PROVISIONAL APPLICATION FOR
`
`ADVANCED DYNAMIC DISK MEMORY MODULE
`
`Inventor: Randy M. Bonella
`
`Express Mail Label No. ER823284625US
`
`1
`
`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 1
`
`

`
`2
`
`Table of Contents
`1 Reference Documentation ................................................................................................ 5
`1.1 Related Documentation ............................................................................................. 5
`1.2 Reference Documents ............................................................................................... 5
`Terms and Abbreviations ........................................................................................... 6
`1.3
`Introduction ....................................................................................................................... 6
`2.1
`ADDMM Overview ..................................................................................................... 6
`2.1.1
`PC Applications .................................................................................................. 7
`2.1.1.1
`Video Applications ....................................................................................... 7
`2.1.1.2
`Gaming Applications ................................................................................... 8
`2.1.2
`Competitive solutions ......................................................................................... 8
`PC Applications ........................................................................................... 8
`2.1.2.1
`2.1.2.2
`Video Application ......................................................................................... 8
`2.1.2.3
`Gaming Application ..................................................................................... 9
`3 ADDMM relationship to industry standards ....................................................................... 9
`3.1
`Relationship to the ExpressCard Standard ................................................................ 9
`3.1.1
`PCI Express Gen1 .............................................................................................. 9
`3.1.2
`USB 2.0 .............................................................................................................. 9
`3.2 Memory Standards .................................................................................................. 10
`3.2.1
`FLASH Memory ................................................................................................ 10
`3.2.1.1
`NANDTechnology ..................................................................................... 10
`3.2.1.2
`NOR Technology ....................................................................................... 10
`3.2.2
`DRAM Memory ................................................................................................. 11
`3.2.2.1
`DDR2 Technology ..................................................................................... 11
`3.2.2.2
`DDR1 Technology ..................................................................................... 11
`3.3 Power Management Standards ............................................................................... 12
`3.3.1
`Express Card Power Management Standard .................................................... 12
`3.3.2
`PCI Express Power Management Standard ..................................................... 12
`3.3.3
`ACPI Power Management Standard ................................................................. 12
`3.4 Security Standards .................................................................................................. 13
`3.4.1
`CPPM/CPRM Standards .................................................................................. 13
`3.4.2
`Data Encryption Standards ............................................................................... 14
`3.4.3 Government Requirements .............................................................................. 14
`3.5 Software Standards ................................................................................................. 14
`3.5.1
`PCI Express Standard ...................................................................................... 14
`3.5.2
`USB 2.0 Standard .............................................................................................. 14
`3.5.3 OS .................................................................................................................... 14
`3.5.3.1
`Microsoft Windows .................................................................................... 14
`3.5.3.2
`Apple OS ................................................................................................... 14
`3.5.3.3
`Linux .......................................................................................................... 14
`4 ADDMM Module ............................................................................................................. 15
`4.1
`Interface Pin Definitions ........................... : ............................................................... 17
`4.2 ADDMM Controller ................................................................................................... 17
`4.2.1
`Controller Pin Overview .................................................................................... 19
`4.2.2 Controller Block Definitions .............................................................................. 23
`4.2.2.1
`Host Interface ............................................................................................ 23
`Express Mail Label No. ER823284625US
`2
`
`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 2
`
`

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`DRAM Interface ......................................................................................... 23
`4.2.2.2
`FLASH Interface ........................................................................................ 23
`4.2.2.3
`SMBUS Controller ..................................................................................... 23
`4.2.2.4
`Voltage Regulator Controller Interface ...................................................... 23
`4.2.2.5
`Router ....................................................................................................... 24
`4.2.2.6
`Arbitration Manager and Router Control.. .................................................. 25
`4.2.2.7
`FLASH Write Leveling Engine ................................................................... 25
`4.2.2.8
`Power Management Controller .................................................................. 26
`4.2.2.9
`4.2.2.1 0 ExpressCard Power Management Overview ............................................. 27
`4.2.2.11 Configuration Registers ............................................................................. 29
`4.2.2.12 Security Manager ...................................................................................... 31
