Slide 1
`
`Petitioner’s Demonstrative Exhibit
`
`Patent No. 6,661,639
`
`Patent Owner
`
`PRESIDIO COMPONENTS, INC.
`
`v.
`
`Petitioner
`
`AVXCORPORATION
`
`IPR2016-00636
`
`
`
`Petitioner’s Demonstrative Exhibit
`
`Patent No. 6,661,639
`
`Patent Owner
`
`PRESIDIO COMPONENTS, INC.
`
`v.
`
`Petitioner
`
`AVXCORPORATION
`
`IPR2016-00636
`
`
`
`Not argued separately by Patent Owner
`
`Slide 2
`
`§10320
`
`Liebowitz, Devoe, and SinghDeo
`
`§10319 and 21
`
`§10316
`
`§10314
`
`§10313, 15, and 18
`
`§1037
`
`Liebowitzand Devoe
`
`Liebowitz, Veater, and Yih
`
`Liebowitz, Veater, and Insetta
`
`Liebowitzand Veater
`Applicants’ Admitted Prior Art;
`Liebowitz, Devoe, Veater, and
`
`§1035 and 12
`
`Liebowitz, Devoe, Veater, and Insetta
`
`Liebowitz, Devoe, Veater, and SinghDeo§1032 and 9
`
`§1031, 3, 4, 6, 8, 10, 11, and 17
`
`Liebowitz, Devoeand Veater
`
`BasisClaims of ‘639Patent
`
`References
`
`Grounds Instituted for Trial
`IPR2016-00636
`
`
`
`Slide 3
`
`trace on a printed circuit board.
`coating provides an electrical lead for attaching the capacitor to a metallic surface
`portion not sintered to the ceramic dielectric portion, whereby the conductive metal
`ceramic dielectric portion, and a conductive metal coating on faces of the composite
`
`(b) a metallization area partially between the composite portion and the
`
`printed circuit board; and
`provides an electrical lead for attaching the capacitor to a metallic surface trace on a
`sufficient to render the composite portion conductive, wherein the composite portion
`
`(a) the composite portion comprises the conductive metal in an amount
`
`capacitor further characterized by a feature selected from the group consisting of:
`wherein the composite portion includes a ceramic and a conductive metal, the
`
`via extending from the buried metallization to the composite portion,
`a buried metallization in the dielectric portion and at least one conductive metal-filled
`
`sintered with a ceramic dielectric portion,
`an essentially monolithic structure comprising at least one composite portion
`
`1. A capacitor comprising:
`
`‘639 Patent (Ex. 1001) –Claim 1
`
`
`
`Slide 4
`
`‘639 Patent (Ex. 1001) –Exemplary Figures
`
`
`
`Devoe(Ex. 1005, Fig. 11)
`
`Slide 5
`
`. . .
`
`Liebowitz(Ex. 1004, Fig. 2)
`
`on a printed circuit board; and
`attaching the capacitor to a metallic surface trace
`composite portion provides an electrical lead for
`the composite portion conductive, wherein the
`conductive metal in an amount sufficient to render
`
`(a) the composite portion comprises the
`
`consisting of:
`characterized by a feature selected from the group
`and a conductive metal, the capacitor further
`wherein the composite portion includes a ceramic
`
`portion,
`from the buried metallization to the composite
`at least one conductive metal-filled via extending
`a buried metallization in the dielectric portion and
`
`dielectric portion,
`least one composite portion sintered with a ceramic
`an essentially monolithic structure comprising at
`
`1. A capacitor comprising:
`
`Claim 1 vs. Prior Art
`
`
`
`Veater(Ex. 1006, Fig. 5)
`
`Devoe(Ex. 1005, Fig. 11)
`
`Slide 6
`
`circuit board.
`capacitor to a metallic surface trace on a printed
`coating provides an electrical lead for attaching the
`dielectric portion, whereby the conductive metal
`composite portion not sintered to the ceramic
`and a conductive metal coating on faces of the
`composite portion and the ceramic dielectric portion,
`
`(b) a metallization area partially between the
`
`. . .
