UTILITY
`PATENT APPLICATION
`TRANSMITTAL
`
`Atlomey Docket No_
`
`I
`
`i Fmst lnv<?otor
`i
`i Tine
`
`~ ............. : ................................ "~"""""""""""""""""""""""""""""""""""""""""'
`
`PTOiS8i05 (08-0~·l
`r>,pproved fM <;~c: tt;rowgh 091;30!'20-1 0 OMS OS51-00S2
`U.S Patr..-1! ;;nd Tn:Ki~m«r~ Omc., U.S DEPARTMENT OF COMMERCE
`Un·:Jer the Paoen'<'ork Reduction Act ol 1995. no oe;:wns are recuired to rE!sooM to a coilec!ion of information ;_ml!lss ;t disPiovs a valid OMB control number.
`I AU·001CIP1
`I Richarct Drysdale
`I COMPONENT PROTECTIVE ...
`~
`1,1N/A
`
`APPLICATION ELEMENTS
`
`ADDRESS TO:
`
`Commissioner for Patents
`P.O. Box 1450
`Alexandria VA 22313-1450
`
`Express Mail Label No_
`
`1
`
`1 _ D Fee Transmittal Form (e.g .. PTOiSB/'17)
`2. D Applicant claims small Mt!ty status.
`See 37 CFR 1.27 _
`3. 0 Specification
`[Total Pages ........... ~'J:J .......... l
`S.oth the c.taims ;aqd abst~act nK~S\ ztF:Jrt :..1rt a r~e\ov p.a-ge
`;·;~~l ir.·'fv.~m·tlfK.ttl :.:~ .. n !h:8 r.,.<f(...•iNlt~r...i ~l:::¢lrrge::;~.ni.- .;,;~"'.S· !i,.~~.~)c.;:-:. r.~0&.-:..'1-~{s)~
`4. GJ Orawing(s) (3:5 US. C. -113)
`[Toli~l Sileels ......... JQ ........ .l
`5. Oath or Declaration
`
`[Total Sheets ____ _
`
`a. a Ne;llly executed (originai or copy)
`
`b
`
`A copy from a prior application (37 CFR 1.63(d))
`lf>.'Jr ccmlinuelion/div·isioneil';'ilh Box 18 comoletedi
`L D DELETION OF INVENTOR($)
`.
`.
`Sign-ed staternent attacl1<:.'d deleting inventm{s)
`narne kt the pr~c~r appl~cati-on; see 37 CFR
`l.E:i:J{d)(2) <Jnd 1-:.KJ!t>).
`
`Application Data Sheet, See 37 CFR ·t. 76
`
`CD·ROM or CD·R in duplicate, large laole or
`Cau~Puler Program {Appemlix)
`U
`landsc3pe Table on CD
`
`8.
`
`ACCOMPANYING APPLICATION PARTS
`S. D Assignment Papers (cover stleet & ctOCL!ment(s)_l
`Name of Assignee ______________ _
`
`1Q_ 0 37 CFR 3.73(b} Statement
`OPowerof
`(Wilen there is an assigMe)
`Attorney
`11. 0 English Translation Document (if applicable)
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`
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`
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`Applic.ant. :y,ust attacr; form PTOiS8f35 or eql1ivalent
`
`H. Dothec ~~~~~~~~~~~~~~~--
`
`ot prior appl;caiion N•~<.:. 13/~5$,$72 -- ...
`
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`W ,~pplic->t)l<:, items a. - c are r<:quired}
`a_ D Comp~;ter Readable Form \CRF)
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`Hl_ If a CONTINUING APPLICATION, check apprc•pnate box, <3nd svpply tfle requisite 1nformat10n belo>ti and 1n tile first sentence of the
`spectf!c-allon following the titl<:t. or in an Application Oat,~ Sheet <mder 37 CFR f 76:
`D Divlsion-ai
`
`19. CORRESPONDENCE ADDRESS
`
`.. r~8ii=ie ............... T .......................................................................................................................................................................................................................................... .
`
`15516
`
`-----------------------------+--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
`.. 1!
`
`U "<>:>
`
`Ad."'r~~-
`City
`Country
`
`Signature
`Name
`(PrintlTvpe l
`
`/Scot! S. Kokka/
`
`Sco!l S. Kokka
`
`Stale
`Telephone
`
`Zip Code
`Email
`
`Date I June 11, 2011
`I Registration No. I
`I {AtlorneviA:,entl 151 '893
`
`This. ,;-.;olh~':\::tiof~ of infflrrnatic:n is requ~:-Bd b)' 37 CFR 1.5a(b}. The infoHnatio·n ts f5qulrBd tc rJfJtam ar .reia:n ~ hena~it. by ~hs pubt~c i."'~4li:ch is ~o fHe {an~"j by me
`USPTO io proc'6ss} an app1k;.atlf.1rl Coni;fJe.ntfa:lity is go,>"ernsrJ by .:}5 U.S C. 122 and:}·~ CFR ·3 .·1·1 and ·3 ·~4. Th~s f..:Ol~ection. ~~ estnna.ted to ta.~e ·~2 minutes tr;
`/.·-.ny
`oomp!et-.3, tnclutHng galhering~ p:':t:f:'iJnng. ar.d Sltb:-oitUng the cornp~eted appf~caticn tOnTi to the USPTO ·nrm: w~ll V3J)' depenct~ng upon the· tndiv~dua: C'.¢'1~:&.
`r.xJmmer.ts oq the arnount vt t~rne you require k, rornp;ete thi& fonn ant..it\x Si.igg-F.:stlon~ for ~-e(h.K:tng t!1~s burcJsn, sho'L~:id be sent to ~t.e· Cr.isf lnforTnation Oftk:af,
`U.S" P~tent aflfJ "fradernark Office. U.S. Oepartrt<:~~nt of Con~rnerce, f.J·.o. Box "!450, l\texandr-ta, VA 223"!3··lk50. DO NO'f SEND FEES Of~ GQt .... 1PLETED
`FORMS TO THIS ADDRESS. SEND TO: Commlsslon~r for F>at.,nt$, f'.O, Box 1450, Alell:aildrla. VA 22313·1400.
`/f yo~; need ase;i·stsno~ in r_.:orr!J.~l~tmg UH; fonn .. r.:au 1-,800~PTC).~9199 and st~wct optfo,"': 2.
`
`1 of 319
`
`FITBIT EXHIBIT 1018
`
`

