United States Patent [19]
`Nate et al.
`
`[451 Jun. 17, 1980
`
`METHOD FOR MOUNTING PARTS ON
`CIRCUIT BOARDS
`
`[75]
`
`Inventors: Kazuo Nate, Machida; Kyoko
`Kotsuka; Tokio Isogai, both of
`Fujisawa, all of Japan
`
`[73] Assignee: Hitachi, Ltd., Tokyo, Japan ¯
`[21] Appl. No.: 10,026
`
`Feb. 6, 1979
`
`[22] Filed:
`Foreign Application Priority Data
`[30]
`Feb. 8, 1978 [JP] Japan .................................. 53-12400
`[51] Int. 0.2 ............................................... H05K 3/34
`[52] U.S. CI ..................................... 228/175; 228/179;
`228/180 R; 427/44; 427/96; 29/834; 29/840;
`156/275; 156/281
`[58] Field of Search ...................... 29/626; 427/96, 44;
`228/179, 180 IL 175
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`3,704,515 !2/1972 Nelson ................................... 29/626
`3,859,722 1/1975 Kinsky et al ........................... 29/626
`4,064,287 12/1977 Lipson et al ........................... 427/96
`
`4,074,008
`4,139,881
`4,141,055
`
`2/1978 Green ..................................... 427/96
`Shimizu et al ................... 228/180 R
`2/1979
`2/1979 Berry et al ............................. 427/96
`
`OTHER PUBLICATIONS
`National Technical Report, vol. 24, No. 1, pp. 120-126,
`2-1978.
`
`Primary Examiner--John D. Smith
`.4ttorney, Agent. or Firm---Craig & Antonelli
`
`[57]
`
`ABSTRAC-~r
`
`One or more parts having terminals can be mounted on.
`a circuit board by coating an ultraviolet-curing and
`thermosetting resin composition comprising an ultravi-
`olet-curing resin, an addition poiymerizable monomer, a
`photosensitizer and a heat polymerization initiator, on
`the circuit board by screen printing with a prescribed
`pattern, mounting the parts on the printed resin compo-
`sition, curing the resin composition by simultaneous
`irradiation of ultraviolet light and heat rays so as to
`bond the parts to the circuit board, and soldering the
`parts onto the circuit board.
`
`11 Claims, 2 Drawing Figures
`
`4 5
`
`3
`
`R.J. Reynolds Vapor
`IPR2017-01117
`R.J. Reynolds Vapor v. Fontem
`Exhibit 1021-00001
`
`

`

`U.S. Patent
`U.S. Patent
`
`Jun. 17, 1980
`Ju~. 17, 1980
`
`4,208,005
`4,208,005
`
`FIG.
`
`6
`
`
`
`FIG. 2
`4 5
`
`3
`
`Exhibit 1021-00002
`Exhibit 1021-00002
`
`
`
`

`

`1
`
`4,208,005
`
`2
`FIG. 1 shows a plan view of a circuit board on which
`a chip part is mounted according to the method of this
`invention and
`FIG. 2 shows a cross-sectional view taken along the
`5 line II--II shown in FIG. 1.
`According to this invention, opaque chip parts can be
`bonded to the circuit board within 30 seconds. Further
`this invention has the following advantages: (1) continu-
`ous operation is possible, (2) changes of properties of
`10 the elements by heating do not appear, (3) there occurs
`no failure in adhesion due to a temporary decrease in
`the viscosity of an adhesive during the curing with
`heating, (4) there occurs no failure in soldering by dirty-
`ing the soldering portions due to a temporary decrease
`15 in the viscosity of aa adhesive during the curing with
`heating, (5) the resin composition has a long pot life, and
`(6) the realization of production procedures i~ possible.
`The nlt~aviolet-curing and thermosetting resin com-
`position used in this invention comprises:
`20 (a) I00 parts by weight of at least one ultraviolet-cur-
`ing resin,
`(b) 5 to 70-parts by weight of at least one addition
`polymerizable monomer having at least one ethyleni-
`cally unsaturated group (CH2---C <) and a boiling point
`25 of 100° C. or more at atmospheric pressure,
`" (c) 0.05 to 5 parts by weight of at least one photosen-
`sitizer, and
`(d) 0.05 to 5 parts by weight of a heat polymerization
`initiator.
