Accelerated Graphics Port
`Interface Specification
`
`Revision 1.0
`
`Intel Corporation
`
`July 31, 1996
`
`Intel may have patents and/or patent applications related to the various Accelerated Graphics
`Port (AGP or A.G.P). interfaces described in the Accelerated Graphics Port Interface
`Specification. A reciprocal, royalty-free license to the electrical interfaces and bus protocols
`described in, and required by, the Accelerated Graphics Port Interface Specification Revision
`1.0 is available from Intel.
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`Page 1 of 161
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` ZTE EXHIBIT 1024
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`Revision 1.0
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`A.G.P. Interface Specification
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`Accelerated Graphics Port Interface Specification
`
`Copyright © Intel Corporation 1996
`
`All rights reserved.
`
`THIS SPECIFICATION IS PROVIDED “AS IS” WITH NO WARRANTIES WHATSOEVER INCLUDING ANY WARRANTY OF
`MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF
`ANY PROPOSAL, SPECIFICATION , OR SAMPLE. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
`TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED OR INTENDED HEREBY.
`
`INTEL DISCLAIMS ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS,
`RELATING TO USE OF INFORMATION IN THIS SPECIFICATION. INTEL DOES NOT WARRANT OR REPRESENT THAT
`SUCH USE WILL NOT INFRINGE SUCH RIGHTS.
`
`*THIRD-PARTY BRANDS AND NAMES ARE THE PROPERTY OF THEIR RESPECTIVE OWNERS.
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`A.G.P. Interface Specification
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`Revision 1.0
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`Table of Contents
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`1. INTRODUCTION....................................................................................................................................... 1
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`1.1 MOTIVATION. .............................................................................................................................................. 1
`1.2 RELATIONSHIP TO PCI ................................................................................................................................. 1
`
`2. ARCHITECTURAL CONTEXT AND SCOPE........................................................................................ 3
`
`2.1 TWO USAGE MODELS: “EXECUTE” & “DMA”............................................................................................. 3
`2.2 A.G.P. QUEUING MODELS ........................................................................................................................... 4
`2.3 PERFORMANCE CONSIDERATIONS................................................................................................................ 6
`2.4 PLATFORM DEPENDENCIES .......................................................................................................................... 6
`
`3. SIGNALS AND PROTOCOL SPECIFICATION.................................................................................... 9
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`3.1 A.G.P. OPERATION OVERVIEW .................................................................................................................... 9
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`3.1.1 Pipeline Operation........................................................................................................................... 9
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`3.1.2 Addressing Modes and Bus Operations......................................................................................... 11
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`3.1.3 Address Demultiplexing Option..................................................................................................... 13
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`3.2 ACCESS ORDERING RULES & FLOW CONTROL........................................................................................... 16
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`3.2.1 Ordering Rules and Implications ................................................................................................... 16
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`3.2.2 Deadlock Avoidance ..................................................................................................................... 19
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`3.2.3 Flush and Fence Commands........................................................................................................... 19
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`3.2.4 Access Request Priority................................................................................................................. 20
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`3.2.5 Flow Control ................................................................................................................................. 21
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`3.2.5.1 Introduction............................................................................................................................. 21
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`3.2.5.2 Read Flow Control ................................................................................................................. 22
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`3.2.5.3 Write Data Flow Control........................................................................................................ 25
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`3.2.5.4 1 and 2 Clock Rule for IRDY# and TRDY# ........................................................................... 27
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`3.2.5.5 Other Flow Control Rules....................................................................................................... 27
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`3.2.6 Source Throttling Address Flow Control....................................................................................... 27