`
`consisting of:
`characterized by a feature selected from the group
`and a conductive metal, the capacitor further
`wherein the composite portion includes a ceramic
`
`the buried metallization to the composite portion,
`least one conductive metal-filled via extending from
`a buried metallization in the dielectric portion and at
`
`dielectric portion,
`least one composite portion sintered with a ceramic
`an essentially monolithic structure comprising at
`
`1. A capacitor comprising:
`
`Claim 1 vs. Prior Art
`
`
`
`Slide 7
`
`complexity in manufacturing (POR at 34).
`combination, and avoids additional cost and
`
`4.Liebowitzdevice would be simpler than
`
`Liebowitzprefers a “true SLC” structure (Id.);
`
`3.Combination results in multi-layer device, while
`
`in lower capacitance (POR at 32);
`
`2.POSA would avoid combination because it results
`
`avoid higher inductance (POR at 30);
`
`1.Liebowitzallegedly teaches away from Devoeto
`
`PO Arguments regarding Liebowitz+ Devoe
`
`
`
`Slide 8
`
`Liebowitz(Ex. 1004) at 1:40-53
`
`capacitor with dielectric thickness of 0.001 inch or less.”
`methods and in fact makes practical a classic single layer ceramic
`The present invention avoids any of these inductance-increasing
`
`brought to the surface through vias, edge connections, etc.
`structure in which electrical contact(s) to said buried layer(s) are
`dielectric layer and one or more electrodes buried within a multi-layer
`This high inductance drawback also applies to devices with a single
`
`inductance, an undesirable property, relative to single layer devices.
`which yields high capacitance per unit board area but also causes high
`much below 0.004 inch, ceramics are usually used in multi-layer form,
`“… due to their fragility and the difficulty in firing them at thicknesses
`
`Liebowitzteaches a preference
`
`
`
`Slide 9
`
`Ex. 1006 at 7:19-30
`
`electrical connection useful at high frequencies.”
`T]he redundant viasmake a low-resistance
`
`…[
`
`multiple, vias.
`exterior pads by plural, and more preferably by
`redundantly, electrically connected to associated
`should be redundantly, and preferably massively
`plane within a ceramic capacitor so constructed
`contemplates that each interior metallization
`Invention: “The present invention further
`
`Ex. 1006 at 3:18-20
`
`faster microprocessors are designed into PCs.”
`for the PC market, particularly as faster and
`Background: “Low inductance is also in demand
`
`Devoe(Ex. 1006)
`
`Reducing inductance taught by Devoe
`
`
`
`Slide 10
`
`inductance due to buried electrodes)
`99:5-13 (no sense of magnitude of increase in
`See also Randal Dep. (Ex. 1018) at 96:5-14,
`
`Devoe(Ex. 1006)
`
`Liebowitz(Ex. 1004)
`
`Liebowitzinductance “problem” overblown
`
`
`
`Slide 11
`
`Devoecol. 8 (Ex. 1006)
`
`Liebowitzcol. 7 (Ex. 1004)
`
`Allegedly greater capacitance of Liebowitz
`
`
`
`Slide 12
`
`(Ex. 2010) at 2
`
`JohansonTechnology Catalog
`
`Liebowitz(Ex. 1004)
`
`therefore the same reduction in capacitance)
`patent would require same margins and
`desirable benefits, and that claim 8 of ‘639
`72:10, 145:12-23 (admitting that margins had
`See also Randal Dep. (Ex. 1018) at 71:2–
`
`Use of “margins” well accepted
`
`
`
`Devoe(Ex. 1006)
`
`Slide 13
`
`Use of “margins” well accepted
`
`
`
`Slide 14
`
`(Ex. 2001) ¶100
`Randall Decl.
`
`Allegedly “complex” manufacturing
`
`
`
`Slide 15
`
`In re Gurley, 27 F.3d 551, 553 (Fed. Cir. 1994)
`
`somewhat inferior to some other product for the same use.”