`30 If necessary, the resin composition may further con-
`tain one or more conventional fillers, thixotropic
`agents, adhesion imparting agents, coloring agents, anti-
`oxidants, surface curing accelerating agents and other
`conventional additives.
`35 Examples of the ultraviolet-curing resin are unsatu-
`rated polyesters, unsaturated polyurethanes, epoxy ac-
`rylate resins, 1,2-polybutadienes having a molecular
`weight of 500 to 10,000 and having aeryloyl,
`acryloyloxy, methacryloyl, or methacryloyloxy groups
`40 at terminals, and polyorganosiloxanes having a molecu-
`lar weight of 500 to 10,000 and having acryloyl,
`acryloyloxy, methacryloyl or methacryloyloxy groups
`at terminals.
`The molecular weight of the 1,2-polybutadienes hay-
`45 ing acryloyl, acryloyloxy, methacryloyl, or metha-
`cryloyloxy groups at terminals or the polyorganosilox-
`anes having acryloyi, acyloyloxy, methacryloyl or me-
`thacryloyloxy groups at terminals should be 500 to
`10,000. If the molecular weight is smaller than 500,
`50 mechanical properties of the cured resin composition
`are lowered too much to be practically used, .and if
`more than 10,000, the viscosity of the resin composition
`becomes too high, so that printing properties of the
`highly viscous resin composition are lowered too much
`55 to be practically used.
`The addition polymerizable monomer having at least
`one ethylenicaIly unsaturated group (CH2~-----C<)
`should have a boiling point of 100° C. or more at atmo-
`spheric pressure. If the boiling point is less than 100° C.,
`60 evaporation at the ultraviolet curing increases, which is
`not preferable from the viewpoint of safety. Examples
`of the addition polymerizable monomers are styrene
`derivatives such as styrene, vinyltolueue, etc.; acrylate
`compounds such as acrylic acid, butyl acrylate, 2-
`65 hydroxyethyl acrylate, 2-hydroxypropyl acrylate, lau-
`ryt acrylate, etc.; methacrylate compounds such as
`methacrylio acid, ethyl methacry]ate, lauryl methaery-
`late, 2-hydroxypropyl methaerylate, 2-hydroxyethyl
`
`METHOD FOR MOUNTING PARTS ON CIRCUIT
`BOARDS
`
`This invention relates to a method for mounting parts
`on circuit boards such as printed wiring boards, hybrid
`integrated circuits and the like.
`Heretofore, in the case of mounting parts such as
`l~m~nated chip capacitors, laminated chip resistors, etc.
`on circuit boards such as printed wiring boards, hybrid
`integrated circuits and the like, the~ parts initially have
`b~n bonded to the boards with thermosetting adhe-
`sives, and subsequently soldered by passing the parts
`and associated boards through a tank of molten solder.
`As the thermosetting adhesives, epoxy resins and the
`like have been used for bonding the parts by heating, for
`example, at 120" C. for 20 minutes. The adhesives have
`usually been coated on the parts or areas on the circuit
`boards on which the parts are to b~ mounted with a
`brush, etc. But the above-mentioned method had vari-
`ous disadvantages in that since the thermosetting adhe-
`sives required a long period of curing with heating, it
`was difficult to work continuot~y, properties of the
`parts were changed by heating, inferior curing of the
`adhesives occurred due to variability of curing tempera-
`ture~ and the like. In addition, the method of coating
`adhesives by brushing had another disadvantage in that
`it w~ difficult to coat the adhesives under a constant
`pattern, which resulted in inferior soldering.
`In order to overcome the disadvantages mentioned
`above, ultraviolet-curing resins and electron radiation-
`curing resins have been studied. Particularly, since ul-
`traviolet-curing resins not only contribute to the realiza-
`tion of the production but also can be produced by
`using inexpensive production facilities, extensive studies
`on practical uses of these resins in various fields have
`been made ((cid:128).g. National Technical R.eport eel. 24, No.
`l, February 1978, pages 120-126). Further, in order to
`coat an adhesive under a constant pattern) a screen
`printing technique is mainly employed. But, although
`the ultraviolet-curing resins are fast~uring, since they
`do not cure on the portions wherein no ultraviolet light
`is transmitted, their use as adhesive has been limited
`narrowly to, for example, glass and the like.
