Exhibit 2036
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`Exhibit 2036
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`

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`Universal Serial Bus
`Power Delivery Specification
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`Revision 3.0, V1.0a. 25 March 2016
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`USB Power Delivery Specification Revision 3.0, Version 1.0a
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` Page 1
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`VIS EXHIBIT 2036
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`

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`Editors
`
`Bob Dunstan
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`Intel Corporation
`
`Richard Petrie
`
`DisplayLink
`
`Contributors
`
`Charles Wang
`
`ACON, Advanced-Connectek, Inc.
`
`Conrad Choy
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`ACON, Advanced-Connectek, Inc.
`
`Steve Sedio
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`ACON, Advanced-Connectek, Inc.
`
`Vicky Chuang
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`ACON, Advanced-Connectek, Inc.
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`Joseph Scanlon
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`Advanced Micro Devices
`
`Howard Chang
`
`Allion Labs, Inc.
`
`Greg Stewart
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`Analogix Semiconductor, Inc.
`
`Mehran Badii
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`Analogix Semiconductor, Inc.
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`Bill Cornelius
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`Apple
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`Colin Whitby-Strevens Apple
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`Corey Axelowitz
`
`Apple
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`Corey Lange
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`Dave Conroy
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`Apple
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`Apple
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`David Sekowski
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`Apple
`
`Girault Jones
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`James Orr
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`Jason Chung
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`Jennifer Tsai
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`Karl Bowers
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`Apple
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`Apple
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`Apple
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`Apple
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`Apple
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`Keith Porthouse
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`Apple
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`Matt Mora
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`Paul Baker
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`Apple
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`Apple
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`Reese Schreiber
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`Apple
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`Page 2
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` USB Power Delivery Specification Revision 3.0, Version 1.0a
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`

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`Sameer Kelkar
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`Sasha Tietz
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`Sree Raman
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`William Ferry
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`Zaki Moussaoui
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`Apple
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`Apple
`
`Apple
`
`Apple
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`Apple
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`Bernard Shyu
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`Bizlink Technology, Inc.
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`Eric Wu
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`Bizlink Technology, Inc.
`
`Morphy Hsieh
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`Bizlink Technology, Inc.
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`Shawn Meng
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`Bizlink Technology Inc.
`
`Tiffany Hsiao
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`Bizlink Technology, Inc.
`
`Weichung Ooi
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`Bizlink Technology, Inc.
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`Michal Staworko
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`Cadence Design Systems, Inc.
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`Alessandro Ingrassia
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`Canova Tech
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`Andrea Colognese
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`Canova Tech
`
`Davide Ghedin
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`Canova Tech
`
`Matteo Casalin
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`Canova Tech
`
`Nicola Scantamburlo
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`Canova Tech
`
`Yi-Feng Lin
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`Canyon Semiconductor
`
`Anup Nayak
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`Cypress Semiconductor
`
`Jagadeesan Raj
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`Cypress Semiconductor
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`Pradeep Bajpai
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`Cypress Semiconductor
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`Rushil Kadakia
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`Cypress Semiconductor
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`Steven Wong
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`Cypress Semiconductor
`
`Subu Sankaran
`
`Cypress Semiconductor
`
`Sumeet Gupta
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`Cypress Semiconductor
`
`Adolfo Montero
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`Dell Inc.
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`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 3
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`
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`

