(12) United States Patent
`Chen
`
`I lllll llllllll Ill lllll lllll lllll lllll lllll 111111111111111111111111111111111
`US006909234 B2
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 6,909,234 B2
`Jun.21,2005
`
`(54) PACKAGE STRUCTURE OF A COMPOSITE
`LED
`
`(75)
`
`Inventor: Hsing Chen, Ju-Bei (TW)
`
`(73) Assignee: Solidlite Corporation, Shin-Chu (TW)
`
`5,998,925 A * 12/1999 Shimizu et al. ............. 313/503
`6,310,364 Bl * 10/2001 Uemura ...................... 257/100
`6,396,082 Bl * 5/2002 Fukasawa et al.
`............ 257/79
`6,653,661 B2 * 11/2003 Okazaki ...................... 257/98
`6,667,190 B2 * 12/2003 Kung et al. ................. 438/107
`6,686,609 Bl * 2/2004 Sung .......................... 257/100
`
`( *) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 191 days.
`
`* cited by examiner
`
`(21) Appl. No.: 10/315,649
`
`(22) Filed:
`
`Dec. 9, 2002
`
`(65)
`
`Prior Publication Data
`
`US 2004/0000867 Al Jan. 1, 2004
`
`(30)
`
`Foreign Application Priority Data
`
`Jun. 27, 2002
`
`(TW) ....................................... 91114438 A
`
`Int. Cl.7 ............................. HOU 1/62; HOlL 23/02
`(51)
`(52) U.S. Cl. ........................ 313/512; 257/678; 438/107
`(58) Field of Search ............................. 257/88, 98-100,
`257/678, 684, 687; 313/512, 498-511; 438/106-108,
`118, 127
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`5,998,232 A * 12/1999 Maruska ...................... 438/46
`
`Primary Examiner-Joseph Williams
`Assistant Examiner-German Colon
`(74) Attorney, Agent, or Firm---Pro-Techtor International
`Services
`
`(57)
`
`ABSTRACT
`
`A package structure of a composite LED is to package an
`LED chip into a SMD LED package subbody component.
`Then, a single SMD LED package subbody component or
`multiple SMD LED package subbody components may be
`packaged into a large sized recessed package mother body,
`thereby forming the package structure of a composite LED.
`Thus, the quality is better, and the color shift is less, thereby
`enhancing the quality of production, and thereby decreasing
`the cost of production. In addition, the SMD LED may be
`previously classified according to the features, and may then
`be packaged into the mother body, thereby obtaining better
`features, such as Vf, color, brightness or the like.
`
`8 Claims, 5 Drawing Sheets
`
`IPR PAGE 1
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`Acuity v. Lynk
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`U.S. Patent
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`Jun. 21, 2005
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`Sheet 1 of s
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`US 6,909,234 B2
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`9.
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`FIG.l
`(PRIOR ART)
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`(PRIOR ART)
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`IPR PAGE 2
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`Jun. 21, 2005
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`Sheet 2 of s
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`FIG.3
`(PRIOR ART)
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`5
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`FIG.4
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`IPR PAGE 3
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`U.S. Patent
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`Jun. 21, 2005
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`Sheet 3 of s
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`l 8
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`FIG.5
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`FIG.6
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`IPR PAGE 4
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`U.S. Patent
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`Jun. 21, 2005
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`Sheet 4 of s
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`IPR PAGE 5
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`U.S. Patent
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`Jun. 21, 2005
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`Sheets of s
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`FIG.9
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`US 6,909,234 B2
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`1
`PACKAGE STRUCTURE OF A COMPOSITE
`LED
`
`BACKGROUND OF THE INVENTION
`
`2
`into a white SMD LED. Then, the white SMD LED may be
`placed in the recessed larger sized case package. The end
`electrode of the white SMD LED may be connected to the
`inner electrode in the recessed larger sized case package.
`5 Then, a transparent resin may be added into the recess of the
`recessed larger sized case package, thereby forming the
`composite white LED including the subbody and the mother
`body.
`The SMD is made by a molding procedure, so that the
`velocity of production is faster. In addition, the molding
`material is the solid compound that is made by the phosphor
`mixed with the molding colloid. The solid compound made
`by the phosphor mixed with the molding colloid may be
`coated on the LED chip evenly during the molding process,
`so that the color coordinate of the emitted light is more
`concentrated.