`It is an object of this invention to provide a method
`for mounting parts such as laminated chip capacitors
`and resis~ors on circuit boards by using a special ultravi-
`olet-curing and thermosetting resin composition which
`overcomes the disadvantages of the known methods,
`and by curing the special resin composition with the use
`of irradiation of ultraviolet light and heat rays in a very
`short time. Further objects and advantages of this in-
`vention will be apparent to one skilled in the art from
`the accompanying drawings and the following disclo-
`sure.
`This invention provides a method for mounting one
`or more parts having terminals on a circuit board which
`comprises coating an ultraviolet-curing and thermoset-
`ting resin composition on the circuit board by screen
`printing with a prescribed pattern except for the wiring
`portions of the circuit board, mounting the parts on the
`printed resin composition so as to connect the terminals
`of the parts to the wiring, curing the resin composition
`by simultaneous irradiation of ultraviolet light and heat
`rays to bond the parts to the circuit board, and soldering
`the terminals of the parts onto the wiring of the circuit
`board.
`In the attached drawings,
`
`I I
`
`Exhibit 1021-00003
`
`

`

`4,208,005
`
`4
`As the filler, there can be used powders of aluminum
`oxide, silicon dioxide, calcium carbonate, titanium diox-
`ide, barium sulfate, mica, etc. The filler can preferably
`be used in an amount of 300 parts by weight or less,
`5 preferably 50 to 200 parts by weight per 100 parts by
`weight of the ultraviolet-curing resin.
`As the thixotropic agent, there can preferably be used
`pulverized silicon dioxide having a specific surface area
`of 100--450 m2/g in an amount of 10 parts by weight or
`10 less, preferably 5 to 7 parts by weight per 100 parts by
`weight of the ultraviolet-curing resin.
`As the coloring agent, there can be used pigments and
`dyes conventionally used such as phthalocyanine blue,
`phthalocyanine green, etc.
`15 As the antioxidant, there can preferably be used con-
`ventional heat polymerization inhibitors such as hydro-
`quinone, hydroquinone methyl ether, catechol, 2,6-di-t-
`bntyl-4-methylphenol, etc.
`As the adhesion imparting agent, there can preferably
`20 be used silane coupling agents such as y-metha-
`cryloyloxypropyltfimethoxysilane, vinyltris(/3-methox-
`yethoxy)silane, etc., in an amount of 0.1 to 10 parts by
`weight per 100 parts by weight of the ultraviolet-curing
`resin.
`25 As the surface curing accelerating agent, there can
`preferably be used metal salts of organic acids such as
`cobalt naphthenate, manganese octoate, etc.
`The coating of the ultraviolet-curing and thermoset-
`ting resin composition on the circuit board on which
`30 parts are to be mounted is conducted by screen printing
`to give a coating film having a prescribed pattern. As
`the screen printing technique, a conventional one can be
`used. Other methods such as the brushing method are
`not preferable for giving a constant pattern continu-
`35 ously.
`After mounting parts on the printed resin composi-
`tion, the resin composition is cured by simultaneous
`irradiation of ultraviolet light and heat rays to bond the
`parts on the circuit board in a very short time, e.g.
`40 within 30 seconds.
`As the source of ultraviolet light and heat rays, there
`can be used high-pressure mercury lamps, ultrahigh-
`pressure mercury lamps, metal halide lamps, carbon arc
`lamps, xenon lamps, etc. These lamps can be used alone
`45 or in combination, or together with an infrared lamp.
`After bonding of the parts by simultaneous irradiation
`of ultraviolet light and heat rays, the bonded parts are
`soldered by using a conventional soldering technique.
`This invention is illustrated more particularly by way
`50 of the following examples, in which all parts are given
`as parts by weight unless otherwise specified.
`
`3
`methacrylate, etc.; polyfunctional acrylic or meth-
`acrylic esters having two or more unsaturated groups
`such as 1,6-hexanediol diacrylate, ethylene glycol di-
`methacrylate, trimethylolpropane trimethacrylate,
`polyethylene glycol dimethacrylate, 1,4-butanediol di-
`methacrylate, etc.; polyfunctional vinyl monomers such
`as diallyl phthalate, divinyl benzene, etc.