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`Bruce Montag
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`Dell Inc.
`
`Gary Verdun
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`Merle Wood
`
`Dell Inc.
`
`Dell Inc.
`
`Mohammed Hijazi
`
`Dell Inc.
`
`Siddhartha Reddy
`
`Dell Inc.
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`Dan Ellis
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`DisplayLink
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`Jason Young
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`DisplayLink
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`Peter Burgers
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`DisplayLink
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`Richard Petrie
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`DisplayLink
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`PD Chair/Device Policy Lead
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`Abel Astley
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`Chuck Trefts
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`Ellisys
`
`Ellisys
`
`Emmanuel Durin
`
`Ellisys
`
`Mario Pasquali
`
`Ellisys
`
`Chien-Cheng Kuo
`
`Etron Technology, Inc.
`
`Jack Yang
`
`Etron Technology, Inc.
`
`Richard Crisp
`
`Etron Technology, Inc.
`
`Shyanjia Chen
`
`Etron Technology, Inc.
`
`TsungTa Lu
`
`Etron Technology, Inc.
`
`Christian Klein
`
`Fairchild Semiconductor
`
`Oscar Freitas
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`Fairchild Semiconductor
`
`Souhib Harb
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`Fairchild Semiconductor
`
`AJ Yang
`
`Foxconn / Hon Hai
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`Fred Fons
`
`Foxconn / Hon Hai
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`Steve Sedio
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`Foxconn / Hon Hai
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`Terry Little
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`Foxconn / Hon Hai
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`Bob McVay
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`Fresco Logic Inc.
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`Page 4 USB Power Delivery Specification Revision 3.0, Version 1.0a
`
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`

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`Christopher Meyers
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`Fresco Logic Inc.
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`Tom Burton
`
`Fresco Logic Inc.
`
`Dian Kurniawan
`
`Fresco Logic Inc.
`
`Adam Rodriguez
`
`Google Inc.
`
`Alec Berg
`
`Google Inc.
`
`David Schneider
`
`Google Inc.
`
`Jim Guerin
`
`Google Inc.
`
`Juan Fantin
`
`Google Inc.
`
`Ken Wu
`
`Google Inc.
`
`Mark Hayter
`
`Google Inc.
`
`Nithya Jagannathan
`
`Google Inc.
`
`Todd Broch
`
`Google Inc.
`
`Vincent Palatin
`
`Google Inc.
`
`Mike Engbretson
`
`Granite River Labs
`
`Rajaraman V
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`Granite River Labs
`
`Alan Berkema
`
`Hewlett Packard
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`Lee Atkinson
`
`Hewlett Packard
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`Rahul Lakdawala
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`Hewlett Packard
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`Robin Castell
`
`Hewlett Packard
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`Roger Benson
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`Hewlett Packard
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`Ron Schooley
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`Hewlett Packard
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`Vaibhav Malik
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`Hewlett Packard
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`Walter Fry
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`Hewlett Packard
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`Bob Dunstan
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`Intel Corporation
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`PD Chair/Protocol WG Lead
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`Brad Saunders
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`Intel Corporation
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`Chee Lim Nge
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`Intel Corporation
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`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 5
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`

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`Christine Krause
`
`Intel Corporation
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`Dan Froelich
`
`Intel Corporation
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`David Harriman
`
`Intel Corporation
`
`David Hines
`
`Intel Corporation
`
`David Thompson
`
`Intel Corporation
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`Guobin Liu
`
`Intel Corporation
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`Harry Skinner
`
`Intel Corporation
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`Henrik Leegaard
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`Intel Corporation
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`Jervis Lin
`
`Intel Corporation
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`John Howard
`
`Intel Corporation
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`Karthi Vadivelu
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`Intel Corporation
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`Leo Heiland
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`Intel Corporation
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`Maarit Harkonen
`
`Intel Corporation
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`Nge Chee Lim
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`Intel Corporation
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`Paul Durley
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`Intel Corporation
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`Rahman Ismail
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`Intel Corporation
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`System Policy Lead
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`Ronald Swartz
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`Intel Corporation
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`Sarah Sharp
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`Intel Corporation
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`Scott Brenden
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`Intel Corporation
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`Sridharan
`Ranganathan
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`Intel Corporation
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`Steve McGowan
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`Intel Corporation
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`Tim McKee
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`Intel Corporation
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`PD Chair/Compliance Lead
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`Toby Opferman
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`Intel Corporation
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`Kenta Minejima
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`Japan Aviation Electronics Industry Ltd. (JAE)
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`Mark Saubert
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`Japan Aviation Electronics Industry Ltd. (JAE)
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`Toshio Shimoyama
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`Japan Aviation Electronics Industry Ltd. (JAE)
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`Page 6 USB Power Delivery Specification Revision 3.0, Version 1.0a
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`

