Leonard W. Schaper Jr.
`516 Neapolitan Lane
`Naples, FL 34103
`(479) 200-5369 (Cell)
`schaper@uark.edu
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`PROFESSIONAL EXPERIENCE:
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`2012 to present Schaper Consulting, Inc. (Naples, FL)
`President
`• Leonard Schaper, consulting in electronic packaging.
`• Louise Schaper, consulting in library design and operations.
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`2003 to 2006 Xanodics, LLC (Fayetteville, AR)
`Founder and CEO
`• With Prof. Rick Ulrich, initiated start-up company to commercialize
`UA-developed thin film capacitor technology.
`• Had several successful contracts to supply prototype components.
`• Dissolved company when customer program needs changed.
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`1992 to present University of Arkansas (Fayetteville, AR)
`Professor Emeritus of Electrical Engineering (2009 to present)
`Professor of Electrical Engineering (2002 to 2008)
`• Directed research program in through-silicon vias for 3-D VLSI
`packaging.
`• Developed fabrication methods for multilayer thin film capacitors.
`• Taught undergraduate courses in electronics and graduate courses in
`electronic packaging.
`• Fall, 2005 semester, sabbatical assignments: 6 weeks at the
`Fraunhofer Institute IZM in Berlin and Munich; 4 weeks at NEC in
`Sagamihara, Japan.
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` Director, High Density Electronics Center and Professor, Electrical
`Engineering (1992 to 2002)
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`Petitioner Samsung - SAM1015
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`• Directed large ($3M annual) research program in Multichip Module
`technology. Led efforts of 15 faculty, 4 - 6 post-docs, 8 staff, and
`25 graduate students. Ran a 4000 square foot clean room dedicated
`to MCM research.
`• Developed the interconnected mesh power system topology for MCM
`cost reduction.
`• Developed new, low inductance, thin-film decoupling capacitors.
`• Led development of integral passive components on polyimide film.
`• Formulated national policy on advanced packaging R&D working
`through the EIA MCM division and consulting for DARPA.
`• Led efforts resulting in the successful merger of IEPS and ISHM to
`form IMAPS.
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`1990 to 1992 Alcoa Electronic Packaging (San Diego, CA)
`Director, Thin Film Product Programs (1991 to 1992)
`• Directed product and market development for thin film multichip
`modules. Oversaw applications engineering, product engineering, and
`design effort on various implementations of MCM technology.
`Consulted extensively with customers on the tradeoffs affecting their
`MCM designs. Was corporate spokesman at many conferences,
`workshops, and
`industry seminars on MCMs. Successfully
`led
`prototype development for several satisfied customers. Represented
`Alcoa on the industry-wide team seeking enlarged Federal support of
`MCM technology.
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`Director, Thin Film Technology Development (1990 to 1991)
`• Led technology development for thin film multichip modules.
`Transferred the AT&T MCM technology licensed to Alcoa. Led a team
`of materials scientists and engineers in correcting reliability problems.
`Refined the modeling approaches for MCM power distribution.
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`1978 to 1990 AT&T BELL LABORATORIES (Murray Hill, New Jersey)
`Head, Technical Program Analysis Department (1986 to 1990)
` Managed the department responsible for the coherence of the Bell
`Laboratories technical program. Reviewed project expenses and
`program content, and projected future needs.
`• Served as chief technologist for the AT&T 21st Century Project, a
`year long effort to define future scenarios for AT&T. Gained extensive
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`experience in scenario analysis methods. Produced a robust plan for
`technology development.
`• Created numerous presentations for international audiences for the
`president of AT&T Bell Laboratories. Developed and researched
`presentation themes, assembled material, produced professional
`graphics, and had overall responsibility for technical content on a
`wide range of telecommunications and technology issues.
`• Produced an annual report on AT&T R&D. Coordinated the inputs of a
`score of diverse authors into a coherent document used by top-level
`AT&T executives to plan R&D programs. Created a management
`tracking system for the several hundred individual R&D projects
`throughout the AT&T R&D community.
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`Supervisor, Electronics Technology Planning Center (1981 to 1986)
` Co-invented the copper-polyimide on silicon multichip module
`packaging concept known as Advanced VLSI Packaging (AVP).
`Developed and patented AVP power distribution using an integrated
`decoupling capacitor. Successfully lobbied area management to turn
`a “skunkworks” effort into a fully funded R&D program.