`In addition, the package structure of a composite LED of
`the present invention may be used to make a high power
`multi-chip package structure. In general, the high power
`20 white LED may be made by the following methods.
`The first method is to use multiple lamp type LEDs that
`are packaged together, so that the entire structure has greater
`brightness. In the first method, multiple LED chip are placed
`in the recess of the different lead frame, and are initially
`treated by a diode bonding and wire bonding process. Then,
`the phosphor is coated on the multiple LED chip, thereby
`packaging the multiple LED chip into the white LED. In
`such a manner, the volume is larger.
`The second method is to use a multi-chip package struc-
`ture to produce the LED with greater brightness. In the
`second method, the electrode that needs a wire bonding
`process faces downward to cover the positive and negative
`electrodes in the recess by using a Filp Chip technology, so
`35 that the electrode needs not to be treated by a wire bonding
`process, and the volume may be reduced. In such a manner,
`the quality, wavelength and Vf of the chips are not
`distinguished, so that the chips easily cause problems in the
`manufacturing procedure.
`The difference between the package process of the pack-
`age structure of a composite LED of the present invention
`and that of the conventional high power multi-chip package
`structure is described as follows. In the present invention,
`multiple SMD LEDs are initially packaged. Then, the mul-
`tiple packaged SMD LEDs are packaged into a larger
`package body. Thus, the quality of production is better. In
`addition, the wavelength, Vf and brightness of the LED
`chips may be classified before package of the SMD LEDs,
`thereby enhancing the convenience and choice of the LED
`procedure. Further, the SMD is processed by the molding
`procedure, thereby enhancing the velocity and survival rate.
`Further, the volume is very small, so that the package
`manner of the composite structure makes the color more
`evenly.
`On the other hand, the package structure of a composite
`LED of the present invention may be used to a single mixed
`color LED (such as purplish pink LED). In such a manner,
`a single SMD LED or multiple SMD LEDs may be pack(cid:173)
`aged in the recess of the same lead frame. In addition, the
`60 SMD type package structure has a smaller volume, and may
`solve the problem in that the phosphor is not evenly dis(cid:173)
`tributed. Further, the wavelength, Vf, color and brightness of
`the LED chip may be classified before the SMD LEDs are
`packaged into a larger package body, thereby greatly
`enhancing the quality of production.
`The primary objective of the present invention is to
`provide a package structure of a composite LED, to improve
`
`1. Field of the Invention
`The present invention relates to a package structure of a
`composite LED, and more particularly to a package structure
`of a composite LED, wherein the quality is better, and the 10
`color shift is less, thereby enhancing the quality of
`production, and thereby decreasing the cost of production.
`2. Description of the Related Art
`In general, the LED (light emitting diode) has a long
`lifetime, can save the electric power, has a quick reaction 15
`velocity, has a high reliability, is environment protective,
`and may be used safely. The white LED is commonly used
`in the modern world.
`The conventional method for manufacturing a white LED
`adopts a single LED chip to produce the white light. The
`surface of the single LED chip is coated with a layer of
`phosphor, so that the light produced by the single LED chip
`may excite the phosphor, so as to produce rays with different
`wavelengths. The rays with different wavelengths may mix
`with the rays produced by the single LED chip, so as to 25
`produce the white LED.
`In the recent years, the conventional method for manu(cid:173)
`facturing a white LED adopts a blue LED chip (the wave(cid:173)
`length is ranged between 450 nm and 470 nm) and YAG
`yellow phosphor. Thus, the blue light of the blue LED chip
`may excite the YAG yellow phosphor to produce yellow
`light that may be mixed with the blue light of the blue LED
`chip, so that the yellow color and the blue color may be
`complimentary with each other, thereby producing the white
`LED. The most important disturbance of the first conven(cid:173)
`tional method for manufacturing a white LED is the color
`shift phenomenon. After the colloid and phosphor are mixed
`during the colloid bonding process, the phosphor will be
`deposited, thereby producing the color shift phenomenon. In
`addition, the amount of the YAG yellow phosphor cannot be 40
`controlled exactly, so that the white LED easily produces
`excessive bluish light or yellowish light.
`
`30
`
`SUMMARY OF THE INVENTION
`
`45
`
`The closest prior art references of which the applicant is
`aware are disclosed in his U.S. Pat. No. 5,952,681 and U.S.
`Pat. No. 5,962,971.