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`3.3 PIN DESCRIPTION ...................................................................................................................................... 28
`3.4 A.G.P. SEMANTICS OF PCI SIGNALS.......................................................................................................... 31
`3.5 BUS TRANSACTIONS.................................................................................................................................. 33
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`3.5.1 Address Transactions .................................................................................................................... 33
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`3.5.1.1 AD Bus ................................................................................................................................... 33
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`3.5.1.2 SBA Port................................................................................................................................. 35
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`3.5.2 Basic Data Transactions ................................................................................................................ 36
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`3.5.2.1 1x Data Transfers.................................................................................................................... 37
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`3.5.2.2 2x Data Transfers.................................................................................................................... 39
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`3.5.3 Flow Control ................................................................................................................................. 42
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`3.5.3.1 Initial Data Block.................................................................................................................... 42
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`3.5.3.2 Subsequent Data Block ........................................................................................................... 44
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`3.6 ARBITRATION SIGNALING RULES ............................................................................................................... 51
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`3.6.1 Introduction.................................................................................................................................... 51
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`3.6.2 A.G.P. Compliant Master’s REQ#................................................................................................ 52
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`3.6.3 GNT# and ST[2::0] ...................................................................................................................... 53
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`3.6.4 GNT# for Single Transactions ...................................................................................................... 53
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`3.6.5 GNT# Pipelining........................................................................................................................... 54
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`3.6.6 GNT# Interaction with RBF#........................................................................................................ 61
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`3.7 A.G.P. SEQUENCER STATE MACHINE EQUATIONS ..................................................................................... 61
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`3.7.1 Error Reporting.............................................................................................................................. 62
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`4. ELECTRICAL SPECIFICATION........................................................................................................... 63
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`4.1 OVERVIEW................................................................................................................................................. 63
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`4.1.1 Introduction.................................................................................................................................... 63
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`4.1.2 1X Transfer Mode Operation......................................................................................................... 63
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`4.1.3 2X Transfer Mode Operation......................................................................................................... 63
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`4.1.3.1 Transmit/Receive Outer Loop................................................................................................. 65
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`4.1.3.2 Transmit to Receive Inner loop............................................................................................... 65
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`4.1.3.3 Transmit Outer to Inner Loop.................................................................................................. 66
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`4.1.3.4 Receive Inner to Outer Loop................................................................................................... 66
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`4.1.3.5 SB_STB Synchronization........................................................................................................ 68
`
`4.2 COMPONENT SPECIFICATION..................................................................................................................... 69