`These monomers are effectively used in an amount of
`5 to 70 parts by weight per I00 parts by weight of the
`ultraviolet-curing resin. If the amount is less than 5 parts
`by weight, mechanical strength of the cured coating
`film is lowered unfavorably from the viewpoint of prac-
`tical use and ultraviolet curing reaction rate is lowered
`unfavorably. If the amount is more than 70 parts by
`weight, mechanical properties and heat resistance of the
`cured coating film are lowered unfavorably. These
`monomers can be used alone or as a mixture of two or
`more of them.
`As the photosensitizer, there can be used benzoin and
`its derivatives such as 4,4’-dimethyl benzoin; benzoin
`ethers such as benzoin methyl ether, benzoin ethyl
`ether, benzoin isopropyl ether, etc.; benzil and its deriv-
`atives such as 4,4’-dimethyl benzil, etc.; aryl diazonium
`salts such a~ benzene diazonium chloride, etc.; anthra-
`quinone and its derivatives such as 2-methylanthraqui-
`none, 2-t-butylanthraquinone, 2-chloroanthraquinone,
`etc.; acetophenone and its derivatives such as 4-methox-
`yacetophenone, etc.; sulfur compounds such as di-
`phenyl disulfide, diethyl disulfide, etc.; benzophenone
`and its derivatives such as 4-methoxybenzophenone,
`etc. These photosensitizers can be used alone or as a
`mixture of two or more of them.
`The photosensitizer is effectively used in an amount
`of 0.05 to 5 parts by weight per 100 parts by weight of
`the ultraviolet-curing resin. If the amount is less than
`0.05 part by weight, the ultraviolet curing reaction rate
`of the ultraviolet-curing resin is lowered and excellent
`moisture resistance and mechanical properties of the
`cured coating film cannot be obtained. If the amount is
`more than 5 parts by weight, no cured material having
`a high molecular weight can be obtained and moisture
`resistance of the cured coating film is remarkably low-
`ered unfavorably. In each case, the resulting circuit
`board cannot be used praetically. A more effective
`amount of the photosensitizer is 0.3 to 2 parts by weight
`per I00 parts by weight of the ultravioletcuring resin.
`As the heat polymerization initiator, there can be
`used organic peroxides such as benzoyl peroxide, acetyl
`peroxide, lanroyl peroxide, l,l-bis(t-butylperoxy)-3,3,5-
`trimethylcyclohexane, etc., conventional radical poly-
`merization initiators such as azo compounds, e.g. azo-
`bisisobutyronitrile, 2,2’-azobis-2-methylbutyronitrile,
`2,2’-azobis(methyl isobutyrate), etc. The heat polymeri-
`zation initiator is used effectively in an amount of 0.05
`to 5 parts by weight per 100 parts by weight of the
`ultraviolet-curing resin. If the amount is less than 0.05
`part by weight, the heat polymerization rate of the
`ultraviolet-curing and thermosetting resin composition
`becomes slow and a cured coating film having excellent
`moisture resistance and mechanical properties can not
`be obtained. If the amount is more than 5 parts by
`weight, a cured material having high molecular weight
`can not be obtained and moisture resistance of the cured
`coating film is remarkably lowered unfavorably. In
`each case, the resulting circuit board cannot be used
`practically. A more effective amount of the heat poly-
`merization initiator is 0.3 to 3 parts by weight per 100
`parts by weight of the ultraviolet-curing resin.
`
`EXAMPLE 1
`
`A resin composition was prepared by mixing uni-
`55 formly 100 parts of 1,2-polybutadiene having terminal
`methacryloyloxy groups and a molecular weight of
`about 2000, 15 parts of ethylene glycol dimethacrylate,
`15 parts of trimethylolpropane trimethacrylate, 2 parts
`of 2-methylanthraquinone, 5 parts of pulverized silicon
`60 dioxide having a specific surface area of 380 m2/g, 50
`parts of a-alumina particles having an average particle
`size of I/xm, 3 parts of T-methacryloyloxypropyltrime-
`thoxysilane, and 3 parts of benzoyl peroxide with stir-
`ring. The resin composition was coated on a printed
`65 circuit board 1 as shown in FIGS. I and 2 by using a
`usual screen printing machine to form an adhesive layer
`3 of about 50/~m thick between connecting terminals 2.