`The present invention has arisen to mitigate and/or obvi-
`ate the disadvantage of the conventional package structure 50
`of a composite LED.
`The present invention is to provide a package structure of
`a composite LED, including a subbody consisting of a small
`sized SMD (surface mount diode) LED component added
`with phosphor, and a mother body consisting of a larger 55
`sized case package. Thus, the small sized SMD LED com(cid:173)
`ponent added with phosphor may be placed in the larger
`sized case package, thereby forming a composite package
`structure which is called a composite LED including the
`subbody and the mother body.
`In the package technology of the package structure of a
`composite LED of the present invention, the LED chip is
`initially treated on the SMD substrate by a diode bonding
`and wire bonding process. Then, the package resin contain(cid:173)
`ing the phosphor is packaged into the small sized SMD LED 65
`(such as 1.6*0.8 mm of the 0603 type or 1.0*0.5 mm of the
`0402 type), so that the small sized SMD LED may be made
`
`IPR PAGE 7
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`

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`US 6,909,234 B2
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`3
`the color shift problem, to enhance the quality of production,
`to make a high power multi-chip LED illumination module
`that is available for illumination, indication and backlight.
`In accordance with one aspect of the present invention,
`there is provided a package structure of a composite LED, 5
`comprising:
`an LED chip;
`a lead frame or substrate, for fixing the LED chip, and
`having positive and negative electrodes;
`a package colloid containing a phosphor, wherein the
`phosphor may be excited by light emitted from the LED
`chip;
`at least one SMD LED package subbody component, for
`molding the LED chip, the lead frame or substrate and the 15
`package colloid containing a phosphor into an integral body;
`a large sized package mother body, having inner elec(cid:173)
`trodes connected to outer electrodes of the SMD LED
`package subbody component; and
`a transparent package colloid, filled in the large sized
`package mother body, for covering the SMD LED package
`subbody component.
`Preferably, the LED chip is packaged into the SMD LED
`package subbody component in a diode bonding and wire
`bonding manner or in a Filp Chip manner.
`Preferably, the package structure includes a single SMD
`LED package subbody component or multiple SMD LED
`package subbody components.
`Preferably, the large sized package mother body is made 30
`of a metal, ceramics, a PCB, a semiconductor or plastic
`material.
`Preferably, the large sized package mother body has a top
`light type, a side light type, a lamp type and a SMD type.
`Preferably, when the large sized package mother body has 35
`a side light type, the light emitting face has a circular,
`rectangular or oblong structure.
`In accordance with another aspect of the present
`invention, there is provided a package method of a compos- 40
`ite LED, comprising the steps of:
`providing at least one small sized SMD LED package
`subbody component containing a phosphor;
`providing a large sized package mother body;
`packaging the small sized SMD LED package subbody
`component into the large sized package mother body, so that
`outer electrodes of the SMD LED package subbody com(cid:173)
`ponent are connected to inner electrodes of the large sized
`package mother body; and
`adding a package colloid into the large sized package
`mother body, thereby forming a composite LED.
`Preferably, the composite LED includes a single SMD
`LED package subbody component or multiple SMD LED
`package subbody components.
`Preferably, the SMD LED package subbody component
`includes a red SMD LED, a green SMD LED and a blue
`SMD LED which are packaged into the large sized package
`mother body simultaneously, thereby forming a single triple(cid:173)
`wavelength white LED.
`Preferably, the SMD LED package subbody component
`includes a white SMD LED or a mixed color SMD LED
`excited by other phosphor.
`Further benefits and advantages of the present invention
`will become apparent after a careful reading of the detailed
`description with appropriate reference to the accompanying
`drawings.
`
`4
`BRIEF DESCRIPTION OF THE DRAWINGS
`FIG. 1 is a schematic view of a conventional top light type
`white LED package structure in accordance with the prior
`art;
`FIG. 2 is a schematic view of a conventional PCB type
`white LED package structure in accordance with the prior
`art;
`FIG. 3 is a schematic view of a conventional molding
`10 SMD type white LED package structure in accordance with
`the prior art;
`FIG. 4 is a schematic view of a package structure of a
`composite LED in accordance with a first embodiment of the
`present invention;
`FIG. 5 is a schematic view of a package structure of a
`composite LED in accordance with a second embodiment of
`the present invention;
`FIG. 6 is a schematic view of a package structure of a
`composite LED in accordance with the second embodiment
`20 of the present invention;
`FIG. 7 is a schematic view of a package structure of a
`composite LED in accordance with a third embodiment of
`the present invention;
`FIG. 8 is a schematic view of a package structure of a
`25 composite LED in accordance with a fourth embodiment of
`the present invention; and
`FIG. 9 is a schematic view of a package structure of a
`composite LED in accordance with a fifth embodiment of
`the present invention.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`Referring to the drawings and initially to FIG. 4, a
`package structure of a composite LED in accordance with a
`first embodiment of the present invention comprises an LED
`chip 1, a SMD package support 3, a phosphor 11, a package
`colloid (or epoxy) 4, a top light package support 5, two inner
`electrodes 6, and two top light outer electrodes 9.