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`Brian Fetz
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`Keysight Technologies Inc.
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`Babu Mailachalam
`
`Lattice Semiconductor Corp
`
`Gianluca Mariani
`
`Lattice Semiconductor Corp
`
`Joel Coplen
`
`Lattice Semiconductor Corp
`
`Thomas Watza
`
`Lattice Semiconductor Corp
`
`Vesa Lauri
`
`Lattice Semiconductor Corp
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`Daniel H Jacobs
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`LeCroy Corporation
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`Jake Jacobs
`
`LeCroy Corporation
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`Kimberley McKay
`
`LeCroy Corporation
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`Mike Micheletti
`
`LeCroy Corporation
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`Roy Chestnut
`
`LeCroy Corporation
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`Phil Jakes
`
`Lenovo
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`Dave Thompson
`
`LSI Corporation
`
`Alan Kinningham
`
`Luxshare-ICT
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`Daniel Chen
`
`Luxshare-ICT
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`Josue Castillo
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`Luxshare-ICT
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`Chris Yokum
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`MCCI Corporation
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`Geert Knapen
`
`MCCI Corporation
`
`Terry Moore
`
`MCCI Corporation
`
`Velmurugan Selvaraj MCCI Corporation
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`Brian Marley
`
`Microchip Technology Inc.
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`Dave Perchlik
`
`Microchip Technology Inc.
`
`Don Perkins
`
`Microchip Technology Inc.
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`John Sisto
`
`Microchip Technology Inc.
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`Josh Averyt
`
`Microchip Technology Inc.
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`Kiet Tran
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`Microchip Technology Inc.
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`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 7
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`

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`
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`Mark Bohm
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`Microchip Technology Inc.
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`Matthew Kalibat
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`Microchip Technology Inc.
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`Mick Davis
`
`Microchip Technology Inc.
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`Rich Wahler
`
`Microchip Technology Inc.
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`Ronald Kunin
`
`Microchip Technology Inc.
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`Shannon Cash
`
`Microchip Technology Inc.
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`Anthony Chen
`
`Microsoft Corporation
`
`Dave Perchlik
`
`Microsoft Corporation
`
`David Voth
`
`Microsoft Corporation
`
`Geoff Shew
`
`Microsoft Corporation
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`Jayson Kastens
`
`Microsoft Corporation
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`Kai Inha
`
`Microsoft Corporation
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`Marwan Kadado
`
`Microsoft Corporation
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`Rahul Ramadas
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`Microsoft Corporation
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`Randy Aull
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`Microsoft Corporation
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`Shiu Ng
`
`Microsoft Corporation
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`Timo Toivola
`
`Microsoft Corporation
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`Toby Nixon
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`Microsoft Corporation
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`Vivek Gupta
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`Microsoft Corporation
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`Yang You
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`Microsoft Corporation
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`Dan Wagner
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`Motorola Mobility Inc.
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`Ben Crowe
`
`MQP Electronics Ltd.
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`Pat Crowe
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`MQP Electronics Ltd.
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`Sten Carlsen
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`MQP Electronics Ltd.
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`Frank Borngräber
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`Nokia Corporation
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`Kai Inha
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`Nokia Corporation
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`Page 8 USB Power Delivery Specification Revision 3.0, Version 1.0a
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`

