to, organic light emitting diodes (OLEDs), laser diodes, etc.
`
`According to another aspect of the present invention, there is provided a
`
`method of assembling a light output device, the method comprising: providing a heat sink;
`
`placing a substrate with at least one light emitting element arranged thereon on the heat sink;
`
`and mounting an optical component to the heat sink by means of a bayonet mechanism such
`
`30
`
`that the substrate is fixed between the heat sink and the optical component. In one
`
`embodiment, the bayonet type mechanism comprises two opposite lateral members
`
`protruding from the optical component and two opposite grooves in the heat sink, wherein
`
`mounting the optical component to the heat sink comprises rotating the optical component in
`
`relation to the heat sink such that the protruding members are received in the grooves. In
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`3
`
`particular, the optical component is preferably mounted to the heat sink by rotating it about
`
`30-150 degrees, preferably about 45 degrees, i.e. a short rotary movement, compared to for
`
`instance a screw fitting which requires a long rotary movement for a similar function.
`
`Moreover, this aspect exhibits similar advantages and may exhibit similar features as the
`
`5
`
`aspect discussed above.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`These and other aspects of the present invention will now be described in more
`
`detail, with reference to the appended drawings showing currently preferred embodiments of
`
`10
`
`the invention.
`
`Figs. la-5b are perspective views and side views, respectively, illustrating
`
`steps of assembling a light output device according to an embodiment of the present
`
`invention.
`
`Fig. 6a is a perspective view and fig. 6b is a cross-sectional side view of an
`
`15
`
`optical element of the present light output device.
`
`DETAILED DESCRIPTION
`
`A light output device 10 according to an embodiment of the present invention
`
`will now be described with reference to the appended drawings.
`
`20
`
`The light output device 10 comprises a heat sink 12, a PCB 14, and an optical
`
`component 16.
`
`The heat sink 12 is preferably made of a material with high thermal
`
`conductivity, such as metal, in particular aluminum. The present heat sink 12 is a profiled
`
`channel having a base portion 18 and two side wall portions 20a, 20b. Two opposite grooves
`
`25
`
`22a, 22b run along the inside of the wall portion 20a, 20b near the base portion 18, as
`
`illustrated in e.g. figs la-lb. The heat sink 12 may optionally comprise a plurality of fins for
`
`enhanced heat dissipation.
`
`The PCB 14 comprises at least one LED 24 thermally connected thereto. The
`
`LED 24 may be an LED package, or a chip or die mounted directly on the PCB 14. The PCB
`
`30
`
`14 further comprises electrically conductive traces 26 or the like for electrically connecting
`
`the LED(s) 24 to a power source (not shown), for activation of the LED(s) 24. The PCB 14
`
`rests, preferably directly, on the base portion 18 between the two wall portions 20a, 20b of
`
`the heat sink 12. Also, opposite edges 28a, 28b of the PCB 14 may abut the inside of the wall
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`4
`
`portions 20a, 20b, as illustrated in e.g. fig. 2b, thereby preventing movement of the PCB 14
`
`transversal to the wall portions 20a, 20b.
`
`The optical component 16 comprises a body portion made of e.g.
`
`polycarbonate or PMMA with a cylindrical outside 30 and a sloping inside 32 (see figs. 6a-
`
`5
`
`6b ), the latter serving as a collimating reflector based on total internal reflection (TIR). The
`
`optical component 16 further comprises a central opening 34 where the at least one LED 14
`
`is to be placed. Also, the optical component 16 comprises a base plate 36 facing the base
`
`portion 18 of the heat sink 12. The base plate 36 is substantially rigid, and the optical
`
`component 16 including the base plate 36 may be integrally formed in one piece. The base
`
`10
`
`plate 36 has the overall shape of a rectangle with two rounded comers 38a, 38b, as illustrated.
