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`UNITED STATES PATENT AND TRADEMARK OFFICE
`____________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`____________
`
`
`
`TAIWAN SEMICONDUCTOR MANUFACTURING
`COMPANY, LTD.,
`Petitioner
`
`v.
`
`
`
`GODO KAISHA IP BRIDGE 1,
`Patent Owner
`____________
`
`Case IPR2016-01249
`Patent 6,538,324
`____________
`
`
`
`PETITIONER’S UPDATED EXHIBIT LIST
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`Case No.: IPR2016-001249
`Patent No. 6,538,324
`Further to 37 C.F.R. § 42.63(e), Petitioner, Taiwan Semiconductor
`
`
`
`Manufacturing Company, Ltd.’s, hereby submits a current listing of exhibits filed
`
`with the Board and counsel for Patent Owner.
`
`Exhibit
`No.
`1001
`1002
`1003
`1004
`1005
`1006
`
`1007
`
`1008
`1009
`1010
`
`1011
`1012
`
`1013
`
`1014
`
`Description
`
`U.S. Patent No. 6,538,324 to Tagami et al.
`File History of U.S. Patent No. 6,538,324.
`Expert Declaration of Dr. Sanjay Kumar Banerjee.
`U.S. Patent No. 5,893,752 to Zhang et al.
`U.S. Patent No. 6,887,353 to Ding et al.
`Holloway et al., “Tantalum as a diffusion barrier
`between copper and silicon: Failure mechanism and
`effect of nitrogen additions,” Journal of Applied
`Physics, 71(11), 5433-5444 (1992).
`Sun et al., “Properties of reactively sputter-deposited
`Ta-N thin films,” Thin Solid Films, 236 (1993) 347-
`351.
`U.S. Patent No. 5,858,873 to Vitkavage et al.
`U.S. Patent No. 5,668,411 to Hong et al.
`Excerpt of El-Kareh, “Fundamentals of
`Semiconductor Processing Technologies,” Kluwer
`Academic Publishers (1995).
`Declaration of Dr. Li Jiang.
`Library of Congress Catalog Record of Holloway et
`al., “Tantalum as a diffusion barrier between copper
`and silicon: Failure mechanism and effect of nitrogen
`additions,” Journal of Applied Physics, 71(11), 5433-
`5444 (1992).
`Library of Congress Catalog Record of Sun et al.,
`“Properties of reactively sputter-deposited Ta-N thin
`films,” Thin Solid Films, 236 (1993) 347-351.
`Library of Congress Catalog Record of El-Kareh,
`“Fundamentals of Semiconductor Processing
`Technologies,” Kluwer Academic Publishers (1995).
`
`
`
`2
`
`Previously
`Submitted
`x
`x
`x
`x
`x
`x
`
`x
`
`x
`x
`x
`
`x
`x
`
`x
`
`x
`
`
`
`Case No.: IPR2016-001249
`Patent No. 6,538,324
`Previously
`Submitted
`x
`
`x
`
`x
`
`x
`
`x
`
`x
`
`x
`
`x
`
`1016
`
`Description
`
`Stavrev et al., “Crystallographic and morphological
`characterization of reactively sputtered Ta, Ta-N and
`Ta-N-O thin films,” Thin Solid Films, 307 (1997) 79-
`88.
`Library of Congress Catalog Record of Stavrev et al.,
`“Crystallographic and morphological characterization
`of reactively sputtered Ta, Ta-N and Ta-N-O thin
`films,” Thin Solid Films, 307 (1997) 79-88.
`Duan et al., “Magnetic Property and Microstructure
`Dependence of CoCrTa/Cr Media on Substrate
`Temperature and Bias,” IEEE Transactions on
`Magnetics, Vol. 28, No. 5 (September 1992).
`Library of Congress Catalog Record of Duan et al.,
`“Magnetic Property and Microstructure Dependence
`of CoCrTa/Cr Media on Substrate Temperature and
`Bias,” IEEE Transactions on Magnetics, Vol. 28, No.
`5 (September 1992).
`1019 Moussavi et al., “Comparison of Barrier Materials and
`Deposition Processes for Copper Integration,”
`Proceedings of the IEEE 1998 International
`Interconnect Technology Conference, pp. 295-97
`(1998).
`Library of Congress Catalog Record of Moussavi et
`al., “Comparison of Barrier Materials and Deposition
`Processes for Copper Integration,” Proceedings of the
`IEEE 1998 International Interconnect Technology
`Conference, pp. 295-97 (1998).
`1021 Wijekoon et al., “Development of a Production
`Worthy Copper CMP Process,” 1998 IEEE/SEMI
`Advanced Semiconductor Manufacturing Conference,
`pp. 354-63 (1998).
`Library of Congress Catalog Record of Wijekoon et
`al., “Development of a Production Worthy Copper
`CMP Process,” 1998 IEEE/SEMI Advanced
`Semiconductor Manufacturing Conference, pp. 354-63
`(1998).