`patentable simply because it has been described as
`“A known or obvious composition does not become
`
`U.S. v. Adams 383 U.S. 39, 52 (1966)
`
`disadvantages thereby discovers a patentable innovation.”
`old inventions by shutting his eyes to their prior
`“This is not to say that one who merely finds new uses for
`
`Alleged Teaching Away
`
`
`
`Slide 16
`
`“inductance problem” identified by Liebowitz)
`(stating that inventors were not trying to overcome
`See also Randal Dep. (Ex. 1018) at 102:25–103:8
`
`Syntex(U.S.A.) LLC v. Apotex, Inc., 407 F.3d 1371, 1380 (Fed. Cir. 2005)
`
`produce the objective of the [patented] invention.”
`developments flowing from its disclosure are unlikely to
`“[A] reference will teach away when it suggests that the
`
`Alleged Teaching Away
`
`
`
`Slide 17
`
`fragile).”(cid:3)(8:4(cid:882)10)
`thin(cid:3)so(cid:3)as(cid:3)to(cid:3)typically(cid:3)be(cid:3)undesirably(cid:3)
`from(cid:3)a(cid:3)ceramic(cid:3)capacitor(cid:3)so(cid:3)excessively(cid:3)
`even(cid:3)that(cid:3)which(cid:3)would(cid:3)normally(cid:3)be(cid:3)realized(cid:3)
`that(cid:3)the(cid:3)capacitance(cid:3)is(cid:3)much(cid:3)higher(cid:3)than(cid:3)
`fracture(cid:3)during(cid:3)routine(cid:3)handling(cid:3)(regardless(cid:3)
`thickness(cid:3)so(cid:3)as(cid:3)to(cid:3)substantially(cid:3)avoid(cid:3)
`“[C]eramicbodies(cid:3)…(cid:3)of(cid:3)sufficient(cid:3)size(cid:3)and(cid:3)
`
`high(cid:3)capacitance.”(cid:3)(3:2(cid:882)6)
`utilize(cid:3)thin(cid:3)dielectric(cid:3)layers(cid:3)to(cid:3)provide(cid:3)
`structural(cid:3)strength(cid:3)…(cid:3)and(cid:3)which(cid:3)may(cid:3)
`“The(cid:3)present(cid:3)invention(cid:3)provides(cid:3)…(cid:3)good(cid:3)
`
`structure.”(cid:3)(9:13(cid:882)14)(cid:3)
`“The(cid:3)new(cid:3)capacitors(cid:3)are(cid:3)a(cid:3)true(cid:3)monolithic(cid:3)
`
`structure.”(cid:3)(5:38)(cid:3)
`“The(cid:3)resulting(cid:3)capacitor(cid:3)is(cid:3)a(cid:3)monolithic(cid:3)
`
`geometrically(cid:3)smaller(cid:3)volume”(cid:3)(8:53(cid:882)55)(cid:3)
`same(cid:3)dielectric(cid:3)formulation(cid:3)in(cid:3)a(cid:3)
`“producing(cid:3)the(cid:3)same(cid:3)capacitance(cid:3)with(cid:3)the(cid:3)
`
`SLC(cid:3)“less(cid:3)expensive”(cid:3)to(cid:3)make(cid:3)(8:51(cid:882)52)(cid:3)
`
`Devoe(Ex. 1006)
`
`capacitors”(cid:3)(3:36(cid:882)37)(cid:3)
`“allowing(cid:3)for(cid:3)further(cid:3)miniaturization(cid:3)of(cid:3)
`4)(cid:3)
`SLC(cid:3)“easily(cid:3)and(cid:3)inexpensively(cid:3)made”(cid:3)(3:3(cid:882)
`
`‘639 Patent (Ex. 1001)
`
`‘639 Patent vs. Devoe
`
`
`
`Slide 18
`
`Randall Dep. Tr, (Ex. 1018)
`
`Liebowitzand Devoe(152:21–155:22)
`the alleged problems in combining
`
`•The ‘639 patent does not overcome any of
`
`and Liebowitz(123:12–127:22)
`the combination of the elements of Devoe
`
`122:19)
`thick-film composite electrodes (114:20 –
`’639 patent and Devoeusing conventional
`
`•Nothing surprising or unexpected about
`
`•No distinction between Claims 1-3 of the
`
`36:11-16)
`within the electrode itself (34:23–35:3;
`between electrode and dielectric, and
`
`(31:18–31:17; 34:6-22)
`metal-ceramic composite electrodes
`It was also known to include glass in
`
