`
`
`
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`MICRON TECHNOLOGY, INC.,
`INTEL CORPORATION, AND
`GLOBALFOUNDRIES U.S., INC.,
`
`Petitioners
`
`v.
`
`DANIEL L. FLAMM,
`
`Patent Owner
`
`
`
`
`Case IPR No. Unassigned
`U.S. Patent No. 6,017,221
`Issued: January 25, 2000
`Named Inventor: Daniel L. Flamm
`
`Title: PROCESS DEPENDING ON PLASMA DISCHARGES SUSTAINED BY
`INDUCTIVE COUPLING
`
`
`PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 6,017,221
`UNDER 35 U.S.C. §§ 311-319 AND 37 C.F.R. §§ 42.1-.80, 42.100-.123
`
`
`
`
`
`Mail Stop “PATENT BOARD”
`Patent Trial and Appeal Board
`United States Patent and Trademark Office
`P.O. Box 1450
`Alexandria, Virginia 22313-1450
`
`
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`TABLE OF CONTENTS
`
`Page
`
`I.
`II.
`
`III.
`
`INTRODUCTION ........................................................................................... 1
`REQUIREMENTS FOR PETITION FOR INTER PARTES REVIEW ........ 2
`A. Grounds for Standing (37 C.F.R. § 42.104(a)) ..................................... 2
`B.
`Notice of Real Party-In-Interest (37 C.F.R. § 42.8(b)(1)) .................... 3
`C.
`Notice of Related Matters (37 C.F.R. § 42.8(b)(2)) .............................. 3
`D. Designation of Lead and Back-up Counsel
`(37 C.F.R. § 42.8(b)(3)) and Service Information
`(37 C.F.R. § 42.8(b)(4)) ........................................................................ 4
`Payment of Fees (37 C.F.R. § 42.103) .................................................. 6
`E.
`Proof of Service ..................................................................................... 6
`F.
`IDENTIFICATION OF CLAIMS BEING CHALLENGED .......................... 6
`A.
`Specific Art and Statutory Grounds on Which the Challenges to
`the Claims are Based ............................................................................. 6
`IV. OVERVIEW OF THE 221 Patent ................................................................... 9
`A.
`The 221 Patent Disclosure ..................................................................... 9
`1.
`Inductively-Coupled Plasma Source ........................................... 9
`2.
`Capactively Coupled Currents .................................................. 10
`3.
`Phase and Anti-Phase Portions of the Capacitively
`Coupled Currents ...................................................................... 10
`4. Wave Adjustment Circuit ......................................................... 14
`PERSON HAVING ORDINARY SKILL IN THE ART ............................. 16
`V.
`VI. CLAIM CONSTRUCTION .......................................................................... 16
`A.
`“selectively balanced” ......................................................................... 17
`1.
`Correct Construction: “selectively balanced” means
`“chosen to be made substantially equally distributed” ............. 17
`Flamm’s Construction: “selectively balanced covers a
`range, per one’s selection, between 100% balanced to
`various lesser percentages” ....................................................... 20
`VII. SUMMARY OF PRIOR ART REFERENCES ............................................ 21
`
`2.
`
`
`
`i
`
`
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`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`b)
`
`c)
`
`A.
`Lieberman ............................................................................................ 21
`Dible .................................................................................................... 23
`B.
`Qian ..................................................................................................... 24
`C.
`D. Hanawa ................................................................................................ 26
`E.
`Collins.................................................................................................. 27
`VIII. THERE IS A REASONABLE LIKELIHOOD THAT AT LEAST
`ONE CLAIM OF THE 221 PATENT IS UNPATENTABLE ..................... 27
`A. Ground 1: Claims 1 and 5-7 Are Rendered Obvious by
`Lieberman Under 35 U.S.C. § 103(a) ................................................. 27
`1.