`The LED crystal 1 is a blue LED chip 1 (the wavelength
`is ranged between 430 nm and 470 nm) that may provide a
`light source and may excite the phosphor 11 to produce other
`wavelengths.
`The phosphor 11 is a yellow phosphor 11 that may be used
`45 to absorb the blue light emitted from the blue LED chip 1,
`and may convert the blue light into the yellow light of a
`different wavelength. The yellow light and the blue light are
`complimentary with each other to produce the white light.
`The manufacturing process of the package structure of a
`50 composite LED in accordance with the first embodiment of
`the present invention is described as follows.
`First of all, a blue LED chip 1 is chosen. Then, the blue
`LED chip 1 is placed on the SMD package support 3 by a
`diode bonding and wire bonding process, and is packaged
`55 into a SMD LED 7 in a molding manner the molding
`compound is previously added with the required phosphor
`11, and is evenly distributed around the periphery of the blue
`LED chip 1 in the molding process, so that a white SMD
`LED 7 may be made in the molding process. Then, the SMD
`60 LED 7 is placed on a larger sized top light package support
`5 and is heated, so that the terminal electrodes of the SMD
`LED 7 are combined with the two inner electrodes 6 of the
`larger sized top light package support 5. Finally, the package
`colloid (or epoxy) 4 are added into the recess of the larger
`65 sized top light package support 5, thereby completing a
`single top light type white light composite LED in accor(cid:173)
`dance with the first embodiment of the present invention.
`
`IPR PAGE 8
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`US 6,909,234 B2
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`20
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`25
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`5
`Referring to FIGS. 5 and 6, a package structure of a
`composite LED in accordance with a second embodiment of
`the present invention comprises a SMD LED 7, a phosphor
`11, a package colloid (or epoxy) 4, a side light package
`support 13, and a rectangular package 18 or an oblong 5
`package 19.
`FIG. 5 is a schematic view of a rectangular package of the
`package structure of a composite LED in accordance with
`the second embodiment of the present invention, and FIG. 6
`is a schematic view of an oblong package of the package
`structure of a composite LED in accordance with the second
`embodiment of the present invention.
`The SMD LED 7 is a white light SMD LED 7 to provide
`a subbody of a white light source.
`The side light package support 13 has an inside containing
`the rectangular package 18 or the oblong package 19, so that
`the side light package support 13 may function as a mother
`body of the package structure.
`The manufacturing process of the package structure of a
`composite LED in accordance with the second embodiment
`of the present invention is the same as that of the package
`structure of a composite LED in accordance with the first
`embodiment of the present invention, and is described as
`follows.
`The SMD LED 7 is placed in the side light package
`support 13 and is heated, so that the terminal electrodes of
`the SMD LED 7 are combined with the two inner electrodes
`6 of the larger sized side light package support 13, thereby
`forming a single side light type white light composite LED 30
`in accordance with the second embodiment of the present
`invention.
`Referring to FIG. 7, a package structure of a composite
`LED in accordance with a third embodiment of the present
`invention comprises a SMD LED 7, a phosphor 11, a
`package colloid (or epoxy) 4, a lamp type package support
`10, a conducting wire 2, and a PCB 12.
`The SMD LED 7 is a white SMD LED 7 to provide a
`subbody of a white light source.
`The PCB 12 is a printed circuit board that may be used to
`support the SMD LED 7 and to connect the lamp type
`package support 10.
`The manufacturing process of the package structure of a
`composite LED in accordance with the third embodiment of
`the present invention is the same as that of the package
`structure of a composite LED in accordance with the first
`embodiment of the present invention, and is described as
`follows.
