410 LAKELAND • GROSSE POINTE, MI 48230
`PHONE 313-492-8793 •FAX 313-417-9067 •E-MAIL
`CRAIGWHITE@THECRAIGWHITEGROUP.COM
`
`CRAIG WHITE
`
`SUMMARY OF QUALIFICATIONS
`
`Executive with extensive and diverse international experience in technology innovation, product design, and
`operations management across multiple industries including automotive, consumer, and industrial. Superior and
`innovative leadership capabilities proven in bankruptcy. Result oriented with strong commitment to meet
`corporate objectives.
`
`WORK EXPERIENCE
`
`September 2014 to present
`Cojounder and CEO
`Founded as spinoff from LVD focused on a unique patented technology for non-invasive measurement of body Hydration.
`Currently finishing two clinical studies with a major medical health system and a California based University.
`MoreLlght seeks to radically transform hydration related healthcare practices to benefit patients and caregivers
`
`Morelight Technologies, Inc.
`
`October 2011 to present
`Cojounder and Managing Director
`Founded as spinoff of The Craig White Group to focus on investment in and business development of companies that improve
`the health, safety, and wellbeing of people.
`
`Lakeland Venture Development, LLC
`
`October 2003 to present
`President / Owner
`Founded company to guide corporations in strategic technology planning methods, and innovative design practices.
`Diverse consultancy across automotive, consumer, industrial, and military clients.
`Outside director of Canesta, a 3-D camera company.
`
`The Craig White Group, LLC
`
`Key Automotive Group/ Breed Technologies
`May 1997 to October 2003
`Multiple Positions and assignments. Some held concurrent!J.
`Senior Vice President of Engineering and Chief Technology Officer
`
`11
`
`• Directly responsible for all worldwide engineering activity including, applications, core engineering and research and
`development with a $100 million budget.
`
`• Drove worldwide standardization and change that resulted in improved MIT technology rating from #20 to #1 in the
`automotive segment while reducing costs by 40%.
`
`• Streamlined Intellectual property activity into single process resulting in 40% improvement in "useful patents" that
`were actually used in product offerings.
`
`• Created new revenue streams by expanding from only product offerings to products and service. Service stream
`added $15 million EBfIDA with little investment or resource.
`
`• Managed diverse staff in Asia, Europe, and America through company bankruptcy, reorganization, and sale without
`major disruptions. Retained key personnel with innovative incentive programs and the creation of a unique working
`environment. Used reduced activity period created by bankruptcy to completely renovate technical infrastructure and
`test facilities.
`
`• Developed and licensed new system integration software that became de facto industry standard and emerged as
`industry leader in this area during bankruptcy.
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`11
`
`Senior Vice President and General Manager - Electronics Division
`• P & L Responsible for $120 million division with factories in Finland, Mexico, and the United States, including two
`"brand" companies, Hamlin and vn, serving diverse markets.
`Increased margins by 20% by rationalizing operations across brand companies while maintaining unique brand
`identities.
`Introduced TPS into factory environment. Resulting savings in plant space and personnel allowed reduction from
`three locations to two.
`" Created new patented technology to extend life of" cash cow" with 50% gross margin for additional 3 years.
`• Built state of the art micromachining facility in Finland, on time and under budget.
`11 Chief Technology Officer and member of the Operating Board-Breed/ Siemens Joint Venture
`
`•
`
`•
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`• Responsible for worldwide harmonization and rationalization of the Breed / Siemens technology portfolios and work
`teams.
`• Created hybrid product offering which resulted in $40 million win in a new market for both parent companies
`
`October 1987 to May 1997
`Multiple Positions and Assignments Held Concurrent!J.
`Executive Director - Automotive Systems Laboratory
`
`Takata Corporation
`
`• Responsible for all engineering worldwide. Increased sales from 0 to $25 million.
`
`" All aspects of the organization where developed with a fresh eyes approach, including design rules, work methods,
`human resource practices and policies, the formulation of a production/ design process laboratory, quality and
`purchasing policies, ASIC design methods, and others technologies, practices and procedures required to compete and
`win business on an international level in Automotive safety electronics.
`
`11 Created unique method for evaluating and improving reliability of software and hardware that enticed first major
`Japanese OEM to take a risk with an unproven entity.
`
`111 Developed new software techniques that increase EMI immunity by 30% with no hardware shielding.
`11 Executive Director - Takata Electronics
`
`• P & L responsible for all electronics production worldwide.
`
`• Took over operations in a time of turmoil and improved quality and delivery ratings by 50% to high 90's.
`
`• Reduced factory WIP from over 5000 pieces to less than 100, approaching 1-piece flow.
`
`• Developed and introduced first known "no repair" electronics assembly line to the Automotive Industry.
`
`Semiconductor Reliability Associates
`October 1983 to September 1987
`Vice President of Engineering and Member of the Board of Directors
`•
`Company founded by Management team to deliver high reliability electronic components to the mid-west.
`
`• Began first full service reliability lab in the US outside of major corporations.
`
`•
`
`Led full service ASIC design capability with multiple designs completed by myself. All designs were first pass successes.
`
`August 1979 to October 1983
`Lead engineer
`II Various positions in motor control, IT, convenience products, and trip computers.
`
`Ford Motor Company
`
`EDUCATION
`
`BSEE
`Education - Graduate Studies
`
`University of Michigan -Ann Arbor
`University of Sheffield - England
`
`PATENTS AND PUBLICATIONS
`
`Over 20 Patents. Various papers and presentations at SAE, IEEE, Convergence, and AORC.
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