`• Developed
`fundamental
`concepts
`of
`the
`economics
`of
`interconnection to show that system cost can be minimized by
`reducing the length of interconnection wire.
`• Created econometric models for integrated circuit pricing as a
`function of technology development and production capacity.
`• Supervised work on integrated circuit yield modeling which led to
`more cost-effective utilization of IC production facilities.
`MTS, Electronics Technology Planning Center (1980 to 1981)
`• Developed a product line planning tool to relate product volume and
`development expense as a function of technological maturity.
`• Designed and patented a chip package with power distribution
`optimized for low noise.
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`MTS, Electronic Power Systems Laboratory (1978 to 1980)
` Designed and built the first 500 KHz power converter using MOSFET
`technology.
`• Analyzed the noise propagation characteristics of various planar
`power distribution systems.
`• Developed a UNIX-based automated test system for production
`testing of electronic power converters.
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`1968 to 1978 New Jersey Institute of Technology (Newark, New Jersey)
`Assistant Professor, Civil Engineering Department (1973 to 1978)
`• Developed and taught courses in transportation, urban systems
`analysis, and numerical methods.
`• Researched the demographics and economics of urban environments
`using the simulation modeling techniques of systems dynamics.
`• Helped establish a new degree program, Man and Technology, as a
`general undergraduate program
`in humanistic
`studies and
`technological literacy.
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`Instructor in NSF Summer Program for minority high school students
`(1971 to 1973 )
` Taught a course in urban planning to a mix of inner city and suburban
`students which promoted teamwork and allowed them to discover
`their similarities.
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`Instructor in Electrical Engineering (1968 to 1971)
` Introduced elective courses in antenna theory and radio astronomy.
`• Established an antenna measurements laboratory with donated
`equipment.
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`Dr. Engr. Sc., New Jersey Institute of Technology, 1973
` Urban Mass Transportation Fellowship
`SMEE, Massachusetts Institute of Technology, 1968
` National Defense Education Act Title IV Fellowship
`BSEE, Newark College of Engineering, 1967
` Summa cum Laude
` National Merit Scholarship
`Member, Tau Beta Pi, Eta Kappa Nu, and Omicron Delta Kappa
`Honor Societies
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`PROFESSIONAL ACTIVITIES:
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` Fellow, Institute of Electrical and Electronic Engineers (IEEE)
`• Fellow and Life Member, International Microelectronics and Packaging
`Society (IMAPS)
`• IEEE Computer Society technical committee on packaging, 1982 -
`1994
`• Board of Directors, International Electronics Packaging Society, 1990 -
`1996
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`EDUCATION:
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`• President, International Electronics Packaging Society, 1995 - 1996
`• Continuing education chair, IMAPS, 1997 - 1998
`• Vice President of Technology, IMAPS, 1999 - 2000
`• Program committee and session chair, IEPS conferences, 1983 -
`1996
`• General co-chair, ISHM MCM Advanced Technology Workshop, 1992
`• Program committee and session chair, IEPS/ISHM MCM conference,
`1992 - 1996
`• Technical co-chair, IMAPS MCM Conference, 1997
`• Technical chair, IMAPS MCM Conference, 1998
`• Program committee and session chair, IEEE MCM conference, 1992
`• Session chair, IEEE Computer Packaging Workshops, 1984 - 1992
`(even years)
`• Steering committee member and Technology chair, EIA MCM Division,
`1992 - 1995
`• Associate editor, IEEE Transactions on Advanced Packaging, 1992 -
`2000
`• General chair, IEEE Computer Packaging Workshop, 1993
`• Program committee, IEEE VLSI Packaging Workshop of Japan, 1996 –
`2009
`• Program committee, IEEE Japan System Packaging Workshop, 1994 –
`2009
`• Program committee, Electronic Components and Technology
`Conference, 1994 – 2010
`• Chair, IEEE CPMT Technical Committee on Discrete and Integral
`Components, 2002 – 2005
`• Member, IEEE CPMT Board of Governors, 1999 – 2001 and 2007 –
`2012
`• Chair, IEEE CPMT Field Level CPMT Award committee, 2008 - 2009
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`IMAPS William D. Ashman Memorial Award, 2002
`AWARDS:
`IMAPS Executive Council Service Award, 1999
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`IEEE CPMT Outstanding Sustained Technical Contributions Award, 1996
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`IEEE ECTC Outstanding Paper Award, 1995
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`IEPS Symposium Best Paper Award, 1996
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`IMAPS MCM Conference Outstanding Paper Award, 1997
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`PUBLICATIONS: Over 320 journal articles, proceedings papers, and presentations
`authored or co-authored.
