US007339198B2
`
`(12) United States Patent
`Shen
`
`(10) Patent N0.:
`(45) Date of Patent:
`
`US 7,339,198 B2
`Mar. 4, 2008
`
`(54) LIGHT-EMITTING DIODE CHIP PACKAGE
`BODY AND PACKAGING METHOD
`THEREOF
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`(76) Inventor: Yu-Nung Shen, No. 60, Lane 328,
`Li-Shan Street, Nei-hu Dist, Taipei City
`(TW)
`
`( * ) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 236 days.
`
`1/2004 Peterson et a1. .......... .. 257/680
`6,674,159 B1 *
`7/2001 Furukawa et a1. .... .. 310/313 A
`2001/0009342 A1 *
`2005/0023550 A1* 2/2005 Eliashevich et a1. ........ .. 257/99
`
`* cited by examiner
`
`Primary ExamineriDao H. Nguyen
`(74) Attorney, Agent, or F irmiRosenberg, Klein & Lee
`
`(21) App1.No.: 11/004,910
`
`(57)
`
`ABSTRACT
`
`(22) Filed:
`(65)
`
`Dec. 7, 2004
`Prior Publication Data
`
`Jul. 21, 2005
`US 2005/0156184 A1
`Foreign Application Priority Data
`
`(30)
`
`Jan. 16, 2004
`
`(TW) ............................. .. 93101125 A
`
`(51) Int. Cl.
`(2006.01)
`H01L 33/00
`(52) US. Cl. ........................ .. 257/98; 257/99; 257/100;
`257/E33.056; 257/E33.065
`(58) Field of Classi?cation Search ................ .. 257/95,
`257/98, 99
`See application ?le for complete search history.
`
`AN LED chip package body provides an LED chip With a
`pad-installed surface, a plurality of pads disposed on the
`pad-installed surface and a rear surface formed opposite the
`pad-installed surface. The LED chip package body further
`has a light-re?ecting coating disposed on the pad-installed
`surface of the LED chip and a plurality of pad-exposed holes
`for exposure of the corresponding pads of the LED chip. The
`LED chip package body further comprises a light-transpar
`ent element disposed on the rear surface of the LED chip and
`a plurality of conductive projecting blocks. Each of the
`conductive projecting blocks is disposed on the correspond
`ing pad of the LED chip.
`
`11 Claims, 12 Drawing Sheets
`
`130
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`16
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`IPR PAGE 1
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`IPR PAGE 2
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`

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`U.S. Patent
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`Mar. 4, 2008
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`Sheet 2 0f 12
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`US 7 339 198 B2
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`IPR PAGE 3
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`U.S. Patent
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`Mar. 4, 2008
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`Sheet 3 0f 12
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`US 7,339,198 B2
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`U.S. Patent
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`Mar. 4, 2008
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`Sheet 5 0f 12
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`IPR PAGE 6
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`U.S. Patent
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`Mar. 4, 2008
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`Sheet 6 0f 12
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`US 7,339,198 B2
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`IPR PAGE 7
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`U.S. Patent
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`Mar. 4, 2008
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`Sheet 7 0f 12
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`US 7,339,198 B2
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`FIG. 19
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`IPR PAGE 9
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`U.S. Patent
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`Mar. 4,2008
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`IPR PAGE 10
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`IPR PAGE 13
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`

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`US 7,339,198 B2
`
`1
`LIGHT-EMITTING DIODE CHIP PACKAGE
`BODY AND PACKAGING METHOD
`THEREOF
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`The present invention relates to a light-emitting diode
`chip, and especially to a light-emitting diode chip package
`body and a packaging method of the light-emitting diode
`chip package body.
`2. Description of the Related
`In general, the LED (Light-emitting diode) of prior art
`comprises a package substrate and/or an electric conduction
`frame and an LED chip disposed on the package substrate
`and/or the electric conduction frame. The LED chip has a
`plurality of pads electrically connected to corresponding
`joining points of the package substrate and/or the electric
`conduction through corresponding metal Wires by Wire
`bonding process. However, the packaging process according
`to the above packaging method Wastes time. Thus, the output
`and the quality of the LED chip package body Will not
`improve.