`Lieberman: Claim 1 .................................................................. 28
`a)
`[1.P] A process for fabricating a product using a
`plasma source .................................................................. 28
`[1.1] subjecting a substrate to entities, at least one
`of said entities emanating
`from a gaseous
`discharge excited by a high frequency field from
`an inductive coupling structure....................................... 28
`[1.2] in which a phase portion and an anti-phase
`portion of capacitive currents coupled from the
`inductive coupling
`structure are
`selectively
`balanced .......................................................................... 30
`[1.3] wherein said inductive coupling structure is
`adjusted using a wave adjustment circuit, said
`wave adjustment circuit adjusting
`the phase
`portion and
`the anti-phase portion of
`the
`capacitively coupled currents. ........................................ 36
`Lieberman discloses all limitations of dependent claims
`5-7 ............................................................................................. 38
`a)
`Claim 5: The process of claim 1 wherein said
`process is provided in a chamber .................................... 38
`Claim 6: The process of claim 5 wherein the
`chamber is provided for a process selected from
`etching, deposition, sputtering, or implantation. ............ 39
`Claim 7: The process of claim 1 wherein said
`inductive coupling structure provides a wave
`
`2.
`
`d)
`
`b)
`
`c)
`
`
`
`ii
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`
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`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`B.
`
`b)
`
`c)
`
`d)
`
`multiple selected from a one-sixteenth wave, a
`one-eighth-wave, a quarter-wave, a half-wave, a
`three-quarter wave, and a full-wave. .............................. 39
`Ground 2: Claims 1 and 5-7 Are Rendered Obvious by
`Lieberman In View of Dible Under 35 U.S.C. § 103(a) ..................... 40
`1.
`Lieberman in view of Dible: Claim 1 ....................................... 41
`a)
`[1.P] A process for fabricating a product using a
`plasma source .................................................................. 41
`[1.1] subjecting a substrate to entities, at least one
`of said entities emanating
`from a gaseous
`discharge excited by a high frequency field from
`an inductive coupling structure....................................... 41
`[1.2] in which a phase portion and an anti-phase
`portion of capacitive currents coupled from the
`inductive coupling
`structure are
`selectively
`balanced .......................................................................... 42
`[1.3] wherein said inductive coupling structure is
`adjusted using a wave adjustment circuit, said
`wave adjustment circuit adjusting
`the phase
`portion and
`the anti-phase portion of
`the
`capacitively coupled currents. ........................................ 44
`Lieberman in view of Dible discloses all limitations of
`dependent claims 5-7 ................................................................ 45
`a)
`Claim 5: The process of claim 1 wherein said
`process is provided in a chamber .................................... 45
`Claim 6: wherein the chamber is provided for a
`process
`selected
`from
`etching, deposition,
`sputtering, or implantation. ............................................. 46
`Claim 7: wherein said inductive coupling structure
`provides a wave multiple selected from a one-
`sixteenth wave, a one-eighth-wave, a quarter-
`wave, a half-wave, a three-quarter wave, and a
`full-wave. ........................................................................ 46
`Reasons to Combine Lieberman and Dible .............................. 46
`
`2.
`
`3.
`
`b)
`
`c)
`
`
`
`iii
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`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`C.
`
`E.
`
`Ground 3: Claims 2-3 Are Rendered Obvious by Lieberman
`(Ground 1), or Lieberman in view of Dible (Ground 2
`Combination), in View of Hanawa Under 35 U.S.C. § 103(a) ........... 49
`1.
`Lieberman (Ground 1), or Lieberman in view of Dible
`(Ground 2 Combination), in view of Hanawa teaches all
`limitations of claims 2 and 3 ..................................................... 49
`a)
`Claim 2: The process of claim 1 wherein the wave
`adjustment circuit selectively adjusts a frequency
`of an rf power supply ...................................................... 49
`Claim 3: The process of claim 1 wherein the high
`frequency field
`is adjusted using a variable
`frequency power supply .................................................. 51
`Reasons to Combine Lieberman and Hanawa .......................... 51
`2.
`D. Ground 4: Claim 4 is Rendered Obvious by Lieberman in View
`of Collins, or Alternatively in view of Dible and Collins, Under
`35 U.S.C. § 103(a) ............................................................................... 56
`1.
`Lieberman in View of Collins teaches all limitations of
`Claim 4 ...................................................................................... 56
`a)
`Claim 4: The process of claim 1 wherein the wave
`adjustment circuit comprises a transmission line ........... 56
`Reasons to Combine Lieberman and Collins ............................ 57
`2.
`Ground 5: Claims 1, 5-7 Are Rendered Obvious By Qian Under
`35 U.S.C. § 103(a) ............................................................................... 59
`1.