`
`The (perpendicular) distance dl between the shorter sides 40a, 40b of the rectangular base
`
`plate 36 is substantially equal to the distance d2 between the bottom of the grooves 22a, 22b,
`
`whereas the corresponding distance between the other sides of the rectangular base plate 34 is
`
`shorter. Further, the thickness of the base plate 36 is preferably selected such that it may be
`
`15
`
`jammed in the grooves 22a, 22b. Alternatively, wedges 42a, 42b may be provided at the
`
`shorter sides 40a, 40b for this purpose.
`
`In the state illustrated in figs. 5a and 5b, the optical component 16 is placed
`
`over the PCB 14 and rotated such that at least portions of the shorter sides 40a, 40b of the
`
`rectangular base plate 36 are received in the grooves 22a, 22b. This prevents movement of
`
`20
`
`the optical component 16 transversal to the base portion 18 of the heat sink. Further,
`
`movement of the optical component 16 transversal to the wall portions 20a, 20b is prevented.
`
`The connection between the optical component 16a and the heat sink 12 additionally applies
`
`a pressure or force to the PCB 14, which PCB 14 is inlayed or mechanically sandwiched
`
`between the optical component 16 and the heat sink 12, such that the PCB 14 is pressed
`
`25
`
`against the heat sink 12, thereby fixating the PCB 14 to the heat sink 12 and establishing a
`
`desired level of thermal contact between the PCB 14 and the heat sink 12. This may be
`
`achieved by appropriately selecting the thickness of the PCB 14 in relation to the distance
`
`between the base portion 18 and the grooves 22a, 22b of the heat sink 12. No additional
`
`components except of the optical component 16 are needed to fixate the PCB 14 to the heat
`
`30
`
`sink 12. Also, the optical component 16 designed as described above may seal the LED 24
`
`from the outside. This beneficially allows filling the device or module 10 outside the optical
`
`component 16 with a filling/potting material (not shown) to protect the LED 24 from water or
`
`moisture, without the filling/potting material entering the central opening or optical cavity 34
`
`from the underside.
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`5
`
`Longitudinal movement of the PCB 14 and the optical component 16 along the
`
`wall portions 20a, 20b is prevented as portions of the base plate 34 are jammed in the grooves
`
`22a, 22b. End caps may optionally be used.
`
`Upon operation of the light output device 10, current is supplied to the LED(s)
`
`5
`
`24 via the electrically conductive traces 26 of the PCB 14, whereby the at least one LED 24
`
`emits light. The radiation pattern of the emitted light may be shaped by the optical
`
`component 16. Here, the emitted light is collimated. Further, heat generated by the LED(s) 24
`
`is effectively transferred by direct thermal contact from the PCB 14 to the heat sink 12, for
`
`cooling of the LED(s) 24.
`
`10
`
`A method of assembling the light output device 10 according to an
`
`embodiment of the present invention will now be described.
`
`First, in step SI (figs. la-lb), the heat sink 12 is provided.
`
`Then, in step S2 (figs. 2a-2b ), the PCB 14 is placed on the base portion 18
`
`between the side wall portions 20a, 20b of the heat sink 12. The at least one LED 24 is
`
`15
`
`preferably mounted to the PCB 14 prior to the PCB 14 being placed on the heat sink 12, but it
`
`could alternatively be mounted to the PCB 14 subsequent to the PCB 14 being placed on the
`
`heat sink 12.
`
`Then, in step S3 (figs. 3a-3b), the optical component 16 is introduced, e.g.
`
`from above, into the space between the wall portions 20a, 20b and placed on the PCB 14,
`
`20 with the opening 34 aligned with the at least one LED 24. Here, the optical component 16 is
`
`oriented such that the sides of the base plate 36 are oriented at about 45 degrees to the side
`
`wall portions 20a, 20b of the heat sink 12, as illustrated.
`
`Thereafter, the optical component 16 is rotated (step S4) around a central axis
`
`44 of the optical component 16, which axis 44 is perpendicular to the plane of the base
`
`25
`
`portion 18 of the heat sink 12. The optical component 16 may be rotated manually or
`
`automatically by means of a machine.