`
`PT0;'S8/35 {07·09;
`Apprt•Yed ft·f li~E': ti">Nl!!gh 0713!12012 01<;!8 0651.1)()3"1
`U.S Patent«nd TrademarK Offbl; U.S DEPARTME~JTOF COMMERCE
`UM;;r lhe Paperwork Recuc!itlrl Act of 1995, no persons are requirec to respotld loa collection t•f lnfo>mil!i!l!l un!ess it ci:SJl~a>'S a vahci OMB ccrt!rol number.
`
`NONPUBLICATION REQUEST
`UNDER
`
`/''
`I
`
`I
`
`35 U.S.C. 122(b)(2)(B)(i) ~
`
`Ftrst Named Inventor
`
`I Richard Drysdale
`
`Attorney Docket Number
`
`All-001CIP1
`
`I hereby certify that the invention disclosed in the attached application has not and will not be
`the subject of an application filed in another country, or under a multilateral international
`agreement, that requires publication at eighteen months after filing.
`
`I hereby request that the attached application not be published under 35 U.S.C. 122(b).
`
`/ScottS. Kokka'
`
`Scott S. Kokka
`
`(650) 566-9921
`
`Signature
`
`June 11, 2011
`
`Date
`
`51,893
`
`Typed or printed name
`
`Registration Number, if applicable
`
`Telephone Number
`
`This request must be signed in compliance with 37 CFR 1.33(b) and submitted with the
`application upon filing.
`
`Applicant may rescind this nonpublication request at any time. If applicant rescinds a request
`that an appl.ication not be published under 35 U.S,C. 122(b), the application will be scheduled
`for publication at eighteen months from the earliest claimed filing date for which a benefit is
`claimed.
`
`If applicant subsequently files an application directed to the invention disclosed in the attached
`application in another country, or under a multilateral international agreement, that requires
`publication of applications eighteen months after filing, the applicant must notify the United
`States Patent and Trademark Office of such filing within forty-five (45} days after the date of
`the filing of such foreign or international application. Failure to do so will result in
`abandonment. of this application (35 U.S.C. 122(b)(2)(B)(iii)).
`
`Ttsls ~·}t..)He.:.~i:."jn ot ir~ft)ti!laUon ~$ requlr~d t;y ::~? CPR 1 _2i3(a) Yt1~ inforrnatk1n is req~_;jt·erj to ofJtal:J trr !"€t3~n a t>eneflt b:,,:' the put~Hc 'llhich is to me {~nd by ttJt!L
`USPTO to process} an appHt:atfon. Con1td:entia~ity' ~s go~leme-rj by 35 u.S. C. ·122 and 37 CFR 1.1·~ arK~ i.i4. TtJfs c:e .. mectlon ts esHmated to ~ake 6 mfrHJtes to
`oompftrte. inctud~ng g:a:th~rlng, prepa:ing. $3ild submfttlng the c.c:mpfele<l appticaBon form to tl"'l~ USPTO. r:n~e: wm vary· t3ependmg upon th~ if'H.itvjdua! ca5t:. Any
`r;ornmenl& o·P ~he amo~~nt of ilrn:e yOll re-r~~~tire h.,'} rornp:ete th~s ~OfP1: andior suggestions f~x r·OOl:dr~g tht~ tn .. Jrden~ st~tH.Jld b-e ser~t to thr:: Ch~ef ;nronnaHor< Of"fk~t,
`IJ S. Pimmt am! Tt<>t.iem<>t'K Office, U.S. Departmeflt a! C(3tlllllen::e, P 0 Box i45ll .. ll,le:<aMfla, VA n<r1iH4W. DO NOT SEND fEES OR COMPLETED
`FORMS TO THiS ADDRESS SEND TO: Commissioner for Patents, P.O, Box 145{1, Ale.xandria, VA22313-145{!.
`
`2 of 319
`
`