`Subsequently, a laminated chip capacitor 4 was
`
`Exhibit 1021-00004
`
`

`

`4,2081005
`
`6
`methaeryloyloxypropyltrimethoxysilane and 5 parts of
`benzoyl peroxide. By using the resin composition, a
`laminated chip capacitor, a chip resistor, a glass mold-
`ing diode and a transistor were mounted on a printed
`5 circuit board in the same manner as described in Exam-
`ple 1. The resulting circuit board was irradiated with a
`80 W/cm metal halide lamp (total consuming electric
`power 2 kW) at a distance of 15 cm for about 20 seconds
`to cure the adhesive layer. Subsequently, the resulting
`10 printed circuit board was dipped in a molten solder tank
`heated at 240°±10° C. for I0 seconds to effect solder-
`ing. The dipping procedure was repeated five times
`without causing the peeling of the chip elements from
`the printed circuit board. No change was observed after
`15 washing with a solvent such as 1,1,l-trichloroethane
`and the adhesion properties and soldering properties
`were better.
`
`mounted thereon and irradiated with a 80 W/cm metal
`halide lamp (iron chloride) (total consuming electric
`power 2 kW) at a distance of 15 cm for about 20 seconds
`so as to cure the adhesive layer 3. Subsequently, the
`resulting printed circuit board was dipped in a molten
`solder tank heated at 240"±10" C. for 10 seconds in
`order to solder electrode portions 5 of the laminated
`chip capacitor 4 with the connecting terminals 2 using
`solder 6. During the soldering, the laminated chip ca-
`pacitor 4 did not peel off from the printed circuit board
`1 and the soldering properties were better.
`
`EXAMPLE 2
`
`A resin composition was prepared by mixing uni-
`forraly with stirring 100 parts of the same 1,2-
`polybutadiene as used in Example 1, 30 parts of 2-
`hydroxyethyl methaerylate, 10 parts of ethylene glycol
`dimethacryalte, 1 part of 2-methylanthraquinone, 5
`parts of pulverized silicon dioxide having a speuifie
`surface area of 380 m2ig, 50 parts of a-alumina particles
`having an average particle size of 1 /xm, 3 parts of ?-
`methacryloyloxypropyltrimethoxysilane and 3 parts of
`benzoyI peroxide. By using the resin composition, the
`same sample as used in Example 1 as shown in FIGS. 1
`and 2 was Produced. The sample was irradiated with a
`80 W/cm metal halide lamp (total consuming electric
`power 2 kW) at a distance of 15 cm for about 30 seconds
`so as to cure the adhesive layer. Subsequently, the re-
`suiting printed circuit board was dipped in a molten
`solder tank heated at 240°±10° C. five times for 10
`seconds for each time. The chip element did not peel off
`from the printed circuit board and the adhesion proper-
`ties were better.
`
`EXAMPLE 3
`A resin composition was prepared by mixing uni-
`formly with stirring I00 parts of polyorganosiloxane
`having terminal methacryloyloxy groups and a molecu-
`lar weight of about 3000, 30 parts of 2-hydroxypropyl
`methacrylate, 10 parts of lanryl methacrylate, 1 part of
`benzophenone, 7 parts of pulverized silicon dioxide
`having a specific surface area of 380 m2/g, 100 parts of
`silica powder having a particle size of 1/~m, 3 parts of
`vinyltris(/3-methoxyethoxy)sflane and 3 parts of 1,1-
`bis(t-butylperoxy)-3,3,5-trimethyleyclohexane. By
`using the resin composition, a glass molding diode was
`mounted on a printed circuit board in the same manner
`as described in Example 1. The resulting circuit board
`was irradiated with a 80 W/cm high-pressure mercury
`lamp (total consuming electric power 2 kW) at a dis-
`tance of 20 cm for about 30 seconds to cure the adhesive
`layer. Subsequently, the resulting printed circuit board
`was dipped in a molten solder tank heated at 260"±10"
`C. for 5 seconds to effect soldering. The dipping proce-
`dure was repeated five times without causing the peel-
`ing of the glass molding diode from the printed circuit
`board. The adhesion properties and soldering properties
`were better.