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` Twenty-one U. S. patents in electronic packaging and optical
`PATENTS:
`communications.
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`CONSULTING: Expert witness in patent matters related to electronic packaging.
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`L. W. SCHAPER – BOOKS AND BOOK CHAPTERS
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`L. W. SCHAPER, Chapter 4, Modeling and Simulation, in Advanced Packaging with
`Emphasis on Multichip Modules, W. D. Brown, Ed., Piscataway, NJ: IEEE Press,
`1999.
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`L. W. SCHAPER, Chapter 7, Packaging Trade-offs and Decisions, in Advanced Packaging
`with Emphasis on Multichip Modules, W. D. Brown, Ed., Piscataway, NJ: IEEE
`Press, 1999.
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`L. W. SCHAPER, “Applications of the Interconnected Mesh Power System (IMPS)
`Substrate Layer Reduction Topology,” in Electronic Packaging for High
`Reliability, Low Cost Electronics, R. Tummala, M. Kosec, K. Jones, and D.
`Belavic, Eds., Kulwer Press, 1999, pp. 245 – 252.
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`L. W. SCHAPER, Chapter 12, “Flex and the Interconnected Mesh Power System (IMPS),”
`in Foldable Flex and Thinned Silicon Multichip Packaging Technology, John W.
`Balde, Editor, Kulwer Press, 2003.
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`ULRICH, R. K., AND L. W. SCHAPER. Integrated Passive Component Technology.
`Piscataway, NJ: IEEE Press, June 2003.
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`L. W. SCHAPER AND S. ANG, Chapter 6, Electrical Considerations, in Advanced
`Packaging, R. K. Ulrich and W. D. Brown, Eds., Piscataway, NJ: IEEE Press,
`February, 2006.
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`L. W. SCHAPER AND J. P. PARKERSON, Chapter 11, Design Considerations, in Advanced
`Packaging, R. K. Ulrich and W. D. Brown, Eds., Piscataway, NJ: IEEE Press,
`February, 2006.
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`L. W. SCHAPER - JOURNAL ARTICLES
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`[1] A. SHILMAN AND L. W. SCHAPER, “The Analysis of Small Concentrations of Biacetyl”,
`Journal of Gas Chromatography, p. 486, December, 1966.
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`L. W. SCHAPER, D. H. STAELIN AND J. W. WATERS, “The Estimation of Tropospheric
`Electrical Path Length by Passive Microwave Radiometry,” IEEE Proceedings Letters,
`February, 1970.
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`H. DEUTSCHMAN, J. SCHRAM, AND L. W. SCHAPER,“Urban Laboratory + City Problems +
`High School Students + Educational Success,” Journal of the American Society for
`Engineering Education, May, 1973.
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`L. W. SCHAPER AND D. I. AMEY, “Improved Electrical Performance Required for Future
`MOS Packaging,” IEEE Transactions on Components, Hybrids, and Manufacturing
`Technology, pp. 283-289, September, 1983.
`
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`[5] W. H. KNAUSENBERGER AND L. W. SCHAPER,“Interconnection Cost of Various Substrates
`- The Myth of Cheap Wire,” IEEE Transactions on Components, Hybrids, and
`Manufacturing Technology, pp. 261-263, September, 1984.
`
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`[2]
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`[3]
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`[4]
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`[6]
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`[7]
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`[8]
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`[9]
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`L. W. SCHAPER, “Multichip Modules: What the Experts Say,” One of a panel of quoted
`experts, in Inside ISHM, March/April, 1991.
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`L. W. SCHAPER, “Emerging Technologies: What the Experts Say,” One of a panel of
`quoted experts, in Inside ISHM, November/December, 1991.
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`L. W. SCHAPER, "Design of multichip modules," Proceedings of the IEEE, vol. 80, pp.
`1955-1964, 1992. (Invited Paper)
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`A. P. MALSHE, S. JAMIL, M. H. GORDON, H. A. NASEEM, W. D. BROWN, AND L. W.