`
`Application Data Sheet
`
`Cross Reference to Related Applications
`
`This application is a continuation~in~part of U.S. Patent Application No .. 13/158,372, filed
`
`June 10, 2011 (Attorney Docket No.: AL!-001CIP1 ), entitled "Component Protective
`
`Overmolding," which is hereby incorporated by reference in its entirety for a!! purposes.
`
`Application Information
`
`Filing Date::
`
`Application Type::
`
`Subject Matter::
`
`Suggested Group Art Unit::
`
`June 11, 2011
`
`Regular
`
`Utility
`
`None
`
`None
`
`Title::
`
`COMPONENT PROTECTIVE
`OVERMOLD!NG
`
`Attorney Docket Number::
`
`ALI-001
`
`Request for Early Publication?::
`
`Request for Non .. Publication?::
`
`Suggested Drawing Figure::
`
`Total Drawing Sheets::
`
`Small Entity::
`
`Petition included?::
`
`Secrecy Order in Parent Appl. ?::
`
`Applicant Information
`
`No
`
`No
`
`6A
`
`10
`
`No
`
`No
`
`No
`
`Applicant Authority type::
`
`Inventor
`
`Prima.ry Citizenship Country::
`
`United States of America
`
`1
`
`3 of 319
`
`

`
`Status::
`
`Given Name::
`
`Family Name::
`
`City of Residence::
`
`Ftlll Capacity
`
`Richard
`
`Drysdale
`
`Sunnyvale
`
`State or Province of Residence~:
`
`CA
`
`Country of Residence::
`
`United States of America
`
`Street of mailing address::
`
`687 W. Maude Avenue
`
`City of mailing address::
`
`Sunnyvale
`
`Country of mailing address::
`
`United States of America
`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94085
`
`Applicant Authority type::
`
`Inventor
`
`Primary Citizenship Country::
`
`United States of America
`
`Status::
`
`Given Name::
`
`Family Name::
`
`City of Residence::
`
`Full Capacity
`
`Scott
`
`Fullam
`
`Palo Alto
`
`State or Province of Residence::
`
`CA
`
`Country of Residence::
`
`United States of America
`
`Street of mailing address::
`
`3982 Sutherland Dr.
`
`City of mailing address::
`
`PaloA!to
`
`Country of mailing address::
`
`United States of America
`
`2
`
`4 of 319
`
`