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`Pekka Leinonen
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`Nokia Corporation
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`Richard Petrie
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`Nokia Corporation
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`PD Vice-Chair/Device Policy Lead
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`Sten Carlsen
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`Nokia Corporation
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`Physical Layer WG Lead
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`Abhijeet Kulkarni
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`NXP Semiconductors
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`Ahmad Yazdi
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`NXP Semiconductors
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`Bart Vertenten
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`NXP Semiconductors
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`Dong Nguyen
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`NXP Semiconductors
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`Guru Prasad
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`NXP Semiconductors
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`Ken Jaramillo
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`NXP Semiconductors
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`Krishnan TN
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`NXP Semiconductors
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`Michael Joehren
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`NXP Semiconductors
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`Robert de Nie
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`NXP Semiconductors
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`Rod Whitby
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`NXP Semiconductors
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`Vijendra Kuroodi
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`NXP Semiconductors
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`Robert Heaton
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`Obsidian Technology
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`Bryan McCoy
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`ON Semiconductor
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`Cor Voorwinden
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`ON Semiconductor
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`Edward Berrios
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`ON Semiconductor
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` Power Supply WG Lead
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`Tom Duffy
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`ON Semiconductor
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`Craig Wiley
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`Parade Technologies Inc.
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`Ricardo Pregiteer
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`Power Integrations
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`Chris Sporck
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`Qualcomm, Inc.
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`Craig Aiken
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`Qualcomm, Inc.
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`George Paparrizos
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`Qualcomm, Inc
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`Giovanni Garcea
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`Qualcomm, Inc
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`James Goel
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`Qualcomm, Inc
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`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 9
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`
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`Joshua Warner
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`Qualcomm, Inc
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`Narendra Mehta
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`Qualcomm, Inc.
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`Terry Remple
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`Qualcomm, Inc.
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`Yoram Rimoni
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`Qualcomm, Inc.
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`Atsushi Mitamura
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`Renesas Electronics Corp.
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`Dan Aoki
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`Renesas Electronics Corp.
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`Kiichi Muto
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`Renesas Electronics Corp.
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`Masami Katagiri
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`Renesas Electronics Corp.
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`Nobuo Furuya
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`Renesas Electronics Corp.
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`Patrick Yu
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`Renesas Electronics Corp.
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`Peter Teng
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`Renesas Electronics Corp.
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`Philip Leung
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`Renesas Electronics Corp.
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`Steve Roux
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`Renesas Electronics Corp.
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`Tetsu Sato
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`Renesas Electronics Corp.
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`Heinz Wei
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`Richtek Technology Corporation
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`Tatsuya Irisawa
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`Ricoh Company Ltd.
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`Akihiro Ono
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`Rohm Co. Ltd.
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`Chris Lin
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`Rohm Co. Ltd.
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`Hidenori Nishimoto
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`Rohm Co. Ltd.
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`Kris Bahar
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`Rohm Co. Ltd.
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`Manabu Miyata
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`Rohm Co. Ltd.
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`Ruben Balbuena
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`Rohm Co. Ltd.
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`Takashi Sato
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`Rohm Co. Ltd.
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`Vijendra Kuroodi
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`Rohm Co. Ltd.
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`Yusuke Kondo
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`Rohm Co. Ltd.
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`Matti Kulmala
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`Salcomp Plc
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`Page 10 USB Power Delivery Specification Revision 3.0, Version 1.0a
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`