`Qian: Claim 1 ............................................................................ 59
`a)
`[1.P] A process for fabricating a product using a
`plasma source .................................................................. 59
`[1.1] Subjecting a substrate to entities, at least one
`of said entities emanating
`from a gaseous
`discharge excited by a high frequency field from
`an inductive coupling structure....................................... 59
`[1.2] in which a phase portion and an anti-phase
`portion of capacitive currents coupled from the
`inductive coupling
`structure are
`selectively
`balanced .......................................................................... 60
`
`b)
`
`b)
`
`c)
`
`
`
`iv
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`
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`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`d)
`
`2.
`
`[1.3] wherein said inductive coupling structure is
`adjusted using a wave adjustment circuit, said
`wave adjustment circuit adjusting
`the phase
`portion and
`the anti-phase portion of
`the
`capacitively coupled currents. ........................................ 66
`Qian discloses all limitations of dependent claims 5-7 ............ 67
`a)
`Claim 5: The process of claim 1 wherein said
`process is provided in a chamber .................................... 67
`Claim 6: The process of claim 5 wherein the
`chamber is provided for a process selected from
`etching, deposition, sputtering, or implantation. ............ 68
`Claim 7: The process of claim 1 wherein said
`inductive coupling structure provides a wave
`multiple selected from a one-sixteenth wave, a
`one-eighth-wave, a quarter-wave, a half-wave, a
`three-quarter wave, and a full-wave. .............................. 68
`Ground 6: Claims 2-3 Are Rendered Obvious by Qian in View
`of Hanawa Under 35 U.S.C. § 103(a) ................................................. 69
`1.
`Qian in view of Hanawa teaches all limitations of claims
`2 and 3 ....................................................................................... 69
`a)
`Claim 2: The process of claim 1 wherein the wave
`adjustment circuit selectively adjusts a frequency
`of an rf power supply ...................................................... 69
`Claim 3: wherein the high frequency field is
`adjusted using a variable frequency power supply ......... 71
`Reasons to Combine Qian and Hanawa .................................... 71
`2.
`G. Ground 7: Claim 4 is Rendered Obvious by Qian in View of
`Collins Under 35 U.S.C. § 103(a) ....................................................... 75
`1.
`Qian in view of Collins discloses all limitations of claim
`4 ................................................................................................. 75
`a)
`Claim 4: The process of claim 1 wherein the wave
`adjustment circuit comprises a transmission line ........... 75
`Reasons to combine Qian and Collins ...................................... 77
`2.
`IX. CONCLUSION .............................................................................................. 78
`
`F.
`
`b)
`
`c)
`
`b)
`
`
`
`v
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`Exhibit List
`
`Exhibit #
`
`Description
`
`1001
`
`1002
`
`1003
`
`1004
`
`1005
`
`1006
`
`1007
`
`1008
`
`1009
`
`1010
`
`1011
`
`1012
`
`1013
`
`1014
`
`1015
`
`1016
`
`U.S. Patent No. 6,017,221 (“221 Patent”)
`
`File History for U.S. Patent No. 6,017,221
`
`Declaration of David Graves, Ph.D. (“Graves Decl.”)
`
`Curriculum Vitae of Dr. David Graves
`
`Decision on Institution of Inter Partes Review, Lam Research Corp.
`v. Daniel L. Flamm, IPR2015-01767 (P.T.A.B. Feb. 24, 2016)
`
`M. A. Lieberman and R. A. Gottscho, Design of High-Density Plasma
`Sources for Materials Processing (1994) (“Lieberman”)
`
`U.S. Patent No. 5,573,595 (“Dible”)
`
`U.S. Patent No. 5,065,118 (“Collins”)
`
`U.S. Patent No. 5,683,539 (“Qian”)
`
`U.S. Patent No. 5,688,357 (“Hanawa”)
`
`Merriam-Webster’s Collegiate Dictionary, Tenth Edition (1996)
`(Excerpt)
`
`EP Patent Application No. 0421430 A2 (“Mintz”)
`
`Not Used
`
`U.S. Patent No. 5,401,350 (“Patrick”)
`
`V. A. Godyak, et al., Electrical Characteristics and Electron Heating
`Mechanism of an Inductively Coupled Argon Discharge, Plasma
`Sources Sci. Technol. Vol 3, pp. 169-176 (1994) (“Godyak”)
`
`Rudolf F. Graf, Dictionary of Modern Electronics, 6th ed. (1984)
`(Excerpt)
`
`1017
`
`R. B. Piejak et al., A simple analysis of an inductive RF discharge,
`
`
`
`vi
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`Exhibit #
`
`Description
`Plasma Sources Sci. Technol. Vol. 1, pp. 179 – 186 (1992)
`(“Piejak”).