`
`EXAMPLE 5
`
`20 A resin composition was prepared by mixing uni-
`formly with stirring 100 parts of epoxy acrylate resin
`having terminal methacryloyloxy groups and a molecu-
`lar weight of about 500, 5 parts by weight of 2-hydrox-
`yethyl methacrylate, 0.05 part of 2-methylanthraqui-
`25 none, 5 parts of pulverized silicon dioxide powder hav-
`ing a specific surface area of 380 m2/g, 3 parts of T-
`methacryloyloxypropyltrimethoxysilane and 0.05 part
`ofbenzoyl peroxide. By using the resin composition, the
`same sample as shown in Example I was produced. The
`30 sample was irradiated with a 80 W!em metal halide
`lamp (total consuming electric power 2 kW) at a dis-
`tance of 15 em for about 30 seconds so ~s to cure the
`adhesive layer. Subsequently, the resulting printed cir-
`~euit board was dipped in a molten solder tank heated at
`35 240"±10° C. for 10 seconds without causing the peeling
`of the chip element from the printed circuit board. The
`adhesion properties were better.
`
`EXAMPLE 6
`
`40 A resin composition was prepared by mixing uni-
`formly with stirring 100 parts of the same 1,2~
`polybutadiene as used in Example 1, 30 parts of 2-
`hydroxyethyl methacrylate, 10 parts of ethylene glycol
`dimethacrylate, 1 part of 2-methylanthraquinone and 3
`45 parts of benzoyl peroxide. By using the resin composi-
`tion, the same sample as used in Example ! as shown in
`FIGS. I and 2 was produced. The sample was irradiated
`with a 80 W/em metal halide lamp (total consuming
`electric power 2 kW) at a distance of 15 em for about 30
`50 seconds so as to cure the adhesive layer. Subsequently,
`the resulting printed circuit board was dipped in a mol-
`ten solder tank heated at 240"±10° C. five times for 10
`seconds each time without causing the peeling of the
`chip element from the printed circuit board. The adhe-
`55 sion properties were excellent.
`
`COMPA1LATIVE EXAMPLE 1
`To 100 parts of the same 1,2-polybutadiene as used in
`Example 1, 3 parts of ethylene glycol dimethacrylate, 2
`parts of 2-methylanthraquinone, 5 parts of pulverized
`silicon dioxide having a specific surface area of 380
`m2/g, 3 parts of T-methacryloyloxypropyltrimethoxysi-
`lane and 3 parts of benzoyl peroxide were added and
`stirred to give a uniformly mixed resin composition. But
`since the viscosity of the resin composition was so high
`the resin composition could not be coated on a printed
`circuit board. Since the workability was poor, the resin
`composition could not be applied to practical use.
`
`Exhibit 1021-00005
`
`EXAMPLE 4
`
`60
`
`A resin composition was prepared by mixing uni-
`formly with stirring 100 parts of the same 1,2-
`polybutadiene as used in Example 1, 30 parts of 2-
`hydroxypropyl methacrylate, 40 parts of ethylene gly-
`col dimethacrylate, 5 parts of 2-t-butylanthraquinone, 5 65
`parts of pulverized silicon dioxide having a specific
`surface area of 380 mZ/g, 200 parts of a-alumina powder
`having an average particle size of 1 /~m, 3 parts of ~-
`
`

`

`COMPAP-OkTIVE EXAMPLE 2
`To 100 parts of the same 1,2-polybutadiene as used in
`Example 1, 30 parts of ethylene glycol dimethacrylate,
`2 parts of 2-methylanthraquinone, 5 parts of pulverized
`silicon dioxide having a specific surface area of 380
`m2/g and 3 parts of 3,-methacyloyloxypropyltrimethox-
`ysilane were added with stirring to give a uniform resin
`composition. By using this resin composition, a lami-
`nated chip capacitor was mounted on a printed circuit
`board in the same manner as described in Example 1.
`The resulting circuit board was irradiated with a 80
`W/era metal halide lamp (total consuming electric
`power 2 kW) at a distance of 15 cm for 30 seconds so as
`to cure the adhesive layer. Subsequently, the resulting
`circuit board was dipped in a molten solder tank heated
`at 240"~10’ C. for 10 seconds to effect soldering.