`Furthermore, the siZe of the LED is increasingly small
`With the advancement of the chip process and the area of the
`pad of the LED chip is increasingly small. Thus, it is hard
`to carry out the Wire bonding process on the small area of the
`pad.
`With the employment of unique considerations and appli
`cation of theories, and based on several years experience in
`specialiZed production of all ?exible assembly systems and
`mechanisms, the inventor has come up With an innovative
`light-emitting diode chip package body.
`
`SUMMARY OF THE INVENTION
`
`The primary object of the present invention is to provide
`a light-emitting diode chip package body and a packaging
`method of the light-emitting diode chip package body. The
`light-emitting diode chip package body and the packaging
`method of the light-emitting diode chip package body are
`used to resolve the problems of the pad of the LED chip of
`the prior art.
`In order to achieve the above objects, the present inven
`tion provides a light-emitting diode chip package body
`comprising a light-emitting diode chip having a pad-in
`stalled surface formed thereon, a plurality of pads installed
`on the pad-installed surface and a rear surface formed on an
`opposite side of the pad-installed surface; a light-re?ecting
`coating disposed on the pad-installed surface and having a
`plurality of pad-exposed holes for exposure of the corre
`sponding pads of the light-emitting diode; a surface insula
`tion layer disposed on the rear surface of the light-emitting
`diode chip and having a central through hole for exposure of
`a central portion of the rear surface; a ?rst light-transparent
`element received in the central through hole of the surface
`insulation layer; and a plurality of conductive projecting
`blocks, each of the conductive projecting blocks disposed on
`the corresponding pad of the light-emitting diode.
`In order to achieve the above objects, the present inven
`tion provides a light-emitting diode chip package body
`comprising a light-emitting diode chip having a pad-in
`stalled surface formed thereon, a plurality of pads installed
`on the pad-installed surface and a rear surface formed on an
`opposite side of the pad-installed surface; a light-re?ecting
`coating disposed on the rear surface of the light-emitting
`diode chip; an insulative protective layer formed on the
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`light-re?ecting coating; a surface insulation layer disposed
`on the rear surface of the light-emitting diode chip, and
`having a central through hole for exposure of a central
`portion of the rear surface and a plurality of pad-exposed
`holes for exposure of the corresponding pads; a ?rst light
`transparent element received in the central through hole of
`the insulative protective layer; and a plurality of conductive
`projecting blocks, each of the conductive projecting blocks
`disposed on the corresponding pad of the light-emitting
`diode.
`In order to achieve the above objects, the present inven
`tion provides a light-emitting diode chip package body
`comprising an insulative substrate including at least one
`chip-installed scope, the at least one chip-installed scope
`having a chip-installed surface, a rear face formed opposite
`the chip-installed surface, a through hole penetrating
`through the chip-installed surface and the rear face and a
`plurality of conductive tracks extending from the chip
`installed surface to the rear face through the through hole; a
`substrate insulative layer disposed on the chip-installed
`surface to form an open hole for exposure of a central scope
`of the at least one chip-installed scope; at least one light
`emitting diode chip disposed on the at least one chip
`installed scope of the insulative substrate, and having a
`pad-installed surface formed thereon, a plurality of pads
`installed on the pad-installed surface and a rear surface
`formed on an opposite side of the pad-installed surface; a
`light-re?ecting coating disposed on the pad-installed surface
`and having a plurality of pad-exposed holes for exposure of
`the corresponding pads of the at least one light-emitting
`diode chip; a plurality of conductive projecting blocks, each
`of the conductive projecting blocks disposed on the corre
`sponding pad of the at least one light-emitting diode chip
`and electrically connected to the corresponding conductive
`tracks; a heat-conducting layer formed betWeen the insula
`tive substrate and the at least one light-emitting diode chip;
`and a light-transparent element disposed on the rear face of
`the at least one light-emitting diode chip.
