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`BEFORE THE PATENT TRIAL AND APPEAL BOARD
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`INTEL CORPORATION,
`GLOBALFOUNDRIES U.S ., INC., AND
`MICRON TECHNOLOGY, INC. ,
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`Petitioners
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`v.
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`DANIELL. FLAMM,
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`Patent Owner
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`Case IPR No. 2017-00279
`U.S. Patent No. RE40,264 E
`Reissued: April 29, 2008
`Named Inventor: Daniel L. Flamm
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`Title: MULTI-TEMPERATURE PROCESSING
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`AFF ADA VIT OF JARED BOBROW IN SUPPORT OF PETITIONER'S
`MOTION FOR ADMISSION PRO HAC VICE
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`Intel Corp. et al. Ex. I 023
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`I, Jared Bobrow, being duly sworn and upon oath, hereby attest to the
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`following:
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`1.
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`I am a member in good standing of the State Bar of California.
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`I was
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`admitted to the California State Bar on June 16, 1988. My California Bar
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`membership number is 133712.
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`I am admitted to practice before the District
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`Courts of the Northern, Central, Southern and Eastern Districts of California, and
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`the Eastern District of Texas. I am also admitted to practice before the California
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`State Supreme Court, U.S. Court of Appeals for the Federal Circuit, Ninth Circuit,
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`and First Circuit. For over 25 years, my practice has been focused on the field of
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`intellectual property, particularly patent litigation.
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`2.
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`I have never been suspended or disbarred from practice before any court or
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`administrative body.
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`3.
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`I have never had a court or administrative body deny my application for
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`admission to practice.
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`4.
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`I have never had any sanctions or contempt citations imposed on me by any
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`court or administrative body.
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`5.
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`I have read and will comply with the Office Patent Trial Practice Guide and
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`the Board's Rules of Practice for Trials set forth in part 42of37 C.F.R.
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`I
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`Intel Corp. et al. Ex. I 023
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`6.
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`I agree to be subject to the United States Patent and Trademark Office Rules
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`of Professional Conduct set forth in 3 7 C.F .R. § § 11.101 et seq., and disciplinary
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`jurisdiction under 37 C.F.R. § l l.19(a).
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`7.
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`I have applied to appear pro hac vice before this office in the following
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`proceedings in the past three years: CBM2014-00091 , CBM2014-00092, and
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`CBM2014-00093.
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`I was admitted to practice in these proceedings as back-up
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`counsel on March 10, 2015, subject to filing a supplemental declaration, which
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`filing occurred on March 19, 2015. I have also applied to appear pro hac vice
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`before this office in the following proceeding in the past three years: IPR2015-
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`00657, IPR2015-00658, IPR2015-00660, IPR2015-00662, and IPR2015-00666. I
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`was admitted to practice in these proceedings as back-up counsel only on May 29,
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`2015. I have also applied to appear pro hac vice before this office in the following
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`proceedings in the past three years: IPR2014-0l 197, IRP2014-01207, and
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`IPR2014-01209. I was admitted to practice in these proceedings as back-up
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`counsel on September 16, 2015. I have also applied to appear pro hac vice before
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`this office in the following proceedings in the past three years: IPR2016-00320,
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`IPR2016-00322, IPR2016-00323 , IPR2016-00330.
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`I was admitted to practice in
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`these proceedings as back-up counsel on September 26, 2016.
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`I have also applied
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`to appear pro hac vice before this office in the following proceeding in the past
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`three years: IPR2016-00782. The application was filed on October 3, 2016 and is
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`2
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`Intel Corp. et al. Ex. l 023
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`pending before this office. I am also concurrently applying to appear pro hac vice
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`before this office in the following proceedings: IPR2017-00280, IPR2017-0028 l,
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`IPR2017-00282, IPR2017-00391, IPR2017-00392, and IPR2017-00406.
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`8.
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`I am an experienced litigation attorney, with particular experience in patent
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`infringement litigations in District Courts across the country, including experience
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`with fact and expert document and deposition discovery, claim construction,
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`Markman hearings, motion practice, trials, and hearings.
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`9.
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`I am counsel for Micron Technology, Inc. ("Micron"), a Petitioner and the
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`defendant in a related pending litigation in the United States District Court for the
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`District of Delaware, in which U.S. Patent Nos. 5,711,849, 6,017,221, and
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`RE40,264 are asserted by the Patent Owner (Daniel L. Flamm v Micron
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`Technology, Inc., Case No. 5:16-cv-01581-BLF (N.D. Cal.)). I am familiar with
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`the subject matter at issue in this proceeding as a result of my representation of
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`Micron in the related litigation, including the prior art that Petitioner presents in
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`this proceeding. I am familiar with the invalidity defenses raised in the related
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`litigation and have reviewed and am familiar with prior art raised in this
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`proceeding, including; U.S. Patent No. 5,605,600 to Muller et al. (Ex.1002); U.S.
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`Patent No. 5,151,871 to Matsumura et al. (Ex.1003); U.S. Patent No. 5,226,056 to
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`Kikuchi et al. (Ex.1004); U.S. Patent No. 6,063,710 to Kadomura et al. (Ex.1005);
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`Wright, D.R. et al. , A Closed Loop Temperature Control System for a Low-
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`3
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`Intel Corp. et al. Ex. l 023
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`Temperature Etch Chuck, Advanced Techniques for Integrated Processing II, Vol.
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`1803 (1992), pp. 321-329 ("Wright") (Ex.1008); U.S. Patent No. 5,192,849 to
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`Moslehi (Ex.1009); U.S. Patent No. 3,863,049 to Hinman (Ex.1010); and U.S.
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`Statutory Invention Registration No. HI 145 to Anderson (Ex.1011).
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`I have
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`reviewed the briefs and papers filed in this proceeding and in inter partes review
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`proceedings involving related patents.
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`I declare that all statements made herein of my own knowledge are true and
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`correct.
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`Respectfully submitted,
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`Dated: January 20, 2017
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`4
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`Intel Corp. et al. Ex. I 023