`SCHAPER, "Diamond for MCMs," Advanced Packaging, vol. 4, pp. 50-53, 1995.
`
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`[10] A. P. MALSHE, S. JAMIL, M. H. GORDON, H. A. NASEEM, W. D. BROWN, AND L. W.
`SCHAPER, "Diamond substrate synthesis," Advanced Packaging, vol. 4, p. 52, 1995.
`
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`[11] Y. L. LOW, L. W. SCHAPER, S. ANG, AND M. AHMAD, "Theory and experimental
`confirmation of the Interconnected Mesh Power System (IMPS) MCM topology,"
`Int'l. J. Microcircuits Elec. Pack., vol. 18, pp. 146-153, 1995.
`
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`[12] D. G. BHAT, D. G. JOHNSON, A. P. MALSHE, H. NASEEM, W. D. BROWN, L. W. SCHAPER,
`AND C.-H. SHEN, "A preliminary investigation of the effect of post-deposition
`polishing of diamond films on the machining behavior of diamond-coated cutting
`tools," Diamond Relat. Mater., vol. 4, pp. 921-929, 1995.
`
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`[13] L. W. SCHAPER, S. ANG, Y. L. LOW, AND D. R. OLDHAM, "Electrical characterization of
`the Interconnected Mesh Power System (IMPS) MCM topology," IEEE Trans. On
`Comp., Packag., Manufact. Technol.-Part B, vol. 18, pp. 99-105, 1995.
`
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`[14] T. G. LENIHAN, A. P. MALSHE, W. D. BROWN, AND L. W. SCHAPER, "Artifacts in SPM
`measurements of thin films and coatings," Thin Solid Films, vol. 270, pp. 356-361,
`1995.
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`[15] R. P. READE, P. BERDAHL, R. E. RUSSO, AND L. W. SCHAPER, "Y-Ba-Cu-O multilayer
`structures with amorphous dielectric layers for multichip modules using ion-assisted
`pulsed-laser deposition," App. Phys. Lett., vol. 66, pp. 2001-2003, 1995.
`
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`[16] S. AFONSO, F. T. CHAN, K. Y. CHEN, G. J. SALAMO, Y. Q. TANG, R. C. WANG, X. L. XU,
`Q. XIONG, G. FLORENCE, S. SCOTT, S. ANG, W. D. BROWN, AND L. W. SCHAPER,
`"Magnetic field and temperature dependence of critical current densities in multilayer
`YBa2Cu3O7-_ films," J. Appl. Phys., vol. 79, pp. 6593-6595, 1996.
`
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`[17] R. G. FLORENCE, S. S. ANG, W. D. BROWN, G. SALAMO, L. W. SCHAPER, AND R. K.
`ULRICH, "Sputter-deposited yttrium-barium-copper-oxide multilayer structures
`incorporating a thick interlayer dielectric material," J. Appl. Phys., vol. 79, pp. 2003-
`2005, 1996.
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`[18] K. Y. CHEN, G. J. SALAMO, S. AFONSO, X. L. XU, Y. Q. TANG, Q. XIONG, F. T. CHANG,
`AND L. W. SCHAPER, "Fabrication of biaxially aligned YBa2Cu3O7-x thin films on glass
`substrates," Physica C, vol. 267, pp. 355-360, 1996.
`
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`[19] Y. L. LOW, L. W. SCHAPER, AND S. S. ANG, "Modeling and experimental verification of
`the Interconnected Mesh Power System (IMPS) MCM topology," IEEE Trans. Comp.,
`Packag., Manufact. Technol.-Part B, vol. 20, pp. 42-49, 1997.
`
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`[20]
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`J. W. COOKSEY, S. AFONSO, W. D. BROWN, L. W. SCHAPER, S. S. ANG, R. K. ULRICH,
`G. J. SALAMO, AND F. T. CHAN, "Fabrication and characterization of vias for
`contacting YBa2Cu3O7x multilayers," Physica C, vol. 282-287, pp. 683-684, 1997.
`
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`[21] S. AFONSO, K. Y. CHEN, Q. XIONG, F. T. CHAN, G. J. SALAMO, J. W. COOKSEY, S.
`SCOTT, S. ANG, W. D. BROWN, AND L. W. SCHAPER, "Fabrication techniques and
`electrical properties of YBa2Cu3O7-x multilayers with RF sputtered amorphous SiO2
`interlayers," Physica C, vol. 282-287, pp. 685-686, 1997.