`
`1018
`
`1019
`
`1020
`
`1021
`
`1022
`
`1023
`
`1024
`
`1025
`
`1026
`
`1027
`
`1028
`
`1029
`
`1030
`
`1031
`
`Petition for Inter Partes Review, Lam Research Corp. v. Daniel L.
`Flamm, IPR2015-01767
`
`Not Used
`
`Deposition Transcript of Dr. Flamm, Lam Research Corp. v. Daniel
`L. Flamm, IPR2015-01767
`
`Patent Owner’s Response, Lam Research Corp. v. Daniel L. Flamm,
`IPR2015-01767
`D. Jorgesen and C. Marki, Balun Basics Primer, A Tutorial on
`Baluns, Balun Transformers, Magic-Ts, and 180 Hybrids, Marki
`Microwave, Inc. (2014)
`Balun Transformers, available at
`https://www.minicircuits.com/pages/BalunApplicationNote.htm
`
`U.S. Patent No. 5,312,778 (“Collins 778”)
`
`U.S. Patent No. 4,741,799 (“Chen”)
`
`U.S. Patent No. 4,534,816 (“Chen 816”)
`Publisher's Webpage for Plasma Sources for Thin Film Deposition
`and Etching (1994) (1st Edition), available at
`http://store.elsevier.com/product.jsp?isbn=9780125330183&_request
`id=1611063 (last visited Oct. 3, 2016)
`Straw, The ARRL Antenna Book, The American Radio Relay
`League, (1994)
`Sevick, Transmission Line Transformers, The American Radio Relay
`League, 2nd Edition, (1990)
`Declaration of Miloche Kottman (regarding Lieberman), head of
`Cataloging and Archival Processing, University of Kansas
`JP17568591A (“Matsuki”)
`
`
`
`vii
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`I.
`
`INTRODUCTION
`
`Pursuant to 35 U.S.C. §§ 311-319 and 37 C.F.R. §§ 42.1-.80, 42.100-.123,
`
`Petitioners Micron
`
`Technology,
`
`Inc.,
`
`Intel
`
`Corporation,
`
`and
`
`GLOBALFOUNDRIES U.S., Inc. (collectively “Petitioners”) hereby request inter
`
`partes review of claims 1-7 of U.S. Patent No. 6,017,221 (Ex.1001, the “221
`
`Patent”) and cancellation of those claims as unpatentable. According to USPTO
`
`records, the 221 Patent is assigned to Daniel L. Flamm.
`
`There is a pending inter partes review trial on claims 1 and 4-7 of the 221
`
`Patent. Lam Research Corp. v. Daniel L. Flamm, IPR2015-01767 (Ex.1005)
`
`(“IPR2015-01767”). For claims 1 and 4-7, this Petition relies on the same prior
`
`art1 in Grounds 1, 2, and 4 as in IPR2015-01767. Petition, 01767 IPR, (Ex.1018).
`
`Notably, this Petition also illustrates that this prior art discloses the claim
`
`limitations even assuming Flamm’s interpretations in IPR2015-01767.
`
`Also for claims 1-7, this Petition relies on a reference that the petition in
`
`IPR2015-01767 does not present. U.S. Patent No. 5,683,539 to Qian et. al.
`
`
`1 This Petition, however, does not present Lieberman 93 and Lieberman 94 as
`
`alternative primary references as in IPR2015-01767. Instead, it relies on
`
`Lieberman 94 because the Lieberman references both include the same substantive
`
`disclosures.
`
`
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`(Ex.1009, “Qian”). Qian sets forth in detail experimental results and specific
`
`measuring equipment, and therefore is not cumulative to the references in
`
`IPR2015-01767.
`
`For claims 2-3, this Petition relies on a secondary reference that IPR2015-
`
`01767 does not raise: U.S. Patent No. 5,688,357 to Hanawa (Ex.1010, “Hanawa”).
