(12) United States Patent
`Huang et al.
`
`(10) Patent N0.:
`(45) Date of Patent:
`
`US 6,667,497 B1
`Dec. 23, 2003
`
`US006667497B1
`
`(54) LED PACKAGE
`
`(75) Inventors: Teng-Huei Huang, Hsinchu (TW);
`Chuan-Ming Chang, Hsinchu (TW);
`Tse-Min Mao, Taipei (TW);
`Min-Huang Huang, Yuan Lin Hsien
`(W)
`(73) Assignee: Advanced Optoelectronic Technology,
`Hsinchu Hsien
`
`( * ) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(21) Appl. No.: 10/271,532
`(22) Filed:
`Oct. 17, 2002
`(30)
`Foreign Application Priority Data
`
`Jun. 21, 2002
`
`..................................... .. 91113659 A
`
`(51) Int. Cl.7 .............................................. .. H01L 29/72
`
`(52) us. Cl. ........................... .. 257/99; 257/81; 257/84;
`257/89; 257/93
`
`(58) Field of Search ............................... .. 257/432, 433,
`257/448, 459, 81, 84, 89, 93, 99
`
`(56)
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`2002/0149312 A1 * 10/2002 Roberts et al. ........... .. 257/433
`* cited by examiner
`Primary Examiner—EdWard WojciechoWicZ
`(74) Attorney, Agent, or Firm—TroXell LaW Of?ce PLLC
`(57)
`ABSTRACT
`
`A LED package is comprised of a ?at panel base and three
`LED dies. The ?at panel base is composed of a ?rst golden
`?lm area, a second golden ?lm area, a third golden ?lm area,
`a fourth golden ?lm area, a ?rst connection area, and a
`second connection area, Wherein the ?rst connection area
`and the second connection area are connected to the ?rst
`golden ?lm area. The ?rst LED die is attached on the ?at
`panel base by ?ip-chip mounting, Wherein an anode of the
`?rst LED die is connected to the ?rst golden ?lm area, and
`a cathode of the ?rst LED die is connected to the second
`golden ?lm area. The second LED die is attached on the ?at
`panel base by ?ip-chip mounting, Wherein the second LED
`die is composed of an anode connected to the ?rst golden
`?lm area, and a cathode connected to the fourth golden ?lm
`area. The third LED die is attached on the third golden ?lm
`area; Wherein the third LED die is composed of an anode
`connected to the ?rst golden ?lm area by a metallic Wire, and
`a cathode connected to the third golden ?lm area.
`
`24 Claims, 2 Drawing Sheets
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`Z92
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`IPR PAGE 1
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`Acuity v. Lynk
`Acuity Ex.
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`1008
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`

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`U.S. Patent
`
`Dec. 23, 2003
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`Sheet 1 0f 2
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`US 6,667,497 B1
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`50
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`20 K
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`i
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`P
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`15115540955555;
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`‘V3013
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`M3021
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`ls
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`Fig.1
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`P
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`50
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`20 \
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`—a
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`N
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`1155552995555};
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`~30b M3081
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`Q
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`Q1
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`Fig.2
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`U.S. Patent
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`Dec. 23, 2003
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`Sheet 2 0f 2
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`US 6,667,497 B1
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`A ?at panel base 10 is first provided
`
`~ 101
`
`l
`
`The first golden film area 20a, the second golden
`film area 20b, the third golden film area 20c, the
`fourth golden film area 20d, the first connection
`area 30a, and the second connection area 30b
`are formed on the flat panel base 10
`
`~ 102
`
`l
`
`The first LED die 40a, the second LED die 40b,
`and the third LED die 40c are attached on the
`?at panel base by means of silver glue
`
`~ 103
`
`1
`
`The anode or cathode of the third LED die 40c
`
`is connected to the common anode or common
`cathode of the LED package by means of Wire bonding
`
`~ 104
`
`l
`
`A PCB is formed by using a glue plate and a mold
`
`'\~ 105
`
`The PCB is cut by using a cutter
`
`~ 106
`
`l
`
`A step of classification is performed by inputting
`a stable current into the LED package
`
`~ 107
`
`Fig.3
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`IPR PAGE 3
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`US 6,667,497 B1
`
`1
`LED PACKAGE
`
`BACKGROUND OF THE INVENTION
`
`1. Field of Invention
`The present invention relates to a packaging design for
`light emitting diode (LED), more particularly, to a LED
`package contains three LED dies.