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`Toni Lehimo
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`Salcomp Plc
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`Samsung Electronics Co. Ltd.
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`Seagate Technology LLC
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`Cab Con WG Lead
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`Tong Kim
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`Alvin Cox
`
`John Hein
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`Seagate Technology LLC
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`Marc Noblitt
`
`Seagate Technology LLC
`
`Ronald Rueckert
`
`Seagate Technology LLC
`
`Tony Priborsky
`
`Seagate Technology LLC
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`John Sisto
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`Ken Gay
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`Mark Bohm
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`SMSC
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`SMSC
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`SMSC
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`Richard Wahler
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`SMSC
`
`Shannon Cash
`
`Tim Knowlton
`
`SMSC
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`SMSC
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`William Chiechi
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`SMSC
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`Fabien Friess
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`ST-Ericsson
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`Giuseppe Platania
`
`ST-Ericsson
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`Jean-Francois Gatto
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`ST-Ericsson
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`Milan Stamenkovic
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`ST-Ericsson
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`Nicolas Florenchie
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`ST-Ericsson
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`Patrizia Milazzo
`
`ST-Ericsson
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`Christophe Lorin
`
`ST-Microelectronics
`
`John Bloomfield
`
`ST-Microelectronics
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`Massimo Panzica
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`ST-Microelectronics
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`Meriem Mersel
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`ST-Microelectronics
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`Nathalie Ballot
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`ST-Microelectronics
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`Pascal Legrand
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`ST-Microelectronics
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`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 11
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`

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`Patrizia Milazzo
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`ST-Microelectronics
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`Zongyao Wen
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`Synopsys, Inc.
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`Joan Marrinan
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`Tektronix
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`Kimberley McKay
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`Teledyne-LeCroy
`
`Matthew Dunn
`
`Teledyne-LeCroy
`
`Tony Minchell
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`Teledyne-LeCroy
`
`Anand Dabak
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`Texas Instruments
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`Bill Waters
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`Texas Instruments
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`Deric Waters
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`Texas Instruments
`
`Physical Layer WG Lead
`
`Grant Ley
`
`Texas Instruments
`
`Ingolf Frank
`
`Texas Instruments
`
`Ivo Huber
`
`Texas Instruments
`
`Javed Ahmad
`
`Texas Instruments
`
`Jean Picard
`
`Texas Instruments
`
`Martin Patoka
`
`Texas Instruments
`
`Scott Jackson
`
`Texas Instruments
`
`Srinath Hosur
`
`Texas Instruments
`
`Steven Tom
`
`Texas Instruments
`
`Dydron Lin
`
`VIA Technologies, Inc.
`
`Fong-Jim Wang
`
`VIA Technologies, Inc.
`
`Jay Tseng
`
`VIA Technologies, Inc.
`
`Rex Chang
`
`VIA Technologies, Inc.
`
`Terrance Shih
`
`VIA Technologies, Inc.
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`Charles Neumann
`
`Western Digital Technologies, Inc.
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`Curtis Stevens
`
`Western Digital Technologies, Inc.
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`John Maroney
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`Western Digital Technologies, Inc.
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`Page 12 USB Power Delivery Specification Revision 3.0, Version 1.0a
`
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`