`4.2.2.13 Encryption Engine ..................................................................................... 31
`4.2.2.14 ECC/EDC Management ............................................................................ 31
`4.2.2.15 CPPM I CPRM Management.. ................................................................... 31
`4.2.2.16 BIST (Built In Self Test) Controller ............................................................ 31
`4.3 Power Delivery ........................................................................................................ 33
`4.3.1
`Flash Power Requirements (Generic) .............................................................. 34
`4.3.2
`DRAM Power Requirements (Generic) ............................................................. 35
`4.3.3
`ADDMM Controller Power Requirements ......................................................... 35
`4.3.4 Miscellaneous Power Delivery Requirements .................................................. 35
`4.4
`Timing Requirements ............................................................................................... 36
`4.4.1
`ExpressCard Interface ...................................................................................... 36
`4.4.1.1
`PCI Express Link ....................................................................................... 36
`4.4.1.2
`USB 2.0 Link ............................................................................................. 36
`4.4.2
`DDR2 DRAM .................................................................................................... 36
`4.4.3
`FLASH Interface ............................................................................................... 37
`5 Performance ................................................................................................................... 37
`5.1
`PCI Express Link ..................................................................................................... 37
`5.2 USB 2.0 Link ............................................................................................................ 37
`5.3 DDR2 DRAM ........................................................................................................... 37
`6 DC Parametrics .............................................................................................................. 37
`6.1
`DC Parametrics Voltage Regulator .......................................................................... 37
`6.2 DC Parametrics FLASH Interface ............................................................................ 37
`6.3 DC Parametrics DRAM Interface ............................................................................. 38
`6.4 DC Specification for Controller Interface .................................................................. 38
`7 AC Parametrics ................................................................. Error! Bookmark not defined.
`8 Test I Validation ................................................................ Error! Bookmark not defined.
`9 Packaging ......................................... · ................................ Error! Bookmark not defined.
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`Express Mail Label No. ER823284625US
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`3
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`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 3
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`

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`Table of Figures
`FIG. 1- ADDMM Block Diagram ............................................................................................ 16
`FIG. 2 - ADDMM Controller Block Diagram ........................................................................... 19
`FIG. 3 - Power State Transition Flow chart ............................................................................ 27
`
`Table of Tables
`Table 1 - External ExpressCard Interface .............................................................................. 17
`Table 2- Controller Pin Count Summary ............................................................................... 20
`Table 3- ExpressCard Port Interface ..................................................................................... 20
`Table4- NAND Flash lnterface ............................................................................................. 21
`Table 5- DDR2 DRAM Interface ............................................................................................ 22
`Table 6- Voltage Regulator Controller Interface .................................................................... 22
`Table 7- Power State definitions ........................................................................................... 26
`Table 8 - ExpressCard Power Delivery .................................................................................. 28
`Table 9- ADDMM Power Delivery Summary Example Design .............................................. 34
`Table 10- Flash Power Delivery Requriements ..................................................................... 34
`Table 11- DRAM Power Delivery Requirements ................................................................... 35
`Table 12- ADDMM Controller Power Delivery Requirements ................................................ 35
`Table 13 - Miscellaneous Power Delivery Requirements ....................................................... 35
`Table 14- DC Parametrics Voltage Regulator ....................................................................... 37
`Table 15- DC Parametrics FLASH Interface ......................................................................... 37
`Table 16- DC Parametrics DRAM Interface .......................................................................... 38
`Table 17- DC Parametrics Controller Interface ..................................................................... 38
`
`Express Mail Label No. ER823284625US
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`4
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`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 4
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`

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`1 Reference Documentation
`
`1.1 Related Documentation
`o ExpressCard Standard Release 1.0 (PCMCIA)
`o PCI Express Base Specification 1.1 - PCI Special Interest Group (PCI-SIG)
`o USB Specification Release 2.0 - Universal Serial Bus lmplementers Forum (USB-IF)
`o System Management Bus (SMBus) Specification, Version 2.0 - Smart Battery
`System lmplementers Forum (SBS-IF)
`o EIA-364-1 000.01: Environmental test methodology for assessing the performance of
`electrical connectors and sockets used in business office applications
`o PCI Express Card Electromechanical (CEM) Specification 1.0a- PCI Special
`Interest Group (PCI-SIG)
`o PHY Electrical test specification for PCI Express architecture (PCI-SIG)
`o NAND Flash Interface Specification
`o DDR2 DRAM specification
`o CPRM Specification Revision 0.94 and 1.3a for SO binding.