`
`Notably, Hanawa explicitly teaches that frequency tuning—using a variable RF
`
`power source—may be used as an alternative to conventional electromechanical
`
`tuning using electric servos and variable capacitors, and further details the
`
`advantages thereof.
`
`II. REQUIREMENTS FOR PETITION FOR INTER PARTES REVIEW
`A. Grounds for Standing (37 C.F.R. § 42.104(a))
`The 221 Patent qualifies for IPR, and Petitioners are not barred.2
`
`
`2 Patent Owner did not name Petitioners in an infringement complaint until January
`
`15, 2016, and the court did not issue summonses for purposes of service until
`
`January 21, 2016. N.D. Cal. Case No. 5:15-cv-01277-BLF, Dkts. 50, 58, 60 & 61.
`
`Patent Owner did not serve any Petitioner with the complaint before January 21,
`
`2016.
`
`
`
`2
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`B. Notice of Real Party-In-Interest (37 C.F.R. § 42.8(b)(1))
`The real-parties in interest for this petition are Micron Technology, Inc.,
`
`Intel Corporation, GLOBALFOUNDRIES, Inc., and GLOBALFOUNDRIES U.S.,
`
`Inc. No other parties exercised or could have exercised control over this petition;
`
`no other parties funded or directed this Petition. See Office Patent Trial Practice
`
`Guide, 77 Fed. Reg. 48759-60.
`
`C. Notice of Related Matters (37 C.F.R. § 42.8(b)(2))
`There is one child application to the 221 Patent, 09/451,633, which issued as
`
`U.S. Pat. No. 6,127,275.
`
`The 221 Patent is presently at issue in the declaratory judgment action
`
`entitled Lam Research Corp. v. Daniel L. Flamm, Case 5:15-cv-01277-BLF (N.D.
`
`Cal.). The 221 Patent is also at issue in five related patent infringement actions, in
`
`which Flamm sued Petitioners and other defendants, in the Northern District of
`
`California, Case Nos. 5:16-cv-01578-BLF; 5:16-cv-01579-BLF; 5:16-cv-01580-
`
`BLF; 5:16-cv-01581-BLF; 5:16-cv-02252-BLF (“Co-Pending Litigations”).
`
`The 221 Patent is also subject to a pending inter partes review in Lam
`
`Research Corp. v. Daniel L. Flamm, IPR2015-01767 (Ex.1005, “IPR2015-
`
`01767”). There, the Panel instituted review of claims 1 and 4-7. Id. Grounds 1-2
`
`of this Petition, which cover claims 1 and 5-7, rely on the same prior art that was
`
`the basis for the PTAB instituting a trial on claims 1 and 5-7 of the 221 Patent in
`
`
`
`3
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`IPR2015-01767 (but also advance additional arguments in light of Flamm’s claim
`
`interpretations). Ground 4 of this Petition, which covers claim 4, relies on the
`
`same prior art that was the basis for the PTAB instituting a trial on claim 4 of the
`
`221 Patent in IPR2015-01767.
`
`In addition to this Petition, Petitioners are filing petitions for inter partes
`
`review of each asserted patent in the Co-Pending Litigations: Petitions for Inter
`
`Partes Review of U.S. Patent No. 5,711,849, IPR2016-Unassigned (two petitions)
`
`and Petitions for Inter Partes Review of U.S. Patent No. RE40,264, IPR2017-
`
`00279, IPR2017-00280, IPR2017-00281, IPR2017-00282.
`
`D. Designation of Lead and Back-up Counsel (37 C.F.R. § 42.8(b)(3))
`and Service Information (37 C.F.R. § 42.8(b)(4))
`
`Lead Counsel
`Jeremy Jason Lang
`Registration No. 73,604
`(jason.lang@weil.com)
`Attorney for Micron Technology, Inc.
`
`Postal & Hand-Delivery Address:
`Weil, Gotshal & Manges LLP
`201 Redwood Shores Parkway
`Redwood Shores, CA 94065
`T: 650-802-3237; F: 650-802-3100
`
`Back-Up Counsel
`Jared Bobrow
`Pro hac vice to be submitted
`Weil, Gotshal & Manges LLP
`201 Redwood Shores Parkway
`Redwood Shores, CA 94065
`650-802-3034 (phone)
`650-802-3100 (fax)
`Attorney for Micron Technology, Inc.