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`4.2.1 DC SPECIFICATIONS.................................................................................................................. 69
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`4.2.1.1 A.G.P. 1X Mode DC Specification......................................................................................... 70
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`4.2.1.2 A.G.P. 2X Mode DC Specification......................................................................................... 70
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`4.2.2 AC Timings.................................................................................................................................... 71
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`4.2.2.1 A.G.P. 1X Timing Parameters ................................................................................................ 72
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`4.2.2.2 A.G.P. 2X AC Timing Parameters.......................................................................................... 73
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`4.2.2.3 Measurement and Test Conditions .......................................................................................... 76
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`4.2.3 Signal Integrity Requirement.......................................................................................................... 78
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`4.2.4 Driver Characteristics ................................................................................................................... 78
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`4.2.5 Receiver Characteristics................................................................................................................ 79
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`4.2.6 Maximum AC Ratings and Device Protection................................................................................ 80
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`4.2.7 Component Pinout Recommendations ............................................................................................ 81
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`4.3 MOTHERBOARD SPECIFICATION................................................................................................................. 82
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`4.3.1 System Timing Budget ................................................................................................................... 82
`
`4.3.2 Clock Skew.................................................................................................................................... 83
`
`4.3.3 Reset.............................................................................................................................................. 84
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`4.3.4 Interconnect Delay ......................................................................................................................... 85
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`4.3.5 Physical Requirements................................................................................................................... 85
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`4.3.5.1 Interface Signaling .................................................................................................................. 85
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`4.3.5.2 Pullups.................................................................................................................................... 85
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`4.3.5.3 Signal Routing and Layout ...................................................................................................... 86
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`4.3.5.4 Impedances ............................................................................................................................. 86
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`4.3.5.5 Vref Generation ...................................................................................................................... 86
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`4.3.5.6 Crosstalk Consideration.......................................................................................................... 86
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`4.3.5.7 Line Termination..................................................................................................................... 87
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`4.4 ADD-IN CARD SPECIFICATION ................................................................................................................... 87
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`4.4.1 Clock Skew.................................................................................................................................... 87
`
`4.4.2 Interconnect Delay ......................................................................................................................... 87
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`4.4.3 Physical Requirements................................................................................................................... 88
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`4.4.3.1 Pin Assignment ....................................................................................................................... 88
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`4.4.3.2 Signal Routing and Layout ...................................................................................................... 88
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`4.4.3.3 Impedances ............................................................................................................................. 88
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`4.4.3.4 Vref Generation ...................................................................................................................... 88