`o CPPM Specification Revision
`
`1.2 Reference Documents
`o ExpressCard Implementation Guidelines - Personal Computer Memory Card
`International Association (PCMCIA) I Japan Electronic s and Information Technology
`Industries Association (JEITA)
`o PC Card Standard, Release 8.1 - Personal Computer Memory Card International
`Association (PCMCIA) I Japan Electronics and Information Technology Industries
`Association (JEITA)
`o Advanced Configuration and Power Interface (ACPI) Specification, Revision 2.0b(cid:173)
`Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix
`Technologies Ltd., Toshiba Corporation
`o PCI Bus Power Management Interface Specification, Revision 1.2 - PCI Special
`Interest Group (PCI-SIG)
`
`Express Mail Label No. ER823284625US
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`5
`
`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 5
`
`

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`ExpressCard/54 module
`
`Extended module
`plug-n-play
`
`1.3 Tenns and Abbreviations
`. f
`1
`d . th. d
`d bb
`d fi if
`t'
`Th'
`'d
`1s ocumen t
`1s sec 1ons prov1 es e n 1on or acronyms an a
`rev1a 1ons oun
`~
`In
`ACPI
`Acronym for Advanced Configuration and Power Interface
`ExpressCard/34 module
`The smallest standard width module defined by this
`standard, characterized by its 34mm width
`The largest standard width module defined by this standard ,
`characterized by its 54mm width and nominally 140% the
`volume of the ExpressCard/34 module
`Any ExpressCard that is more than 75mm long
`An ability to insert and put into operation, or remove a
`module without cycling the system power, re-booting the
`system, or requiring a manual user intervention for
`configuration.
`Content Protection for Pre-recorded Media
`Content Protection for Recordable Media
`Hard Disk Drive
`Solid State Disk drive
`Voltage Regulator. This can be either a linear regulator
`design or a buck regulator design. There are resonant
`designs available but are typically targeted at very high
`current voltage regulator supply solutions.
`Voltage Regulator Controller. This can be an integrated
`solution and or a separate component added to the design.
`
`CPPM
`CPRM
`HOD
`SSD
`VR
`
`VRC
`
`Introduction
`2
`The initial design concept of ADDMM was establish as we looked at the PC system and the
`existing bottlenecks in those systems. We knew that the new ExpressCard interface was
`new and provided significantly higher available bandwidth than what has previously been
`available to a PC user via USB and PCMCIA interfaces. We also knew that for a
`technology such that we are proposing to be successful would allow the end user to
`upgrade their system without opening the PC enclosure. So we adopted the ExpressCard
`form factor that has already defined the form factor and has slots established in the
`industry.
`
`2.1 ADDMM Overview
`The 1st generation ADDMM module will conform to the ExpressCard interface specification.
`This standard carried the existing user interface that the USB dongles, FLASH and SO
`memory cards established over the past several years. This type of interface allows the end
`user to purchase and install without any requirements to open the PC or consumer
`electronic box in any manor. The module functions via an externally accessible interface
`slot. We also understood the need to keep the consumer markets and the PC markets
`functionally interchangeable similar to today's existing FLASH memory cards. We identified
`Express Mail Label No. ER823284625US
`6
`
`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 6
`
`

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`two adjacent markets that could take advantage of the ADDMM technology; 1) Video
`recording and movie portability, 2) Video games/general gaming. The ADDMM media
`provides a highly portable solution that is easily adapted and useable in these area's. Cost
`and power/performance per bit is currently mapping out to be a very good solution.