`
`In figs. 4a-4b, the optical element 16 is rotated clockwise about 22.5 degrees
`
`from its initial position, whereas in figs. 5a-5b the optical element 16 is in its final position,
`
`where it is rotated clockwise about 45 degrees from its initial position. In this final position
`
`30
`
`or state, as discussed above, at least portions of the shorter sides 40a, 40b of the rectangular
`
`base plate 36 are received in the grooves 22a, 22b, whereby the optical element 16 is locked
`
`in the heat sink 12, and the PCB 14 is fixed between the heat sink 12 and the optical
`
`component 16.
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`6
`
`As appreciated, the base plate 36 should be sized so as to first allow the optical
`
`component 16 to be introduced into the space between the wall portions 20a, 20b and then
`
`allow it to rotate the full 45 degrees when the base plate 36 is in level with the grooves 22a,
`
`22b. Further, the optical element 16 may be provided with protrusions mating with at least
`
`5
`
`one slit in the PCB 14, or vice versa, for guiding the optical element 16 on the PCB 14,
`
`ensuring proper alignment of the optical element 16 on the PCB 14 and also controlling the
`
`rotary motion of the optical element 16 on the PCB 14. The protrusion may for instance be
`
`two downright pins 46a, 46b extending from the underside of the optical element 16 (see fig.
`
`6a), whereas the at least one slit may be two curved slits 48a, 48b (see fig. 2a) provided in the
`
`10
`
`PCB 14 around the LED 24. This solution is easier in production, compared to a solution
`
`where the PCB has the pins and the optical element has the recess( es). The length of the
`
`curved slits 48a, 48b should preferably match the angle of rotation that is needed between the
`
`initial state and the final state of the optical element 16. At an angle of rotation equal to about
`
`45 degrees as above, the two curved slits 48a, 48b may be sufficiently short to allow some
`
`15
`
`place on the PCB 14 for the traces 26 and maintain an adequate mechanical stiffness of the
`
`PCB 14.
`
`The device and method described above may beneficially be used in all
`
`applications that use LEDs on a PCB, combined with an optical component.
`
`The person skilled in the art realizes that the present invention by no means is
`
`20
`
`limited to the preferred embodiments described above. On the contrary, many modifications
`
`and variations are possible within the scope of the appended claims. For instance, several
`
`PCBs and optical components could be arranged on a single heat sink.
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`CLAIMS:
`
`7
`
`PCT/IB2009/052934
`
`1.
`
`A light output device (10), comprising:
`
`a heat sink (12);
`
`a substrate (14) with at least one light emitting element (24) arranged thereon;
`
`and
`
`5
`
`an optical component ( 16),
`
`wherein the optical component is mounted to the heat sink by means of a bayonet type
`
`mechanism, and wherein the substrate is fixed between the heat sink and the optical
`
`component.
`
`10
`
`2.
`
`A light output device according to claim 1, wherein the bayonet type
`
`mechanism comprises two opposite lateral members ( 40a, 40b) protruding from the optical
`
`component and two opposite grooves (22a, 22b) in the heat sink adapted to receive said
`
`protruding members.
`
`15
`
`3.
`
`A light output device according to claim 1 or 2, wherein the substrate is a
`
`printed circuit board.
`
`4.
`
`A light output device according to any preceding claim, wherein the optical
`
`component is a collimating lens.
`
`20
`
`5.
`
`A light output device according to any preceding claim, wherein the at least
`
`one light emitting element is at least one light emitting diode.
`
`6.
`
`A method of assembling a light output device (10), the method comprising:
`
`25
`
`providing a heat sink (12);
`
`placing a substrate (14) with at least one light emitting element (24) arranged
`
`thereon on the heat sink; and
`
`mounting an optical component (16) to the heat sink by means of a bayonet
`
`mechanism such that the substrate is fixed between the heat sink and the optical component.
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`8
`
`7.
`
`A method according to claim 6, wherein the bayonet type mechanism
`
`comprises two opposite lateral members ( 40a, 40b) protruding from the optical component
`
`and two opposite grooves (22a, 22b) in the heat sink, and wherein mounting the optical
`
`5
`
`component to the heat sink comprises rotating the optical component in relation to the heat
`
`sink such that the protruding members are received in the grooves.