`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94303
`
`Applicant Authority type::
`
`Inventor
`
`Primary Citizenship Country~:
`
`United States of America
`
`Status::
`
`Given Name::
`
`Family Name::
`
`Full Capacity
`
`Skip
`
`Orvis
`
`City of Residence::
`
`Sunnyvale
`
`State or Province of Residence::
`
`CA
`
`Country of Residence::
`
`United States of America
`
`Street of mailing address::
`
`687 W. Maude Avenue
`
`City of mailing address::
`
`Sunnyvale
`
`Country of mailing address::
`
`United States of America
`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94085
`
`Applicant Authority type::
`
`Inventor
`
`Primary Citizenship Country::
`
`United States of America
`
`Status::
`
`Given Name::
`
`Family Name::
`
`City of Residence::
`
`Full Capacity
`
`Nora
`
`Levinson
`
`Sunnyvale
`
`3
`
`5 of 319
`
`

`
`State or Province of Residence::
`
`CA
`
`Country of Residence::
`
`United States of America
`
`Street of mailing address::
`
`687 W .. Maude Avenue
`
`City of mailing address::
`
`Sunnyvale
`
`Country of mailing address::
`
`United States of America
`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94085
`
`Correspondence Information
`
`Customer Number::
`
`15516
`
`Name::
`
`Kokka & Backus, PC
`
`Street of mailing address::
`
`703 High Street
`
`City of mailing address::
`
`Palo Alto
`
`Country of mailing address::
`
`USA
`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94301
`
`Telephone::
`
`Fax::
`
`(650) 566~9921
`
`(650) 566-9922
`
`Representative Information
`
`15516
`Representative Customer Number::
`---Represe-ntati-ve _____________________________ ---Reiiistrati_o_n __ N_um_il_er:-:-------- ---Nime-:-;-----------------------------------------------------~
`
`;~~;~~ti~~''
`
`=1,~~=
`
`=:it=-~~~ka
`
`I
`
`4
`
`6 of 319
`
`

`
`Assignee Information
`
`Name:: A!iphCom
`
`Mailing address:: 687 W, Maude Avenue, Sunnyvale, CA 94085
`
`5
`
`7 of 319
`
`

`
`1/10
`
`102
`
`100
`
`104
`
`FIG. 1
`
`102
`
`•
`
`.. ····
`200
`
`\206 208
`
`106
`
`FIG. 2
`
`8 of 319
`
`

`
`2/10
`
`'104
`
`FIG. 3
`
`40
`4.~0~ \:--41 Q
`406-j< t ·~
`
`'10(} 208
`
`104
`
`FIG. 4
`
`302
`
`102
`
`300
`
`40
`
`400
`
`9 of 319
`
`

`
`3/10
`
`FIG. 5A
`
`FIG. 5B
`
`~.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.'.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.·.'
`
`FIG. 5C
`
`10 of 319
`
`

`
`4/10
`
`602
`
`Form protective layer
`
`Form inner molding
`
`Perform function test
`
`604
`
`606
`
`608
`
`No
`
`612
`
`Fon-n out€r rno!ding
`
`Pe1fonn final test
`
`616
`
`Reject item
`
`610
`
`618
`
`Perform visual inspection
`
`• , ... ··
`600
`
`FIG. 6A
`
`11 of 319
`
`

`
`5/10
`
`622
`
`Selectively apply'
`prntective material nver
`e~ements coupled to
`frame¥vork
`
`624
`
`Form inner molding over
`framev.,•ork, elements, and
`protective rnaterial
`
`626
`
`628
`
`Fonn outer molding over
`inner rno!ding, frarnework,
`~-------------,
`e~ements, and protective
`rnateriat
`
`Perform inspection of
`outer rno!ding to
`determine if defect is
`present
`
`D"'.'O
`u>J.
`
`Rernove outer molding
`
`632
`
`620
`
`FIG. 6B
`
`12 of 319
`
`

`
`6/10
`
`642
`
`Selectively apply secu6ng
`coating over components
`on trarnework
`
`644
`
`Fonn molding over
`securing coating~
`cornponents, and
`frarnework
`
`/f
`
`640
`
`FIG. 6C
`
`13 of 319
`
`

