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`IPR20l6—0l246
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`IP Bridge Exhibit 2002
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`TSMC V. IP Bridge
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`Chemical Mechanical
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`Planarizafion of
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`Microelectronic
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`Materials
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`JOSEPH M. S'l'EIGEIl‘.WALB
`SHYAM P. MIJRARKA
`RDHALD J. GUTI|-'L=LEi‘N
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`@ ‘
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`WILEY-
`‘WZH
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`w.nnLE'r-v-SH Vfirlag GmhH a Cu. K.Ga.A
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`Page 2 of 7
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`

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`Chemical Mechanical
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`Planarizatinn of
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`Miereelectnmic
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`Materials
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`This Page intentionally Lefi Blank
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`‘L-' .'--.-'r-'.-'.':'-:I n n'-"-..':
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`.I'.'l'l’t:a:«-o.'i.1i' pilblisllad ‘by Wiby-VCH :1l‘lH:EI'BflIll‘_|.' pmduced.
`Ncvmldm. amlrcla. editors. and publishcr in mi warmnnhe infurmamm
`I::v:r1IIain-ad in thcal: bunks, including this hook. tube 111:: ufmars.
`Rnadurs arr advised to l-:nI:p in rncind Ilw: natenmwu, 1:la1a.1'1lLB11'aIinn5~.
`pmDDtll.II."i!l Iihi-Bil.-I var ulilltr l:l;6I'n5 |'n.ay ly hclrmcuram
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`Lil11‘II‘)r I-I‘-Euuptm Curd Nun:
`Applied For
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`nrlllsh Lihnrgr Cataloging-in-Puhlculnl Dita:
`A canning-ue 1-cum-d fur Lhk hunk isairailahla mm the Ba-ifish Lihranr
`
`BihIingr.I[.IIIl¢ ins:-mum pnblhhcd by
`Die Dcllifilll HI'l‘.|.l.lI-lick
`
`Dix: Dmusubc Bibllulhnk list: 1114': put-,slis:a1inu1£1:.tJ:u°. D-:I.1.l!sI:.lJ|eE=1'*iali:t::a|I:i‘:-Ii:-grafice;
`detailed hibll-ugnaplllc data is available l'|:'l'Il!'|l: Internet in =:l-uipc.fi''d11b.ddb.lic>.
`
`@ 199? by Jenn ‘Wiley 3:. Sam. Inc.
`@ EEK!-4 WILEY-JFCH ‘u"I.'.-rlkg Gmbfi fit Cu. Jifiah. Wcinluzim
`
`All rigid: lwesecm:-d{iI1r:Iud‘ir1g Ihme oi‘ Iran.-sllliaon into -Inhcr iangtiagcsl.
`‘Nu pa;-1 uflhis. In-cl: may be rqn-udmud in any fnnn — nnr Erarlsiniltsrl nr translaiacil
`into n1acIIiI|EIa.1'.g1fl.ge without 'I.I.r|'i1:.|an. pIII'|!l1i:5'u:n fi'm11t|:L: puIJ.l'|5l:1.¢I‘S.
`Regimmd mines. lriidnrruatlcs. 31%. ‘I-ISHI in this back, cvw whorl nu-t 5-11¢-III-lull)‘
`marl-cedag such, arcno-I In becmasidereud hylaw.
`
`Printed in me Fadm! Republic al-‘fiennunzv
`Fri.I11:1.'.d cm acid-Fm: pap-er
`
`Pu-inning Sums: flm|:Il-I, M-Sdmbanh
`Bu-qkhiufling Lilge-5 at Dow‘ BLInh|:sinde-reiiimhll, Hgppmmim
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`ISBN-I3: WE-0411-1382?-3
`IE-BN—l M I}-fill-138.2?-I
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`Chemical Mechanical
`
`Planarization of
`
`Microelectronic
`
`Materials
`
`JDSEPI-I Ill. STEIGEEWALD
`SHYAM P. MURARKA
`RONALD J. GUTMANN
`
`@ W
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`ILEY-
`‘FE-I
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`WlLE‘11‘v'CH Uerlag Clmhfl & Cu. KGEA
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`i.l’.I|:~-.-IIg|‘.iI1::; "Hill."-u Page 4 of 7
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`"_.'-I'.-~'-'-'I'-|‘."i'l -" '1rr::' 3'1
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`

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`CONTENTS
`
`
`France
`
`1 Chanllcal MechanicalP fil III:1'u-Illfllnn
`
`1.1
`
`Introduction
`
`.a.pp1‘n:ari-ans
`12
`1.3 T]11:C1‘-IPPmcass
`1.4
`-'.”.'1'IrfPToo1s.