`In order to achieve the above objects, the present inven
`tion provides a light-emitting diode chip package body
`comprising an insulative substrate including at least one
`chip-installed scope, the at least one chip-installed scope
`having a chip-installed surface, a rear face formed opposite
`the chip-installed surface, a through hole penetrating
`through the chip-installed surface and the rear face and a
`plurality of conductive tracks extending from the chip
`installed surface to the rear face through the through hole; a
`substrate insulative layer disposed on the chip-installed
`surface to form an open hole for exposure of a central scope
`of the at least one chip-installed scope; at least one light
`emitting diode chip disposed on the at least one chip
`installed scope of the insulative substrate, and having a
`pad-installed surface formed thereon, a plurality of pads
`installed on the pad-installed surface and a rear surface
`formed on an opposite side of the pad-installed surface; a
`heat-conducting layer formed betWeen the insulative sub
`strate and the at least one light-emitting diode chip; an
`insulative material layer disposed betWeen the internal Wall
`of each of the open holes and the corresponding conductive
`body, the insulative material layer being thicker near the at
`least one light-emitting diode chip and thinner near the
`substrate insulative layer, so that the insulative material
`layer has a concave top face; a metal re?ecting layer formed
`on the insulative material layer; a transparent protection
`layer formed on the metal re?ecting layer; and a plurality of
`conductive projecting blocks, each of the conductive pro
`jecting blocks disposed on the corresponding pad of the at
`
`IPR PAGE 14
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`

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`US 7,339,198 B2
`
`3
`least one light-emitting diode chip and electrically con
`nected to the corresponding conductive tracks.
`In order to achieve the above objects, the present inven
`tion provides a light-emitting diode chip package body
`comprising a light-emitting diode chip having a pad-in
`stalled surface formed thereon, a plurality of pads installed
`on the pad-installed surface and a rear surface formed on an
`opposite side of the pad-installed surface; a light-re?ecting
`coating disposed on the pad-installed surface and having a
`plurality of pad-exposed holes for exposure of the corre
`sponding pads of the light-emitting diode; a ?rst light
`transparent element disposed on the rear face of the light
`emitting diode chip; and a plurality of conductive projecting
`blocks, each of the conductive projecting blocks disposed on
`the corresponding pad of the light-emitting diode.
`In order to achieve the above objects, the present inven
`tion provides a packaging method of a light-emitting diode
`chip package body, the packaging method comprising pro
`viding a light-emitting diode chip having a pad-installed
`surface formed thereon, a plurality of pads installed on the
`pad-installed surface and a rear surface formed on an oppo
`site side of the pad-installed surface; setting a light-re?ect
`ing coating on the pad-installed surface, the light-re?ecting
`coating having a plurality of pad-exposed holes for exposure
`of the corresponding pads of the light-emitting diode; form
`ing a surface insulation layer on the rear surface of the
`light-emitting diode chip, the surface insulation layer having
`a central through hole for exposure of a central portion of the
`rear surface; setting a ?rst light-transparent element in the
`central through hole of the surface insulation layer; and
`setting a plurality of conductive projecting blocks, With each
`of the conductive projecting blocks disposed on the corre
`sponding pad of the light-emitting diode.
`In order to achieve the above objects, the present inven
`tion provides a packaging method of a light-emitting diode
`chip package body, the packaging method comprising pro
`viding a light-emitting diode chip having a pad-installed
`surface formed thereon, a plurality of pads installed on the
`pad-installed surface and a rear surface formed on an oppo
`site side of the pad-installed surface; setting a light-re?ect
`ing coating on the rear surface of the light-emitting diode
`chip; forming an insulative protective layer on the light
`re?ecting coating; forming an insulative layer on the pad
`installed surface of the light-emitting diode chip, the insu
`lative layer having a central through hole for exposure of a
`central portion of the pad-installed surface and plurality of
`pad-exposed holes for exposure of the corresponding pads;
`setting a ?rst light-transparent element in the central through
`hole of the insulation layer; and setting a plurality of
`conductive projecting blocks, each of the conductive pro
`jecting blocks being disposed on the corresponding pad of
`the light-emitting diode.