`
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`[22] S. AFONSO, K. Y. CHEN, Q. XIONG, Y. Q. TANG, G. J. SALAMO, F. T. CHAN, J. COOKSEY,
`S. SCOTT, Y. J. SHI, S. ANG, W. D. BROWN, AND L. W. SCHAPER, "Y1Ba2Cu3O7-x
`multilayer structures with a thick SiO2 interlayer for multichip modules," J. Mater.
`Res., vol. 12, pp. 2947-2951, 1997.
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`[23]
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`J. P. PARKERSON, L. W. SCHAPER, AND T. G. LENIHAN, "Design considerations for using
`integrated passive components," Int'l. J. Microcircuits Elec. Pack., vol. 20, pp. 297-
`302, 1997.
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`[24] T. G. LENIHAN, L. SCHAPER, G. MORCAN, R. (K.) FAIRCHILD, AND J. P. PARKERSON,
`"Embedded thin film resistors, capacitors, and inductors in flexible polyimide films,"
`Int'l. J. Microcircuits Elec. Pack., pp. 474-481, 1997.
`
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`[25] L. W. SCHAPER, R. ULRICH, D. NELMS, E. PORTER, T. LENIHAN, AND C. WAN,
`"Fabrication, performance, and applications of the 'Stealth' decoupling capacitor," Int'l.
`J. Microcircuits Elec. Pack., pp. 494-500, 1997.
`
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`[26] L. W. SCHAPER, "Future trends in MCMs," Advancing Microelectronics, vol. 25, pp. 13-
`16, 1998.
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`[27] L. W. SCHAPER AND T. G. LENIHAN, “Passives Go Into Hiding,” Advanced Packaging, pp.
`22 - 26, February, 1998.
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`[28] K. MANER, S. S. ANG, L. SCHAPER, AND W. D. BROWN, "Polymeric conductive pastes as
`solder replacement for flip-chip attachment," IEEE Trans. Comp., Packag., Manufact.
`Technol.-Part B, pp. 247-251, 1998.
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`[29] G. MORCAN, S. ANG, T. LENIHAN, L. SCHAPER, J. PARKERSON, AND W. BROWN,
`“Electrical characterization of thin film integral passive devices on polyimide-based
`packaging structures,” Int'l. J. Microcircuits Elec. Pack., pp. 306 – 315, 1998.
`
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`[30] W. D. BROWN, A. MALSHE, T. RAILKAR, T. G. LENIHAN, J. STONE, W. B. SOMMERS, AND
`L. SCHAPER, "Thermal management with 3-D flex MCM packaging," High Density
`Interconnect Magazine, pp. 28 - 32, 1998.
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`[31] S. AFONSO, L. SCHAPER, J. P. PARKERSON, W. D. BROWN, S. S. ANG, AND H. NASEEM,
`"Modeling and electrical analysis of Seamless High Off-Chip Connectivity (SHOCC)
`interconnects," IEEE T-AP, pp. 309-320, 1999.
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`[32] G. MORCAN, S. S. ANG, T. G. LENIHAN, L. SCHAPER, AND W. D. BROWN,
`"Characterization of thin film tantalum oxide capacitors on polyimide substrates,"
`IEEE T-AP, pp. 499-509, 1999.
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`[33] R. ULRICH, L. SCHAPER, D. NELMS, AND M. LEFTWICH, "Comparison of paraelectric and
`ferroelectric materials for applications as dielectrics in thin film integrated capacitors,"
`Int'l. J. Microcircuits Elec. Pack., pp. 172-181, 2000.
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`[34] R. K. ULRICH, W. D. BROWN, S. S. ANG, F. BARLOW, A. ELSHABINI, T. G. LENIHAN, H.
`NASEEM, J. P. PARKERSON, L. W. SCHAPER, AND G. MORCAN, “Getting Aggressive
`with Passive Devices”, IEEE Circuits and Devices, Vol. 16, No. 5, pp. 16-25, 2000.
`(Invited)
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`[35] K. CHEN, W. D. BROWN, L. SCHAPER, S. S. ANG, AND H. NASEEM, "A study of the high
`frequency performance of thin film capacitors for electronic packaging," IEEE T-AP,
`pp. 293-302, 2000.