`

`Revision History
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`
`
`Revision
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`Version
`
`Comments
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`Issue Date
`
`5 July, 2012
`
`Initial release Revision 1.0
`
`Including errata through 31-October-2012
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`31 October 2012
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`Including errata through 26-June-2013
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`Including errata through 11-March-2014
`
`Initial release Revision 2.0
`
`Including errata through 7-May 2015
`
`26 June, 2013
`
`11 March 2014
`
`11 August 2014
`
`7 May 2015
`
`Initial release Revision 3.0
`
`11 December 2015
`
`1.0
`
`1.1
`
`1.2
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`1.3
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`1.0
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`1.1
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`1.0
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`1.0
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`1.0
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`1.0
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`1.0
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`2.0
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`2.0
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`3.0
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`3.0
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`
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`1.0a
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`Including errata through 25-March-2016
`
`25 March 2016
`
`INTELLECTUAL PROPERTY DISCLAIMER
`
`THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY
`
`WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE
`
`AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY
`
`PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE
`
`PROVISION OF THIS SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR
`
`IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
`
`
`
`
`
`Please send comments via electronic mail to techsup@usb.org
`
`For industry information, refer to the USB Implementers Forum web page at http://www.usb.org
`
`
`
`
`
`All product names are trademarks, registered trademarks, or service marks of their respective owners.
`
`Copyright © 2010-2016 Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas,
`STMicroelectronics, and Texas Instruments
`
`All rights reserved.
`
`
`
`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 13
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`
`
`Table of Contents
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`
`
`Contributors ................................................................................................................ 2
`
`Revision History .......................................................................................................... 13
`
`Table of Contents ....................................................................................................... 14
`
`List of Tables ............................................................................................................... 23
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`List of Figures .............................................................................................................. 29
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`1.
`
`Introduction ......................................................................................................... 36
`
`1.1
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`1.2
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`1.3
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`1.4
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`Overview ................................................................................................................................................................................... 36
`
`Purpose ...................................................................................................................................................................................... 37
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`Scope ........................................................................................................................................................................................... 37
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`Conventions ............................................................................................................................................................................. 37
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`1.4.1 Precedence .......................................................................................................................................................................... 37
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`1.4.2 Keywords ............................................................................................................................................................................. 37
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`1.4.3 Numbering .......................................................................................................................................................................... 38
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`1.5
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`1.6
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`1.7
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`1.8
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`1.9
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`Related Documents ............................................................................................................................................................... 39
`
`Terms and Abbreviations ................................................................................................................................................... 39
`
`Parameter Values................................................................................................................................................................... 45
`
`Changes From Revision 2.0 ............................................................................................................................................... 46
`
`Compatibility with Revision 2.0 ...................................................................................................................................... 46
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`2. Overview .............................................................................................................. 47
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`2.1
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`2.2
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`2.3
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`Introduction ............................................................................................................................................................................. 47
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`Section Overview ................................................................................................................................................................... 48
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`Revision 2.0 Changes and Compatibility ...................................................................................................................... 49
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`2.3.1 Changes From Revision 2.0 .......................................................................................................................................... 49
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`2.3.2 Compatibility with Revision 2.0 ................................................................................................................................. 49
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`2.4
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`2.5
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`USB Power Delivery Capable Devices ........................................................................................................................... 50
`
`SOP* Communication ........................................................................................................................................................... 51
`
`2.5.1
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`Introduction ........................................................................................................................................................................ 51
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`2.5.2 SOP* Collision Avoidance .............................................................................................................................................. 51
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`2.5.3 SOP Communication ........................................................................................................................................................ 51
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`Page 14 USB Power Delivery Specification Revision 3.0, Version 1.0a
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`2.5.4 SOP’/SOP’’ Communication with Cable Plugs ....................................................................................................... 51
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`2.6
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`Operational Overview .......................................................................................................................................................... 53
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`2.6.1 Source Operation .............................................................................................................................................................. 53
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`2.6.2 Sink Operation ................................................................................................................................................................... 56
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`2.6.3 Cable Plugs .......................................................................................................................................................................... 58
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`2.7
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`Architectural Overview ....................................................................................................................................................... 59
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`2.7.1 Policy ..................................................................................................................................................................................... 61
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`2.7.2 Message Formation and Transmission.................................................................................................................... 62
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`2.7.3 Collision Avoidance ......................................................................................................................................................... 62
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`2.7.4 Power supply ..................................................................................................................................................................... 63
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`2.7.5 DFP/UFP .............................................................................................................................................................................. 63
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`2.7.6 VCONN Source...................................................................................................................................................................... 63
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`2.7.7 Cable and Connectors ..................................................................................................................................................... 64
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`2.7.8
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`Interactions between Non-PD, BC and PD devices ............................................................................................. 64
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`2.7.9 Power Rules ........................................................................................................................................................................ 64
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`3. USB Type-A and USB Type-B Cable Assemblies and Connectors ............................ 65