`In order to achieve the above objects, the present inven
`tion provides a packaging method of a light-emitting diode
`chip package body, the packaging method comprising pro
`viding an insulative substrate including at least one chip
`installed scope, the at least one chip-installed scope having
`a chip-installed surface, a rear face formed opposite the
`chip-installed surface, a through hole penetrating through
`the chip-installed surface and the rear face and a plurality of
`conductive tracks extending from the chip-installed surface
`to the rear face through the through hole; setting a substrate
`insulative layer on the chip-installed surface to form an open
`hole for exposure of a central scope of the at least one
`chip-installed scope; setting at least one light-emitting diode
`chip on the at least one chip-installed scope of the insulative
`substrate, the at least one light-emitting diode chip having a
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`pad-installed surface formed thereon, a plurality of pads
`installed on the pad-installed surface and a rear surface
`formed on an opposite side of the pad-installed surface;
`setting a light-re?ecting coating on the pad-installed surface,
`the light-re?ecting coating having a plurality of pad-exposed
`holes for exposure of the corresponding pads of the at least
`one light-emitting diode chip; setting a plurality of conduc
`tive projecting blocks, each of the conductive projecting
`blocks being disposed on the corresponding pad of the at
`least one light-emitting diode chip and electrically con
`nected to the corresponding conductive tracks; forming a
`heat-conducting layer betWeen the insulative substrate and
`the at least one light-emitting diode chip; and setting a
`light-transparent element on the rear face of the at least one
`light-emitting diode chip.
`In order to achieve the above objects, the present inven
`tion provides a packaging method of a light-emitting diode
`chip package body, the packaging method comprising pro
`viding an insulative substrate including at least one chip
`installed scope, the at least one chip-installed scope having
`a chip-installed surface, a rear face formed opposite the
`chip-installed surface, a through hole penetrating through
`the chip-installed surface and the rear face and a plurality of
`conductive tracks extending from the chip-installed surface
`to the rear face through the through hole; setting a substrate
`insulative layer on the chip-installed surface to form an open
`hole for exposure of a central scope of the at least one
`chip-installed scope; setting at least one light-emitting diode
`chip on the at least one chip-installed scope of the insulative
`substrate, the at least one light-emitting diode chip having a
`pad-installed surface formed thereon, a plurality of pads
`installed on the pad-installed surface and a rear surface
`formed on an opposite side of the pad-installed surface;
`forming a heat-conducting layer betWeen the insulative
`substrate and the at least one light-emitting diode chip;
`setting an insulative material layer betWeen the internal Wall
`of each of the open holes and the corresponding conductive
`body, the insulative material layer being thicker near the at
`least one light-emitting diode chip and thinner near the
`substrate insulative layer, so that the insulative material
`layer has a concave top face; forming a metal re?ecting layer
`on the insulative layer; forming a transparent protection
`layer on the metal re?ecting layer; and setting a plurality of
`conductive projecting blocks, each of the conductive pro
`jecting blocks being disposed on the corresponding pad of
`the at least one light-emitting diode chip and electrically
`connected to the corresponding conductive tracks.
`In order to achieve the above objects, the present inven
`tion provides a packaging method of a light-emitting diode
`chip package body, the packaging method comprising pro
`viding a light-emitting diode chip having a pad-installed
`surface formed thereon, a plurality of pads installed on the
`pad-installed surface and a rear surface formed on an oppo
`site side of the pad-installed surface; setting a light-re?ect
`ing coating on the pad-installed surface, the light-re?ecting
`coating having a plurality of pad-exposed holes for exposure
`of the corresponding pads of the light-emitting diode; setting
`a ?rst light-transparent element on the rear face of the
`light-emitting diode chip; and setting a plurality of conduc
`tive projecting blocks, each of the conductive projecting
`blocks being disposed on the corresponding pad of the
`light-emitting diode.