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`[36] A. P. MALSHE, J. YOUNG, W. D. BROWN, AND L. W. SCHAPER, “Emerging Trends in
`Electronic Systems: Very Thin Silicon Chips”, Electronic News, p. 28, April 2, 2001.
`(Invited)
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`[37] R. K. ULRICH AND L. W. SCHAPER, “Putting Passives in their Place,” IEEE Spectrum, July
`2003, pp. 26 – 30.
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`[38] L. W. SCHAPER, S. BURKETT, S. SPIESSHOEFER, G. VANGARA, Z. RAHMAN, S.
`POLAMREDDY, “Architectural Implications and Process Development of 3D VLSI Z-
`Axis Interconnects Using Through Silicon Vias,” IEEE T-AP, August, 2005, pp. 356 –
`366.
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`[39] R. F. FIGUEROA, S. SPIESSHOEFER, S. L. BURKETT, AND L. SCHAPER, “Control of Sidewall
`Slope in Silicon Vias using SF6/O2 Plasma Etching in a Conventional RIE Tool,” J.
`Vac. Sci. Technol. B, Vol. 23, No. 5, pp. 2226-2231, 2005.
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`[40] S. SPIESSHOEFER, Z. RAHMAN, G. VANGARA, S. POLAMREDDY, S. BURKETT, AND L.
`SCHAPER, “Process Integration for Through-Silicon Vias,” J. Vac. Sci. Technol. A,
`Vol. 23, No. 4, pp. 824-829, 2005.
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`[41] S. SPIESSHOEFER, J. PATEL, T. LAM, L. CAI, S. POLAMREDDY, R. F. FIGUEROA, S. L.
`BURKETT, L. SCHAPER, R. D. GEIL, AND B. R. ROGERS, “Copper Electroplating to Fill
`Blind Vias for 3D Integration,” J. Vac. Sci. Technol. A, Vol. 24, No. 4, pp. 1277-1282,
`Jul/Aug. 2006.
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`[42]
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` T. ROWBOTHAM, J. PATEL, T. LAM, S. BURKETT, L. CAI, AND L. SCHAPER, “Back Side
`Exposure of Variable Size Through-Silicon Vias,” J. Vac. Sci. Technol. B, Vol. 24,
`No. 5, pp. 2460-2466, 2006.
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`[43] R. RAGHUVEER, S. L. BURKETT, L. W. SCHAPER, R. K. ULRICH , R. GEIL, AND B. ROGERS,
`“Dual Process Dielectric Formation for Decoupling Capacitors on Flexible
`Substrates,” IEEE Trans. Comp. Packaging Technologies, Vol. 30, No. 4, pp. 579-583,
`December 2007.
`
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`[44] L. W. SCHAPER AND C. THOMASON, “High Density Double and Triple Layer Tantalum
`Pentoxide Decoupling Capacitors,” IEEE Trans. Comp. Packaging Technologies, Vol.
`30, No. 4, pp. 563-568, December 2007.
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`[45]
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`I. U. ABHULIMEN, S. POLAMREDDY, S. BURKETT, L. CAI, AND L. SCHAPER, “Effect of
`Process Parameters on Via Formation in Si using Deep Reactive Ion Etching (DRIE),”
`J. Vac. Sci. Technol. B, Vol. 25, No. 6, pp. 1762-1770, Nov/Dec 2007.
`
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`[46] A. K. TEGUEU, Y. LIU, S. JACOB, M. D. GLOVER, L. W. SCHAPER, AND S. L. BURKETT,
`“Integration of Tantalum Pentoxide Capacitors with Through-Silicon Vias,” IEEE
`Trans. Components, Packaging, and Manufacturing Technology, Vol. 1, No. 10, pp.
`1508-1516, October, 2011.
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`L. W. SCHAPER - CONFERENCE PROCEEDINGS
`
`L. W. SCHAPER AND H. DEUTSCHMAN, “A Simulation Modeling Approach to Housing
`Dynamics in a Central City”, Proc. International Conference on Housing and
`Transportation, pp. 179-184, June, 1975.
`
`L. W. SCHAPER, “The Impact of Inductance on Semiconductor Packaging”, Proceedings
`of the IEPS Conference, 1981.
`
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`[3] W. H. KNAUSENBERGER AND L. W. SCHAPER, “Interconnection Cost of Various
`Substrates - The Myth of Cheap Wire”, Proceedings of the International
`Conference on Computer Design (ICCD), 1984.