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`4.4.3.5 Power supply delivery............................................................................................................ 88
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`5. MECHANICAL SPECIFICATION......................................................................................................... 89
`
`5.1 INTRODUCTION.......................................................................................................................................... 89
`5.2 EXPANSION CARD PHYSICAL DIMENSIONS AND TOLERANCES................................................................... 89
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`5.3 CONNECTOR:............................................................................................................................................. 91
`5.4 CONNECTOR PHYSICAL DESCRIPTION........................................................................................................ 92
`5.5 PLANAR IMPLEMENTATION ........................................................................................................................ 93
`
`5.5.1 ATX Planar Implementation .......................................................................................................... 93
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`5.5.2 Low Profile Planar Implementation ............................................................................................... 94
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`5.5.3 Pin List........................................................................................................................................... 95
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`6. SYSTEM CONFIGURATION AND A.G.P. INITIALIZATION........................................................... 97
`
`6.1 POST-TIME INITIALIZATION....................................................................................................................... 97
`
`6.1.1 A.G.P. Compliant Master Devices................................................................................................. 97
`
`6.1.2 A.G.P. Compliant Target Devices ................................................................................................. 97
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`6.1.3 Boot-time VGA Display Device(s)................................................................................................ 98
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`6.1.4 Operating System Initialization...................................................................................................... 98
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`6.1.5 PCI Status Register ...................................................................................................................... 100
`
`6.1.6 Capabilities Pointer - (offset 34h) ............................................................................................... 100
`
`6.1.7 Capability Identifier Register (Offset = CAP_PTR)................................................................... 100
`
`6.1.8 A.G.P. status register (offset CAP_PTR + 4)............................................................................... 101
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`6.1.9 A.G.P. command register - (offset CAP_PTR + 8)..................................................................... 102
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`7. APPENDIX A .......................................................................................................................................... 103
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`8. APPENDIX B .......................................................................................................................................... 105
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`A.G.P. Interface Specification
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`List of Figures
`FIGURE 1-1 SYSTEM BLOCK DIAGRAM: A.G.P. AND PCI RELATIONSHIP........................................................... 2
`FIGURE 2-1 GRAPHICS ADDRESS RE-MAPPING FUNCTION.................................................................................. 4
`FIGURE 2-2 A.G.P. ACCESS QUEUING MODEL................................................................................................... 5
`FIGURE 2-3 DIFFERENT CORE LOGIC ARCHITECTURES ....................................................................................... 7
`FIGURE 3-1 BASIC A.G.P. PIPELINE CONCEPT. ................................................................................................ 10
`FIGURE 3-2 A.G.P./PCI OPERATIONAL STATES................................................................................................ 10
`FIGURE 3-3 LAYOUT OF AN A.G.P. ACCESS REQUEST ..................................................................................... 12
`FIGURE 3-4 MAXIMUM NUMBER OF GNT#S QUEUED BEFORE THE ASSERTION OF RBF#................................... 24
`FIGURE 3-5 MAXIMUM DELAY BY MASTER ON WRITE DATA............................................................................ 26
`FIGURE 3-6 WRITE DATA WITH ONE TP. .......................................................................................................... 27
`FIGURE 3-7 SINGLE ADDRESS - NO DELAY BY MASTER................................................................................... 34
`FIGURE 3-8 MULTIPLE ADDRESSES ENQUEUED, MAXIMUM DELAY BY MASTER ............................................... 35
`FIGURE 3-9 1X SIDEBAND ADDRESSING........................................................................................................... 36
`FIGURE 3-10 2X SIDE BAND ADDRESSING........................................................................................................ 36
`FIGURE 3-11 MINIMUM DELAY BY TARGET OF READ TRANSACTION................................................................ 37
`FIGURE 3-12 MINIMUM DELAY ON BACK TO BACK READ DATA...................................................................... 38