`•Glass added to promote adhesion
`
`•
`
`them conductive (28:3–29:12)
`
`•Composite electrodes have metal to make
`
`(27:1-23)
`CTE matching and shrinkage matching
`
`•Ceramics are used in electrodes for both
`same material as the dielectric (26:7-25)
`•Ceramic particles in electrode usually the
`internal and external electrodes (22:7-12)
`electrode compositions applies to both
`
`•Discussion in Randall Declaration of
`
`2002 (21:1-6)
`
`•Thick film “technology” well established by
`together (19:19–20:6; 21:9-24; 80:13-17)
`include ceramic and metal particles mixed
`
`•Thick film external electrodes typically
`
`already available (19:4-18)
`
`or thick external electrodes (15:20–16:23)
`•Commercial SLCs in 2002 could have thin
`
`•Thick films easier to make if equipment
`
`Obviousness of Using Composite Electrodes
`
`
`
`Slide 19
`
`permit handling if it were separately fired.” (Col. 1, ll. 67-71.)
`and usually will not exceed 0.003 inch thickness. The layer 1 is much too thin to
`be of extreme thinness. The layer 1 may have a thickness as little as 0.0002 inch
`“Because of the mechanical support provided by the outer layers 2, 3 the layer 1 can
`
`the central layer 1.” (Col. 1, ll. 47-50.)
`5 to the central layer 1 and to sinter or unite the outer layers 2, 3 to the margin 8 of
`“The assembly is then fired at ceramic firing temperatures to sinter the electrodes 4,
`
`•
`
`•
`
`ceramic layers
`“compatible”
`
`metal electrodes
`
`(dielectric)
`central layer
`ceramic
`
`Veater(Ex. 1006)
`
`
`
`Slide 20
`
`electronic composites where electrical conductivity is desired.” (Col. 9, ll. 34-38.)
`areas outside the electronic packaging field such as in engineered composites and
`“Such an electrically conductive composite is believed to have wide application in
`
`ceramic and metal particles bound together by a glass.” (Col. 5, ll. 50-52.)
`“The present invention particularly relates to a composite formed of a mixture of
`
`applications in the packaging of electronic components.” (Col. 1, ll. 9-13.)
`composite with desired properties which may be specifically tailored for specific
`“The invention discloses the bonding together of ceramic particles to form a coherent
`
`•
`
`•
`
`•
`
`•SinghDeo: “ELECTRONIC PACKAGING OF COMPONENTS INCORPORATING A
`
`CERAMIC-GLASS-METAL COMPOSITE”
`
`fuse with the ceramic sheet 100 during the sintering step.” (Col. 10, ll. 27-34.)
`are either glass/metal or ceramic/metal with sufficient glassor ceramic content to
`at least some ceramic content, and the layers 126 adjacent the ceramic sheet 100
`one on top of another, wherein the majority of layers 128 are metal, preferably with
`sheets 110‘, 112‘ may comprise a plurality of layers 126, 128 of cast tape placed
`“In one embodiment of the invention, further depicted in FIG. 13, the composite
`
`•
`
`‘639 Patent
`
`•
`
`SinghDeo(Ex. 1007)
`
`
`
`Slide 21
`
`•However, Insettaactually says “a metal plating process is
`
`sometimes used.” (Col. 1, ll. 61-68.)
`
`•Patent Owner argues Insettateaches away from an electroplating
`
`process (POR at 51).
`
`Insetta(Ex. 1008)
`
`
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