`About 10% of the chip element was peeled off from the
`printed circuit board and the adhesion properties were
`not good. Therefore, the resulting printed circuit board
`mounting the chip element could not be applied to prac-
`tical use.
`
`COMPARATIVE EXAMPLE 3
`Using a conventionally used thermosetting adhesive 25
`composition containing 100 parts of bisphenol A type
`epoxy resin (epoxy equivalent 500, Epon 828, manufac-
`tured by Shell Chemical Corp.) and 75 parts of a poly-
`amide resin (amine value 390, Versamide 140, manufae- 30
`tured by General Chem. Co.), a laminated chip capaci-
`tor was mounted on a printed circuit board as shown in
`FIGS. I and 2 by allowing the chip element to stand at
`100" C. for 30 minutes to bond tentatively. Subse-
`quently, the printed circuit board was dipped in a tool- 35
`ten solder tank heated at 240*-4-10° C. for 10 seconds to
`conduct soldering. During the soldering, the laminated
`chip capacitor was not peeled off from the substrate
`printed circuit board. But, since the pot life of the adhe-
`sive composition was as short as about several to several 40
`tens minutes and the curing time was as long as several
`tens minutes, this method was poor in mass producibil-
`ity and could not be applied to practical use.
`What is claimed is:
`1. A method for mounting one or more parts having 45
`terminals on a circuit board which comprises coating an
`ultraviolet-curing and thermosetting resin composition
`on the circuit board by screen printing with a pre-
`scribed pattern except for wiring portions of the circuit
`board, mounting the parts on the printed resin composi- 50
`tion, curing the resin composition by simultaneous irra-
`diation of ultraviolet light and heat rays so as to bond
`the parts to the circuit board, and soldering the termi-
`nals of the parts onto the wiring of the circuit board.
`2. A method according to claim 1, wherein the ul- 55
`traviolet-euring and thermosetting resin composition
`comprises
`(a) 100 parts by weight of at least one ultraviolet-cur-
`ing resin,
`(b) 5 to 70 parts by weight of at least one addition 60
`polymetizable monomer having at least one ethyl-
`enically unsaturated group (CH2--C<) and a boil-
`ing point of 100" C. or more at atmospheric pres-
`sure,
`(c) 0.05 to 5 parts by weight of at least one photosen- 65
`sitizer, and
`(d) 0.05 to 5 parts by weight of a heat polymerization
`initiator.
`
`7
`
`4,208,005
`
`8
`3. A method according to claim 2, wherein the ul-
`traviolet-curing resin is an unsaturated polyester, an
`unsaturated polyurethane, an epoxy acrylate resin, a
`1,2-polybutadiene having terminal acryloyl,
`5 aeryloyloxy, methacryloyl or methaeryloyloxy groups
`and a molecular weight of 500 to 10,000, or a polyor-
`ganosiloxane having terminal acryloyl, acryloyloxy,
`methaeryloyl or methaeryloyloxy groups and a molecu-
`lar weight of 500 to 10,000.
`10 4. A method according to claim 2, wherein the addi-
`tion polymerizable monomer is styrene, a styrene deriv-
`ative, acrylic acid, a derivative of acrylic acid, meth-
`acrylic acid, a derivative of methaerylie acid, a poly-
`functional acrylic or methacrylic ester having two or
`15 more unsaturated groups, or a polyfunctionai vinyl
`monomer.
`5. A method according to claim 2, wherein the photo-
`sensitizer is benzoin, a derivative of benzoin, a benzoin
`ether, benzil, a derivative of benzil, an aryl diazonium
`20 salt, anthraquinone, a derivative of anthraquinone, ace-
`tophenone, a derivative of acetophenone, diphenyl di-
`sulfide, benzophenone or a derivative of benzophenone.
`6. A method according to claim 2, wherein the heat
`polymerization initiator is an organic perioxide or an
`azo compound.
`7. A method according to claim 2, wherein the heat
`polymerization initiator is benzoyl peroxide, acetyl per-
`oxide, lauroyl peroxide, 1,1-bis(t-butylperoxy)-3,3,5-
`trimethylcyclohexane, azobisisobutyronitrile, 2,2’-azo-
`bis-2-methylbutyronitrile, or 2,2’-azobis(methyl isobu-
`tyrate).