`
`8.
`
`A method according to claim 7, wherein the optical component is mounted to
`
`the heat sink by rotating it about 30 to 150 degrees.
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`1/4
`
`18
`
`20b
`
`20b
`22b
`
`FIG. lb
`
`FIG. la
`
`24
`
`FIG. 2b
`
`FIG. 2a
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`2/4
`
`10
`
`(
`
`10
`
`(
`
`16
`
`/)0
`
`14
`
`14
`
`FIG. 3b
`
`FIG. 3a
`
`40a
`
`14
`
`FIG. 4a
`
`14
`
`FIG. 4b
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`3/4
`
`10
`
`(
`
`16 10
`
`/~
`
`14
`
`14
`
`FIG. Sb
`
`FIG. Sa
`
`PETITIONERS, Ex. 1020
`
`

`

`WO 2010/004503
`
`PCT/IB2009/052934
`
`16
`
`~
`
`40a
`
`46b
`
`4/4
`
`38a
`
`30
`
`FIG. 6a
`
`34
`
`40b
`
`42a
`
`42b
`
`FIG. 6b
`
`PETITIONERS, Ex. 1020
`
`

`

`INTERNATIONAL SEARCH REPORT
`
`International appllcatlon No
`PCT/IB2009/052934
`
`A. CLASSIFICATION fJ SUBJECT MATTER
`INV. F21V17 14
`F21Vl9/00
`ADD. F21Y101/02
`
`F21V29/00
`
`F21S4/00
`
`According lo lnternalional Patent Classification (IPC) or lo both national classification and IPC
`
`B. FIELDS SEARCHED
`Minimum documen\ation searched (classilicalion sys\em followed by c\ass\licalion symbols)
`F21V F21S
`
`Documenlalion searched other than minimum documenlalion to the extent that such documents are included in the fields searched
`
`Electronic dala base consulted during the international search (name of data base and, where practical, search lerms used)
`EPQ..:. Intern a 1
`
`C. DOCUMENTS CONSIDERED TO BE RELEVANT
`
`Calegory• Cilalion of documenl, wilh indication, where appropriale, of the relevant passages
`
`Relevanl lo claim No.
`
`x
`
`x
`
`y
`x
`
`DE 20 2007 009297 Ul (CAMERA DYNAMICS GMBH
`[DE]) 8 November 2007 ( 2007-11-08)
`· paragraphs [0026] - [0038]; claims
`1,5,6,10-15; figures 1-3
`-----
`us 2006/146531 Al ( REO ANN [US] ET AL)
`6 July 2006 (2006-07-06)
`paragraphs [0025] - [0067]; figures 1-7,9
`-----
`us 2007/098334 Al (CHEN KUEI-FANG [TW])
`3 May 2007 (2007-05-03)
`paragraphs [0025] - [0042]; figures
`2-4,7-15
`-----
`
`-/--
`
`1-8
`
`1,3-6
`
`2,7,8
`
`1,3-5
`
`[]] Further documents are lisled in lhe conlinualion of Box C.
`
`[] See patent family annex.
`
`• Special calegories of ciled documents :
`
`•A• document defining the general stale of \he art which is no\
`considered lo be of particular relevance
`'E' earlier documenl but published on or after the· lnternaHonal
`-
`filing date -
`'L' document which may throw doubts on priority claim(s) or
`. citation or other special reason (as specified)
`which Is ciled lo establish the publication date of another
`
`'0' document referring to an oral disclosure, use, exhibilion or
`other means
`'P' document published prior lo \Ile in\ernatlonal filing dale bu\
`laler lhan the priorily dale claimed
`
`'T' later documenl published after the international filing dale
`or priority dale and nol in conflicl wilh the applicalion bul
`ciled lo undersland the principle or lheory underlying lhe
`lnvenlion
`'X' document of particular relevance; lhe claimed invenlion
`cannot Ile considered novel or cannot be considered lo
`involve an inventive step when the document is taken alone
`'Y' document of particular relevance; the claimed invention
`cannot be considered lo involve an inventive step when the
`document Is combined with one or more other such docu-
`ments, such combination being obvious lo a person skilled
`Jn the art.