`
`7/10
`
`652
`
`654
`
`656
`
`Place t~lements on
`framework
`
`Secure elements to
`ff'amevtork using curable
`rnateria!
`
`Perform inspection of
`curable rnateria! after
`layering on frarr1ework
`and e!ernents
`
`658
`
`Forrn one or rnore
`moldings over curable
`material, framework, and
`elements
`
`666
`
`660
`
`Perform insoection for
`defects in moldings
`
`Reform molding over
`curable rnateria!,
`framework,. and elements
`
`662
`
`Remove defective
`mdding
`
`664
`
`.. ft
`
`650
`
`FIG. 6D
`
`14 of 319
`
`

`
`0
`
`15 of 319
`
`

`
`00
`
`0 !<--<
`
`~
`
` \\
`
`_\\W
`
`16 of 319
`
`

`
`0 .,......
`... -... -..,_........_ c, E.Q,’1G
`
`17 of319
`
`F]C},
`
`953-152
`
`9{%»{;’»
`
`17 of 319
`
`

`
`Electronic Acknowledgement Receipt
`
`EFSID:
`
`Application Number:
`
`10284265
`
`13158416
`
`International Application Number:
`
`Confirmation Number:
`
`9386
`
`Title of Invention:
`
`COMPONENT PROTECTIVE OVERMOLDING
`
`First Named Inventor/Applicant Name:
`
`Richard Drysdale
`
`Customer Number:
`
`15516
`
`Filer:
`
`Scott Susumu Kokka
`
`Filer Authorized By:
`
`Attorney Docket Number:
`
`ALI-001 CIP1
`
`Receipt Date:
`
`11-JUN-2011
`
`Filing Date:
`
`TimeStamp:
`
`23:39:24
`
`Application Type:
`
`Utility under 35 USC 111 (a)
`
`Payment information:
`
`Submitted with Payment
`
`I no
`
`File Listing:
`
`Document
`Number
`
`1
`
`Document Description
`
`File Name
`
`File Size( Bytes)/
`Message Digest
`
`Multi
`Part /.zip
`
`Pages
`(ifappl.)
`
`ALI-001 CIP1_ApplicationFILED.
`pdf
`
`10314453
`
`c00b3fd bb46469ad a 7 31 e85 036c4 9624d 68
`7cee3
`
`yes
`
`50
`
`18 of 319
`
`

`
`Multipart Description/PDF files in .zip description
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`Transmittal of New Application
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`Application Data Sheet
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`Specification
`
`Claims
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`Abstract
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`
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`If a new application is being filed and the application includes the necessary components for a filing date (see 37 CFR
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`If a new international application is being filed and the international application includes the necessary components for
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`19 of 319
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`