`
`2.1.1 PC Applications
`As we investigated the application of the technology the original focus was on a DRAM only
`type module. Our main goal was to figure out how to increase memory bit utilization in a PC
`system. While a DRAM only solution provides some interesting capability it didn't quiet
`meet all the needs for this module to act as an intermediary memory solution between the
`main memory and the hard disk drive "HOD". We then explored a hybrid solution of DRAM
`and FLASH which quickly led us down the path in which this specification outlines.
`
`In the process of our investigation we found that there are several solutions that come
`close to providing the value that we think the ADDMM memory module provides but the
`solutions have several draw backs that would prevent them from being adopted.
`
`There are four key elements that have come together in 2005 that make the ADDMM
`memory module a viable and interesting product in 2006 and beyond: 1) High bandwidth
`user accessible interfaces were introduced and productized in early 2005 that deliver
`substantially higher performance capabilities than what were previously available. 2)
`FLASH capacity has grown substantially over the past couple of years to where it is no
`longer cost prohibitive to deliver acceptable memory module capacity at consumer price
`points. 3) SO and Compact FLASH interfaces have become accepted and embraced by
`consumer products, i.e. MP3 players, Digital Cameras and Cell phones. 4} A gap was
`identified in the PC memory hierarchy that hasn't been addressed to date between main
`memory and the HOD.
`
`There are other applications of the ADDMM technology that may enhance the consumers
`view of the ADDMM device. We are exploring the opportunity for using ADDMM as a High
`Definition Video recording media. Many of today's HiDef media solutions again have gaps
`in performance cost and power consumption areas. HiDef is driving high bandwidth and
`high capacity requirements to the recording media. In order to store a full 2hr movie
`-15GBytes of storage capacity are required. Today's mini DV tapes are capable of about
`13GBytes of storage.
`
`2.1.1.1 Video Applications
`The ADDMM module is well suited to provide a HiOef video recording media solution. The
`module his low power, highly portable and delivers both capacity and performance at a very
`cost competitive point to other storage media. This specification will outline the use and the
`value to this application. This highly portable module makes video transfer to PC's and or
`other video editing equipment much more efficient as there is no need real time stream the
`data from the device to the PCMdeo editing equipment you plug the module in to the PC
`and it is ready to go saving valuable time.
`
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`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 7
`
`

`
`2.1.1.2 Gaming Applications
`Using the ExpressCard interface as the basis for a gaming media solution we are able to
`provide cost competitive, portable, low power solution for future gaming. The module
`delivers on all fronts. Capacity equivalent to DVD's, much higher performance, cost
`equivalent and lower power. Similar to the video applications gaming can take advantage of
`both the capacity and the performance that this module provides without having to design
`and define a new form factor.
`
`2.1.2 Competitive solutions
`In our investigation we have identified several possible competitive solutions each with their
`issues and or values depending on the functionality that is desired. These competitive
`solution cover the PC applications, video and gaming applications.
`
`2.1.2.1 PC Applications
`The first and most obvious is a FLASH only module based on the EXPRESS CARD form
`factor. While easy to do and interesting does not have the capability to take advantage of
`the high speed PCI Express interface without adding substantial cost. Panasonic has
`announced an SO card based solution that is a direct replacement for uDrives and 2.5"
`HODs. The cost on this design is prohibitively expensive.
`
`The second is a Solid State Disk "SSD". SSD's have been around for a couple of years and
`are targeted at very high end systems where the cost of the storage media is substantially
`higher than the cost of most systems that the ADDMM application is targeting. There isn't a
`lot of published information on SSD's available today. Companies who do supply these
`devices today are in very good position to quickly deliver an ADDMM type solution and
`does pose a considerable risk to the ADDMM design however it would accomplish the goal
`of the ADDMM design which is grow memory bit consumption.
`
`A third competitive solution would be to hard wire and or deliver an internal FLASH/DRAM
`solution that is a fixed part of the core design. This is most likely not a probable solution
`due to the cost increase to the base system from the highly cost volatile memory market.
`
`The forth and currently in development competitive solution is to add additional
`DRAM/FLASH buffering to the HOD devices. A recent announcement described such a
`change by adding a FLASH write buffer to the HOD. This accomplished at least in part the
`ability to save power and improved HOD reliability (described later) and in some cased
`improve performance.