`'&' document member of lhe same palenl family
`
`Date of lhe acJual cornplelion of the international search
`
`Date of mailing of lhe International search report
`
`30 October 2009
`
`Name and mailing address of the ISA/
`European Patent Office,-P.B. 5818 Palentlaan 2
`NL - 22CJO HV Rijswijk
`Tel. (+31-70) 340-2040,
`Fax: (+31-70)340-3016
`
`Form PCTllSA1210 (second sheet) (April 2005)
`
`05/11/2009
`
`Authorized officer
`
`von der Hardt, M
`
`PETITIONERS, Ex. 1020
`
`

`

`INTERNATIONAL SEAACH REPORT
`
`International application No
`PCT/IB2009/052934
`
`C(Contlnuatlon). DOCUMENi:s CONSIDERED T? BE RELEVANT
`
`Category• Cilalion of documenl, with indicalion, where appropriate, of the relevanl passages
`
`Relevanl lo claim No.
`
`Y
`
`y
`
`y
`
`y
`
`y
`
`US 2005/265019 Al (SOMMERS MATHEW [US] ET
`AL) 1 December 2005 (2005-12-01)
`paragraphs [0053] - [0077]; figures
`11,15,18,21,22
`
`DE 20 2007 016530 Ul (REISEN WILLY [DE])
`7 February 2008 (2008-02~07)
`paragraphs [0027] - [0037]; claim 9;
`figures 1-8
`
`EP 1 467 416 A (WELDON TECHNOLOGIES INC
`[US]) 13 October 2004 (2004-10-13)
`paragraphs [0048] - [0063]; figures 1-8,15
`-----
`US 2006/284199 Al (MATHESON GEORGE E [CA])
`21 December 2006 (2006-12-21)
`cited in the application
`paragraphs [0034] -_[0056]; figures 1,3,4
`-----
`US 2007/047207 Al (MCPHEE PHILIP S [US])
`1 March 2007 (2007-03-01)
`paragraphs [0023] - [0038]; figures 1-6
`-----
`
`1-3,5,7,
`8
`
`1,3-5
`
`1,3-5
`
`1,3,4
`
`1,3
`
`Form PCT/ISA/210 (continuation of second sheet) (April 2005)
`
`PETITIONERS, Ex. 1020
`
`

`

`INTERNATIONAL SEARCH REPORT
`Information on patent family members
`
`International application No
`PCT/IB2009/052934
`
`Patent family
`member(s)
`
`I Publication
`
`date
`
`2007129213 A
`280332 B
`
`2005250875 Al
`1761146 A2
`2008500705 T
`2005119124 A2
`
`2451808 Al
`1536686 A
`PA03012020 A
`238542 B
`2005194607 Al
`2004201025 Al
`
`24-05-2007
`01-05-2007
`
`15-12-2005
`14-03-2007
`10-01-2008
`15-12-2005
`
`11-10-2004
`13-10-2004
`14-10-2004
`21-08-2005
`08-09-2005
`14-10-2004
`
`Patent document
`cited in search report
`
`date
`
`I Publication
`
`DE 202007009297 Ul
`
`08-11-2007
`
`US 2006146531
`
`US 2007098334
`
`Al
`
`Al
`
`06-07-2006
`
`03-05-2007
`
`US 2005265019
`
`Al
`
`01-12-2005
`
`NONE
`
`NONE
`
`JP
`TW
`
`AU
`EP
`JP
`WO
`
`DE 202007016530 Ul
`
`07-02-2008
`
`NONE
`
`EP 1467416
`
`A
`
`13-10-2004
`
`US 2006284199
`
`Al
`
`21-12-2006
`
`US 2007047207
`
`Al .
`
`01-03-2007
`
`CA
`CN
`MX
`TW
`us
`us
`
`NONE
`
`NONE
`
`Form PCT /ISA/210 (patent family annex) (Aprll 2005)
`
`PETITIONERS, Ex. 1020
`
`