`
`APPLICATION FOR UNITED STATES PATENT
`
`COMPONENT PROTECTIVE OVERMOLDING
`
`ALI-OOICIPI
`
`By Inventors:
`
`Richard Drysdale
`687 W. Maude A venue
`Sunnyvale, CA 94085
`A Citizen of the United States of America
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`Scott Fullam
`3982 Sutherland Dr
`Palo Alto, CA 94303
`A Citizen of the United States of America
`
`Skip Orvis
`687 W. Maude Avenue
`Sunnyvale, CA 94085
`A Citizen of the United States of America
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`Nora Levinson
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`Assignee: AliphCom
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`KOKKA & BACKUS, PC
`703 High Street
`Palo Alto. CA 94301
`Tel: (650) 566-9921
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`ALl-OOICIPI
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`COMPONENT PROTECTIVE OVERMOLDING
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`CROSS-REFERENCE TO RELATED APPLICATIONS
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`[000 I]
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`This application is a continuation-in-part of U.S. Patent Application No.
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`13/158,372, tiled June 10, 2011 (Attorney Docket No.: ALI-001 CIPI ), entitled
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`"Component Protective Ovcrmolding," which is hereby incorporated by reference in its
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`entirety for all purposes.
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`FIELD
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`[0002]
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`The present invention relates generally to electrical and electronic hardware,
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`computer software. wired and wireless network communications. and computing devices.
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`I 0 More specifically, techniques for component protective overmolding are described.
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`BACKGROUND
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`[0003] With the advent of greater computing capabilities in smaller mobile fonn
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`factors and an increasing number of applications (i.e., computer and Internet software or
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`programs) for different uses, consumers (i.e., users) have access to large amounts of data,
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`personal or otherwise. Information and data are often readily available, but poorly
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`captured using conventional data capture devices. Conventional devices typically lack
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`capabilities that can record, store, analyze, communicate, or use data in a contextually-
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`meaningful, comprehensive, and efficient manner. Further. conventional solutions are
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`often limited to specific individual purposes or uses, demanding that users invest in
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`20 multiple devices in order to perfonn dif1erent activities (e.g., a sports watch for tracking
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`time and distance, a GPS receiver for monitoring a hike or run, a cyclometer for
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`.
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`gathering cycling data, and others). Although a wide range of data and information is
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`available, conventional devices and applications generally fail to provide effective
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`solutions that comprehensively capture data for a given user across numerous disparate
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`activities.
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`[0004]
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`Some conventional solutions combine a small number of discrete functions.
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`Functionality for data capture, processing, storage, or communication in conventional
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`devices such as a watch or timer with a heart rate monitor or global positioning system
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`("GPS") receiver are available, but are expensive to manufacture and typically require
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`purchasing multiple, expensive devices. Other conventional solutions for combining data
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`capture facilities often present numerous design and manufacturing problems such as size
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`specifications, materials requirements, lowered tolerances for defects such as pits or holes
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`in covelings tor water-resistant or waterproof devices, unreliability, higher failure rates,
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`increased manufacturing time, and expense. Subsequently, conventional devices such as
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`fitness watches, heart rate monitors, GPS-enabled fitness monitors, health monitors (e.g.,
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`diabetic blood sugar testing units), digital voice recorders, pedometers, altimeters, and
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`other conventional data capture devices arc generally manufactured tor conditions that
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`occur in a single or small groupings of activities and, subsequently, are limited in tenns
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`of commercial appeal to consumers.
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`[0005]
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`Generally, if the number of data inputs accessible by conventional data
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`capture devices increases, there is a corresponding rise in design and manufacturing
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`requirements and device size that results in significant consumer expense and/or
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`decreased consumer appeal, which eventually becomes prohibitive to both investment
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`and commercialization. Still further, conventional manufacturing techniques are often
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`limited and ineffective at meeting increased requirements to protect sensitive hardware,
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`circuitry, and other components that are susceptible to damage, but which are required to
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`perfonn various data capture activiti~s. As a conventional example, sensitive electronic
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`components such as printed circuit board assemblies ("PCBA"), sensors, and computer
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`5 memory (hereafter "memory") can be significantly damaged or destroyed during
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`manufacturing processes where protective ovennoldings or layers of material occurs
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`using techniques such as injection molding, cold molding, and others. Damaged or
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`destroyed items subsequently raises the cost of goods sold and can deter not only
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`investment and commercialization, but aJso innovation in data capture and analysis
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`technologies, which are highly compelling fields of opportunity.
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`[0006]
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`Thus, what is needed is a solution for efficiently manufacturing devices
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`without the limitations of conventional techniques.
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`BRIEF DESCRIPTION OF THE DRAWINGS
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`[0007]
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`Various embodiments or examples ("examples") arc disclosed in the
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`following detailed description and the accompanying drawings:
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`[0008]
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`FIG. I illustrates a cross-sectional view of an exemplary process for providing
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`protective material in component protective overmolding;