`2. Description of Related Art
`Light emitting diode (LED) is a junction diode formed by
`an epitaXial P-type layer and an epitaXial N-type layer on a
`heavily doped semiconductor compound base. The diode
`further includes an ohmic metallic contact on the P-type and
`N-type layers. LED is mainly packaged Within an epoXy or
`a metallic housing. Visible LED are generally used in
`display screens, automobile braking lights, scanners, indi
`cator lights for equipment and so on.
`Surface-mount device LED (SMD LED) Was developed
`in the early 1980s. For assembling SMD LED, the chip is
`glued or eutectic bonded to a metallic system carrier, What
`is referred to as a leadframe, namely on a central part or
`island thereof given standard components or, respectively,
`standard ICs, and Wires are bonded to the chip. The chip is
`also completely enveloped With a plastic molding compound
`in an injection molding process such that only the ends of the
`system carrier serving as outer terminals project therefrom.
`SMD LEDs have several of speci?cation, such as 1206M
`(3.0 mm*1.5 mm*0.7 mm), 1206P (With a siZe of 3.0
`mm*1.5 mm*0.7 mm), 0805M (With a siZe of 2.0 mm*1.2
`mm*0.6 mm), and 0603M (With a siZe of 1.6 mm*0.8
`mm*0.5
`Because the 0603M model is especially small
`in siZe, only single light emitting diode could be contained
`in the LED package in accordance With the prior art.
`As soon as the rapid development of mobile phones and
`PDAs (Personal Digital Assistants), there is a request to
`develop colorful LED panels to display colorful images.
`Therefore, it is necessary to develop a LED package With
`three (3) light emitting diodes (generally red, blue, and
`green).
`HoWever, particularly for the smallest 0603M model, the
`conventional LED package can contain only one die, so it is
`impossible to generate colorful images. Therefore, in order
`to display colorful images, it is very important for the LED
`package industry to create a package assembly containing at
`least a red, a blue, and a green light emitting diodes.
`
`SUMMARY OF THE INVENTION
`
`It is the main object of the present invention to provide a
`LED package With three different light emitting diodes (red,
`blue, and green).
`The second object of the present invention is to disclose
`a LED package.
`The third object of the present invention is to provide a
`method for manufacturing a LED package.
`The ?rst embodiment of the present invention discloses a
`LED package, Which is comprised of a ?at panel base and
`three LED dies. The ?at panel base is composed of a ?rst
`golden ?lm area, a second golden ?lm area, a third golden
`?lm area, a fourth golden ?lm area, a ?rst connection area,
`and a second connection area, Wherein the ?rst connection
`area and the second connection area are connected to the ?rst
`golden ?lm area. The ?rst LED die is attached on the ?at
`panel base by ?ip-chip mounting, Wherein an anode of the
`?rst LED die is connected to the ?rst golden ?lm area, and
`
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`20
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`35
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`2
`a cathode of the ?rst LED die is connected to the second
`golden ?lm area. The second LED die is attached on the ?at
`panel base by ?ip-chip mounting, Wherein the second LED
`die is composed of an anode connected to the ?rst golden
`?lm area, and a cathode connected to the fourth golden ?lm
`area. The third LED die is attached on the third golden ?lm
`area; Wherein the third LED die is composed of an anode
`connected to the ?rst golden ?lm area by a metallic Wire, and
`a cathode connected to the third golden ?lm area.
`The second embodiment of the present invention dis
`closes a LED package, Which is comprised of a ?at panel
`base and three LED dies. The ?at panel base is composed of
`a ?rst golden ?lm area, a second golden ?lm area, a third
`golden ?lm area, a fourth golden ?lm area, a ?rst connection
`area, and a second connection area, Wherein the ?rst con
`nection area and the second connection area are connected
`to the ?rst golden ?lm area. The ?rst LED die is attached on
`the ?at panel base by ?ip-chip mounting, Wherein a cathode
`of the ?rst LED die is connected to the ?rst golden ?lm area,
`and an anode of the ?rst LED die is connected to the second
`golden ?lm area. The second LED die is attached on the ?at
`panel base by ?ip-chip mounting, Wherein the second LED
`die is composed of a cathode connected to the ?rst golden
`?lm area, and an anode connected to the fourth golden ?lm
`area. The third LED die is attached on the third golden ?lm
`area; Wherein the third LED die is composed of a cathode
`connected to the ?rst golden ?lm area by a metallic Wire, and
`an anode connected to the third golden ?lm area.