`
`Robert Stephen Magee
`Registration No. 70,227
`(robert.magee@weil.com)
`Weil, Gotshal & Manges LLP
`201 Redwood Shores Parkway
`Redwood Shores, CA 94065
`T: 650-802-3985; F: 650-802-3100
`Attorney for Micron Technology, Inc.
`
`
`
`
`4
`
`
`
`Lead Counsel
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`Back-Up Counsel
`Chad Campbell
`Pro hac vice to be submitted
`Perkins Coie LLP
`2901 N. Central Ave, Suite 2000,
`Phoenix, AZ 85012
`602-351-8000 (phone)
`602-648-7000 (fax)
`Attorney for Intel Corporation
`
`Jonathan McFarland
`Registration No. 61,109
`Perkins Coie LLP
`1201 Third Avenue, Suite 4900
`Seattle, WA 98101
`206-359-8000 (phone)
`206-359-9000 (fax)
`Attorney for Intel Corporation
`
`Philip A. Morin
`Registration No. 45,926
`Perkins Coie LLP
`11988 El Camino Real, Suite 350
`San Diego, CA 92130
`858-720-5700 (phone)
`858-720-5799 (fax)
`Attorney for Intel Corporation
`
`David M. Tennant
`Registration No. 48,362
`WHITE & CASE LLP
`701 Thirteenth Street, NW
`Washington, DC 20005-3807
`(202) 626-3600 (phone)
`(202) 639-9355 (fax)
`Attorney for GLOBALFOUNDRIES
`U.S., Inc.
`
`Nathan Zhang
`Registration No. 71,401
`
`
`
`5
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`Lead Counsel
`
`
`
`Back-Up Counsel
`WHITE & CASE LLP
`3000 El Camino Real
`5 Palo Alto Square, 9th Floor,
`Palo Alto, CA 94306
`650-213-0300 (phone)
`650-213-8158 (fax)
`Attorney for GLOBALFOUNDRIES
`U.S., Inc.
`
`Payment of Fees (37 C.F.R. § 42.103)
`
`E.
`The Director is authorized to charge the fee specified by 37 C.F.R.
`
`§ 42.15(a), and any other required fees, to Deposit Account No. 506499.
`
`Proof of Service
`
`F.
`Proof of service of this Petition on the Patent Owner at the correspondence
`
`address of record for the 221 Patent is attached.
`
`III.
`
`IDENTIFICATION OF CLAIMS BEING CHALLENGED
`
`Pursuant to 37 C.F.R. § 42.22(a)(1) and 37 C.F.R. § 42.104(b) and (b)(1),
`
`Petitioners challenge claims 1-7 of the 221 Patent. Petitioners respectfully request
`
`inter partes review and cancellation of claims 1-7 of the 221 Patent based on the
`
`grounds detailed below.
`
`A.
`
`Specific Art and Statutory Grounds on Which the Challenges to
`the Claims are Based
`Pursuant to 37 C.F.R. § 42.104(b)(2), inter partes review of the 221 Patent is
`
`requested in view of the following references:
`
`
`
`6
`
`
`
`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
`
`1. Michael A. Lieberman and Richard A. Gottscho, Design of High-Density
`
`Plasma Sources for Materials Processing (Ex.1006; Ex. 1027, “Lieberman”),
`
`PLASMA SOURCES FOR THIN FILM DEPOSITION AND ETCHING (PHYSICS OF
`
`THIN FILMS VOLUME 18), August 18, 1994. Lieberman is prior art to the 221
`
`Patent under 35 U.S.C. § 102(b).3
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`2. U.S. Patent No. 5,573,595 to Dible (Ex.1007, “Dible”), issued on
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`November 12, 1996, and filed on September 29, 1995. Dible is prior art to
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`the 221 Patent under 35 U.S.C. § 102(e).
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`3. U.S. Patent No. 5,065,118 to Collins et al. (Ex.1008, “Collins”), issued
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`on November 12, 1991, and thus prior art to the 221 Patent under 35
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`U.S.C. § 102(b).
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`4. U.S. Patent No. 5,683,539 to Qian et al. (Ex.1009, “Qian”), issued on
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`November 4, 1997 and filed on June 7, 1995. Qian is prior art to the 221
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`Patent under 35 U.S.C. § 102(e).