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`[0009]
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`FIG. 2 illustrates another cross-sectional view of an exemplary process for
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`providing protective material in component protective overmolding;
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`[00 I 0]
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`FIG. 3 illustrates a cross-sectional view of an exemplary process for fonning
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`an inner molding in component protective overmolding;
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`[0011]
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`FIG. 4 illustrates another cross-sectional view of an exemplary process for
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`forming an outer molding in component protective overmolding;
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`[0012]
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`FIG. 5A illustrates an exemplary design applied during component protective
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`overmolding;
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`[0013]
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`FIG. 5B illustrates another exemplary design applied dul'ing component
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`protective overmolding;
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`[0014]
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`FIG. 5C illustrates a further exemplary design applied during component
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`protective overmolding;
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`[0015]
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`FIG. 6A illustrates an exemplary process for component protective
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`ovcrmolding;
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`[0016]
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`FIG. 6B illustrates an alternative exemplary process for component protective
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`ovennolding;
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`[00 17]
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`FIG. 6C illustrates another altemative exemplary process for component
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`protective ovennolding;
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`[0018]
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`FIG. 60 illustrates yet another altemative exemplary process for component
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`protective ovem1olding;
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`[00.19]
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`FIG. 7 illustrates a view of an exemplary data-capable strapband configured to
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`receive ovcm1olding;
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`[0020]
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`FIG. 8 illustrates a view of an exemplary data-capable strapband having a first
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`molding; and
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`f0021]
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`FIG. 9 illustrates a view of an exemplary data-capable strapband having a
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`second molding.
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`DETAILED DESCRIPTION
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`[0022]
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`Various embodiments or examples may be implemented in numerous ways,
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`including as a system, a process. an apparatus. a user interface, or a series of program
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`instructions on a computer readable medium such as a computer readable storage medium
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`or a computer network where the program instructions arc sent over optical, electronic, or
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`wireless communication links. In general, operations of disclosed processes may be
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`performed in an arbitrary order, unless otherwise provided in the claims.
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`[0023]
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`A detailed description of one or more examples is provided below along with
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`accompanying figures. The detailed description is provided in connection with such
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`examples, but is not limited to any particular example. The scope is limited only by the
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`claims and numerous alternatives, modifications, and equivalents are encompassed.
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`Numerous specific details are set forth in the following description in order to provide a
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`thorough understanding. These details are provided for the purpose of example and the
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`described techniques may be practiced according to the claims without some or all of
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`these specific details. For clarity, technical material that is known in the technical fields
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`related to the examples has not been described in detail to avoid unnecessarily obscuring
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`the description.
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`[0024]
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`FIG. I illustrates a cross-sectional view of an exemplary process for providing
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`protective material in data-capable strapband ovennolding. Here, device 100 includes
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`framework 102, clements I 04-106, and covering 1 08. In some examples, framework 102
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`may be referred to interchangeably as a substrate, wafer, board (printed, unprinted, or
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`otherwise), or other surface upon which elements 104-106 may be mounted, placed, or
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`otherwise fixed. The type and configuration of elements may be varied and are not
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`limited to any given type of electrical, electronic, or mechanical component. For
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`example. element I 04 may be implemented as a microvibrator or motor conligured to
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`provide a vibratory signal for a'n alann or other indicator. Element I 04 may also be a
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`printed circuit board assembly (''PCBA"), logic, processor, microprocessor, memory
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`(e.g., solid state, RAM, ROM, DRAM, SDRAM, or others), or other computing element
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`and is not limited to any specific type of component. Further, element I 04 may be
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`coupled electrically or electronically to element I 06, which may also be an electrical,
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`electronic, or mechanical component that can be placed on framework 102. When placed
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`on framework I 02, elements 104-106 may be fixed using various techniques. including
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`adhesives, mechanical fixing stmctures (e.g., posts and holes), or others, without
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`limitation.
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`(0025]
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`As shown, covering 108 may be placed over element 104 in order to protect
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`the latter from damage resulting from the application of subsequent layers, coverings,
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`15 moldings, or other protective material, regardless ofenvironmental conditions (e.g.,
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`temperature, pressure, thickness, and others). As shown, element 1 04 is covered by
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`covering 108 and element I 06 is uncovered. However, other protective materials may be
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`used to cover element I 06. In still other examples, protective materials such as covering