`It is to be understood that both the foregoing general
`description and the folloWing detailed description are exem
`plary, and are intended to provide further explanation of the
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`IPR PAGE 15
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`US 7,339,198 B2
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`5
`invention as claimed. Other advantages and features of the
`invention will be apparent from the following description,
`drawings and claims.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`The various objects and advantages of the present inven
`tion will be more readily understood from the following
`detailed description when read in conjunction with the
`appended drawing, in which:
`FIGS. 1 to 4 are schematic, cross-sectional views of the
`LED chip package body according to the steps of the ?rst
`embodiment of the present invention;
`FIG. 5 is a schematic, cross-sectional view of the LED
`chip package body according to the second embodiment of
`the present invention;
`FIG. 6 is a schematic, cross-sectional view of the LED
`chip package body according to the third embodiment of the
`present invention;
`FIGS. 7 to 9 are schematic, cross-sectional views of the
`LED chip package body according to the steps of the fourth
`embodiment of the present invention;
`FIG. 10 is a schematic, cross-sectional view of another
`conductive projecting block of the present invention;
`FIG. 11 is a schematic, cross-sectional view of another
`conductive projecting block of the present invention;
`FIGS. 12 to 18 are schematic, cross-sectional views of the
`LED chip package body according to the steps of the ?fth
`embodiment of the present invention;
`FIGS. 19 to 21 are schematic, cross-sectional views of the
`LED chip package body according to the steps of the sixth
`embodiment of the present invention;
`FIGS. 22 to 27 are schematic, cross-sectional views of
`another conductive projecting block according to the steps
`of the present invention;
`FIGS. 28 to 32 are schematic, cross-sectional views of
`another conductive projecting block according to the steps
`of the present invention; and
`FIGS. 33 to 34 are schematic, cross-sectional views of the
`LED chip package body according to the steps of the seventh
`embodiment of the present invention.
`
`DETAILED DESCRIPTION OF PREFERRED
`EMBODIMENTS
`
`Referring to FIGS. 1 to 4, the ?rst embodiment of the
`present invention provides an LED chip package and a
`packaging method of the LED chip package.
`Referring to FIG. 1, the steps of the ?rst embodiment
`provide a light-emitting diode (LED) chip 10. The LED chip
`10 is or is not cut from a wafer and has a pad-installed
`surface 100, a plurality of pads 102 disposed on the pad
`installed surface 100 and a rear surface 101 disposed oppo
`site the pad-installed surface 100.
`The steps of the ?rst embodiment comprise forming a
`light-re?ecting coating 11 on the pad-installed surface 100
`with a plurality of pad-exposed holes 110 for exposure of the
`corresponding pads 102.
`Referring to FIG. 2, the steps of the ?rst embodiment
`comprise setting a plurality of protrusions 12 on the corre
`sponding pads 102, after forming the light-re?ecting coating
`11 on the pad-installed surface 100. The protrusions 12 are
`made of a photoresist material like a polyimide. First,
`photoresist material is used to form a protrusion layer (not
`shown in drawing) on the light-re?ecting coating 11, then
`the protrusions 12 are formed from the protrusion layer by
`a development and exposure process.
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`The steps of the ?rst embodiment comprise forming a
`surface insulative housing 13 on the rear surface 101 of the
`LED chip 10. The surface insulative housing 13 is made of
`a photoresist material like a sensitiZation printing ink. After
`forming the surface insulative housing 13 on the rear surface
`101, a central through hole 130 is formed for exposure of a
`central portion of the rear surface 101 by a development and
`exposure process.
`Referring to FIG. 3, the steps of the ?rst embodiment
`comprise forming a ?rst metal layer 14 on each of the pads
`102 for covering a surface of the corresponding pad 102 and
`the corresponding protrusion 12. The ?rst metal layer 14 is
`made of any metal material like aluminum.
`Then, the steps of the ?rst embodiment comprise forming
`a second metal layer 15 on the ?rst metal layer 14. Each of
`the protrusions 12 and the corresponding ?rst and second
`metal layers 14, 15 are formed together to form a conductive
`projecting block. Each of the second metal layers 15 is
`composed of a nickel layer 150 and a gold layer 151.
