United States Patent [191
`Stuber et al.
`
`lllllllllllllllllllllllllllllllllllllllllll
`
`US005659690A
`[11] Patent Number:
`[45] Date of Patent:
`
`5,659,690
`Aug. 19, 1997
`
`[54] PROGRAMMABLY CONFIGURABLE HOST
`ADAPTER INTEGRATED CIRCUIT
`INCLUDING A RISC PROCESSOR
`
`[75]
`
`Inventors: Craig A. Stuber. Santa Clara; Byron
`Arlen Young, Palo Alto; Paresh M.
`Borkar. Fremont; Stillman F. Gates,
`Los Gatos; Douglas K. Makishima,
`Pleasanton; Paul von Stamwitz,
`Mountain View. all of Calif.
`
`[73]
`
`Assignee:
`
`Adaptec, Inc., Milpitas, Calif.
`
`[21]
`[22]
`[5 1]
`[52]
`[58]
`
`[56]
`
`Appl. No.:
`964,532
`Oct. 15, 1992
`
`Filed:
`
`Int. Cl.6 .................................................... .. G06F 13/00
`395/309; 395/306
`Field of Search ................................... .. 395/325, 800,
`395/250, 309, 306
`
`References Cited
`
`U.S. PATENT DOCULIENTS
`
`4,062,059
`4,384,327
`4,553,133
`4,635,194
`4,716,525
`4,933,840
`4,975,829
`5,204,951
`5,233,692
`5,237,660
`5,239,632
`5,241,630
`5,257,391
`5,265,252
`5,276,807
`5,280,601
`5,283,872
`5,287,460
`5,287,463
`5,293,624
`5,297,067
`5,299,315
`5,313,588
`
`12/1977
`5/1983
`11/1985
`l/1987
`12/1987
`6/1990
`12/1990
`4/1993
`8/1993
`8/1993
`8/1993
`8/1993
`10/1993
`11/1993
`1/1994
`1/1994
`2/1994
`2/1994
`2/1994
`3/1994
`3/1994
`3/1994
`5/1994
`
`Suzuki et al. .
`Conway et al. .
`Peterson et al. .
`Burger et al. .
`Gilanyi et a1. .
`Sera et al. .
`Clarey et al. .
`Keener et a1. ........................ .. 395/325
`Gajjar et al. .
`Weber et a1. .
`
`Lamer ................................... .. 395/325
`Lattin, Jr. et al. .
`Dulac et al. .......................... .. 395/800
`Rawson, HI et al. ................ .. 395/700
`Kodama et a1. .
`Desai et al. .
`
`Ohnishi .
`Olsen et a1. .
`Frame et al. .
`Andrade et a1. ...................... .. 395/425
`Blackborow et a1. ............. .. 364/7081
`Chin et al. .
`Nagashige et al. .
`
`5,319,766
`5,333,276
`5,333,277
`5,355,453
`5,404,548
`5,410,674
`
`6/1994
`7/1994
`7/1994
`10/ 1994
`4/1995
`4/1995
`
`Thaller et al. ........................ .. 395/425
`Solari .
`
`Searls .................................... .. 395/325
`
`Row et al. ................ ..
`
`..
`
`Nishioka .
`
`Lawler .
`
`FOREIGN PATENT DOCUMENTS
`
`28 7301 A2 10/1988 European Pat. O?'. .
`45 1516 A1 10/1991 European Pat. OE. .
`
`Primary Examiner—Krisna Lim
`Attorney, Agent, or Fimt—Skjerven, Morrill, MacPherson,
`Franklin & Friel; Forrest E. Gunnison
`[57]
`ABSTRACT
`
`The host adapter integrated circuit is a one chip high
`performance bus master host adapter for (i) connecting a
`?rst bus having a speci?ed protocol for transferring infor
`mation over the ?rst bus and a ?rst data transfer speed to a
`second bus having a speci?ed protocol for transferring
`information over the second bus and a second data transfer
`speed, and (ii) transferring information between the two
`buses. The host adapter integrated circuit, hereinafter host
`adapter, includes a novel reduced instruction set computing
`(RISC) processor, a ?rst interface module circuit connect
`able to the ?rst bus and coupled to the RISC processor, a
`second interface module circuit connectable to the second
`bus and coupled to the RISC processor, and a memory
`circuit means connected to the ?rst interface module circuit
`and to the second interfacemodule circuit and coupled to the
`RISC processor. An I/O bus interconnects the ?rst interface
`module circuit, the second interface module circuit, the
`memory circuit means, and the RISC processor. The 110 bus
`supports a read and a write operation by the RISC processor
`in single clock cycle of the RISC processor. The host adapter
`supports many features found in traditional add-in card SCSI
`host adapters. These features include bus master transfers,
`fast/wide SCSI, one interrupt per command, scatter/gather,
`overlapped seeks, tagged queuing, etc.
`
`100 Claims, 94 Drawing Sheets
`
`Micro?che Appendix Included
`(8 Micro?che, 517 Pages)
`
`221
`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 1
`
`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 2
`
`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 3
`
`