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`5. U.S. Patent No. 5,688,357 to Hanawa (Ex.1010, “Hanawa”), issued on
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`November 18, 1997 and filed on February 15, 1995. Hanawa is prior art to
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`the 221 Patent under 35 U.S.C. § 102(e).
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`3 Lieberman on its face displays a copyright date of 1994. See also Ex.1030,
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`(Declaration of M. Kottman); Ex.1027 (“Release Date” of 8/18/1994).
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`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
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`None of these references was cited or considered by the PTO during the
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`prosecution of the 221 Patent.
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`Petitioners request cancellation of challenged claims 1-7 under the following
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`statutory grounds:
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` Ground 1: Claims 1 and 5-7 are rendered obvious by Lieberman under
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`35 U.S.C. § 103(a).
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` Ground 2: Claims 1 and 5-7 are rendered obvious by Lieberman in view of
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`Dible under 35 U.S.C. § 103(a).
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` Ground 3: Claims 2-3 are rendered obvious by Lieberman (Ground 1), or
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`Lieberman in view of Dible (Ground 2 combination), in view of Hanawa
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`under 35 U.S.C. § 103(a).
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` Ground 4: Claim 4 is rendered obvious by Lieberman (Ground 1), or
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`Lieberman in view of Dible (Ground 2 combination), in view of Collins
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`under 35 U.S.C. § 103(a).
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` Ground 5: Claims 1 and 5-7 are rendered obvious by Qian under
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`35 U.S.C. § 103(a).
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` Ground 6: Claims 2-3 are rendered obvious by Qian in view of Hanawa
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`under 35 U.S.C. § 103(a).
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` Ground 7: Claim 4 is rendered obvious by Qian in view of Collins under
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`35 U.S.C. § 103(a).
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`Petition for Inter Partes Review of U.S. Pat. No. 6,017,221
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`The following demonstrates that there is a reasonable likelihood that the
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`Petitioners will prevail. See 35 U.S.C. § 314(a). Additional explanation and
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`support for each ground are set forth in the expert declaration of David Graves,
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`Ph.D. (Ex.1003, “Graves Decl.”).
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`IV. OVERVIEW OF THE 221 PATENT
`The 221 Patent is a continuation-in-part of a U.S. patent application filed on
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`October 23, 1996 (now abandoned) (Appl. No. 08/736,315) that claims priority to
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`another application filed on December 4, 1995 (also abandoned) (Appl. No.
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`08/567,224).
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`A. The 221 Patent Disclosure
`The crux of the alleged invention of the 221 Patent is the well-known
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`process of controlling undesirable capacitive coupling of an inductively-coupled
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`plasma source for semiconductor processing. See Ex.1003, ¶37.
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`Inductively-Coupled Plasma Source
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`1.
`The 221 Patent discusses “plasma processing of devices using an inductive
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`discharge,” such processing including, for example, “plasma etching and resist
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`stripping of semiconductor devices. . . . [and] chemical vapor deposition (CVD) of
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`semiconductor devices.” Ex.1001 at 1:16-21. “These plasma processing
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`techniques often rely upon radio frequency power (RF) supplied to an inductive
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`coil for providing power to gas phase species in forming a plasma.” Id., 1:33-36.
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`Capactively Coupled Currents
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`2.
`The 221 Patent describes how, in an inductively-coupled plasma source
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`configuration, “capacitive coupling between high voltage selections of the coil and
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`the plasma discharge often cause high and uncontrollable plasma potentials relative
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`to ground,” which, in turn, “can cause damaging high energy ion bombardment of
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`articles being processed by the plasma.” Ex.1001 at 2:66-3:5. “Consequently,
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`uncontrolled potential differences, such as that caused by ‘stray’ capacitive
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`coupling from the coil of an inductive plasma source to the plasma, are
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`undesirable.” Id., 4:37-39.
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`3.
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`Phase and Anti-Phase Portions of the Capacitively Coupled
`Currents
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`The 221 Patent discusses reducing capacitively coupled currents by
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`selectively adjusting phase and anti-phase portions of an excitation signal. It
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`states: “[s]ince the capacitive current increases monotonically with the magnitude
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`of the difference of peak phase and anti-phase voltages, which occur at points A
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`and C in FIG. 2A, this coupling can be lessened by reducing this voltage
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`difference.” Ex.1001, 10:31-35.
