`Patent”) are obvious under 35 U.S.C. § 103 over Cade in view of U.S. Patent
`No. 5,002,818 to Licari et al. (“Licari”)
`
`
`Prior Art Cited in this Chart:
`U.S. Patent No. 4,599,792 to Cade et al. (“Cade”)
`U.S. Patent No. 5,002,818 to Licari et al. (“Licari”)
`
`
`Claim Language
`Claim 8
`The method of claim 1,
`wherein the step of
`attaching includes the
`steps of placing a layer
`of epoxy between the
`second substrate and the
`wafer portion of the first
`substrate, and degassing
`and curing the epoxy.
`
`Cade in view of Licari
`
`The mechanical substrate 68 of silicon is then
`anodically bonded to the quartz 66 by applying voltage
`to a voltage probe 84 with the seed substrate 80
`grounded.” Cade, 7:27-30.
`
`Figure 15 of Cade
`
`
`
`
`“An adhesive mixture reworkably adheres electronic
`integrated circuit dies to hybrid microcircuit substrates,
`and includes a thermosetting epoxy resin.” Licari,
`Abstract.
`
`“The thermosetting and thermoplastic materials were
`mixed by hand in the above described ratios, and
`outgassed prior to die attach. The dies were 0.08 inch
`square, and mounted on gold plated alumina substrates.
`All samples were outgassed again for 5 minutes after
`die attachment and then cured for one hour at 125°C.”
`Licari, 5:39-44.
`
`
`
`
`
`1
`
`Petitioner Samsung - SAM1019
`
`
`
`
`The mechanical substrate 68 of silicon is then
`anodically bonded to the quartz 66 by applying voltage
`to a voltage probe 84 with the seed substrate 80
`grounded.” Cade, 7:27-30.
`
`Figure 15 of Cade
`
`Claim 18
`The method of claim 13,
`wherein the step of
`attaching includes the
`steps of placing a layer
`of epoxy between the
`second substrate and the
`front surface of the
`single-crystal silicon
`wafer, and degassing and
`curing the epoxy.
`
`
`
`
`“An adhesive mixture reworkably adheres electronic
`integrated circuit dies to hybrid microcircuit substrates,
`and includes a thermosetting epoxy resin.” Licari,
`Abstract.
`
`“The thermosetting and thermoplastic materials were
`mixed by hand in the above described ratios, and
`outgassed prior to die attach. The dies were 0.08 inch
`square, and mounted on gold plated alumina substrates.
`All samples were outgassed again for 5 minutes after
`die attachment and then cured for one hour at 125°C.”
`Licari, 5:39-44.
`
`2
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