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`4. Electrical Requirements ........................................................................................ 66
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`4.1
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`4.2
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`4.3
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`4.4
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`Interoperability with other USB Specifications ........................................................................................................ 66
`
`Dead Battery Detection / Unpowered Port Detection............................................................................................ 66
`
`Cable IR Ground Drop (IR Drop) ..................................................................................................................................... 66
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`Cable Type Detection ........................................................................................................................................................... 66
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`5. Physical Layer ....................................................................................................... 67
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`5.1
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`5.2
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`5.3
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`5.4
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`5.5
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`5.6
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`Physical Layer Overview .................................................................................................................................................... 67
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`Physical Layer Functions .................................................................................................................................................... 67
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`Symbol Encoding ................................................................................................................................................................... 68
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`Ordered Sets ............................................................................................................................................................................ 69
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`Transmitted Bit Ordering ................................................................................................................................................... 70
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`Packet Format ......................................................................................................................................................................... 71
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`5.6.1 Packet Framing .................................................................................................................................................................. 71
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`5.6.2 CRC ......................................................................................................................................................................................... 73
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`5.6.3 Packet Detection Errors ................................................................................................................................................. 75
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`5.6.4 Hard Reset ........................................................................................................................................................................... 75
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`5.6.5 Cable Reset .......................................................................................................................................................................... 76
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`USB Power Delivery Specification Revision 3.0, Version 1.0a Page 15
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`5.7
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`5.8
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`Collision Avoidance............................................................................................................................................................... 76
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`Biphase Mark Coding (BMC) Signaling Scheme ........................................................................................................ 77
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`5.8.1 Encoding and signaling .................................................................................................................................................. 77
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`5.8.2 Transmit and Receive Masks ....................................................................................................................................... 81
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`5.8.3 Transmitter Load Model ................................................................................................................................................ 88
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`5.8.4 BMC Common specifications ....................................................................................................................................... 89
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`5.8.5 BMC Transmitter Specifications ................................................................................................................................. 89
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`5.8.6 BMC Receiver Specifications ........................................................................................................................................ 92
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`5.9
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`Built in Self-Test (BIST) ...................................................................................................................................................... 95
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`5.9.1 BIST Carrier Mode ............................................................................................................................................................ 95
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`5.9.2 BIST Test Data ................................................................................................................................................................... 95
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`6. Protocol Layer ...................................................................................................... 96
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`6.1
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`6.2
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`Overview ................................................................................................................................................................................... 96
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`Messages ................................................................................................................................................................................... 96
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`6.2.1 Message Construction..................................................................................................................................................... 96
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`6.3
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`Control Message .................................................................................................................................................................. 106
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`6.3.1 GoodCRC Message ......................................................................................................................................................... 107
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`6.3.2 GotoMin Message........................................................................................................................................................... 107
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`6.3.3 Accept Message .............................................................................................................................................................. 107
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`6.3.4 Reject Message ............................................................................................................................................................... 108
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`6.3.5 Ping Message ................................................................................................................................................................... 108
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`6.3.6 PS_RDY Message ............................................................................................................................................................ 108
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`6.3.7 Get_Source_Cap Message ............................................................................................................................................ 108
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`6.3.8 Get_Sink_Cap Message ................................................................................................................................................. 108
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`6.3.9 DR_Swap Message ......................................................................................................................................................... 108
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`6.3.10 PR_Swap Message.......................................................................................................................................................... 109
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`6.3.11 VCONN_Swap Message ................................................................................................................................................ 110
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`6.3.12 Wait Message .................................................................................................................................................................. 110
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`6.3.13 Soft Reset Message ........................................................................................................................................................ 111
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`6.3.14 Not_Supported Message ............................................................................................................................................. 111
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`6.3.15 Get_Source_Cap_Extended Message ....................................................................................................................... 111
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`6.3.16 Get_Status Message ....................................................................................................................................................... 111
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`6.3.17 FR_Swap Message .......................................................................................................................................................... 112
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`Page 16 USB Power Delivery Specification Revision 3.0, Version 1.0a
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`6.4
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`Data Message ........................................................................................................................................................................ 112
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`6.4.1 Capabilities Message .................................................................................................................................................... 113
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`6.4.2 Request Message ..............................................................................................................................................