`
`US. Patent
`
`Aug. 19,1997
`
`Sheet 3 0f 94
`
`5,659,690
`
`241
`II
`
`SCSI #1
`PERIPHERAL
`l
`
`242
`I/
`
`SCSI #2
`PERIPHERAL
`I
`
`\
`
`l
`210
`
`3031 BUS
`I
`
`I
`
`7700
`./
`
`/330
`
`\
`SCSI
`MODULE
`
`2/21
`MICROPROCESSOR
`
`226
`/
`
`\
`360
`
`DATA
`FIFO
`
`/230
`
`ISA/EISA
`BUS
`
`310
`\
`
`/350
`
`320
`/
`
`USER
`APPUCAHON
`_________ __
`
`' HOST
`DRIVER
`--------- --\2s0
`DPERAMMD
`SYSTEM
`
`HOST
`INTERFACE
`MODULE
`
`' — SEQUENCER
`
`-
`-/340
`
`MEMORY
`
`FIG. 3
`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 4
`
`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 5
`
`

`
`US. Patent
`
`Aug. 19, 1997
`
`Sheet 5 0f 94
`
`5,659,690
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 6
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`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 7
`
`

`
`US. Patent
`
`Aug. 19, 1997
`
`Sheet 7 of 94
`
`5,659,690
`
`442
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`
`720
`1/
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`
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`—— CRBUSY
`-—- TEST[7:0
`——- SQCLOC
`—-- ICLK
`
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`ILLADDR
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`
`SEQUENCER
`
`FIG. 11
`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 8
`
`

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`US. Patent
`
`Aug. 19, 1997
`
`- Sheet 8 of 94
`
`5,659,690
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 9
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 10
`
`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 11
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 12
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 13
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 14
`
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`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 15
`
`

`
`US. Patent
`
`Aug. 19, 1997
`
`Sheet 15 of 94
`
`5,659,690
`
`7
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`FIG. 14C
`
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`
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`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 16
`
`

`
`US. Patent
`
`Aug. 19, 1997
`
`Sheet 16 0f 94
`
`5,659,690
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 17
`
`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 18
`
`

`
`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 19
`
`

`
`U.S. Patent
`
`Aug. 19, 1997
`
`Sheet 19 of 94
`
`5,659,690
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 20
`
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 21
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`Ex. 1009, p. 22
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`Ex. 1009, p. 23
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`Ex. 1009, p. 24
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`Ex. 1009, p. 25
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`Ex. 1009, p. 26
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`Ex. 1009, p. 27
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`Ex. 1009, p. 28
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`Ex. 1009, p. 29
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 126
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 127
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 128
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 129
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 130
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 131
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 132
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 133
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 134
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 135
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 136
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 137
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 138
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 139
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 140
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 141
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 142
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 143
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 144
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 145
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 146
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 147
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 148
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 149
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 150
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 151
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 152
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 153
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 154
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 155
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`Ex. 1009, p. 156
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 157
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`Ex. 1009, p. 158
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 159
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 160
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 161
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 162
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`Ex. 1009, p. 163
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 164
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 165
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 166
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 167
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 168
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 169
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 170
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 171
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 172
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`Ex. 1009, p. 173
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`Ex. 1009, p. 174
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`Ex. 1009, p. 175
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 176
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 177
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 178
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 179
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 180
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 181
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 182
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 183
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 184
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 185
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 186
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 187
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 188
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 189
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 190
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 191
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 192
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 193
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 194
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 195
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 196
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`Samsung Electronics Co., Ltd., et al.
`Ex. 1009, p. 197