`
`As the ExpressCard interface is still considered to be new we have yet to see what
`technologies will be delivered that can take advantage of this interface technology. We
`expect there to be several competing solutions being made available in the coming years.
`
`2.1.2.2 Video Application
`There are several traditional workable solutions from mini DV tapes or HD equivalent, direct
`to DVD or HD/Biu-ray DVD solutions, and some camcorders today are using micro drives
`
`Express Mail Label No. ER823284625US
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`8
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`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 8
`
`

`
`but at a higher compression and lower bit rate than what we can deliver with the ADDMM
`module.
`
`2.1.2.3 Gaming Application
`There are at least 3 game box producers today that may be able to take advantage of this
`module in the future: 1) Sony Playstation, 2) Microsoft X-Box, 3) Nintendo. Most game
`boxes today are becoming more similar to gaming PC's than they are the traditional game
`consoles of a few years ago. They generally use proprietary solutions and we would expect
`them to continue to use those types of solutions if no other options are available to them.
`
`3 ADDMM relationship to industry standards
`The ADDMM ExpressCard module takes advantage of several existing industry standards.
`There are few interface blocks that are currently not part of those standards. This section
`talks about which standards are being used and why.
`
`3.1 Relationship to the ExpressCard Standard
`The ExpressCard standard has been chosen because of several technical and business
`factors. Technically it is a new interface for Mure PC's that has been defined by the
`industry. The interface is compatible to existing PCI software and drivers, making it highly
`portable and easy to migrate to. The interface delivers exceptional bandwidth at very low
`latencies via an externally accessible and user friendly interface. The form factor is defined
`and is considered to be an open industry standard, reducing the expense and overhead of
`defining and driving a new interface like this. Pin-count is low thus keeping the interface
`small and low cost.
`
`From a business perspective many companies were part of the definition and have a stake
`into the success of the interface. Many companies are now making that interface directly
`available in laptops however desirable applications have yet to be developed around that
`interface. Desktop implementation of the ExpressCard interface is do-able today as all the
`components are available for integration but as of yet those host slots have yet to be
`shipped due to lack of desirable and compelling applications.
`
`3.1.1 PCI Express Gen1
`This interface is the main communication port defined in the ExpressCard specification. It is
`the expected interface of the future. The interesting aspect of this interface is that it
`consists of 2 unidirectional interfaces that in theory can operated independent of each other
`thus delivering a combined read/write bandwidth of around 4Gb/s or 2.0Gb/s effective
`simultaneously in each direction.
`
`3.1.2 USB 2.0
`ExpressCard defined this as the 2nd interface for the standard. USB2.0 capable devices are
`readily available today and can be repackaged for use in the ExpressCard slot driving quick
`adoption of the form factor. The availability of this interface poses some interesting
`application opportunities when used in conjunction with the PCI Express interfaces. If
`
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`9
`
`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 9
`
`

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`power allows, the USB2.0 interface can be as a third simultaneously use port in an
`ExpressCard design.
`
`3.2 Memory Standards
`A main motivator for defining a device such as ADDMM is the ability to utilize any memory
`type or performance behind the controller. There are several opportunities for memory
`manufactures to use memory otherwise not suited for a specific speed grade and or may
`have some functionality disabled for what ever reason. There are also opportunities in the
`future to define specialty memory devices that are targeted at this specific market as it
`grows the bit demand for this specific type of application. We will be outlining several
`common types of memory that could or will be used on the first ADDMM memory module
`design. These are not the only memory types that can be used however today these are
`the most popular defined standards. Keep in mind that any module supplier can design in
`any memory type that they choose.
`
`3.2.1 FLASH Memory
`There are generally 2 types of FLASH memory defined today, NAND and NOR. There are
`sub categories of these memory devices also defined, most using standard bit storage and
`some using multi level bit storage (more than one bit per storage cell). For our use and
`application we will not be distinguishing between the ML bit storage and standard devices.
