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`US 20070247852Al
`
`c19) United States
`c12) Patent Application Publication
`Wang
`
`c10) Pub. No.: US 2007/0247852 Al
`Oct. 25, 2007
`(43) Pub. Date:
`
`( 54) MULTI CHIP LED LAMP
`
`(52) U.S. Cl. .............................................................. 362/294
`
`(76)
`
`Inventor: Xiaoping Wang, El Monte, CA (US)
`
`(57)
`
`ABSTRACT
`
`Correspondence Address:
`LAW OFFICES OF CLEMENT CHENG
`17220 NEWHOPE STREET #127
`FOUNTAIN VALLEY, CA 92708 (US)
`
`(21) Appl. No.:
`
`111408,715
`
`(22) Filed:
`
`Apr. 21, 2006
`
`Publication Classification
`
`(51)
`
`Int. Cl.
`F21V 29100
`
`(2006.01)
`
`A multi chip LED lamp comprises a reflector and a plurality
`of LED chips mounted on a top surface of the reflector. A
`triple laminate board has a board layer; a circuit layer
`formed on the board layer; and a thermal conductor layer
`laminated under the board layer. A well is formed in the
`triple laminate board, the well sized to receive the reflector
`in snug fit. The multi chip LED circuit layer can be copper
`and the thermal conductor layer can be aluminum. A heat
`sink having fins can be attached to the thermal conductor
`layer. Material can be removed from the triple laminate
`board to form the well and reflector. Three or more LED
`chips can be mounted on the top surface of the reflector. The
`chips can be less than 2 mm from each other.
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`8
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`19
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`1~
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`IPR PAGE 1
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`Acuity v. Lynk
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`Patent Application Publication Oct. 25, 2007 Sheet 1 of 3
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`Patent Application Publication Oct. 25, 2007 Sheet 2 of 3
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`Patent Application Publication Oct. 25, 2007 Sheet 3 of 3
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`US 2007/0247852 Al
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`

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`US 2007/0247852 Al
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`Oct. 25, 2007
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`1
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`MULTI CHIP LED LAMP
`
`DISCUSSION OF RELATED ART
`
`[0001] Light emitting diodes or LED technology is almost
`to the point that it can provide environmental residential or
`office lighting. LEDs can generate bright light with low
`power consumption making LED DC lighting particularly
`suitable for DC power systems such as those installed in
`photovoltaic powered homes. This has a potential of saving
`a substantial amount of natural resources. Unfortunately,
`there are a few hurdles to overcome before LED lamps can
`replace compact fluorescent lamps.
`
`[0002] According to related art, light emitting diodes do
`not convert all electricity into light and therefore generate a
`substantial amount of heat. U.S. Pat. No. 7,008,084 issued to
`inventor Galli uses an integrated heat sink to dissipate heat
`from a high brightness LED into a lighting device. "In
`particular, the head assembly utilizes a receiver sleeve that
`includes a tail portion which surrounds the output end of the
`LED thereby isolating the LED and capturing both the
`conductive and radiant waste heat emitted by the LED to
`further dissipate the captured heat out of the assembly."
`
`[0003] Other recent patents such as U.S. Pat. No. 6,966,
`677 provides a Lighting assembly with sufficient space
`around the LED element to provide airflow and thermal
`dissipation. U.S. Pat. No. 6,914,261 issued to inventor Ho
`provides an array of light emitting modules mounted on a
`substrate. The individual elements are arranged in an array
`so that they form a panel. Making elements larger, or
`arranging them as a panel increases cost and creates physical
`size limits.
`
`[0004] U.S. Pat. No. 6,561,680 provides an alternative
`configuration that increases the anode and cathode portions
`to have a larger surface area for heat dissipation. The
`resulting device is a large LED. Sometimes a number of
`smaller lamps substitute a large lamp. U.S. Pat. No. 6,864,
`513 provides a light emitting diode bulb having multiple
`LEDs mounted on a circuit layer so that each chip 21 has
`wires 22 mounted within an encapsulant 23. Making a larger
`lamp, or connecting a large number of individual lamps also
`increases cost.
`
`[0005] The previous patents and related art do not show a
`low-cost solution to allow a high-intensity LED light that
`also dissipates heat. Therefore, the object of the invention is
`to provide a new LED device structure with normal LED
`chips but a better heating dissipation function to allow a
`high-intensity LED light. Making large elements, or large
`heat exchangers are environmentally unfriendly. It is a
`further object of the invention to make the LED lamp
`environmentally friendly.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0006] FIG. 1 is a perspective view of the device.