`The white SMD LED 7 is initially placed on the PCB 12, 50
`and is then placed in the package of the lamp type package
`support 10. The white SMD LED 7 is treated by a wire
`bonding process, so that the white SMD LED 7 is connected
`to the lamp type package support 10. Finally, the white SMD
`LED 7 is packaged by the mold into a single lamp type white 55
`composite LED in accordance with the third embodiment of
`the present invention.
`Referring to FIG. 8, a package structure of a composite
`LED in accordance with a fourth embodiment of the present
`invention comprises a SMD LED 7, a phosphor 11, a 60
`package colloid (or epoxy) 4, a top light package support 5,
`a lens 8, multiple inner electrodes 6, and two top light outer
`electrodes 9.
`The SMD LED 7 is a white SMD LED 7 to provide a
`subbody of a white light source. In the fourth embodiment 65
`of the present invention, multiple SMD LEDs 7 are pack(cid:173)
`aged in a larger sized top light package support 5.
`
`6
`The lens 8 may be used to focus the light emitted from the
`multiple SMD LEDs 7.
`The manufacturing process of the package structure of a
`composite LED in accordance with the fourth embodiment
`of the present invention is the same as that of the package
`structure of a composite LED in accordance with the first
`embodiment of the present invention, and is described as
`follows.
`The multiple white SMD LEDs 7 are placed on the
`10 multiple inner electrodes 6 in the larger sized top light
`package support 5 to conduct the multiple white SMD LEDs
`7. Then, the multiple white SMD LEDs 7 are packaged by
`the package colloid (or epoxy) 4 into a single top light type
`white light composite LED in accordance with the fourth
`15 embodiment of the present invention. The lens 8 may be
`made on the light outlet face of the top light type LED in a
`coating manner. FIG. 8 shows multiple high power white
`light composite LEDs in accordance with the fourth embodi(cid:173)
`ment of the present invention.
`Referring to FIG. 9, a package structure of a composite
`LED in accordance with a fifth embodiment of the present
`invention comprises a blue SMD LED 15, a red SMD LED
`16, a green SMD LED 17, a package colloid (or epoxy) 4,
`a top light package support 5, inner electrodes 6, and top
`light outer electrodes 9.
`The manufacturing process of the package structure of a
`composite LED in accordance with the fifth embodiment of
`the present invention is described as follows.
`First of all, a blue SMD LED 1, a red SMD LED 1 and
`a green SMD LED 1 are chosen. Then, the blue, red and
`green SMD LEDs 1 are placed on the SMD package support
`3 by a diode bonding and wire bonding process, and are
`respectively packaged into the blue SMD LED 15, the red
`35 SMD LED 16 and the green SMD LED 17 by a molding
`process. Then, the blue SMD LED 15, the red SMD LED 16
`and the green SMD LED 17 are placed in the larger sized top
`light package support 5 and are fixed by the joints 14, so that
`the electrodes of the blue SMD LED 15, the red SMD LED
`40 16 and the green SMD LED 17 are conducted with the inner
`electrodes 6 in the larger sized top light package support 5.
`Finally, the package colloid (or epoxy) 4 is packaged into the
`larger sized top light package support 5, thereby forming a
`triple-wavelength white light composite LED in accordance
`45 with the fifth embodiment of the present invention, wherein
`the triple-wavelength white consists of the blue SMD LED
`15, the red SMD LED 16 and the green SMD LED 17.
`The white SMD LED of the package structure of a
`composite LED in accordance with the present invention
`may use the blue light of the blue LED chip to excite the
`YAG yellow phosphor to produce a yellow light that may be
`mixed with the blue light of the blue LED chip, so that the
`yellow color and the blue color may be complimentary with
`each other, thereby producing the white LED with two
`wavelengths. In addition, the white SMD LED of the
`package structure of a composite LED in accordance with
`the present invention may also use the ultraviolet LED chip
`(the wavelength is ranged between 350 nm and 390 nm)
`which is added with the phosphor mixed with red, blue and
`green colors, or use the violet LED chip (the wavelength is
`ranged between 390 nm and 410 nm) which is added with
`the phosphor mixed with red, blue and green colors, or use
`the blue LED chip (the wavelength is ranged between 430
`nm and 480 nm) which is added with the phosphor mixed
`with red and green colors, so as to produce the white light
`with three wavelengths, thereby producing a white light
`source with better colors.