`8. A method for mounting one or more parts having
`terminals on a circuit board which comprises coating an
`ultraviolet-curing and thermosetting resin composition
`comprising
`(a) 1130 parts by weight of at least one ultraviolet-cur-
`ing resin selected from the group consisting of an
`unsaturated polyester, an unsaturated polyure-
`thane, an epoxy acrylate resin, a 1,2-polybutadiene
`having terminal acryloyl, acryloyloxy, methacryl-
`oyl or methacryloyloxy groups and a molecular
`weight of 500 to 10,000, and a polyorganosiloxane
`having terminal acryloyl, acryloyloxy, methacryl-
`oyl or methaeryloyloxy groups and a molecular
`weight of 500 to 10,000,
`(b) 5 to 70 parts by weight of at least one addition
`polymerizable monomer having at least one ethyl-
`enically unsaturated group and a boiling point of
`100° C. or more at atmospheric pressure selected
`from the group consisting of styrene, vinyltoluene,
`acrylic acid, butyl acrylate, 2-hydroxypropyl acry-
`late, 2-hydroxyethyl acrylate, lauryl acrylate,
`methacrylic acid, ethyl methaerylate, lauryl meth-
`acrylate, 2-hydroxypropyl methacrylate, 2-hydrox-
`yethyl methacrylate, 1,6-hexanediol diacrylate,
`ethylene glycol dimethacrylate, trimethylolpro-
`pane trimethacrylate, polyethylene glycol dimeth-
`acrylate, 1,4-butanediol dimethacrylate, diallyl
`phthalate and divinyl benzene,
`(c) 0.05 to 5 parts by weight of a photosensitizer
`selected from the group consisting of benzoin, 4,4’-
`dimethyl benzoin, benzoin methyl ether, benzoin
`ethyl ether, benzoin isopropyl ether, benzil, 4,4’-
`dimethyl benzil, benzene diazonium chloride, an-
`thraquinone, 2-methylanthraquinone, 2-t-butylan-
`thraquinone, 2-chloroanthraquinone, acetophe-
`none, 4-methoxyaeetophenone, diphenyl disulfide,
`
`Exhibit 1021-00006
`
`

`

`4,208,005
`
`9
`diethyl disulfide, bcnzopheaone and 4-methox-
`ybenzophenone,
`(d) 0.05 to 5 parts by weight of a heat polymerization
`initiator selected from the group consisting of ben-
`zoyl peroxide, acetyl peroxide, lauroyl peroxide,
`I, l-bis(t-butylperoxy)-3,3,5-trimethylcyeiohexene,
`azobisisobut yronitrile, 2,2’-azobis-2-methyl-
`butyronitrile and 2,2°-azobis(methyl isobutyrate),
`on the circuit board by screen printing with a pre-
`scribed pattern except for wiring portions 0f the
`circuit board,
`mounting the parts on the printed resin composition,
`curing the resin composition by simultaneous irradia-
`tion of ultraviolet light and heat rays so as to bond
`the parts to the circuit board, and
`soldering the tcrminah of the parts onto the wiring of
`the circuit board.
`
`10
`9. A method according to claim g, wherein the ul-
`traviolet-curing and thermosetting resin composition
`further comprises 300 parts by weight or less of one or
`more fillers, 10 parts by weight or less of one or more
`5 thixotropic agents and 0.1 to 10 parts by weight of one
`or more adhesion imparting agents.
`10. A method according to claim 1, 8 or 9, wherein
`ultraviolet light and heat rays are produced by a high-
`pressure mercury lump, an ultrahigh-pressure mercury
`10 lamp, a metal halide lamp, a carbon arc lamp or a xenon
`lamp.
`11. A method according to claim 9, wherein the f’fller
`is a powder of aluminum oxide, silicon dioxide, calcium
`carbonate, titanium dioxide, barium sulfate or mica, the
`15 thixotropic agent is pulverized silicon dioxide having a
`specific surface area of 100 to 450 m2/g, and the adhe-
`sion imparting agent is "?-methacryloyloxypropyltrime-
`thoxysilane or vinyltris(fl-methoxyethoxy)silane.
`
`25
`
`3O
`
`35
`
`45
`
`5O
`
`65
`
`Exhibit 1021-00007
`
`