`The process How of the method of manufacturing a LED
`package according to the present invention is also disclosed.
`A?at panel base is ?rst provided. Thereafter, the ?rst golden
`?lm area, the second golden ?lm area, the third golden ?lm
`area, the fourth golden ?lm area, the ?rst connection area,
`and the second connection area are formed on the ?at panel
`base. After that, the ?rst LED die, the second LED die, and
`the third LED die are attached on the ?at panel base by
`means of silver glue.
`NeXt, the anode or cathode of the third LED die is
`connected to the common anode or common cathode of the
`LED package by Wire bonding.
`Thereafter, a PCB is formed by using a glue plate and a
`mold, and then the PCB is cut by using a cutter. Finally, a
`step of classi?cation is performed by inputting a stable
`current into the LED package.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`The accompanying draWings are included to provide a
`further understanding of the invention, and are incorporated
`in and constitute a part of this speci?cation. The draWings
`illustrate embodiments of the invention and, together With
`the description, serve to eXplain the principles of the inven
`tion. In the draWings,
`FIG. 1 schematically illustrates the top-vieW diagram of
`the LED package according to the ?rst embodiment of the
`present invention;
`FIG. 2 schematically illustrates the top-vieW diagram of
`the LED package according to the second embodiment of
`the present invention;
`FIG. 3 discloses the process How of the method of
`manufacturing a LED package according to the present
`invention.
`
`DESCRIPTION OF THE PREFERRED
`EMBODIMENTS
`The present invention relates to a packaging design for
`light emitting diode (LED), more particularly, to a LED
`package contains three LED dies.
`
`IPR PAGE 4
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`US 6,667,497 B1
`
`3
`First please refer to FIG. 1, Which schematically illus
`trates the top-vieW diagram of the LED package according
`to the ?rst embodiment of the present invention. The LED
`package is composed of a ?at panel base 10, the ?rst LED
`die 40a, the second LED die 40b, and the third LED die 40c.
`The ?at panel base 10 is composed of a ?rst golden ?lm
`area 20a, a second golden ?lm area 20b, a third golden ?lm
`area 20c, a fourth golden ?lm area 20d, a ?rst connection
`area 30a, and a second connection area 30b. The ?rst
`connection area 30a and the second connection area 30b are
`connected to the ?rst golden ?lm area 20a.
`The ?rst golden ?lm area 20a serves as the common
`anode of the LED package. The second golden ?lm area 20b
`serves as the cathode for blue color of the LED package. The
`third golden ?lm area 20c Works as the cathode for green
`color of the LED package. The fourth ?lm area 20d Works
`as the cathode for the red color of the LED package.
`The ?rst LED die 40a is a blue-colored light emitting
`diode manufactured from InGaN. The ?rst LED die 40a is
`attached on the ?at panel base 10 by ?ip-chip mounting. The
`anode of the ?rst LED die 40a is connected to the ?rst
`connection area 30a and then to the ?rst golden ?lm area
`20a. The cathode of the ?rst LED die 40a is connected to the
`second golden ?lm area 20b.
`The second LED die 40b is a green-colored light emitting
`diode manufactured from InGaN. The second LED die 40b
`is attached on the ?at panel base 10 by ?ip-chip mounting.
`The anode of the second LED die 40b is connected to the
`second connection area 30b, and then to the ?rst golden ?lm
`area 20a. The cathode of the second LED die 40b is
`connected to the fourth golden ?lm area 20d.
`The third LED die 40c is a red-colored light emitting
`diode attached on the third golden ?lm area 20c. The anode
`of the third LED die 40c is connected to the ?rst golden ?lm
`area 20a by a metallic Wire 50. The cathode of the third LED
`die 40c is connected to the third golden ?lm area 20c.
`According to a preferred embodiment of the present
`invention, the LED package can specially be a 0603 model
`package.