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`Ex.1001, 221Patent at Fig. 2A.
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`Referring to Figure 2A above, the phase and anti-phase components of the
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`voltage are represented, respectively, at reference numerals 70 and 71. Capacitive
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`coupling is reduced by setting “substantially zero AC voltage at one point on the
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`inductive coil (refer to point 00 in FIG. 2A),” which with a sinusoid waveform,
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`provides “substantially equal phase 70 and anti-phase voltage 71 distributions in
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`directions about this point (refer to 00-A and 00-C in FIG. 2A) and provides
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`substantially equal capacitance coupling to the plasma from physical inductor
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`elements (00-C) and (00-A), carrying the phase and anti-phase potentials.” Id.,
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`10:14-22.
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`In this embodiment, the 221 Patent notes that “the phase and anti-phase
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`relationship between the plasma potentials substantially cancel each other.” Id.,
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`9:60-63, 10:22-28. By making the voltages substantially “cancel” each other,
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`thereby reducing the magnitude of the difference of peak phase and anti-phase
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`voltages relative to ground, the 221 Patent teaches that the capacitively coupled
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`currents are reduced. Id., 10:29-39; see also Ex.1003, ¶¶39-41. In other words, the
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`phase and anti-phase of the voltages, and corresponding currents, are equally
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`distributed along the coil. See Id.; see also Ex.1003, ¶¶31-33 (explaining
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`correspondence between voltages and currents).
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`In support of the selectively balanced claim element (“in which a phase
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`portion and an anti-phase portion of capacitive currents … are selectively
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`balanced”), the 221 Patent describes how “[p]ower transfer can be occurred [sic]
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`with a balanced feed such as an inductively-coupled push-pull arrangement.”
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`Ex.1001 at 16:18-45, 22:62-65; see also Ex.1003, ¶41. Effectively, the phase
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`voltages “push” capacitively coupled current into the plasma while the anti-phase
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`voltages “pull” capacitively coupled current out of the plasma. Ex.1003, ¶41.
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`With reference to Figure 4 below, this “push-pull arrangement” can be
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`accomplished with a “ferrite or powdered iron core ‘balun’ (balanced-unbalanced)
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`toroidal
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`transformer (i.e., broadband
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`transmission
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`transformer, broadband
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`transformer, etc.) 401 [that] can be used to provide balanced matching.” Ex.1001
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`at 16:27-30. The push-pull arrangement is characterized by phase (405) and anti-
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`phase (404) voltages and corresponding currents that are substantially equally
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`distributed around the midpoint of the coil (406) as well as reduced peak phase and
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`anti-phase voltages with respect to ground, resulting in reduced capacitively
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`coupled current. Ex.1001 at 16:18-45; cf. id., 10:29-35; see also Ex.1003, ¶41.
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`transformer
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`Ex.1001, 221 Patent, Fig. 4 (annotated).
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`4. Wave Adjustment Circuit
`The 221 Patent discusses adjusting the phase and anti-phase portions of
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`capacitively coupled currents using wave adjustment circuits. See, e.g., Ex.1001 at
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`Claim 1. Referring back to Figure 2A, an “upper wave adjustment circuit 57” and
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`a “lower wave adjustment circuit 59” are shown connected to the “inductive
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`applicator 55.” Id., 10:4-6. The wave adjustment circuits are used to achieve the
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`reduction of capacitively coupled currents: “Since the capacitive current increases
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`monotonically with the magnitude of the difference of peak phase and anti-phase
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`voltages, which occur at points A and C in FIG. 2A, this coupling can be lessened
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`by reducing this voltage difference. In FIG. 2A, for example, it is achieved by way
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`of two wave adjustment circuits 57, 59.” Id., 10:31-37.
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`The 221 Patent does not specifically define “wave adjustment circuit,” but
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`describes several possibilities for the circuit elements that comprise a wave
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`adjustment circuit (“e.g. inductors, capacitors, transmission line sections, and
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`others”) (Id., 9:51-53), and describes the role it plays: “A wave adjustment circuit
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`(e.g., RLC circuit, coil, transmission line, etc.) is operably coupled to the plasma
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`applicator. The wave adjustment circuit can selectively adjust phase and anti-
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`phase potentials of the plasma from an rf power supply.” Id., 7:29-34.
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