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`1 08 may not be used if elements 104 or 1 06 are manufactured to resist the formation,
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`deposit, layering, or covering of other protective materials at various temperatures,
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`pressures, or other atmospheric conditions. In other examples, device 100 and the above(cid:173)
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`described elements may be varied and are not limited to those shown and described.
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`[0026]
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`FIG. 2 illustrates another cross-sectional view of an exemplary process for
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`providing protective material in data-capable strapband overmolding. Here, device 200
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`includes framework I 02, elements I 04-106, covering 108, syringe 202, arrows 204-206,
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`and protective coating 208. In some examples, covering 108 and protective coating 208
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`5 may be referred to as "protective material" interchangeably and without limitation. As
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`shown, like numbered clements shown in this drawing and others may refer to the same
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`or a substantially similar element previously described.
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`[0027]
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`In some examples, an applicator (e.g., syringe 202) may be used to selectively
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`apply protective coating 208 to cover as a protective layer over element I 06. As used
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`herein, "selectively applying" may refer to the application, placement, positioning,
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`formation, deposition, growth, or the like, of protective material to one, some, all, or none
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`of any underlying elements (e.g., elements I 04-1 06). In some examples, "protective
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`material" may also be used interchangeably with "protective layer," "covering,"
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`"housing," or "structure" regardless of the composition of material or matter used,
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`without limitation. In other words, covering 108 and protective coating 208 may each be
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`referred to as "protective material" and used to protect underlying elements (e.g.,
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`elements 104-106 (FIG. 1)) as described herein.
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`[0028]
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`· When the plunger of syringe 202 is depressed in the direction of arrow 204,
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`protective coating 208 is forced through applicator tip 210 and applied as a protective
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`layer over clement 106. As an example, protective coating 208 may be applied at
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`substantially atmospheric pressure by applying I -2 psi of pressure to the plunger of
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`syringe 202. When applied, protective coating 208 may be, for example, an ultraviolet
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`("UY") curdble adhesive or other material. In other words, when protective coating 208
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`is applied (i.e., layered over element 1 06) and exposed to ultraviolet radiation (or other
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`curing conditions) at levels similar to those found in natural sunlight or artificial light, it
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`coalesces and hardens into a covering that prevents the underlying element (e.g., element
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`I 06) from being damaged when other protective materials or layers are applied such as
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`those shown and described below. Exemplary types of protective coating 208 may
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`include coatings, adhesives, gels, liquids, or any other type of material that hardens to
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`protect, prevent, minimize, or otherwise aid in avoiding damage to a protected element.
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`Examples ofUV curable coatings include Loctite® coatings produced by Henkel & Co
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`I 0 AG of Dusseldorf, Germany such as, for example, Loctite® 5083 curable coating. Other
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`types of curable coatings, in addition to those that are UV curable., may be used to protect
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`underlying elements without limitation or restriction to any given type.
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`[0029)
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`In some examples, protective material such as Loctite® or others may be
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`applied selectively to one, some, or all electrical, electronic, mechanical, or other
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`elements. Protective coating 208 may also be applied in ditlerent environmental
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`conditions (e.g., atmospheric pressure, under vacuum, in a molding cavity or chamber,
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`within a deposition chamber. or the like) and is not limited to the examples shown and
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`described. As shown, protective coating 208 has been selectively applied to element 106,
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`but not clement l 04, the latter of which is being protected by covering I 08. As an
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`alternative, covering 108 may be used as protective material in the form of an enclosure
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`or physical structure that is used to protect an underlying element. As described herein,
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`protective coating 208 may be selectively applied by determining whether sensitive
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`components, parts, or other elements ("elements") are susceptible to damage or
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`destruction from subsequent processes, for example, to deposit additional protective
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`layers, such as those described in greater detail below. In other examples, device 200 and
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`the above-described elements may be varied in function, structure, configuration,
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`implementation, or other aspects and are not limited to those provided.
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`[0030]
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`FIG. 3 illustrates a cross-sectional view of an exemplary process for forming
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`an inner molding in data-capable strapband overmolding. Here, device 300 includes
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`framework I 02, elements I 04- I 06. covering I 08, syringe 202, arrows 204-206,
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`protective coating 208, mold cavity 302. nozzle 304, arrows 306-310, and inner molding
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`312. In some examples, framework 102 and elements I 04-106 having selectively applied
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`protective coating 208 may be placed in mold cavity 302 where another protective layer
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`or coating (e.g., inner molding 312) may be applied from nozzle 304 in the direction of
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`arrows 306-310. Types of materials that may be used for inner molding 312 include
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`plastics, thennoplastics, thermoplastic elastomers, polymers, elastomers, or any other
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`organic or inorganic material that can molded in mold cavity 302. As shown, mold
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`cavity 302 may be implemented using a variety of molding techniques. For