`For our purposes we look at them as the same. All FLASH memory devices have a limited
`number of write cycles per memory block. In order to prevent premature failure of the
`FLASH devices due to writes a write leveling algorithm will be employed. There are also
`hybrid FLASH devices now coming on to the market that maintain either the NAND or the
`NOR interface but with different core design elements. An example of one of these is the
`Samsung One-NAND Flash device. It has a NOR flash interface with an imbedded SRAM
`as a read/write buffer to a NAND array.
`
`In the future as the market for the ADDMM memory module grows we could fully expect
`custom memory solutions to be defined for this specific market for FLASH memory.
`
`3.2.1.1 NAND Technology
`NAND flash is the most obvious technology to use as the main non-volatile memory
`solution. It has the highest bit density with nominal read/write performance. The NAND
`flash interface is a multiplexed bus keeping pin count low and thus keeping costs low. The
`trade-off is the effective utilization of that bus for data transfer. As noted NAND flash has
`what we consider to be nominal read and write performance, where write bandwidth is
`roughly half of the capable read bandwidth. Bit density on NAND flash today is roughly 2x-
`4x greater than that of NOR flash at lower manufacturing costs. Interface pin count for
`NAND flash is also roughly half of what is defined by NOR flash however with the caveat
`that NAND has a much lower read bandwidth than that of NOR.
`
`3.2.1.2 NOR Technology
`NOR flash technology could play a very interesting role in the ADDMM module. NOR flash
`has very high random read bandwidth and low latency. It gets this at a cost to capacity and
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`Petitioners SK hynix Inc., SK hynix America Inc. and SK hynix memory solutions Inc.
`Ex. 1006, p. 10
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`

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`write bandwidth. Capacity is roughly % to % of NAND flash. Pin Count is roughly 2x that of
`NAND flash and cost is roughly 20-30% higher. Wrth that being said however if NOR flash
`were to achieve 2GByte cost effective capabiHty in late 2006 early 2007 it poses an
`interesting dilemma. As the NOR flash bandwidth is at nearly 4x that of NAND flash. If
`capacity were equivalent then the NOR flash bandwidth would provide the best non volatile
`memory storage solution.
`
`3.2.2 DRAM Memory
`In order to fully utilize the bandwidth supported via the PCI Express channel in the
`E.xpressCard specification a DRAM or SRAM memory solution will be necessary as the
`available flash bandwidth is not sufficient to fully utilize this interface. We will focus on the
`most cost effective DRAM solutions defined today. This in no way states that these are the
`only two viable solutions just that they may be the most cost effective ones that we are
`aware of at this time. At some point in time when the ADDMM technology is generating a
`determined volume level it could then warrant a custom DRAM solution be defined for it.
`
`We will be defining the use of DRAM in this application. Again DRAM is an effective way to
`get high speed low cost bits for the ADDMM memory module application. Some
`applications may choose to use SRAM (Static RAM) and or other types of memory for
`achieving the same purpose. Over time we expect the DRAM type used to shift with using
`whatever is the most cost effective bit solution in that production window.
`
`3.2.2.1 DDR2 Technology
`For late 2006 early 2007 product implementations DDR2 will more than likely be the most
`cost effective DRAM bits available. For that reason alone we will be specifying their use for
`the ADDMM memory module in this specification. Because a single x8 wide device can
`supply the necessary bandwidth for the ADDMM memory module we may go to a x16
`device and eliminate some operating modes in hopes of reducing power and simplifying the
`controller design. A single x8 DDR2 533 MHz device is capable of supplying >4Gb/s
`bandwidth which is 2x the necessary single read or single write bandwidth. Going to a x16
`device would allow us to operate at roughly half that speed. Due to possibly needing to run
`both read and write simultaneously we would choose to run the DRAM at higher data rates
`but well below the rated capacity to keep power low and possibly turn off certain power
`hungry functionality.
`
`3.2.2.2 DDR1 Technology
`DDR1 technology is also fully adequate to meet the performance demands of the ADDMM
`memory module. However in our discussions with the memory suppliers they have
`indicated to us that in the 2007 time frame this technology would be more expensive and
`not giving us the best capacity for our application. We may have to