`
`[0007] FIG. 2 is a cross section of the first embodiment.
`
`[0008] FIG. 3 is a cross section of the lamp module of the
`second embodiment.
`
`[0009] FIG. 4 is a cross section of the third embodiment.
`
`[0010] FIG. 5 is a top view.
`
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENTS
`[0011] The device 1 shown in FIG. 1 is about one square
`inch. A preferred embodiment as shown in FIG. 1 has a pair
`of power wires 19 and 20 entering the housing 14 through
`heat dissipation area (300) and exiting the housing 14. The
`housing 14 can be modularly clipped or joined to the power
`wire 20 using wire piercing means that are commonly and
`commercially available. Modular joining allows connection
`along any section of power wire 20. The heat exchangers 10
`can be integrally formed to the housing 14. The housing 14
`is preferably extruded or rolled from aluminum, although a
`variety of metals can be used. The housing 14 has a housing
`cap 15 bounding each side of the housing 14 to form a
`rectangular or square shape. The heat exchangers 10 are
`shown as fins and can be arranged in a variety of shapes,
`configurations and sizes according to the state of the art in
`heat exchanger technology. The housing cap 15 also dissi(cid:173)
`pates heat. The top cover 200 also called triple laminate
`layer of the device 1 consists of a triple layer: an electrically
`conductive layer 100 also called circuit layer 100, a struc(cid:173)
`tural layer (110) and a Heat conductive layer (120). The
`electrically conductive layer 100 can be made out of copper
`circuits printed on a printed circuit board. The term printed
`circuit board is sometimes abbreviated as PCB. The PCB fits
`within the housing and can slide into a front and rear slot
`formed within the housing as seen in FIG. 2. The top cover
`200 may further have a non-conductive protective layer
`covering it. The layers of the device have a hole or well 25
`formed where LED chip elements 150 are mounted on the
`upper surface of the reflector 130. The reflector is preferably
`parabolic, concave and bowl shaped.
`[0012] Contrary to popular thinking, the LED chips 150
`should be small and mounted closely together in multiples
`around the middle inside surface of the parabolic reflector
`130. The chips 150 are created by ordinary chip fabrication
`means commonly known in the industry. Each chip 150 has
`an anode and cathode, but miniaturized to a degree that they
`are not noticeable by a casual observer. The chips will
`appear as small dots to a casual observer.
`[0013] As is well known in the art, the reflector 130 can be
`coated with phosphorous or other light emitting chemical to
`enhance lumen output efficiency. Packing the chips 150
`close together minimizes material usage and heat can be
`mitigated through dissipation. Preferably the chips are less
`than 2 mm from each other. Although the chips can be about
`5 mm from each other, this is not the best configuration to
`form a spotlight.
`[0014] A preferred embodiment as shown in FIG. 2 has an
`electrically conductive layer 100 over a circuit board struc(cid:173)
`tural layer 110 over a thermal conductive layer 120. The heat
`sink, or heat dissipation fin 10 is shown attached to the
`thermal conductive layer 120. The thermal conductive layer
`is either integrally formed with the reflector 130 as shown in
`FIG. 2 or is inserted into the well 25 after a through hole is
`drilled through the triple layer. Normally, the connecting
`wires 21 that provide electricity to the chip elements 150 are
`small and not usually noticeable. The lead wires 21 lead
`from the conductive layer 100 to the chip elements 150, and
`bridge between the chip elements to lead back to the
`conductive layer 100.
`[0015] The reflector shown in FIG. 2 of the first embodi(cid:173)
`ment can be produced separately but integrally formed with
`
`IPR PAGE 5
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`

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`US 2007/0247852 Al
`
`Oct. 25, 2007
`
`2
`
`the triple laminate layers (200) or formed directly by drilling
`a depression on the triple laminate layer (200) and this
`depression does not pass through the entire triple laminate
`layer so that it can act as reflector.
`
`[0016] A second embodiment as shown in FIG. 3 is also a
`preferred embodiment and has a reflector insert 130 with a
`flat bottom 132 and angled sides. The insert can be manu(cid:173)
`factured separately and sized to the hole 25 size. The chip
`elements 150 can also be mounted on the reflector insert
`130. When the reflector insert is inserted into the triple
`laminate layer as shown in FIG. 2, the reflector sidewalls
`131 automatically interference fit to the thermal conductive
`layer 120.