`
`
`Exhibit
`No.
`1015
`
`1017
`
`1018
`
` 1020
`
`1022
`
`3
`
`
`
`Description
`Exhibit
`
`No.
`1023 Wang et al., “Barrier Properties of Very Thin Ta and
`TaN layers Against Copper Diffusion,” J.
`Electrochem. Soc., Vol. 145, No. 7, pp. 2538-45.
`Library of Congress Catalog Record of Wang et al.,
`“Barrier Properties of Very Thin Ta and TaN layers
`Against Copper Diffusion,” J. Electrochem. Soc., Vol.
`145, No. 7, pp. 2538-45.
`U.K. Patent No. 2,298,657 to Cho.
`U.S. Patent No. 5,780,908 to Sekiguchi et al.
`U.S. Patent No. 5,869,902 to Lee et al.
`U.S. Patent No. 5,882,399 to Ngan et al.
`U.S. Patent No. 6,057,237 to Ding et al.
`U.S. Patent No. 6,136,682 to Hegde et al.
`U.S. Patent No. 6,242,804 to Inoue et al.
`Annotated FIG. 4 of U.S. Patent No. 5,893,752 to
`Zhang et al.
`U.S. Patent No. 6,458,255 to Chiang et al.
`Excerpt of “The American Heritage College
`Dictionary,” 3rd Ed., Houghton Mifflin Company
`(1993).
`U.S. Patent No. 5,281,485 to Colgan et al.
`1035
`1036 May 5, 2017, Deposition Transcript of Harlan R.
`Harris, Ph.D.
`Invalidity Contentions, Godo Kaisha IP Bridge 1 v.
`Broadcom Limited, et al., Case No. 2:16-cv-134
`Declaration of Dr. Sanjay K. Banerjee.
`Declaration of Thomas E. Gorman.
`Ex. A to Exhibit 1039 - PACER Docket, Godo Kaisha
`IP Bridge 1 v. Broadcom Limited, 16-cv-00134.
`Ex. B to Exhibit 1039 - Appendix_B Patent Rules
`5.6.15.
`Ex. C to Exhibit 1039 - Docket Control Order, Godo
`Kaisha IP Bridge 1 v. Broadcom Limited, 16-cv-
`00134.
`Ex. D to Exhibit 1039 - Rule 3-3 Notice of
`Compliance, Godo Kaisha IP Bridge 1 v. Broadcom
`Limited, 16-cv-134.
`
`1024
`
`1025
`1026
`1027
`1028
`1029
`1030
`1031
`1032
`
`1033
`1034
`
`1037
`
`1038
`1039
`1039A
`
`1039B
`
`1039C
`
`1039D
`
`Case No.: IPR2016-001249
`Patent No. 6,538,324
`Previously
`Submitted
`x
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`x
`
`x
`x
`x
`x
`x
`x
`x
`x
`
`x
`x
`
`x
`x
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`x
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`x
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`4
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`
`
`Exhibit
`No.
`1039E
`
`1039F
`
`1040
`
`Description
`
`Ex. E to Exhibit 1039 - TSMC Exhibit 1037,
`IPR2016-01249.
`Ex. F to Exhibit 1039 - TSMC Exhibit 1037,
`IPR2016-01264.
`Email correspondence concerning authenticity of
`Exhibit 1037.
`
`Case No.: IPR2016-001249
`Patent No. 6,538,324
`Previously
`Submitted
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`
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`
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`Petitioner hereby certifies that copies of all listed documents above have
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`
`
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`been served on counsel for Patent Owner.
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`Dated: July 26, 2017
`
`
`Respectfully submitted,
`
` By: / E. Robert Yoches /
`E. Robert Yoches, Lead Counsel
`Reg. No. 30,120
`
`5
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`Case No.: IPR2016-001249
`Patent No. 6,538,324
`
`CERTIFICATE OF SERVICE
`
`The undersigned hereby certifies copies of the foregoing PETITIONER’S
`
`UPDATED EXHIBIT LIST, TSMC Exhibits 1039, 1039A-F and 1040 were
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`served on July 26, 2017, via electronic mail directed to counsel of record for the
`
`Patent Owner at the following:
`
`Michael J. Fink (Reg. No. 31,827)
`E-mail: mfink@gbpatent.com
`
`Neil F. Greenblum (Reg. No. 28,394)
`E-mail: ngreenblum@gbpatent.com
`
`Arnold Turk (Reg. No. 33,094)
`Email: aturk@gbpatent.com
`
`Greenblum & Bernstein, P.L.C.
`1950 Roland Clarke Place
`Reston, Virginia 20191
`Tel: 703-716-1191
`
`
`Patent Owner has agreed to electronic service.
`
`Dated: July 26, 2017
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`By: /Lauren K. Young/
`Lauren K. Young
`Litigation Legal Assistant
`FINNEGAN, HENDERSON, FARABOW,
`GARRETT & DUNNER, L.L.P.
`
`
`
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