`
`1.5 Processhtnugl-afiun
`1.6 Cuxnalusiunamifiontflutlinc
`Refarexmes
`
`2 Hiitat-innlhloflvlflnls liar CM?
`
`2.1
`
`fidvmtcedhietaflinflunfichetnts
`
`1nt.ern:1rmectDe1a;.r]mpac1onFerfu-manna
`2.1.1
`2.1.2 Mgthodsnfkeduchglntwmrmflmflehy
`1.1.3 Plannfiiy Raquiwfinenfl 1‘-n bailfllilenrel
`Metafliialti-ml
`
`2.2 Hanariznfion S-almrnr.-s
`
`xi
`
`|-I-I—-I—I—|
`
`Lnu—I-—-‘:1--Juli-1—r1-I
`.u.u.I—II-I?H:-1:av|:l~l)|
`
`22
`
`'11
`
`Cl2}N'I'EH'1'fl
`
`Smonthing and Loan] Plamrizafmn
`2.2.1
`2.2.2 Glob-alPla11a1'1'zatiIJn
`
`2.3 EMF Ptmmrizaxion
`
`2.3. 1 Advarlingacs of{IM'P
`2.3.2 Dfsadvmmgcs 1:!‘C111?
`
`2.3.3
`Rcferennes
`
`T111‘: Iflhailengae 1;-HEMP
`
`EMF filhhh ind Mlnlpllatinns
`
`3.1
`
`Chztput Va;-iablas
`
`Input ‘4.I"a:iab11:s
`3.2
`Rgferanuea
`
`Mechanical and Eleclmnchemlcll Concepts for EMF
`
`Pneston Equation
`4.1
`4.2 Fluid Layer Imermtium
`
`4.3 Houndmjr Layer Irrtetactiuns
`
`Fluid Btu:-111'1&J1 Lay:-r
`4.3.1
`4.3.2 Double Lljrcr
`4.3.3 Mata! Smfaoe Films
`4.3.4 Mcchanical A.hrasim1
`
`4.4 Abrasion Mu-dns
`
`1*:-1ishh1g vs. Grinding
`4.4.1
`4.4.2 Hartzian 1Ivdr.11ta1io1:1 vs. Fluid-Band ‘Wear
`
`4.5
`
`"[111: Pulislfing Pad
`
`Pad Materials and P1-npI=rtiI:a
`4.5.1
`4.5.2 Pad Dondilioning
`4.6 E [ Pircnmmxm
`
`4.6.1
`
`Ilewtiuna
`
`4.6.2 Hcnnnbaix Diagrams
`4.6.3 Mixed Pnzrteufial Theory
`4.6.4 Emnple: cuppa: CM!’ in NH,-Baud 511111-11:5
`4.6.5 Examples: flapper-Tm.n.i1:n: I11tB:rar;tim1
`4.1-' Ruin oflilwnianyr in (IMP
`
`215
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`29
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`29'
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`I52
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`".-'-rr'r: "«'-=r-n|Pag6 5 Of 7
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`PREFACE
`
`1591
`
`luwealsu cuntrI'bm£:Iid1ningthJeresearcJla1Renas¢1I:raIldinprcp:nration
`ufthe rnmu.1sI::ripL Prufe.-mums I'uI_Tomocwn.r&a.11d D.Duque;cu: havepm-
`videdinsightaandrevizws u'er_I,.r valuable illiliepraapnmliunuftlllzhliiak.
`Discnsiicna with L. C0-Oh M.Fu1':.-'. K. Hfllland. R.Ja.iral:It, and sflveaal
`graduate 5l'l.ll.'l-¢|1l:E- wmlcing in EMF-relaxed research at Runs-sI:laer luv:
`bum: very fi'I.Iitfi1.l.
`Man}'tlLm1k3al'eIilflflndElI|£fiT¢l)'giVfi|tGMIS.[£fi'Wil90Df0T
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`pmfi|1gd:amamsm‘iptt0gethen\VrflmmImr5cveIalhum'sufhurdwork,
`the pm-d1JcIionofflfi5bonicwcIfldn£Jthmeb:enpusaihle.Wealsmn'ishto
`now our Hppreciatiun to Mr. Jim Neirymk furhelping us diligently in
`finding r£l":re:1I:ed materials.
`Wemgmtefiilmnunymithfiswhusepapmureiuwfafluwad
`closely in varimispurtsufthcbunkmtdh-ha allanadustolwatlleirwurlc
`infl3i$book‘M:arealsufl1ankfifltu»'itxadarniJcPreaa,A+LlamHflgcr.