`
`IPR PAGE 9
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`US 6,909,234 B2
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`7
`The package structure of a composite LED in accordance
`with the present invention is to improve the mixed-color
`LED excited by the phosphor, such as the white LED, the
`purplish pink LED or the like. If the phosphor layer is
`packaged in a coating manner, the phosphor is deposited at 5
`a greater velocity, so that the distribution is uneven, and the
`stability of the X and Y color coordinates cannot be con(cid:173)
`trolled easily, thereby decreasing the quality of production.
`In addition, the drop manner has a complicated process due
`to the phosphor colloid, and the velocity of production is 10
`decreased. The package structure of a composite LED in
`accordance with the present invention may initially make a
`smaller sized SMD LED component by a molding process.
`Then, a single smaller sized SMD LED component or a
`plurality of smaller sized SMD LED components is/are 15
`packaged into a larger sized package structure. The phos(cid:173)
`phor may be fully mixed with the molding compound by the
`molding process, so that the phosphor is distributed more
`evenly and is controlled easier during the molding process,
`thereby enhancing the quality of production, and thereby 20
`decreasing the cost of production.
`In conclusion, the package structure of a composite LED
`in accordance with the present invention has the following
`advantages.
`1. The quality is better, and the color shift is less, thereby
`enhancing the quality of production, and thereby decreasing
`the cost of production.
`2. The SMD LED may be previously classified according
`to the features (such as Vf, color, brightness or the like), and 30
`may then be packaged into the mother body, thereby obtain(cid:173)
`ing better features (such as Vf, color, brightness or the like).
`It is appreciated that, the brightness of the LED is shifted due
`to different Vf.
`3. Multiple SMD LEDs may be packaged together in the 35
`common structure, to form the LED with greater brightness
`and power, without having to adopt a larger sized chip.
`Although the invention has been explained in relation to
`its preferred embodiment as mentioned above, it is to be
`understood that many other possible modifications and
`variations can be made without departing from the scope of
`the present invention. It is, therefore, contemplated that the
`appended claim or claims will cover such modifications and
`variations that fall within the true scope of the invention.
`What is claimed is:
`1. A package structure of a composite LED, comprising:
`an LED chip;
`a substrate upon which to fix the LED chip, the substrate
`having positive and negative electrodes;
`
`8
`a package colloid containing a phosphor, such that the
`phosphor is excited by light emitted from the LED
`chip;
`a plurality of SMD LED package subbody components
`included in the LED chip, the substrate and the package
`colloid containing a phosphor, all being formed into an
`integral body;
`a large sized package mother body having inner elec(cid:173)
`trodes connected to outer electrodes of the SMD LED
`package subbody components; and
`a transparent package colloid in the large sized package
`mother body, for covering the SMD LED package
`subbody components.
`2. The package of a composite LED in accordance with
`claim 1, wherein the LED chip is packaged into the SMD
`LED package subbody component in a diode bonding and
`wire bonding manner or in a Filp Chip manner.
`3. The package of a composite LED in accordance with
`claim 1, wherein the large sized package mother body is
`made of a metal, a PCB, a semiconductor or plastic material.
`4. The package of a composite LED in accordance with
`claim 1, wherein the large sized package mother body has a
`top light type, a side light type, a lamp type and a SMD type.
`5. The package of a composite LED in accordance with
`claim 4, wherein the large sized package mother body has a
`25 top light type, a side light type, a lamp type and a SMD type.
`6. The package method of a composite LED, comprising
`the steps of:
`providing a plurality of small sized SMD LED package
`subbody components each containing a phosphor;
`providing a large sized package mother body;
`packaging the small sized SMD LED package subbody
`components into the large sized package mother body,
`so that outer electrodes of the SMD LED package
`subbody components are connected to inner electrodes
`of the large sized package mother body; and
`adding a package colloid into the large sized package
`mother body, thereby forming a composite LED.
`7. The package method of a composite LED in accordance
`with claim 6, wherein the SMD LED package subbody
`40 components included a red SMD LED, a green SMD LED
`and a blue SMD LED which are packaged into the large
`sized package mother body simultaneously, thereby forming
`a single triple-wavelength white LED.
`8. The package method of a composite LED in accordance
`45 with claim 6, wherein the SMD LED package subbody
`components includes a white SMD LED or a mixed color
`SMD LED excited by other phosphor.
`
`* * * * *
`
`IPR PAGE 10