`Referring to FIG. 4, the steps of the ?rst embodiment
`comprise setting a light-transparent element 16 in the central
`through hole 130 of the surface insulative layer 13. The
`light-transparent element 16 is made of a polyimide and has
`a cambered top portion. The light-transparent element 16 has
`light-polarizing compound with different wavelengths
`doped therein to provide light passing through the light
`transparent element 16 with good color.
`Referring to FIG. 10, the protrusion 12 is made of metal
`material like gold to form the conductive projecting block.
`When the protrusion 12 is made of gold, the conductive
`projecting block is formed without using the ?rst and second
`metal layer 14,15. Referring to FIG. 11, the steps of the
`present invention comprises forming a bonded metal layer
`28 on each of the pads 102, before using the photoresist to
`form the protrusion 12. The protrusion 12 is formed by any
`processing method in the present invention.
`Above the LED chip package and the packaging method
`of the LED chip package body have some advantages,
`comprising:
`1. The siZe of the LED chip package body is similar to the
`LED chip, so that the siZe of the LED chip package
`body is smaller than “0603”, “0804” and “0402” LED
`chip package bodies on the market.
`2. The packaging method of the LED chip package body
`is made without a wire bonding process, so that the
`output and the quality of the LED chip package body
`are improved.
`Referring to FIG. 5, the second embodiment of the present
`invention provides a light-transparent element 17 with side
`portion ground to form a planar side portion by a grinding
`process.
`Referring to FIG. 6, the third embodiment of the present
`invention further comprises a second light-transparent ele
`ment 18 disposed on the ?rst light-transparent element 17.
`Both the ?rst and the second light-transparent element 17, 18
`have a light-polarizing compound with different wave
`lengths doped therein to provide light passing through the
`?rst and second light-transparent element 17, 18 with a good
`mixing color.
`Referring to FIGS. 7 to 9, the fourth embodiment of the
`present invention provides an LED chip package and a
`packaging method of the LED chip package.
`Referring to FIG. 7, the steps of the fourth embodiment
`provide a light-emitting diode (LED) chip 10 having a
`pad-installed surface 100, a plurality of pads 102 disposed
`on the pad-installed surface 100 and a rear surface 101
`disposed opposite the pad-installed surface 100.
`
`IPR PAGE 16
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`US 7,339,198 B2
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`7
`The steps of the fourth embodiment further provide a
`light-re?ecting coating 11 formed on the rear surface 101 of
`the LED chip 10, forming an insulative protective layer 19
`on the light-re?ecting coating 11, and forming an insulative
`layer 20 on the pad-installed surface 100 of LED chip 10.
`Both the insulative protective layer 19 and the insulative
`layer 20 are made of a photoresist material like a sensitiZa
`tion printing ink.
`Referring to FIG. 8, after the insulative layer 20 is formed
`on the pad-installed surface 100, a central through hole 200
`is formed in the insulative layer 20 for exposure of a central
`portion of the pad-installed surface 100 and a plurality of
`protrusions 12 is disposed on the corresponding pads 102 by
`a development and exposure process.
`Referring to FIG. 9, the steps of the fourth embodiment
`further comprise forming a ?rst metal layer 14 on each of the
`pads 102 for covering a surface of the corresponding pad
`102 and the corresponding protrusion 12. The ?rst metal
`layer 14 is made of any metal material like aluminum.
`Then, the steps of the fourth embodiment further com
`prise forming a second metal layer 15 on the ?rst metal layer
`14. Each protrusion 12 and the corresponding ?rst and
`second metal layers 14, 15 are formed together to form a
`conductive projecting block. Each of the second metal layers
`15 is composed of a nickel layer 150 and a gold layer 151.
`Finally, a light-transparent element 17 is received in the
`central through hole 200 of the insulative layer 20. The
`light-transparent element 17 is made of any material or
`polyimide.
`Referring to FIGS. 12 to 18, the ?fth embodiment of the
`present invention provides an LED chip package and a
`packaging method of the LED chip package.
`Referring to FIGS. 12 and 13, the steps of the ?fth
`embodiment provide at least one light-emitting diode chip
`10 having a pad-installed surface 100, a plurality of pads 102
`disposed on the pad-installed surface 100 and a rear surface
`101 disposed opposite the pad-installed surface 100.