`
`[0017] As shown in FIG. 4, the third embodiment provides
`a parabolic reflector having walls that reach to the top
`surface of the conductive layer. The conductive layer 100 is
`isolated from the reflector by an annular groove or insulation
`111. The structural layer 110 is not conductive and serves
`only to provide structure. The top view shows a conductive
`layer 100 encircling six chips. A protective layer can cover
`the chips. The chips are mounted close to each other in a
`densely packed array of three, four, five, six ... N pcs or nine
`chips. The anode and cathode sizes remain small providing
`manufacturing economy. Connection wiring 21, 22 may be
`connected in redundant connections providing a back up
`connection in case the main connection fails. The chips
`generate heat. The heat conducts through the thermal con(cid:173)
`ductive reflector 130 that has integral or tight connection on
`a sidewall 131 that interfaces the thermal conductive layer
`120. The thermal conductive layer 120 will transfer the heat
`to the extruded housing (14) via the joint sidewall 131 and
`heat dissipation 300 or heat convective area 300. Thus a
`better heat dissipation structure is ensured. The thermal
`conductive layer 120 can be made out of aluminum. Heat
`dissipation area 300 can be hollow and also act as a channel
`for power wiring 19, 20.
`
`[0018] FIG. 2 shows a thin reflector embodiment having
`small clearance between the bottom of the reflector and the
`concave area of the reflector. FIG. 3 shows a thick reflector
`embodiment that provides mechanical strength for insertion
`into the through hole to form the well 25. The thin reflector
`embodiment is not preferred when using a manufacturing
`method that requires inserting the reflector into the through
`hole. The thin reflector embodiment should be used when
`the reflector 130 is integrally formed, or drilled from the
`triple laminate layer.
`
`[0019] For a focused beam commonly seen in a flashlight,
`the walls and sides 131 of the reflector can be higherthan the
`width of the base 132. The top of the walls 131 may be
`isolated from the conductive layer 100 by a small gap. The
`large gap shown in the drawings is mainly for illustration
`purposes. The conductive layer 100 is typically formed as a
`copper conductive circuit that is printed on an isolation
`board that may be made in a variety of circuit configurations.
`
`[0020] During manufacturing, the triple laminate printed
`circuit board is made by laminating a thermal conductive
`layer 120 on a board 110 and printing a conductive layer 100
`on top. The circuit can be as simple as having the front
`potion of connecting wire 21 correspond with power wire
`19, and the back potion of connection wire 22 with power
`wire 20, with a central conductive layer strip portion
`between 19 and 20 missing or not conductive. In this case,
`
`the connecting wire 22 bridges a positive back portion, to the
`chips 150, the connecting wire 21 to the negative front
`portion. If the front power wire and back power wire are of
`different polarity, the wiring can receive a number of devices
`1 in parallel configuration. FIG. 1 shows two rows of three
`chips 150 in parallel. If each chip of FIG. 1 is 4\7, the total
`voltage would be 12V. If the LED chips are sized and
`matched to voltage, resistors are not necessary. Any voltage
`is possible. Typical lighting voltages are 3\7, 6\7, 12\7, ...
`120\7, 240V, etc. The LED chips are small and/or PCB
`based.
`
`[0021] After circuit printing, the triple laminate printed
`circuit board can either be drilled through or drilled partially
`through as seen in FIG. 2. When the board is drilled through,
`the reflector insert 130 is inserted from the bottom opening
`of the thermal conductive layer 120. The insertion of the
`reflector 130 may require a tool such as a crimp tool. After
`reflector insertion, a wiring machine installs the connecting
`wire 21 for the chips 150.
`
`[0022] The well 25 is preferably round and empty without
`the waterproof resin typically associated with LED lamps.
`Of course, a waterproof lid or some kind of protective layer
`can be added if necessary. Either the chips 150 or the
`protective lens layer can be colored, or multicolored pro(cid:173)
`viding a variety of color outputs.
`
`[0023] The chips 150 can be in rectangular array arrange(cid:173)
`ment, but can also be formed in a circular pattern. As seen
`in the drawings, the reflector 130 can be of any shape, and
`can also be square, or rectangular. The reflector can be
`linearly formed as a long trough where the chips are laid in
`linear configuration. The
`linear configuration can be
`arranged in a single row of led chips 150, or a double row
`of led chips 150. The linear configuration can be formed as
`a ring or loop if long enough. The best mode currently is to
`have the reflector in a parabolic configuration having a
`circular top light opening formed as a well 25.
`
`[0024] Therefore, while the presently preferred form of
`the LED device 1 has been shown and described, persons
`skilled in this art will readily appreciate that various addi(cid:173)
`tional changes and modifications can be made without
`departing from the spirit of the invention, as defined and
`differentiated by the following claims.