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`[1]
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`[2]
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`[6]
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`[9]
`
`L. W. SCHAPER, “Meeting Systems Requirements through Technology Tradeoffs in
`Multichip Modules”, Proceedings of the IEPS Conference, 1990, pp. 25 – 33.
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`F. BACHNER, M. MACCULLOUGH, L. W. SCHAPER, AND E. WARD, “Defining the Interface
`Between Suppliers and Users in the Multichip Module Marketplace”, Proceedings
`of the 1st International Conference on Multichip Modules, 1992, pp. 52 - 55.
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`D. L. ANDREWS, J. M. CONRAD, L. SCHAPER, S. A. MENGEL, AND D. J. BERLEANT,
`"Design of a high speed MIMD distributed processor node using MCM
`technology," Proc. 1993 IEPC, vol. 1, pp. 132-139.
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`L. W. SCHAPER, S. ANG, AND Y. L. LOW, "Design of the Interconnected Mesh Power
`System (IMPS) MCM topology," Proc. 1994 ICEMCM, pp. 543-548.
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`L. W. SCHAPER, S. ANG, Y. L. LOW, AND D. OLDHAM, "Electrical characterization of the
`Interconnected Mesh Power System (IMPS) MCM topology," Proc. 44th ECTC,
`1994, pp. 791-795.
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`Y. L. LOW, L. W. SCHAPER, S. ANG, AND M. AHMAD, "Theory and experimental
`confirmation of the Interconnected Mesh Power System (IMPS) MCM topology,"
`Proc. 1994 IEPC, pp. 462-469.
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`diamond based multichip modules (MCMs)," Applications of Diamond Films and
`Related Materials: Third International Conference, A. FELDMAN, Y. TZENG, W.
`A. YARBROUGH, M. YOSHIKAWA, and M. MURAKAWA eds. NIST: Washington,
`DC. NIST Special Publication 885, 1995, pp. 611-618.
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`novel process for planarizing CVD-diamond substrates for MCM applications,"
`Proc. 1995 ICEMCM, pp. 140-145.
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`Interconnected Mesh Power System (IMPS)," Proc. 1995 ICEMCM, pp. 185-190.
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`Interconnected Mesh Power System (IMPS)," Proc. 1995 MCMC, pp. 200-205.
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`[14] C. HOWARD, S. NAIR, S. ANG, AND L. SCHAPER, "An investigation of conductive polymer
`flip chip attachment in multichip module applications," Proc. 45th ECTC, 1995,
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`J. P. PARKERSON AND L. W. SCHAPER, "A design methodology for the Interconnected
`Mesh Power System (IMPS) MCM technology," Proc. 1995 IEPC, pp. 192-196.
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`SCHAPER, "CVD-diamond substrates for multi-chip modules (MCMs),"
`Proceedings of the 8th International Conference on VLSI Design, IEEE Computer
`Society Press: Los Alamitos, CA 1995, pp. 194-195.
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`module using flex substrate and ball grid array," Proc. 1996 ICEMCM, pp. 28-32.
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`the Interconnected Mesh Power System (IMPS) with a standard four-layer MCM
`topology," Proc. 1996 ICEMCM, pp. 216-219.
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`Interconnected Mesh Power System (IMPS) with a standard four-layer MCM
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`J. P. PARKERSON AND L. W. SCHAPER, "Advanced Interconnected Mesh Power System
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`capacitors," Proc. 46th ECTC, 1996, pp. 358-364.
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`resistors, capacitors and inductors in flexible polyimide films," Proc. 46th ECTC,
`1996, pp. 119-124.
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`resistors, capacitors, and inductors in flexible polyimide films," Proc. 1996 IEPC,
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`J. P. PARKERSON, R. ULRICH, L. W. SCHAPER, V. KANDIKATTU, B. HINSHAW, N.
`YASMEEN, AND T. STOKICH, "An MCM-D test substrate for evaluating
`benzocyclobutene (BCB)/copper processes," Proc. 1996 IEPC, pp. 643-648.
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`assemblies for multichip modules (MCMs)," Proc. 1996 IEPC, pp. 3-13.