`The steps of the ?fth embodiment further comprise form
`ing a light-re?ecting coating 11 on the pad-installed surface
`100. The light-re?ecting coating 11 has a plurality of pad
`exposed holes 110 for exposure of the corresponding pads
`102.
`The steps of the ?fth embodiment further comprise form
`ing a plurality of protrusions 12 on the corresponding pads
`102, after forming the light-re?ecting coating 11 on the
`pad-installed surface 100. The protrusions 12 are made of a
`photoresist like polyimide. First, photoresist material is used
`to form a protrusion layer (not shoWn in draWing) on the
`light-re?ecting coating 11, then the protrusion layer is devel
`oped and exposed to form the protrusions 12.
`The steps of the ?fth embodiment further comprise form
`ing a ?rst metal layer 14 on each of the pads 102 for covering
`a surface of the corresponding pad 102 and the correspond
`ing protrusion 12. The ?rst metal layer 14 is made of any
`metal material like aluminum.
`The steps of the ?fth embodiment further comprise form
`ing a second metal layer 15 on the ?rst metal layer 14. Each
`of the protrusions 12 and the corresponding ?rst and second
`metal layers 14, 15 are formed together to form a conductive
`projecting block. Each of the second metal layers 15 is
`composed of a nickel layer 150 and a gold layer 151.
`Referring to FIGS. 14 and 15, the steps of the ?fth
`embodiment provide an insulative substrate 21. The insula
`tive substrate 21 has a plurality of chip-installed scopes 210.
`Each of the chip-installed scopes 210 has a chip-installed
`surface 211, a rear face 212 formed opposite the chip
`installed surface 211, a through hole 213 penetrating through
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`the chip-installed surface 211 and the rear face 212, and a
`plurality of conductive tracks 214 extending from the chip
`installed surface 211 to the rear face 212 through the through
`hole 213. The number of the through holes 213 is the same
`as that of the corresponding pads 102 of the LED chip 10.
`The insulative substrate 21 is made of ceramic substrate
`or any insulative substrate like glass substrate.
`Referring to FIG. 16, the steps of the ?fth embodiment
`further comprise forming a substrate insulative layer 22 on
`the chip-installed surface 211 of the insulative substrate 21.
`The substrate insulative layer 22 is made of a photoresist
`material and has a plurality of open holes 220 for exposure
`of a central area of the corresponding chip-installed scopes
`210 by a development and exposure process. Then, the steps
`of the ?fth embodiment further comprise forming a light
`re?ecting coating 23 on an internal Wall of each of the open
`holes 220.
`Referring to FIG. 17, the LED chip 10 is received in the
`chip-installed scope 210. Each of the conductive projecting
`blocks is disposed on the corresponding pads 102 and
`electrically connected to the corresponding conductive
`tracks 214 by a conductive body 24.
`Referring to FIG. 18, the steps of the ?fth embodiment
`further comprise forming a heat-conducting layer 26
`betWeen the insulative substrate 21 and the at least one LED
`chip 10, and tWo opposite conductive bodies 24 by a
`heat-conducting material through the through holes 213. The
`heat-conducting material is a metal-insulator and heat-con
`ductive material or a non-metal-insulator and heat-conduc
`tive material.
`Then, a light-transparent element 25 is disposed on each
`of the LED chip 10. The light-transparent element 25 is
`made of any material or polyimide.
`The light-transparent element 25 has light-polarizing
`compound With different Wavelengths doped therein to pro
`vide light passing through the light-transparent element 25
`With good color.
`Finally, the insulative substrate 21 is cut to form a
`plurality of LED chip package bodies. For example, each of
`the LED chip package bodies has a chip-installed scope 210
`or nine chip-installed scope 210 disposed in a matrix.
`Referring to FIGS. 19 to 21, the sixth embodiment of the
`present invention provides an LED chip package and a
`packaging method of the LED chip package.
`Referring to FIG. 19, the steps of the sixth embodiment
`provide an i