`Please then to FIG. 2, Which schematically illustrates the
`top-vieW diagram of the LED package according to the
`second embodiment of the present invention. The LED
`package is composed of a ?at panel base 10, the ?rst LED
`die 40a, the second LED die 40b, and the third LED die 40c.
`The ?at panel base 10 is composed of a ?rst golden ?lm
`area 20a, a second golden ?lm area 20b, a third golden ?lm
`area 20c, a fourth golden ?lm area 20d, a ?rst connection
`area 30a, and a second connection area 30b. The ?rst
`connection area 30a and the second connection area 30b are
`connected to the ?rst golden ?lm area 20a.
`The ?rst golden ?lm area 20a serves as the common
`cathode of the LED package. The second golden ?lm area
`20b serves as the anode for blue color of the LED package.
`The third golden ?lm area 20c Works as the anode for green
`color of the LED package. The fourth ?lm area 20d Works
`as the anode for the red color of the LED package.
`The ?rst LED die 40a is a blue-colored light emitting
`diode manufactured from InGaN. The ?rst LED die 40a is
`attached on the ?at panel base 10 by ?ip-chip mounting. The
`cathode of the ?rst LED die 40a is connected to the ?rst
`connection area 30a and then to the ?rst golden ?lm area
`20a. The anode of the ?rst LED die 40a is connected to the
`second golden ?lm area 20b.
`The second LED die 40b is a green-colored light emitting
`diode manufactured from InGaN. The second LED die 40b
`
`10
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`55
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`4
`is attached on the ?at panel base 10 by ?ip-chip mounting.
`The cathode of the second LED die 40b is connected to the
`second connection area 30b, and then to the ?rst golden ?lm
`area 20a. The anode of the second LED die 40b is connected
`to the fourth golden ?lm area 20d.
`The third LED die 40c is a red-colored light emitting
`diode attached on the third golden ?lm area 20c. The
`cathode of the third LED die 40c is connected to the ?rst
`golden ?lm area 20a by a metallic Wire 50. The anode of the
`third LED die 40c is connected to the third golden ?lm area
`20c.
`According to a preferred embodiment of the present
`invention, the LED package can specially be a 0603 model
`package.
`Referring then to FIG. 3, the process How of the method
`of manufacturing a LED package according to the present
`invention is disclosed. A ?at panel base 10 is ?rst provided
`(step 101). Thereafter, the ?rst golden ?lm area 20a, the
`second golden ?lm area 20b, the third golden ?lm area 20c,
`the fourth golden ?lm area 20d, the ?rst connection area 30a,
`and the second connection area 30b are formed on the ?at
`panel base 10 (step 102). After that, the ?rst LED die 40a,
`the second LED die 40b, and the third LED die 40c are
`attached on the ?at panel base by means of silver glue (step
`103).
`Next, the anode or cathode of the third LED die 40c is
`connected to the common anode or common cathode of the
`LED package by means of Wire bonding (step 104).
`Thereafter, a PCB is formed by using a glue plate and a
`mold (step 105), and then the PCB is cut by using a cutter
`(step 106). Finally, a step of classi?cation is performed by
`inputting a stable current into the LED package (step 107).
`While the present invention has been described With the
`reference to a preferred embodiment thereof, those skilled in
`the art Will appreciate various changes in form and detail
`may be made Without departing from the intended scope of
`the present invention as de?ned in the appended claims.
`What is claimed is:
`1. A LED package comprising:
`a ?at panel base, Which is composed of a ?rst golden ?lm
`area, a second golden ?lm area, a third golden ?lm area,
`a fourth golden ?lm area, a ?rst connection area, and a
`second connection area, Wherein said ?rst connection
`area and said second connection area are connected to
`said ?rst golden ?lm area;
`a ?rst LED die attached on said ?at panel base by ?ip-chip
`mounting, Wherein an anode of said ?rst LED die is
`connected to said ?rst connection area and then to said
`?rst golden ?lm area, and a cathode of said ?rst LED
`die is connected to said second golden ?lm area;
`a second LED die attached on said ?at panel base by
`?ip-chip mounting, Wherein said second LED die is
`composed of an anode connected to said second con
`nection area and then to said ?rst golden ?lm area, and
`a cathode connected to said fourth golden ?lm area;
`a third LED die attached on said third golden ?lm area;
`Wherein said third LED die is composed of an anode
`connected to said ?rst golden ?lm area by a metallic
`Wire, and a cathode connected to said third golden ?lm
`area.