`FIGURE 3-13 MASTER DOES NOT DELAY PROVIDING WRITE DATA................................................................... 38
`FIGURE 3-14 BACK TO BACK WRITE DATA TRANSFERS - NO DELAYS ............................................................. 39
`FIGURE 3-15 2X READ DATA NO DELAY .......................................................................................................... 40
`FIGURE 3-16 2X BACK TO BACK READ DATA - NO DELAY .............................................................................. 40
`FIGURE 3-17 2X BASIC WRITE NO DELAY........................................................................................................ 41
`FIGURE 3-18 QUADWORD WRITES BACK TO BACK - NO DELAYS.................................................................... 41
`FIGURE 3-19 MASTER'S DATA BUFFER IS FULL - NO DELAY ON READ DATA ................................................... 42
`FIGURE 3-20 HIGH PRORITY READ DATA RETURNED WHILE RBF# ASSERTED ................................................ 42
`FIGURE 3-21 2X READ DATA WITH RBF# ASSERTED........................................................................................ 43
`FIGURE 3-22 THROTTLE POINT FOR SUBSEQUENT DATA BLOCK - NO DELAY.................................................. 44
`FIGURE 3-23 MASTER DELAYS SUBSEQUENT DATA BLOCK ............................................................................. 44
`FIGURE 3-24 WRITE WITH SUBSEQUENT BLOCK - NO DELAY........................................................................... 45
`FIGURE 3-25 TARGET DELAYS SUBSEQUENT WRITE DATA BLOCK................................................................... 46
`FIGURE 3-26 EARLIEST READ DATA RETURNED AFTER A REQUEST................................................................... 46
`FIGURE 3-27 REQUEST FOLLOWED BY WRITE AND THEN A READ...................................................................... 47
`FIGURE 3-28 REQUEST FOLLOWED BY READ DATA NO DELAY BY TARGET....................................................... 48
`FIGURE 3-29 REQUEST FOLLOWED BY WRITE - NO AD TURN AROUND ............................................................ 49
`FIGURE 3-30 BASIC PCI TRANSACTION ON A.G.P........................................................................................... 50
`FIGURE 3-31 PCI TRANSACTION BETWEEN A.G.P. REQUEST AND DATA......................................................... 51
`FIGURE 3-32 WRITE DATA FOLLOWED BY READ .............................................................................................. 54
`FIGURE 3-33 GNT# ASSERTION FOR 16, 8, AND THEN 16 BYTE READ TRANSFERS ........................................... 57
`FIGURE 3-34 GNT# ASSERTION FOR NEXT READ DATA AFTER LONG DATA TRANSFER.................................... 57
`FIGURE 3-35 GNT# ASSERTION FOR BACK TO BACK WRITE DATA TRANSFERS............................................... 58
`FIGURE 3-36 BACK TO BACK GNT# WITH DELAY ON INITIAL TRANSFER ........................................................ 59
`FIGURE 3-37 PIPELINED GNT#S - READ AND WRITES (PART 1)........................................................................ 60
`FIGURE 3-38 PIPELINED GNT#S - READ AND WRITES (PART 2)........................................................................ 60
`FIGURE 3-39 LP GNT# PIPELINING STOPPED WHILE RBF# IS ASSERTED ....................................................... 61
`FIGURE 4-1 2X MODE TIME DOMAINS............................................................................................................. 64
`FIGURE 4-2 TRANSMIT STROBE/DATA TIMINGS ............................................................................................... 65
`FIGURE 4-3 RECEIVE STROBE/DATA TIMINGS .................................................................................................. 65
`FIGURE 4-4 TRANSMIT STROBE/CLOCK TIMINGS............................................................................................. 66
`FIGURE 4-5 COMPOSITE TRANSMIT TIMINGS ................................................................................................... 66
`FIGURE 4-6 RECEIVER INNER TO OUTER LOOP TRANSFER TIMING ................................................................... 67
`FIGURE 4-7 COMPOSITE RECEIVE TIMINGS ...................................................................................................... 68
`FIGURE 4-8 SB_STB SYNCHRONIZATION PROTOCOL...................................................................................... 69
`FIGURE 4-9 A.G.P. 1X TIMING DIAGRAM........................................................................................................ 73
`FIGURE 4-10 A.G.P. 133 TIMING DIAGRAM..................................................................................................... 75
`FIGURE 4-11 STROBE/DATA TURNAROUND TIMINGS ....................................................................................... 75
`FIGURE 4-12 OUTPUT TIMING MEASUREMENT CONDITIONS ............................................................................ 76
`FIGURE 4-13 INPUT TIMING MEASUREMENT CONDITIONS................................................................................ 76
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`FIGURE 4-14 TVAL(MAX) RISING EDGE .......................................................................................................... 77
`FIGURE 4-15 TVAL(MAX) FALLING EDGE......................................................................................................... 77
`FIGURE 4-16 TVAL (MIN) AND SLEW RATE ...................................................................................................... 78
`FIGURE 4-17 V/I CURVES FOR 3.3V SIGNALING............................................................................................... 79
`FIGURE 4-18 MAXIMUM AC WAVEFORMS FOR 3.3V SIGNALING..................................................................... 80
`FIGURE 4-19 RECOMMENDED COMPONENT PINOUT ........................................................................................ 81
`FIGURE 4-20 CLOCK SKEW DIAGRAM.............................................................................................................. 84