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`J. P. PARKERSON, L. W. SCHAPER, G. MORCAN, AND T. G. LENIHAN, "Product design
`using integrated passive components," Proc. 3rd Int'l. Conf. Flex Circuits, 1996,
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`COOKSEY, S. SCOTT, S. ANG, W. D. BROWN, AND L. SCHAPER, "Fabrication of
`highly textured superconducting thin films on polycrystalline substrates using ion
`beam assised deposition," Proceedings of the 10th Anniversary HTS Workshop on
`Physics, Materials and Applications, B. BATLOGG, C. W. CHU, W. K. CHU, D. U.
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`"Fabrication and characterization of a high temperature superconducting
`multichip module," Proc. 1997 ECS, pp. 100-107.
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`superconducting MCM," Proc. 1997 ECS, pp. 108-113.
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`"Miniaturizing power electronics using multi-chip module technology," Proc.
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`J. H. GLEZEN, H. A. NASEEM, R. K. ULRICH, L. W. SCHAPER, AND W. D. BROWN,
`"Uniform copper electroplating for application to multichip modules," Proc. 1997
`ICEMCM, pp. 218-223.
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`assemblies for multichip modules (MCMs)," Proc. 1997 ICEMCM, pp. 87-91.
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`J. P. PARKERSON, L. W. SCHAPER, AND T. G. LENIHAN, “Design Considerations for using
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`SOMMERS, J. PARKERSON, AND M. GLOVER, "Reliability of flexible thin-film
`embedded resistors and electrical characterization of thin film embedded
`capacitors and inductors," Proc. 47th ECTC, 1997, pp. 730-738.
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`J. P. PARKERSON, L. W. SCHAPER, G. MORCAN, M. GLOVER, AND T. G. LENIHAN, "MCM
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`Vol. 19-1, Advances in Electronic Packaging 1997, pp. 875-882.
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`"Stealth" decoupling capacitor," Proc. 47th ECTC, 1997, pp. 724-729.
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`flexible ball-grid-array multichip module technology," Proc. SPIE, 1997, vol.
`3184, Microelectronic Packaging and Laser Processing, pp. 13-21.
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`BAUGHER, J. SANTANDREA, G. CONNOR, J. MACPHERSON, G. ADEMA, P. DEAN,
`L. SCHAPER, R. EDEN, AND R. SANDS, "Development of Seamless High Off-Chip
`Connectivity," Proc. 1997 Int'l. Symp. Microelect., pp. 138-143.
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`L. SCHAPER, "Thermal management issues and evaluation of a novel, flexible
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`substrate, 3- dimensional (3-D) packaging concept," Proc. 1998 ICEMCM, pp.
`135-140.
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`J. GLEZEN, H. NASEEM, I. FRITSCH, R. ULRICH, W. D. BROWN, AND L. SCHAPER, "Flip
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`characterization of multilayered thin film integral passive devices," Proc. 48th
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`embedded capacitors in MCM-D and MCM-L substrates," Proc. 48th ECTC,
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`integrated capacitors on silicon and flexible substrates," Proc. 1998 Int'l. Symp.
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`"Stealth" decoupling capacitor," Proc. IEEE Int. Workshop on Chip-Package Co-
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`"Thermal modeling for chip-on-flex," Proc. Pan Pacific Microelectronics
`Symposium, 1998, pp. 351-355.
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`for high speed applications," IMAPS Advanced Technology Workshop on Future
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`[54] L. SCHAPER, K. CHEN, W. D. BROWN, S. S. ANG, AND H. NASEEM, " Thin film decoupling
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`"Modeling and electrical analysis of Seamless High Off-Chip Connectivity
`(SHOCC) interconnects," Proc. Int. Conf. HDP/MCM, 1999, pp. 327-331.
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`Off-Chip Connectivity (SHOCC) packaging technology," Proc. 1999 ECS, pp.
`188-191.
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`dielectric layer for integrated capacitors," Proc. 1999 ECS, pp. 104-113.
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`Chip Connectivity (SHOCC) interconnects," Proc. IEEE Int. Workshop on Chip-
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`ULRICH, "Integral Passives Development: The State of the Art", Proceedings of
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`AD4/3-1 -P-AD4/3-6, 2000.
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`ELSHABINI, S. ANG, AND W. BROWN, “Fabrication Options for Thin Film
`Integrated Capacitors”, Proceedings of the International Conference and
`Exhibition on High Density and Systems Packaging,