`2. The LED package of claim 1, Wherein said LED
`package is a 0603 model package.
`3. The LED package of claim 1, Wherein said ?rst LED
`die, said second LED die, and said third LED die are
`attached on said ?at panel base by means of silver glue.
`
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`US 6,667,497 B1
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`5
`4. The LED package of claim 1, wherein said ?rst golden
`?lm area serves as a common anode of said LED package.
`5. The LED package of claim 1, Wherein said ?rst LED
`die is a blue-colored light emitting diode manufactured from
`InGaN.
`6. The LED package of claim 1, Wherein said second
`golden ?lm area serves as a cathode for blue color of the
`LED package.
`7. The LED package of claim 1, Wherein said second LED
`die is a green-colored light emitting diode manufactured
`from InGaN.
`8. The LED package of claim 1, Wherein said third golden
`?lm area serves as a cathode for green color of the LED
`package.
`9. The LED package of claim 1, Wherein said second LED
`die is a red-colored light emitting diode.
`10. The LED package of claim 1, Wherein said fourth
`golden ?lm area serves as a cathode for red color of the LED
`package.
`11. A LED package comprising:
`a ?at panel base, Which is composed of a ?rst golden ?lm
`area, a second golden ?lm area, a third golden ?lm area,
`a fourth golden ?lm area, a ?rst connection area, and a
`second connection area, Wherein said ?rst connection
`area and said second connection area are connected to
`said ?rst golden ?lm area;
`a ?rst LED die attached on said ?at panel base by ?ip-chip
`mounting, Wherein a cathode of said ?rst LED die is
`connected to said ?rst connection area and then to said
`?rst golden ?lm area, and an anode of said ?rst LED die
`is connected to said second golden ?lm area;
`a second LED die attached on said ?at panel base by
`?ip-chip mounting, Wherein said second LED die is
`composed of a cathode connected to said second con
`nection area and then to said ?rst golden ?lm area, and
`an anode connected to said fourth golden ?lm area;
`a third LED die attached on said third golden ?lm area;
`Wherein said third LED die is composed of a cathode
`connected to said ?rst golden ?lm area by a metallic
`Wire, and an anode connected to said third golden ?lm
`area.
`12. The LED package of claim 11, Wherein said LED
`package is a 0603 model package.
`
`10
`
`15
`
`25
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`35
`
`6
`13. The LED package of claim 11, Wherein said ?rst LED
`die, said second LED die, and said third LED die are
`attached on said ?at panel base by means of silver glue.
`14. The LED package of claim 11, Wherein said ?rst
`golden ?lm area serves as common cathode of said LED
`package.
`15. The LED package of claim 11, Wherein said ?rst LED
`die is a blue-colored light emitting diode manufactured from
`InGaN.
`16. The LED package of claim 11, Wherein said second
`golden ?lm area serves as an anode for blue color of the LED
`package.
`17. The LED package of claim 11, Wherein said second
`LED die is a green-colored light emitting diode manufac
`tured from InGaN.
`18. The LED package of claim 11, Wherein said third
`golden ?lm area serves as an anode for green color of the
`LED package.
`19. The LED package of claim 11, Wherein said second
`LED die is a red-colored light emitting diode.
`20. The LED package of claim 11, Wherein said fourth
`golden ?lm area serves as an anode for red color of the LED
`package.
`21. A method of forming a LED package, comprising:
`providing a ?at panel base;
`forming a ?rst golden ?lm area, a second golden ?lm area,
`a third golden ?lm area, a fourth golden ?lm area, a ?rst
`connection area, and a second connection area on said
`?at panel base;
`attaching a ?rst LED die, a second LED die, and a third
`LED die on said ?at panel base by using silver glue;
`and
`Wire-bonding an electrode of a third LED die to a com
`mon electrode of said LED package.
`22. A method of claim 21, further comprising a step of
`forming a PCB by using a glue plate and a mold.
`23. A method of claim 21, further comprising a step of
`cutting a PCB by using a cutter.
`24. A method of claim 21, further comprising a step of
`performing a step of classi?cation by inputting a stable
`current into the LED package.
`
`*
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