`FIGURE 5-1 A.G.P. CARD EDGE CONNECTOR .................................................................................................. 90
`FIGURE 5-2 DETAIL A, A.G.P. CARD EDGE FINGER LAYOUT............................................................................ 90
`FIGURE 5-3 A.G.P. CARD EDGE CONNECTOR BEVEL ....................................................................................... 91
`FIGURE 5-4 MOTHERBOARD CONNECTOR FOOTPRINT AND LAYOUT DEMINSIONS. ........................................... 92
`FIGURE 5-5 MOTHERBOARD CONNECTOR LAYOUT RECOMMENDATION ..................................................... 93
`FIGURE 5-6 TYPICAL ATX IMPLEMENTATION.................................................................................................. 94
`FIGURE 6-1 CONFIGURATION VIEW OF AN A.G.P. TARGET .............................................................................. 98
`FIGURE 6-2 LOCATION OF A.G.P. CAPABILITIES.............................................................................................. 99
`FIGURE 8-1 SINGLE ADDRESS - NO DELAY BY MASTER.................................................................................. 105
`FIGURE 8-2 SINGLE ADDRESS - MAXIMUM DELAY BY MASTER ...................................................................... 105
`FIGURE 8-3 MULTIPLE ADDRESS - NO DELAY BY MASTER ............................................................................. 106
`FIGURE 8-4 MULTIPLE ADDRESS - MAXIMUM DELAY BY MASTER.................................................................. 106
`FIGURE 8-5 1X SIDEBAND ADDRESSING......................................................................................................... 106
`FIGURE 8-6 2X SIDEBND ADDRESSING........................................................................................................... 107
`FIGURE 8-7 MINIMUM DELAY BY TARGET OF READ TRANSACTION................................................................ 107
`FIGURE 8-8 MAXIMUM DELAY BY TARGET OF READ TRANSACTION............................................................... 108
`FIGURE 8-9 MINIMUM DELAY OF BACK TO BACK READ DATA ...................................................................... 108
`FIGURE 8-10 MAXIMUM DELAY OF BACK TO BACK READ DATA ................................................................... 109
`FIGURE 8-11 MINIMUM DELAY BY MASTER OF WRITE DATA ......................................................................... 109
`FIGURE 8-12 MAXIMUM DELAY BY MASTER OF WRITE DATA ........................................................................ 110
`FIGURE 8-13 MINIMUM DELAY BY MASTER OF BACK TO BACK WRITE DATA................................................ 110
`FIGURE 8-14 MASTER DELAYS INITIAL WRITE NO DELAY.............................................................................. 111
`FIGURE 8-15 2X READ DATA - NO DELAY...................................................................................................... 111
`FIGURE 8-16 2X READ DATA - WITH DELAY .................................................................................................. 112
`FIGURE 8-17 2X BACK TO BACK READ DATA - NO DELAY ............................................................................ 112
`FIGURE 8-18 2X BACK TO BACK READ DATA - MAXIMUM DELAY................................................................. 113
`FIGURE 8-19 2X WRITE DATA - NO DELAY .................................................................................................... 113
`FIGURE 8-20 2X WRITE DATA - MAXIMUM DELAY......................................................................................... 114
`FIGURE 8-21 2X BACK TO BACK WRITES - NO DELAY................................................................................... 114
`FIGURE 8-22 2X BACK TO BACK WRITES - MAXIMUM DELAY ....................................................................... 115
`FIGURE 8-23 2X WRITES, INITIAL TRANSACTION WITH DELAY, SUBSEQUENT TRANSACTIONS NO DELAY ..... 115
`FIGURE 8-24 MASTER DATA BUFFER FULL - MINIMUM DELAY FOR READ DATA............................................ 116
`FIGURE 8-25 MASTER DATA BUFFER FULL - MAXIMUM DELAY FOR READ DATA........................................... 116
`FIGURE 8-26 RBF# ASSERTED, HP READ DATA RETURNED........................................................................... 116
`FIGURE 8-27 RBF# ASSERTED, MAXIMUM DELAY BY TARGET, HP READ DATA RETURNED .......................... 117
`FIGURE 8-28 2X READ DATA, RBF# ASSERTED, MAXIMUM DELAY BY TARGET ............................................ 117
`FIGURE 8-29 2X READ, RBF# ASSERTED, NO HP READ DATA ...................................................................... 118
`FIGURE 8-30 2X READ DATA, WITH DELAY, RBF# ASSERTED, HP READ DATA RETURNED ........................... 118
`FIGURE 8-31 2X READ DATA, RBF# ASSERTED, HP READ DATA DELAYED................................................... 119
`FIGURE 8-32 READ DATA, NO DELAY SUBSEQUENT BLOCK .......................................................................... 119
`FIGURE 8-33 READ DATA, MASTER READY - TARGET DELAYS SUBSEQUENT BLOCK ..................................... 120
`FIGURE 8-34 READ DATA, TARGET READY - MASTER DELAYS SUBSEQUENT BLOCK .................................... 120
`FIGURE 8-35 READ DATA, TARGET DELAYS 1 CLOCK - MASTER DELAYS 2 CLOCKS SUBSEQUENT BLOCK .... 121
`FIGURE 8-36 WRITE DATA, NO DELAY SUBSEQUENT BLOCK......................................................................... 121
`FIGURE 8-37 WRITE DATA, TARGET DELAYS SUBSEQUENT BLOCK 2 CLOCKS............................................... 122
`FIGURE 8-38 2X WRITE NO DELAY INITIAL OR SUBSEQUENT BLOCK ............................................................. 122
`FIGURE 8-39 2X WRITE, INITIAL DELAY, NO DELAY SUBSEQUENT BLOCK..................................................... 123
`FIGURE 8-40 2X WRITE, NO INITIAL DELAY, 2 CLOCKS DELAY SUBSEQUENT BLOCK.................................... 123
`FIGURE 8-41 EARLIEST READ DATA AFTER REQUEST ..................................................................................... 124
`FIGURE 8-42 MAXIMUM DELAY READ DATA AFTER REQUEST........................................................................ 124
`FIGURE 8-43 R