`A.mr:ricau Institute ofPl1ysiD5, fiuricrican -Cutalnic Society. Bum:r'M:H1lI~
`Heinemann. The E Suflietr. Instiluti: of Eleactrical mini
`
`El:-mrmiics Enginacrs, Japan lntmuatiunal Emfiemnm on Solid Stale Da-
`vices and Materials, John Wiley & Sons, Journal at‘ Cellular Plastics,
`
`Journal of Ehjfstalline Graurfli. Macmillan Publishing CHIEF‘-"F. Matea'i-
`als Rmiaarch Sm.-icI:1_.r, and the University -:rI'S-until Fl+:n'ida (TE. Wade},
`wl1i£:h publisheaP of the V1.5] HulltilmralEl Cun-
`fierence, for the use -nfi;:upjr|'1'_gh|:cd malnrialza.
`Mus1nfal],w:wnu1dlikeIcathn:1kmflfaniiIiesfurfl1=un:lm‘stand-
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`'._--'-:'!'.'l'.:':-i'|'Ft-'I rr.-".7-.'--I.‘-.|Page 6 of 7
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`1.3 CIEIHANAREAHIH
`
`3
`
`I'll
`
`IIISTDRICAL I|IUI'I‘I'!L'I'1flH§ FDR I'.'MI"
`I-
`
`2.2.3 Glnhfl
`
`Aamuutiunuclprcvimmly, global planariaiflonismquirudtn
`naeetthedepthuffipldtequixeinnnupflidmgu-aphytoalsinthe
`sub-fl.5pn1rcgim:.1’:1'jrfewuIh.::plnnIriI.a:tinnschemcsahllin
`theglubnlplanafitynffuudhjrflflfidinnrnstwidulyacoapted
`metho-dufachicvlngglnbalplanuiuliona” Rnnentsmclimluvc
`dmwnmludflleahilmrmllumuingluhlplnmfimlimusmga
`blocking mask and an isotropic resisi-uxidu: chm t:ack."'“' Hnwevpr,
`inad1:l1't-
`1011.111: achieveunenl of global plamlrization requires a globally
`p1an1ri:5udIL.DaIth:epreviuus1a}mt.T‘hus,ap1ncflIItcreates
`global plalmity, such as EMF. is l.'U=t|1.Ii.l'ed hefm the blocking
`nusk.IaIdanisfitmpicctd1sch:snun1a}Fhcpufunnad.Funda:rten—
`tafl3r.CMPuhtni:Ishighea-dugmasnfplanafltgrhecauscplanalityis
`hnpaseddnepatheexuunuflaunaasofflippolishingmhlmln
`conuastpflmrplannrizafinnscheniexrelgruntheaddifianui
`planarjzing layers nndunnsequmfly are highlypaunm dcpcntlant
`lcad11!gtun1uwerdcgreeufplana1it5r.Whfl:fl1:Ch-lPpIH)uesais
`stiflinit:infancp,i1sprmrfiscofgInha1plmafityandrclaflv¢lnw-
`coatfluw-cannplexily pmcesxinghuaparkndmnsidenbl: intcrnmt
`inrheprocess.“
`
`2.3
`
`CMP PLANARIZATION
`
`Thcus:ufEMPmchniq1wsisnmmfiq-mmplanariufimt.
`Polishingniglasspiwesiaalong-establishadpIa=cfiuein:hefahai—
`¢afiflnufl=naes.Indeed,anw:sl1a1lmeinChapter5,muchufIJ::
`uJ1d:man:lingufgluspufishingn1a}rbeappliudtnu1cidcEDalP.In
`flwfabricufinnuflflssilinonpofishingunflnalaupinflra
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`Huwncr,ClulPuaudfwp1unnixatinndifl’ux£rmnleI'u£a.bricafinn
`and wafer prcpnrnlion in on: impnrmnt Impact.
`In all
`threat:
`flpplicafifififi.alfigh|ie»£mBufplanaritj'fifflIm:a|i£lBqlIiP¢=d:
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`Eb)
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`exannpln, may way by a::ve.1'a1 mils whil: ILD thickllcsiés faust
`varyless :l1an~iDI}nmfi*umwaferInowa1‘¢I.1'hua.CMP'usedfnr
`planarizaniun deannncls rrurch fighter process control
`Figun: 2.15 shnws a ncltcnutic mprcstntntinu ufa polishing
`tool. Thcwafu'inprGssedlEaiustflm=pnlishingstIrface.t:1'mnd I11:
`polishing pad,md:itcwaf:randpndn1'ehuthmma-d.Apo1iahing
`
`flap;-.*I|1?.rnn n"-.=.?I.=.-Ial Page 7 of 7
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`L’:n;'.I,-rI:_'|nrnrJ n1.nII:=u:..1:
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`Page 7 of 7