`
`CALL OUT LIST OF ELEMENTS
`
`[0025] 1 LED device
`
`[0026] 10 Heat Exchanger
`
`[0027] 14 Extruded Housing
`
`[0028] 15 Housing Cap
`
`[0029] 19 Negative Power wires
`
`[0030] 20 Positive Power Wires
`
`[0031] 21 Front Connecting Wires
`
`[0032] 22 Back Connecting wires
`
`[0033] 25 Reflector Well
`
`[0034] 100 Electrical Conductive Layer
`
`[0035] 110 Structural Layer
`
`[0036] 111 Insulation Layer or Gap
`
`IPR PAGE 6
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`

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`US 2007/0247852 Al
`
`Oct. 25, 2007
`
`3
`
`[0037] 120 Heat Conductive Layer
`
`[0038] 130 Reflector
`
`[0039] 131 Reflector Side Wall
`
`[0040] 132 Reflector Bottom
`
`[0041] 150 LED
`
`[0042] 200 Top cover triple laminate layer
`
`[0043] 300 Heat convective area
`
`11. The multi chip LED lamp of claim 10, wherein the
`chips are less than 2 mm from each other.
`12. The multi chip LED lamp of claim 11, wherein the
`reflector has a base width and height, wherein the width is
`greater than the height.
`13. The multi chip LED lamp of claim 11, wherein the
`reflector has a base width and height, wherein the height is
`greater than the width.
`14. A multi chip LED lamp construction process com(cid:173)
`prising the steps of:
`
`1. A multi chip LED lamp comprising:
`
`a. forming a reflector;
`
`a. a reflector;
`
`b. a plurality of LED chips mounted on a top surface of
`the one reflector;
`
`c. a triple laminate board comprising: a board layer; a
`circuit layer formed on the board layer; and a thermal
`conductor layer laminated under the board layer.
`
`d. a well formed in the triple laminate board, the well
`sized to receive the reflector in snug fit.
`2. The multi chip LED lamp of claim 1, wherein the
`circuit layer is copper and the thermal conductor layer is
`aluminum.
`3. The multi chip LED lamp of claim 1, further compris(cid:173)
`ing a heat sink having fins attached to the thermal conductor
`layer.
`4. The multi chip LED lamp of claim 1, wherein a step of
`removing material from the triple laminate board forms the
`well and reflector.
`5. The multi chip LED lamp of claim 1, wherein three or
`more LED chips are mounted on the top surface of the
`reflector.
`6. The multi chip LED lamp of claim 5, wherein the chips
`are less than 2 mm from each other.
`7. The multi chip LED lamp of claim 6, wherein the
`reflector has a base width and height, wherein the width is
`greater than the height.
`8. The multi chip LED lamp of claim 6, wherein the
`reflector has a base width and height, wherein the height is
`greater than the width.
`9. The multi chip LED lamp of claim 1, wherein a first
`step of forming a through hole to form the well in the triple
`laminate board and a second step of inserting a reflector into
`the well forms the well and reflector.
`10. The multi chip LED lamp of claim 9, wherein three or
`more LED chips are mounted on the top surface of the
`reflector.
`
`b. mounting more than three LED chips on a top surface
`of the reflector;
`
`c. forming a triple laminate board comprising: a board
`layer; a circuit layer formed on the board layer; and a
`thermal conductor layer laminated under the board
`layer;
`
`d. forming a through hole to form a well in the triple
`laminate board;
`
`e. inserting the reflector into the well wherein the reflector
`is in snug fit with the through hole or the triple laminate
`board; and
`
`f. connecting the PCB to the chips with connecting wire.
`15. The multi chip LED lamp construction process of
`claim 14, further comprising the step of attaching a heat sink
`to the thermal conductor layer.
`16. The multi chip LED lamp construction process of
`claim 14, wherein the reflector has a base width and height,
`wherein the width is greater than the height.
`17. The multi chip LED lamp construction process of
`claim 14, wherein the reflector has a base width and height,
`wherein the height is greater than the width.
`18. The multi chip LED lamp construction process of
`claim 14, wherein the step of mounting more than three LED
`chips on a top surface of the reflector further includes the
`substep of mounting the chips less than 2 mm from each
`other.
`19. The multi chip LED lamp construction process of
`claim 18, wherein the reflector has a base width and height,
`wherein the width is greater than the height.
`20. The multi chip LED lamp construction process of
`claim 18, wherein the reflector has a base width and height,
`wherein the height is greater than the width.
`
`* * * * *
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`IPR PAGE 7